CN218001029U - Heat dissipation support - Google Patents

Abstract

The utility model belongs to the technical field of radiators, and relates to a heat dissipation bracket, which comprises a shell, a telescopic component and a refrigerating device, wherein a first holding tank is arranged in the shell, the telescopic component is arranged in the first holding tank along the depth direction of the first holding tank, and one part of the refrigerating device is arranged in the first holding tank and is connected with the telescopic component; when external equipment is placed on the supporting surface of the shell, under the action of the telescopic assembly, the heat conducting plate of the refrigerating device can be abutted against the bottom surface of the external equipment, and when the refrigerating device is attached to the external equipment, the refrigerating surface of the refrigerating piece can refrigerate the external equipment through the heat conducting plate, and meanwhile, the heat of the external equipment is reversely conducted to the heating surface of the refrigerating piece through the heat conducting plate so as to be radiated through the radiating assembly. This heat dissipation support makes the heat-conducting plate tightly laminate the bottom surface at external equipment through flexible subassembly, strengthens the heat-conduction of heat-conducting plate and external equipment to improve the radiating effect of refrigeration piece to external equipment.

Description

Heat dissipation support

Technical Field

The utility model relates to a radiator technical field especially relates to a heat dissipation support.

Background

At present, most of the existing heat dissipation supports in the market adopt a fan device to directly blow heat away from the bottom of the electronic equipment, so that the heat of the electronic equipment is forced to be blown out, cold air is introduced, and air flow at the bottom of the electronic equipment is increased, so that all heating elements in the electronic equipment are all cooled. In addition, the bottom surface of the electronic device is usually provided with supporting legs, and the bottom of the electronic device is lifted by the supporting legs, so that the bottom surface of the electronic device is prevented from being scratched.

However, when the electronic device is placed on the heat dissipation support, due to the lifting relationship of the support legs, the bottom surface of the electronic device and the heat dissipation support are spaced, the heat conductivity of air is poor, when the fan of the heat dissipation support blows cold air to the bottom surface of the electronic device, the air in the cold air mixing gap is limited, and the heat conductivity of air and the electronic device is limited, so that the heat dissipation support cannot well cool the electronic device.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solves current heat dissipation support and external equipment laminating inseparable, and leads to the not good technical problem of radiating effect.

In order to solve the technical problem, an embodiment of the utility model provides a heat dissipation support has adopted following technical scheme:

this heat dissipation support includes:

the device comprises a shell, a first accommodating groove is formed in the shell, and an avoiding hole communicated with the first accommodating groove is formed in the shell;

the telescopic assembly is arranged in the first accommodating groove along the depth direction of the first accommodating groove;

a part of the refrigerating device is arranged in the first accommodating groove and is connected with the telescopic assembly; the refrigerating device comprises a refrigerating piece, a radiating assembly and a heat conducting plate, wherein the bottom surface of the refrigerating piece is a heating surface, and the top surface of the refrigerating piece is a refrigerating surface; the heat dissipation assembly is arranged on the heating surface of the refrigeration piece in a covering mode, and the heat conduction plate is arranged on the refrigeration surface of the refrigeration piece in a covering mode;

when external equipment is placed on the supporting surface of the shell, the heat conducting plate of the refrigerating device can be abutted against the bottom surface of the external equipment under the action of the telescopic assembly, and when the refrigerating device is attached to the external equipment, the refrigerating surface of the refrigerating sheet can refrigerate the external equipment through the heat conducting plate, and meanwhile, heat of the external equipment is reversely conducted to the heating surface of the refrigerating sheet through the heat conducting plate so as to be radiated through the radiating assembly.

Further, in some embodiments, the heat conducting plate protrudes from the supporting surface of the housing in whole or in part when an external device is not placed on the supporting surface of the housing.

