CN212259688U

CN212259688U - Device for cooling high heat flux device by utilizing magnetic field

Info

Publication number: CN212259688U
Application number: CN202021459901.4U
Authority: CN
Inventors: 王增辉; 张登科; 倪明玖
Original assignee: University of Chinese Academy of Sciences
Current assignee: University of Chinese Academy of Sciences
Priority date: 2020-07-22
Filing date: 2020-07-22
Publication date: 2020-12-29
Anticipated expiration: 2030-07-22

Abstract

The utility model relates to a big thermal current density device cooling technology field, and disclose an utilize magnetic field to realize big thermal current density device refrigerated device, it needs the electromagnetic pump to be active drive to have solved the magnetic field on the existing market and realizes big thermal current density device refrigerated device, and the electromagnetic pump occupies certain space, receives space constraint, and heat radiating area is little, and the drive of electromagnetic pump will consume extra electric energy, do not have the ability along with big thermal current density device thermal power size automatically regulated, the limited problem of single loop heat transfer area, it includes the heating element, the utility model discloses the usable difference in temperature realizes the automatic drive under seebeck effect and the magnetic field effect, need not to use the electromagnetic pump, does not have space constraint, and heat radiating area is big, need not consume extra electric energy, along with big thermal current density device thermal power size automatically regulated, automatically adapt to certain power within range electron device cooling, The double annular loop increases the advantage of conductive fluid flow and heat transfer area.

Description

Device for cooling high heat flux device by utilizing magnetic field

Technical Field

The utility model belongs to the technical field of big thermal current density device cooling, specifically be an utilize magnetic field to realize the refrigerated device of big thermal current density device.

Background

The existing liquid metal of the conductive fluid is cooled by the electromagnetic pump, flows into a heat exchanger to carry heat out to the external environment, and flows back to the electromagnetic pump for next circulation after being cooled by a heat dissipation device such as a fan, so as to achieve the purpose of cooling; in addition, a proposal is that the heat emitted by the electronic device is utilized, and the electromagnetic pump is driven by the electric energy generated by the thermoelectric effect, so as to realize the electronic device cooling device which can form the self-circulation of the liquid metal without external energy input.

The existing cooling of the heat flux density device has the following defects:

1. the mode of adopting the flowing heat exchange of the conductive fluid comprising liquid metal or metal powder needs the active drive of an electromagnetic pump, and the automatic drive mode under the actions of the Seebeck effect and the magnetic field is not realized by utilizing the temperature difference, so that the electromagnetic pump occupies a certain space volume, the heat dissipation area is smaller under the condition of space constraint, and the drive of the electromagnetic pump needs to consume extra electric energy;

2. the flow speed of the heat dissipation mode that the electromagnetic pump drives the conductive fluid does not have the capability of automatically adjusting along with the thermal power of the high-heat-flow-density device;

3. the single loop heat exchange area is limited.

SUMMERY OF THE UTILITY MODEL

To the above situation, for overcoming prior art's defect, the utility model provides an utilize magnetic field to realize the refrigerated device of big thermal current density device, the effectual utilization magnetic field that has solved on the existing market realizes that the refrigerated device of big thermal current density device needs the electromagnetic pump to be active drive, and the electromagnetic pump occupies certain space, receives space constraint, and heat radiating area is less, and the drive of electromagnetic pump need consume extra electric energy, do not have along with big thermal current density device thermal power size automatically regulated's ability, the limited problem of single loop heat transfer area.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an utilize magnetic field to realize the refrigerated device of big thermal current density device, includes the device that generates heat, red copper metal is installed at the top of the device that generates heat, red copper metal's surface is provided with the electrically conductive fluid return circuit, the surface that red copper metal is located electrically conductive fluid return circuit bottom is provided with the magnetic field coverage area, radiator fan is installed at red copper metal's top.

Preferably, the red copper metal is made of red copper blocks.

Preferably, the conductive fluid circuit comprises a conductive fluid and a liquid metal or a conductive fluid and a conductive metal powder.

Preferably, the conductive fluid is one of gallium, gallium alloy, mercury or potassium-sodium alloy

Preferably, the magnetic field coverage is implemented using an electromagnetic field or a permanent magnet.

Preferably, the heat dissipation fan is an electrically driven forced convection type heat dissipation mechanism.

A method for cooling a high heat flux device by using a magnetic field comprises the following steps:

s1, arranging the conductive fluid circulation loop above a large heat flow density device to be cooled, wherein the large heat flow density device provides a heat source for the conductive fluid circulation loop, the electric fan provides a cold source for the conductive fluid, and a temperature gradient is formed between metal materials with different temperatures;

s2, arranging a cooling fan on the inner side of the conductive fluid circulation loop to provide a low-temperature area, arranging a heating device on one outer side of the loop to provide a high-temperature area, forming a temperature gradient in the whole red copper metal, and forming potential differences among metal materials with different temperatures and generating current in the conductive fluid according to the Seebeck principle;

and S3, under the action of the magnetic field coverage area, the conductive fluid is driven to flow in the circulation loop under the action of electromagnetic force (Lorentz force).

