CN218042195U

CN218042195U - Device for cooling high heat flux density device by using magnetic field and impressed current

Info

Publication number: CN218042195U
Application number: CN202122476744.9U
Authority: CN
Inventors: 王增辉; 陈昭奇; 倪明玖
Original assignee: University of Chinese Academy of Sciences
Current assignee: University of Chinese Academy of Sciences
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2022-12-13
Anticipated expiration: 2031-10-14

Abstract

Compared with the traditional passive heat dissipation technology which utilizes extension structures such as fins to enhance natural convection to realize cooling, the active heat dissipation technology can flexibly adjust the heat dissipation power by adjusting a magnetic field or external current, enhances the heat dissipation effect, has larger application range, and can be used in application occasions with high thermal power and large heat flux density; compare in drive methods such as force pump, the mode that drives fluid through magnetic field and electric current effect can not produce the noise, and the flow state is stable, can not increase extra flow resistance, and the utility model discloses do not have extra mechanical motion part, simple structure easily installs and maintains.

Description

Device for cooling high heat flux density device by using magnetic field and impressed current

Technical Field

The utility model belongs to the technical field of big thermal current density device cooling, specifically be an utilize magnetic field and impressed current to realize big thermal current density device refrigerated device.

Background

The heat dissipation problem of high power, big thermal current density device is closely relevant with the engineering reality, and traditional small-size heat dissipation power technique has developed maturity, the utility model discloses it is big to plan providing being used for thermal current density, and the solution under the application scenario that the heat dissipation requires highly. The utility model relates to an initiative heat dissipation technique drives the fluid motion through the lorentz power, and liquid metal flows into the heat exchanger and brings the heat for external environment, has adopted the mature fin extension structure of development to strengthen the heat exchanger performance, cools off through forced heat dissipation devices such as fans, and later backward flow gets into next circulation to this reaches the cooling effect. The utility model discloses can adjust heat dissipation power in a flexible way through adjusting magnetic field or impressed current, application scope is wider to there is not complicated mechanical motion part, simple structure, easily installation and maintenance.

The existing cooling of the heat flux density device has the following defects:

1. the flowing heat exchange modes of common heat exchange working media such as water and the like are all driven by the power of the pressure pump, the heat conductivity coefficient of the common heat exchange working media such as water and the like is smaller than that of liquid metal, and the heat dissipation area is smaller under the condition of space constraint;

2. the flow velocity of the fluid driven by the pressure pump does not have the capability of automatically adjusting along with the thermal power of a large heat flow density device, the pressure pump generates noise in the operation process, the flow at the inlet and the outlet of the pressure pump is complex, and additional flow resistance is generated;

3. the capacity of convective heat transfer through extending structures such as fins is limited, and the heat dissipation area is limited by local space and is difficult to further increase;

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides an utilize magnetic field and impressed current to realize big thermal current density device refrigerated device and method, the effectual utilization magnetic field that has solved on the existing market realizes that big thermal current density device refrigerated device and method need the force pump to be active drive, the force pump occupies certain space, receive space constraint, heat radiating area is less to the force pump can produce the noise when the operation, do not have along with big thermal current density device thermal power size automatically regulated's ability, the big problem of flow resistance.

In order to achieve the above object, the utility model provides a following technical scheme: the device comprises a heating device, red copper with good heat conduction performance is mounted at the top of the heating device, a conductive fluid loop is arranged inside the red copper, a magnetic field coverage area and an electrode material are arranged at the left end of the conductive fluid loop, a cooling fan is mounted at the top of the red copper, and a fin extension structure is mounted at the outer part of the other end of the conductive fluid loop.

Preferably, the red copper metal is made of red copper blocks.

Preferably, the conductive fluid circuit comprises a conductive fluid and a liquid metal or a conductive fluid and a conductive metal powder.

Preferably, the conductive fluid is gallium, gallium-based alloy, mercury, potassium-sodium alloy, salt solution, metal powder or the like.