Further, in a preferable scheme of some embodiments, the telescopic assembly includes a first fixing member, a second fixing member and an elastic member, the first fixing member is mounted in the first accommodating groove, the second fixing member is mounted on the first fixing member through the elastic member, and the first fixing member can be covered by the second fixing member to form an accommodating cavity together with the first fixing member; the refrigerating sheet is inserted in the second fixing piece; the heat dissipation assembly is installed in the accommodating cavity.

Further, in a preferred scheme of some embodiments, the first fixing member is provided with an insertion portion, the second fixing member is provided with an insertion groove matched with the insertion portion, the elastic member is sleeved on the insertion portion, one end of the elastic member abuts against the first fixing member, and the other end of the elastic member abuts against the second fixing member.

Further, in a preferable scheme of some embodiments, a groove is formed on the periphery of the insertion part of the first fixing member, and the elastic member is partially accommodated in the groove when being sleeved on the insertion part.

Further, in a preferable scheme of some embodiments, a mounting groove is concavely formed on a top surface of the second fixing piece, and a through hole is formed in a middle portion of the second fixing piece at a groove bottom of the mounting groove; the heat conducting plate is accommodated in the mounting groove and is matched with the mounting groove;

the refrigeration piece is inserted in the through hole, the heating surface is exposed, the through hole is connected with the heat dissipation assembly in the accommodating cavity, and the refrigeration surface is connected with the bottom surface of the heat conduction plate in the installation groove.

Further, in a preferable scheme of some embodiments, the heat conducting plate is a protecting plate with heat conducting property; or the refrigerating device further comprises a protection plate, and the protection plate covers one surface of the heat conduction plate, which is far away from the refrigerating surface; when the external equipment is placed on the supporting surface of the shell, the protective plate is attached to the bottom surface of the external equipment.

Further, in a preferable scheme of some embodiments, the heat dissipation assembly includes a heat dissipation fin and a heat dissipation fan, a top surface of the heat dissipation fin is disposed on the heat generation surface of the refrigeration fin, and a bottom surface of the heat dissipation fin is disposed with the heat dissipation fan;

the bottom of the first fixing piece is provided with an air inlet and an air outlet which are communicated with the accommodating cavity; the air inlet is used for supplying air to the cooling fan, and the air outlet is used for supplying air to the cooling fan.

Further, in a preferable scheme of some embodiments, the telescopic assembly comprises a driving member and a connecting member, one end of the connecting member is in transmission connection with the driving member, and the other end of the connecting member is in fastening connection with the refrigeration sheet.

Further, in a preferred version of some embodiments, the heat-dissipating bracket further includes a height-adjustable support assembly mounted on the housing.

Compared with the prior art, the embodiment of the utility model provides a heat dissipation support mainly has following beneficial effect:

this heat dissipation support is provided with flexible subassembly, refrigerating plant's a part sets up in first holding tank, and is connected with flexible subassembly. When the external equipment is placed on the supporting surface of the shell, the heat conducting plate of the refrigerating device can be abutted against the bottom surface of the external equipment under the action of the telescopic assembly, and when the refrigerating device is attached to the external equipment, the refrigerating surface of the refrigerating piece can refrigerate the external equipment through the heat conducting plate, and meanwhile, the heat of the external equipment is reversely conducted to the heating surface of the refrigerating piece through the heat conducting plate so as to dissipate heat through the heat dissipation assembly.

By last knowing, refrigerating plant can rely on the effort of flexible subassembly to tightly laminate the bottom surface at external equipment in this heat dissipation support to heat-conduction between heat-conducting plate and the external equipment is strengthened in turn to cold and hot through the refrigeration piece, and then improves the refrigeration piece and to external equipment's radiating effect, relative and fan direct-blow radiating equipment's heat dissipation means, the heat-sinking capability is stronger, takes the radiating equipment temperature to drop lower.