Compared with the prior art, the beneficial effects of the utility model are that:

1) compared with a liquid metal cooling device driven by an electromagnetic pump, the circulation of the conductive fluid does not need the driving of the electromagnetic pump, temperature gradient, potential difference and current can be formed between a large heat flux density device and a cooling fan of a loop, the conductive fluid is subjected to the action of electromagnetic force (Lorentz force), and automatic circulation of the conductive fluid under the action of large heat flux and a magnetic field is realized;

2) the flowing speed of the conductive fluid can be automatically adjusted along with the thermal power of the high-heat-flow-density device, when the thermal power is high, the temperature gradient is high, the current generated by the thermoelectric effect is high, the electromagnetic force is high, the flowing speed is high, and more heat can be taken away;

3) compare with the traditional heat pipe that uses phase transition driven and capillary force driven, the utility model discloses the automatic drive mode under seebeck effect and magnetic field effect is realized to usable difference in temperature, and this kind of drive mode is more novel, the utility model discloses the method that utilizes the difference in temperature between two kinds of different metal materials to produce the electrically conductive working medium of seebeck effect drive is expected to obtain wide application in future, especially needs high-efficient cooling those, and the place that needs low-level energy consumption again obtains using

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic overall structure diagram of the present invention;

in the figure: 1. a heat generating device; 2. red copper metal; 3. a conductive fluid circuit; 4. a magnetic field footprint; 5. a heat dissipation fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Embodiment one is given by fig. 1, the utility model discloses a device 1 generates heat, and red copper metal 2 is installed at the top of device 1 generates heat, and the surface of red copper metal 2 is provided with conductive fluid return circuit 3, and the surface that red copper metal 2 is located conductive fluid return circuit 3 bottom is provided with magnetic field coverage area 4, and radiator fan 5 is installed at the top of red copper metal 2.

In the second embodiment, on the basis of the first embodiment, the red copper metal 2 is made of a red copper block, and the red copper metal 2 is arranged so as to transfer heat in a heat conduction manner in the device.

In the third embodiment, on the basis of the first embodiment, the conductive fluid circuit 3 includes a conductive fluid and a liquid metal or a conductive fluid and a conductive metal powder, and the liquid metal flowing through the conductive fluid circuit 3, such as gallium, gallium alloy, mercury, potassium-sodium alloy, etc., is in a high temperature region generated by the thermal power of the high heat flux density device and a low temperature region generated by the rotational cooling of the cooling fan 5.

In the fourth embodiment, on the basis of the first embodiment, the magnetic field coverage area 4 is implemented by using an electromagnetic field or a permanent magnet, and the magnetic field coverage area 4 is arranged so that the conductive fluid is in a counterclockwise or clockwise direction according to the self direction.

In the fifth embodiment, on the basis of the first embodiment, the heat dissipation fan 5 is an electrically driven forced convection type heat dissipation mechanism, and the heat dissipation fan 5 is arranged to provide a cold source for the conductive fluid, so that a temperature gradient is formed between metal materials with different temperatures.

s2, a cooling fan 5 is arranged on the inner side of the conductive fluid circulation loop to provide a low-temperature region, a heating device 1 is arranged on one outer side of the loop to provide a high-temperature region, a temperature gradient can be formed in the whole red copper metal 2, and according to the Seebeck principle, potential differences are formed among metal materials with different temperatures and current is generated in the conductive fluid;

and S3, under the action of the magnetic field coverage area 4, the conductive fluid is driven to flow in the circulation loop under the action of the electromagnetic force Lorentz force.

The working principle is as follows: when the conductive fluid cooling device works, a conductive fluid circulation loop is arranged above a large heat flow density device to be cooled, the large heat flow density device provides a heat source for the conductive fluid circulation loop, an electric fan provides a cold source for the conductive fluid, temperature gradients are formed between metal materials with different temperatures, a cooling fan 5 is arranged at the inner side of the conductive fluid circulation loop to provide a low-temperature region, a heating device 1 is arranged at one outer side of the loop to provide a high-temperature region, the temperature gradients can be formed in the whole red copper metal 2, according to the Seebeck principle, potential differences are formed between the metal materials with different temperatures and currents are generated in the conductive fluid, the conductive fluid is driven to flow in the circulation loop under the action of electromagnetic force Lorentz force under the action of a magnetic field coverage area 4, the flow direction of the conductive fluid is anticlockwise or clockwise direction related to the direction of a magnetic field, and the flow rate of the conductive fluid is related, and the higher the heating power of the high heat flow density device is, the stronger the driving force generated by the Seebeck effect is, the flow of the conductive fluid is accelerated, so that the heat exchange of the conductive fluid is increased, the self-adaptive adjustment of the flow speed of the conductive fluid along with the power of the high heat flow density device is realized, and in the circulating process, heat is taken away by the convection heat exchange of the electrically-driven forced convection fan above the high heat flow density device.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an utilize magnetic field to realize the device cooling of big heat flow density, includes device (1) that generates heat, its characterized in that: red copper metal (2) is installed at the top of device (1) that generates heat, the surface of red copper metal (2) is provided with conducting fluid return circuit (3), the surface that red copper metal (2) are located conducting fluid return circuit (3) bottom is provided with magnetic field coverage area (4), radiator fan (5) are installed at the top of red copper metal (2).

2. The device for cooling the device with high heat flow density by using the magnetic field according to claim 1, wherein: the red copper metal (2) is made of red copper blocks.

3. The device for cooling the device with high heat flow density by using the magnetic field according to claim 1, wherein: the conductive fluid circuit (3) comprises a conductive fluid and a liquid metal or a conductive fluid and a conductive metal powder.

4. The device for cooling the device with high heat flow density by using the magnetic field according to claim 3, wherein: the conductive fluid is one of gallium, gallium alloy, mercury or potassium-sodium alloy.

5. The device for cooling the device with high heat flow density by using the magnetic field according to claim 1, wherein: the magnetic field coverage area (4) is realized by adopting an electromagnetic field or a permanent magnet.

6. The device for cooling the device with high heat flow density by using the magnetic field according to claim 1, wherein: the heat radiation fan (5) is an electrically driven forced convection type heat radiation mechanism.