Preferably, the magnetic field coverage is implemented using an electromagnetic field or a permanent magnet.

Preferably, the electrode material is one of red copper or aluminum alloy.

Preferably, the heat dissipation fan is an electrically driven forced convection type heat dissipation mechanism.

Preferably, the fin extension structure is a thin sheet made of aluminum alloy, copper or alloy copper.

A method for cooling a high heat flux device by using a magnetic field comprises the following steps:

s1, after an electrode material is connected with an external power supply, electromagnetic force (Lorentz force) is generated by interaction of current and a magnetic field in a magnetic field coverage area, and conductive fluid is driven to flow in a circulation loop;

s2, the red copper block guides heat out of the heating device and transfers the heat to conductive fluid in the circulating loop, and a fin extending structure at the other end of the circulating loop conducts the heat in the conductive fluid to ambient air and carries out forced convection heat exchange under the action of a cooling fan;

and S3, continuously refluxing the conductive fluid after cooling, and entering the next cycle.

Compared with the prior art, the beneficial effects of the utility model are that:

1) Compared with a liquid water cooling device driven by a pressure pump, the structure of the cooling device is simpler and more convenient, external heat exchange is expanded through a loop under the condition of space constraint, the cooling device is equivalent to increase of the heat exchange area, no noise is generated in the operation process, the flow of a magnetic field coverage area is stable, no extra flow resistance is increased, the hot end adopts red copper with superior heat conductivity and flowing metal fluid to realize heat transfer, and the cold end adopts a fin extension structure and a fan to realize cooling, so that a better cooling effect is provided for the cooling device;

2) The heat dissipation effect can be flexibly adjusted by adjusting the magnitude of the magnetic field or the magnitude of the impressed current, and when the heat flow density of the heating device is high, the magnetic field or the current can be increased to improve the flow speed of the conductive fluid so as to take away more heat;

3) Compared with the traditional heat pipe driven by phase change and capillary force, the utility model discloses contactless noiseless drive mode under usable impressed current and the magnetic field effect, this kind of drive mode is more novel, the utility model discloses the method of utilizing the effect drive electric conduction working medium in impressed current and magnetic field is expected to obtain wide application in the future, especially big at those heat flux density, needs high-efficient cooling, needs some occasions of low noise to obtain the application again.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the example serve to explain the invention. In the drawings:

fig. 1 is a schematic overall structure diagram of the present invention;

in the figure: 1. a magnetic field footprint; 2. a first electrode material; 3. a second electrode material; 4. a fin structure; 5. a heat radiation fan; 6. a conductive fluid circuit; 7. a thermally conductive material; 8. a heat generating device.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Embodiment one, given by fig. 1, the utility model discloses a device 8 generates heat, heat conduction material 7 is installed at device 8's top generates heat, heat conduction material 7's inside is provided with conductive fluid return circuit 6, conductive fluid return circuit 6's left end is provided with first electrode material 2 and second electrode material 3 and magnetic field coverage area 1, conductive fluid return circuit 6's the other end is provided with installs the fin structure 4 outside in the return circuit, radiator fan 5 is installed at heat conduction material 7's top, fin structure 4 is the aluminum alloy, copper or alloy copper's thin slice type heat radiation structure, radiator fan 5 is electrically driven compulsory convection type heat radiation structure.

In the second embodiment, on the basis of the first embodiment, the material of the heat conductive material 7 is a red copper block, and the structure of the heat conductive material 7 is changed, so that the heat from the heat generating device 8 can be transmitted more efficiently.

In the third embodiment, on the basis of the first embodiment, the conductive fluid circuit 6 includes a conductive fluid and a liquid metal or a conductive fluid and a conductive metal powder, and the heat exchange effect can be enhanced well by the arrangement of the conductive fluid circuit 6 and the flowing conductive fluid such as gallium, gallium alloy, mercury, potassium-sodium alloy, salt solution or conductive metal powder.