Drawings

In order to illustrate the solution of the present invention more clearly, the drawings needed for describing the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:

fig. 1 is a schematic perspective view of a heat dissipation bracket according to an embodiment of the present invention;

FIG. 2 is an exploded view of the heat sink bracket of FIG. 1;

FIG. 3 is a partially exploded view of the heat sink bracket of FIG. 1;

FIG. 4 is a schematic cross-sectional view of the heat dissipating bracket of FIG. 1;

FIG. 5 is a schematic view of a portion of the heat sink bracket of FIG. 2;

FIG. 6 is a perspective view of the first fastener shown in FIG. 5;

FIG. 7 is a perspective view of the second fastening member of FIG. 5;

fig. 8 is a perspective view of the second fastening member of fig. 5 at another angle.

The reference numbers in the drawings are as follows:

100. a heat dissipation bracket;

10. a housing; 11. a first accommodating groove; 12. avoiding holes; 13. a load bearing panel; 14. a housing body;

20. a telescopic assembly; 21. a first fixing member; 211. a plug-in part; 212. a groove; 22. an elastic member; 23. A second fixing member; 231. inserting grooves; 232. mounting grooves; 233. a through hole; 24. an accommodating chamber;

30. a refrigeration device; 31. refrigerating plates; 32. a heat dissipating component; 321. a heat sink; 322. a heat-dissipating fan; 33. a heat conducting plate; 34. a protection plate;

40. a support assembly; 41. a first support member; 42. a second support member.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, for example, the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or position illustrated in the drawings, which are for convenience of description only and are not to be construed as limiting of the present disclosure.

The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. The meaning of "plurality" is two or more unless specifically limited otherwise.

In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The embodiment of the utility model provides a heat dissipation support 100, this heat dissipation support 100 are used for supporting the electronic product to can dispel the heat to the part that generates heat of electronic product. The electronic product can be various electronic products which are easy to generate heat, such as a notebook computer, a PAD, a game machine and the like. In addition, the heat dissipation bracket 100 is usually placed on a supporting platform such as a table top, a tea table, etc., and belongs to a seat type bracket.

As shown in fig. 1 to 4, the heat dissipation bracket 100 includes a housing 10, a telescopic assembly 20, and a cooling device 30. The housing 10 is used for placing an external device (not shown), and the refrigeration device 30 may be attached to a bottom surface of the external device to dissipate heat.

Wherein, be provided with first holding tank 11 in the shell 10, flexible subassembly 20 sets up in first holding tank 11 along the degree of depth direction of first holding tank 11 to ensure flexible subassembly 20's safe handling, and improve its life. It can be understood that, when the heat dissipation bracket 100 is impacted, the housing 10 can be firstly acted by external force, so as to avoid the direct action of the external force on the telescopic assembly 20, thereby protecting the telescopic assembly 20.

In this embodiment, the outer shell 10 includes a shell body 14 and a bearing panel 13, the shell body 14 is provided with the first receiving groove 11, and the bearing panel 13 covers the shell body 14. Specifically, the bearing panel 13 is fixedly connected to the shell body 14 through a fastener (specifically, a screw, a bolt, or other threaded connector). Of course, in other embodiments, the carrying panel 13 can be covered on the shell body 14 by bonding, fastening, or other suitable means.

In addition, the top wall of the outer shell 10 (specifically, the top surface of the bearing panel 13) is provided with an avoiding hole 12 at the middle part, the avoiding hole is communicated with the first accommodating groove 11, a part of the refrigeration device 30 is arranged in the first accommodating groove 11 and is connected with the telescopic assembly 20, so that the top end of the refrigeration device 30 can move towards the direction close to the external device through the telescopic assembly 20 and passes through the avoiding hole 12 to be abutted against the external device, and heat dissipation of the external device is realized.

It will be appreciated that when heat dissipation from the external device is required, the external device is placed on the supporting surface of the housing 10, and the expansion assembly 20 moves towards the external device, i.e. applies a force towards the external device, so that the refrigeration device 30 is tightly attached to the bottom surface of the external device.

