CN218041948U - Printed circuit board etching device - Google Patents
Printed circuit board etching device Download PDFInfo
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- CN218041948U CN218041948U CN202221406109.1U CN202221406109U CN218041948U CN 218041948 U CN218041948 U CN 218041948U CN 202221406109 U CN202221406109 U CN 202221406109U CN 218041948 U CN218041948 U CN 218041948U
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- printed circuit
- circuit board
- assembly
- liquid
- etching
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Abstract
The application discloses printed circuit board etching device relates to printed circuit board etching technical field. The printed circuit board etching device comprises: spraying assembly and imbibition subassembly, spraying assembly are used for spraying etching solution to printed circuit board, and the imbibition subassembly includes pipette and sponge gyro wheel, and the sponge gyro wheel sets up around the surface of pipette, and the sponge gyro wheel is used for driving printed circuit board when rotating, and the imbibition subassembly is used for absorbing the etching solution on the printed circuit board. Through set up the sponge gyro wheel at the pipette surface, remaining etching solution can be absorbed the back by the sponge gyro wheel on the printed circuit board, and rethread pipette discharges, because the hydroscopicity of sponge gyro wheel is stronger, and can with printed circuit board direct contact, consequently can get rid of remaining etching solution better, has improved printed circuit board's etching effect.
Description
Technical Field
The application relates to the technical field of printed circuit board etching, in particular to a printed circuit board etching device.
Background
A Printed Circuit Board (PCB) is an important component of an electronic product, and is mainly used as a carrier of electronic components to realize electrical interconnection between the electronic components. In the process of manufacturing a printed circuit board, it is necessary to form a pattern wiring by etching. In the factory production process, the printed circuit board is generally conveyed in a horizontal position, etching liquid is sprayed for etching, and the printed circuit board is horizontally arranged, so that a water pool effect exists on the printed circuit board, and the precision degree of line etching is seriously influenced by the water pool effect. In order to reduce the influence, the related art uses a vacuum suction pipe to suck away the excessive etching solution, but in this way, some etching solution still remains on the printed circuit board, resulting in an undesirable etching effect.
SUMMERY OF THE UTILITY MODEL
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a printed circuit board etching device, which can better remove the residual etching solution on the printed circuit board and improve the etching effect.
According to the printed circuit board etching device of the first aspect embodiment of this application, including: the spraying assembly is used for spraying etching liquid to the printed circuit board; the liquid suction assembly comprises a liquid suction pipe and a sponge roller, the sponge roller is arranged around the outer surface of the liquid suction pipe, the sponge roller is used for driving the printed circuit board when rotating, and the liquid suction assembly is used for sucking etching liquid on the printed circuit board.
According to the printed circuit board etching device of the embodiment of the application, at least the following beneficial effects are achieved: through set up the sponge gyro wheel at the pipette surface, remaining etching solution can be absorbed the back by the sponge gyro wheel on the printed circuit board, and rethread pipette discharges, because the hydroscopicity of sponge gyro wheel is stronger, and can with printed circuit board direct contact, consequently can get rid of remaining etching solution better, has improved printed circuit board's etching effect.
According to some embodiments of the present application, the wicking assembly further comprises: the vacuum pump is connected with the ejector, the ejector is connected with the air guide pipe, and the air guide pipe is connected with the pipette.
According to some embodiments of the present application, the printed circuit board etching apparatus further comprises: the liquid storage tank is connected with the spraying assembly and used for providing etching liquid for the spraying assembly.
According to some embodiments of the application, the liquid reservoir is connected to the liquid outlet of the ejector.
According to some embodiments of the present application, the printed circuit board etching apparatus further comprises: and the moving assembly is connected with the liquid suction assembly and is used for adjusting the distance between the liquid suction assembly and the printed circuit board.
According to some embodiments of the application, the pipette has a plurality of pipette holes disposed on an outer surface thereof.
According to some embodiments of the present application, the material of the sponge roller is polyurethane plastic.
According to some embodiments of the present application, the spray assembly includes a plurality of spray heads, each of the spray heads being positionally fixed with respect to the wicking assembly.
According to some embodiments of the present application, the printed circuit board etching apparatus further comprises: a transfer roller, the printed circuit board including a first side and a second side, the wicking assembly for contacting the first side, the transfer roller for contacting the second side.
According to some embodiments of the present application, the wicking assembly is staggered from the position of the transfer roller.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic view of an apparatus for etching a printed circuit board according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of a wicking assembly according to an embodiment of the present application;
FIG. 3 is a schematic view of a PCB etching apparatus according to another embodiment of the present application.