In the fourth embodiment, on the basis of the first embodiment, the magnetic field coverage area 1 is implemented by using an electromagnetic field or a permanent magnet, and the magnetic field coverage area 1 is arranged so that the conductive fluid is in a counterclockwise or clockwise direction according to the self direction.

Fifth, on the basis of the first embodiment, the lorentz force generated by the electrode material and the magnetic field is maximized by optimizing the position and the structure of the electrode material and the magnetic field, and then the maximum driving force is generated.

s1, after the first electrode material 2 and the second electrode material 3 are connected with an external power supply, electromagnetic force (Lorentz force) is generated by interaction of current and a magnetic field in a magnetic field coverage area 1, and conductive fluid is driven to flow in a circulation loop;

s2, the red copper block guides heat out of the heating device 8 and transfers the heat to conductive fluid in a circulation loop, a fin extension structure at one end of the circulation loop conducts the heat in the conductive fluid to ambient air, and forced convection heat exchange is carried out under the action of a cooling fan;

The working principle is as follows: when the cooling device works, the conductive fluid circulation loop is arranged above a large heat flow density device to be cooled, the large heat flow density device provides a heat source for the conductive fluid circulation loop through the heat conduction red copper metal, the first electrode material 2 and the second electrode material 3 are connected with an external power supply, the conductive fluid is acted by electromagnetic force Lorentz force under the action of the magnetic field coverage area 1 to form flow in the circulation loop, the flow direction of the conductive fluid is related to the directions of a magnetic field and current in a counterclockwise direction or a clockwise direction, the flow rate of the conductive fluid is related to the magnitude of the magnetic field and the magnitude of external current, the flow speed can be flexibly adjusted by adjusting the magnetic field and the external current, the effect that the higher the heating power of the large heat flow density device is, the stronger the heat dissipation capacity is achieved, in the circulation process, the heat dissipation area is increased by installing the fin structure 4 at the other end of the loop, and heat is timely taken away through the convection heat exchange of the electrically-driven forced convection fan 5 above the large heat flow density device.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An apparatus for cooling a device with high heat flux density by using a magnetic field and an applied current, comprising a heat generating device (8), characterized in that: heat conduction material (7) are installed at the top of device (8) generates heat, the inside of heat conduction material (7) is provided with conductive fluid return circuit (6) that is full of conductive fluid, radiator fan (5) are installed at the top of heat conduction material (7), fin structure (4) of reinforcing heat transfer are installed to the other end of conductive fluid return circuit (6), and conductive fluid's left end is connected and is used for leading-in impressed current's first electrode material (2) and second electrode material (3), first electrode material (2) and second electrode material (3) are provided with magnetic field coverage area (1) with the left end that is located conductive fluid return circuit (6).

2. The apparatus of claim 1, wherein the magnetic field and the applied current are used to cool the device with high heat flux density, and the apparatus further comprises: the heat conduction material (7) is made of red copper blocks.

3. The apparatus of claim 1, wherein the magnetic field and the applied current are used to cool the device with high heat flux density, and the apparatus further comprises: the conductive fluid circuit (6) comprises a conductive fluid and a liquid metal or a conductive fluid or a conductive metal powder.

4. The apparatus of claim 3, wherein the magnetic field and the applied current are used to cool the device with high heat flux density, and the apparatus further comprises: the conductive fluid is one of gallium, gallium alloy, mercury, potassium-sodium alloy, salt solution or conductive metal powder, for example.

5. The apparatus of claim 1, wherein the magnetic field and the applied current are used to cool the device with high heat flux density, and the apparatus further comprises: the magnetic field coverage area (1) is realized by adopting an electromagnetic field or a permanent magnet.

6. The apparatus of claim 1, wherein the magnetic field and the applied current are used to cool the device with high heat flux density, and the apparatus further comprises: the fin structure (4) is a sheet-type heat dissipation structure made of aluminum alloy, copper or alloy copper, and the heat dissipation fan (5) is an electrically driven forced convection type heat dissipation structure.