On one hand, the refrigeration device 30 can move to the outside of the casing 10 by the function of the telescopic assembly 20, and is tightly attached to the bottom surface of the external device, so as to improve the heat dissipation effect of the heat dissipation bracket 100; on the other hand, the refrigeration device 30 can be retracted into the housing 10 by the telescopic assembly 20, thereby reducing the overall space occupied by the heat dissipation bracket 100.

In addition, as shown in fig. 3, the refrigeration device 30 includes a refrigeration sheet 31, a heat dissipation assembly 32 and a heat conduction plate 33, the bottom surface of the refrigeration sheet 31 is a heating surface, the top surface is a refrigeration surface, the heat dissipation assembly 32 covers the heating surface of the refrigeration sheet 31, and the heat conduction plate 33 covers the refrigeration surface of the refrigeration sheet 31. It should be noted that the heat dissipating member 32 is used to dissipate heat from the cooling fins 31, and the heat conducting plate 33 is used to engage with an external device to conduct heat.

It can be understood that, when an external device is placed on the supporting surface of the housing 10, the heat conducting plate 33 of the refrigeration device 30 can be abutted against the bottom surface of the external device under the action of the telescopic assembly 20, and when the refrigeration device 30 is attached to the external device, the refrigeration surface of the refrigeration sheet 31 can refrigerate the external device through the heat conducting plate 33, and simultaneously, the heat of the external device is reversely conducted to the heating surface of the refrigeration sheet 31 through the heat conducting plate 33 so as to be dissipated through the heat dissipating assembly 32.

In summary, compared with the prior art, the heat dissipation bracket 100 at least has the following beneficial effects: refrigerating plant 30 can rely on the effort of flexible subassembly 20 to tightly laminate the bottom surface at external equipment in this heat dissipation support 100 to heat-conduction between heat-conducting plate 33 and the external equipment is strengthened in turn to cold and hot through refrigeration piece 31, and then improves the radiating effect of refrigeration piece 31 to external equipment, relative with the heat dissipation means of fan straight blow heat abstractor, the heat-sinking capability is stronger, takes the heat abstractor temperature to drop lower.

In order to make the technical solution of the present invention better understood, the technical solution of the embodiment of the present invention will be clearly and completely described below with reference to fig. 1 to 8.

Embodiment one of the heat dissipating bracket 100 of the present invention

Further, as a specific embodiment of the heat dissipation bracket 100 provided by the present invention, as shown in fig. 1, when the external device is not placed on the supporting surface of the housing 10, the heat conducting plate 33 protrudes from the supporting surface of the housing 10, so as to ensure that the heat conducting plate 33 can be firstly abutted against the bottom surface of the external device when the external device is placed.

It should be noted that, for some external devices with supporting legs, such as notebook computers, when the external device is not placed, the vertical distance between the supporting surface of the housing 10 and the upper surface of the heat conducting plate 33 needs to be greater than the height of the supporting legs of the external device, that is, the height of the heat conducting plate 33 protruding from the housing 10 is greater than the height of the supporting legs of the external device.

Further, as the utility model provides a specific implementation mode of heat dissipation support 100, as shown in fig. 3 and fig. 4, telescopic component 20 includes first mounting 21, second mounting 23 and elastic component 22, first mounting 21 is installed in first holding tank 11, second mounting 23 passes through elastic component 22 and installs on first mounting 21 to can cover and establish first mounting 21, in order to enclose jointly with first mounting 21 and become to hold chamber 24, radiator unit 32 installs in holding chamber 24, refrigeration piece 31 pegs graft on second mounting 23.

It can be understood that, when the external device needs to be radiated, the external device is placed on the supporting surface of the shell 10, the heat conducting plate 33 contacts with the bottom surface of the external device first, then the bottom surface of the external device continuously presses the heat conducting plate 33, the first fixing member 21 is stressed to extrude the elastic member 22, the elastic member 22 is stressed to compress, the first fixing member 21 moves backwards until the external device abuts against the supporting surface of the shell 10, and finally the external device is released, the external device can press the heat conducting plate 33 by self gravity, so that the elastic member 22 keeps a compressed state, at this time, the heat conducting plate 33 tightly adheres to the bottom surface of the external device due to the reaction force of the elastic member 22, thereby enhancing the heat conduction between the heat conducting plate 33 and the external device, and further improving the radiating effect of the refrigerating sheet 31 on the external device.