Reference numerals are as follows:
the spraying assembly 100, the liquid suction assembly 200, the printed circuit board 300 and the transmission roller 400;
a pipette 210, a sponge roller 220, a vacuum pump 230, an ejector 240, and an air duct 250.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that the positional descriptions referred to, for example, the directions or positional relationships indicated by upper, lower, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and larger, smaller, larger, etc. are understood as excluding the present numbers, and larger, smaller, inner, etc. are understood as including the present numbers. If there is a description of first and second for the purpose of distinguishing technical features only, this is not to be understood as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In some embodiments, referring to fig. 1, the present application provides a printed circuit board etching apparatus, including: the spraying assembly 100 is used for spraying the etching liquid to the printed circuit board 300, the liquid absorption assembly 200 comprises a liquid suction pipe 210 and a sponge roller 220, the sponge roller 220 is arranged around the outer surface of the liquid suction pipe 210, the sponge roller 220 is used for driving the printed circuit board 300 when rotating, and the liquid absorption assembly 200 is used for absorbing the etching liquid on the printed circuit board 300.
The spray assembly 100 sprays the etching solution onto the printed circuit board 300 through the spray head to etch the wiring. The pipette 210 and the sponge roller 220 of the embodiment of the application are both cylindrical, the center axis of the pipette 210 coincides with the center axis of the sponge roller 220, and the sponge roller 220 can be driven by a driving source to rotate. Sponge gyro wheel 220 among imbibition subassembly 200 of this application embodiment sets up to two sets ofly, and corresponds two sides that set up at printed circuit board 300 respectively, and the space that forms between two sets of sponge gyro wheels 220 is used for centre gripping printed circuit board 300, when sponge gyro wheel 220 rotated, can drive printed circuit board 300 motion. It is understood that the two sets of sponge rollers 220 may be disposed opposite to each other or staggered from each other, and both can hold the printed circuit board 300 and drive the printed circuit board 300 to move. The pipette 210 has a through hole, which is formed in the outer surface thereof to allow the etching solution to pass therethrough, and may have a shape of a long hole, a circular hole, or the like, which may be changed according to the user's setting.
The printed circuit board etching device of the embodiment of the application can continuously spray the etching solution to the printed circuit board 300 when working, the sponge roller 220 drives the printed circuit board 300 to move, the sponge roller 220 absorbs the residual etching solution on the printed circuit board 300 through the self high water absorption, and meanwhile, the pipette 210 absorbs the etching solution on the sponge roller 220 through the self generated vacuum negative pressure, so that the etching solution absorbed by the sponge roller 220 is timely discharged, and the water absorption of the sponge roller 220 is maintained. And the sponge roller 220 may directly contact the printed circuit board 300 when in use, so that the residual etching solution on the printed circuit board 300 may be better removed, thereby improving the etching effect of the printed circuit board 300.
In some embodiments, referring to FIG. 2, the wicking assembly 200 further comprises: the vacuum pump 230 is connected with the ejector 240, the ejector 240 is connected with the air duct 250, and the air duct 250 is connected with the pipette 210. The negative pressure generated by the vacuum pump 230 is transmitted into the air duct 250 through the ejector 240, after the air duct 250 is connected with the pipette 210, the etching liquid in the pipette 210 can be sucked out, and the ejector 240 can discharge the sucked etching liquid from the liquid outlet.
In some embodiments, the printed circuit board etching apparatus further comprises: and the liquid storage tank is connected with the spraying assembly 100 and is used for supplying etching liquid to the spraying assembly 100. The liquid storage tank stores etching liquid, and the liquid storage tank conveys the etching liquid to the spraying assembly 100 through a conduit.
In some embodiments, the liquid outlet of the jet 240 is connected to a reservoir. By discharging the etching solution sucked by the ejector 240 into the liquid storage tank again, the etching solution can be recycled, thereby reducing the consumption of the etching solution. It is understood that in some other embodiments, the etching solution sprayed and dropped may be collected and stored in the liquid storage tank for recycling.
In some embodiments, the printed circuit board etching apparatus further comprises: a moving assembly connected to the pipetting assembly 200 for adjusting the distance between the pipetting assembly 200 and the printed circuit board 300. The moving assembly is fixedly connected with the liquid suction assembly 200, and the moving assembly can adjust the distance between the liquid suction assembly 200 and the printed circuit board 300 through a movement control mechanism, namely, the size of a gap for accommodating the printed circuit board 300 can be adjusted. The user can flexibly adjust the degree of pressing force when the sponge roller 220 is in contact with the printed circuit board 300 according to the thickness and type of the printed circuit board 300.
In some embodiments, the pipette 210 has a plurality of pipette holes disposed on an outer surface thereof. The liquid absorbing holes can be circular holes, strip-shaped holes, rhombic holes and the like and can be arranged randomly.
In some embodiments, the material of the sponge roller 220 is polyurethane plastic. The polyurethane plastic has better acid and alkali resistance, so the polyurethane plastic has longer service life.