Further, as the utility model provides a heat dissipation support 100's a specific implementation mode, as shown in fig. 3 to fig. 8, in order to pinpoint the removal of second mounting 23, first mounting 21 is provided with grafting portion 211, and second mounting 23 is provided with the inserting groove 231 that uses with the cooperation of grafting portion 211, and elastic component 22 cover is established on grafting portion 211, and elastic component 22's one end supports mutually with first mounting 21, and elastic component 22's the other end supports mutually with second mounting 23.

It can be understood that, when the external device is placed on the supporting surface of the housing 10, the heat conducting plate 33 contacts with the bottom surface of the external device, then the bottom surface of the external device continuously presses the heat conducting plate 33, the external force of the second fixing member 23 moves toward the first fixing member 21, and the insertion portion 211 is slowly inserted into the insertion groove 231 as the second fixing member 23 moves, so as to position the movement of the second fixing member 23 and prevent the second fixing member 23 from being displaced.

Meanwhile, because the elastic member 22 is sleeved on the inserting portion 211, and one end of the elastic member 22 abuts against the first fixing member 21, and the other end of the elastic member 22 abuts against the second fixing member 23, the elastic member 22 is compressed by a force, so as to provide an acting force opposite to the moving direction for the second fixing member 23, and the heat conducting plate 33 is tightly attached to the bottom surface of the external device due to a reaction force of the elastic member 22, thereby enhancing the heat conduction between the heat conducting plate 33 and the external device, and further improving the heat dissipation effect of the refrigeration plate 31 on the external device.

In this embodiment, the first fixing element 21 forms a groove 212 on the periphery of the insertion portion 211, and the elastic element 22 is partially accommodated in the groove 212 when being sleeved on the insertion portion 211, so that the elastic element 22 makes a telescopic motion in the groove 212.

Further, as a specific embodiment of the heat dissipation bracket 100 provided by the present invention, as shown in fig. 3 and 7, in order to reduce the occupied space of the heat dissipation bracket 100 due to its compact structure, the top surface of the second fixing member 23 is concavely provided with a mounting groove 232, and the heat conducting plate 33 is accommodated in the mounting groove 232 and is adapted to the mounting groove 232. Specifically, in the embodiment, the heat conducting plate 33 is provided with a first connecting hole (not shown), in the mounting groove 232, the second fixing member 23 is provided with a second connecting hole (not shown) corresponding to the first connecting position, and the fastening member (specifically, a screw-threaded connecting member such as a screw or a bolt) sequentially passes through the first connecting hole and the second connecting hole, so as to fasten the heat conducting plate 33 on the second fixing member 23.

Of course, in other embodiments, the heat conducting plate 33 can also be mounted on the second fixing member 23 by other suitable methods such as bonding, fastening, etc. the present invention is not limited thereto, and the user can select according to the actual use condition.

In addition, the middle part of the second fixing member 23 is provided with a through hole 233 at the bottom of the mounting groove 232, the cooling plate 31 is inserted into the through hole 233, the heating surface is exposed out of the through hole 233 and connected with the heat dissipation assembly 32 in the accommodating cavity 24, and the cooling surface is connected with the bottom surface of the heat conduction plate 33 in the mounting groove 232, so that the cooling plate 31 can reduce the temperature of external equipment through the matching of the cooling surface and the heat conduction plate 33, and can reduce the temperature of the heating surface through the heat dissipation assembly 32.