In some embodiments, the spray assembly 100 includes a plurality of spray heads, each of which is fixed in position to the wicking assembly 200. The spray assembly 100 of the embodiment of the present application performs a large-area etching solution spray by providing a plurality of fixed nozzles, thereby etching a plurality of printed circuit boards 300. In some other embodiments, the effect of spraying the etching solution in a large area can be achieved by a movable spray head.
Some embodiments, referring to fig. 3, the printed circuit board etching apparatus further comprises: a transfer roller 400, the printed circuit board 300 including a first side and a second side, the wicking assembly 200 for contacting the first side, the transfer roller 400 for contacting the second side. In the embodiment of the present application, the first side is a side that is vertically upward when the printed circuit board 300 is horizontally placed, and the second side is a side that is vertically downward and is opposite to the first side. It is understood that, during the process of etching the printed circuit board 300, the spray assembly 100 sprays the etching solution toward the second side to etch the printed circuit board 300, and the excessive etching solution is separated from the printed circuit board 300 by gravity, so that the etching solution is not accumulated on the printed circuit board 300. Therefore, only the transfer roller 400 having a transfer function for carrying the printed circuit board 300 may be provided at the second side position of the printed circuit board 300. The transfer roller 400 may be a solid roller driven by a helical gear, a disc roller, or a sponge roller without a pipette, and only needs to have a function of transferring a printed circuit.
In some embodiments, the wicking assembly 200 is staggered with respect to the position of the transfer roller 400. The spaces between the plurality of transfer rollers 400 correspond to the suction assembly 200, and the transfer rollers 400 are positioned to be staggered with respect to the suction assembly 200 for transferring the printed circuit board 300. In some other embodiments, the position of the wicking assembly 200 and the transfer roller 400 can be opposite. It is understood that the number of the liquid suction assembly 200 and the transfer roller 400 provided in the printed circuit board etching apparatus may be changed according to the user's needs, and is not limited thereto.
In the description of the present application, reference to the description of "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present application. Furthermore, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Claims (10)
1. Printed circuit board etching apparatus, characterized by, includes:
the spraying assembly is used for spraying etching liquid to the printed circuit board;
the liquid suction assembly comprises a liquid suction pipe and a sponge roller, the sponge roller is arranged around the outer surface of the liquid suction pipe, the sponge roller is used for driving the printed circuit board when rotating, and the liquid suction assembly is used for sucking etching liquid on the printed circuit board.
2. The printed circuit board etching apparatus of claim 1, wherein the wicking assembly further comprises: the vacuum pump is connected with the ejector, the ejector is connected with the air guide pipe, and the air guide pipe is connected with the liquid suction pipe.
3. The printed circuit board etching apparatus of claim 2, further comprising: the liquid storage tank is connected with the spraying assembly and used for providing etching liquid for the spraying assembly.
4. A printed circuit board etching apparatus according to claim 3, wherein the liquid outlet of the ejector is connected to the liquid reservoir.
5. The printed circuit board etching apparatus of claim 1, further comprising: the moving assembly is connected with the liquid suction assembly and used for adjusting the distance between the liquid suction assembly and the printed circuit board.
6. The printed circuit board etching apparatus according to claim 1, wherein the pipette is provided on an outer surface thereof with a plurality of pipette holes.
7. The printed circuit board etching apparatus of claim 1, wherein the material of the sponge roller is polyurethane plastic.
8. The printed circuit board etching apparatus of claim 1, wherein the spray assembly comprises a plurality of spray heads, each spray head being fixed in position to the wicking assembly.
9. The printed circuit board etching apparatus according to any one of claims 1 to 8, further comprising: a transfer roller, the printed circuit board including a first side and a second side, the wicking assembly for contacting the first side, the transfer roller for contacting the second side.
10. The printed circuit board etching apparatus of claim 9, wherein the position of the wicking assembly is staggered with respect to the position of the transport roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221406109.1U CN218041948U (en) | 2022-06-07 | 2022-06-07 | Printed circuit board etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221406109.1U CN218041948U (en) | 2022-06-07 | 2022-06-07 | Printed circuit board etching device |
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| Publication Number | Publication Date |
|---|---|
| CN218041948U true CN218041948U (en) | 2022-12-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221406109.1U Active CN218041948U (en) | 2022-06-07 | 2022-06-07 | Printed circuit board etching device |
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| CN (1) | CN218041948U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241483A (en) * | 2023-10-25 | 2023-12-15 | 广东达源设备科技有限公司 | Spraying device and method for circuit board production |
-
2022
- 2022-06-07 CN CN202221406109.1U patent/CN218041948U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241483A (en) * | 2023-10-25 | 2023-12-15 | 广东达源设备科技有限公司 | Spraying device and method for circuit board production |
| CN117241483B (en) * | 2023-10-25 | 2024-04-12 | 广东达源设备科技有限公司 | Spraying device and method for circuit board production |
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