Further, as a specific embodiment of the heat dissipation bracket 100 provided by the present invention, in order to avoid the problem that the heat conduction plate 33 is worn or scratched when the external device is repeatedly placed or taken, thereby affecting the heat conduction effect of the heat conduction plate 33, in an optional embodiment, the heat conduction plate 33 is a protection plate 34 having heat conduction performance.

Or, in another alternative embodiment, the refrigeration device 30 further includes a protection plate 34, the protection plate 34 covers a surface of the heat conducting plate 33 away from the refrigeration surface, and the protection plate 34 is attached to a bottom surface of the external device when the external device is placed on the supporting surface of the casing 10.

Further, as a specific embodiment of the heat dissipation bracket 100 provided by the present invention, as shown in fig. 5, the heat dissipation assembly 32 includes a heat dissipation plate 321 and a heat dissipation fan 322, and the top surface of the heat dissipation plate 321 is disposed on the heating surface of the cooling plate 31. It can be understood that, when the cooling fins 31 operate, the heat generating surfaces of the cooling fins 31 generate heat, and because the top surfaces of the cooling fins 321 are disposed on the heat generating surfaces of the cooling fins 31, the heat generated by the heat generating surfaces of the cooling fins 31 is transferred to the cooling fins 321, so as to reduce the temperature of the heat generating surfaces of the cooling fins 31.

In addition, in order to further improve the heat dissipation efficiency of the heat dissipation fins 321, the heat dissipation fans 322 are disposed on the bottom surfaces of the heat dissipation fins 321, an air inlet (not shown) and an air outlet (not shown) are disposed at the bottom of the first fixing member 21, the air inlet is used for supplying air to the heat dissipation fans 322, and the air outlet is used for supplying air to the heat dissipation fans 322.

It should be noted that, firstly, the heat dissipation fan 322 blows air outside the first fixing member 21 into the accommodating cavity 24 through the air inlet, then the air entering the accommodating cavity 24 absorbs heat on the heat dissipation fins 321, and finally, the heat dissipation fan 322 exhausts the air absorbing heat from the air outlet, thereby cooling the heat dissipation fins 321. Thus, the heat radiating fins 321 can better radiate heat from the heat generating surface of the cooling fins 31, and the heat radiating efficiency of the heat radiating fins 321 is improved.

In the present embodiment, the heat sink 321 is provided with a plurality of fins (not shown) on a side away from the heat generating surface of the cooling plate 31, the plurality of fins are spaced along the length direction (or width direction) of the heat sink 321, and the heat dissipation fan 322 is located between the plurality of fins. It should be noted that the heat dissipation area of the heat dissipation fins 321 can be increased by the arrangement of the fins, so that the heat dissipation efficiency of the cooling fins 31, that is, the heat dissipation efficiency of the external device, is improved.

Further, as the utility model provides a heat dissipation support 100's a specific implementation mode, as shown in fig. 2, heat dissipation support 100 still includes height-adjustable's supporting component 40, and supporting component 40 installs on shell 10 to make heat dissipation support 100 can be through the arbitrary height-adjustable of supporting component 40, in order to satisfy the user to the demand of co-altitude not, do benefit to the popularization of product.

In this embodiment, the housing body 14 is provided with a second receiving groove (not shown), the supporting component 40 is rotatably mounted in the second receiving groove, and a limiting component (not shown) is disposed in the second receiving groove and is used for limiting the rotation of the supporting component 40. It can be understood that, when the heat dissipation bracket 100 needs to be supported, the user manually rotates the supporting assembly 40 out of the second receiving groove, that is, the limiting of the limiting member is released, and then the supporting assembly 40 is unfolded; when the supporting assembly 40 is not required to support the heat dissipation bracket 100, the user folds the supporting assembly 40 and holds the supporting assembly 40 in the second receiving groove, so as to limit the rotation of the supporting assembly 40 through the limiting member. It should be noted that the user can adjust the supporting height of the supporting assembly 40 according to the required height, thereby satisfying the user's demands for different heights.

In an alternative embodiment, the support assembly 40 includes a first support 41 and a second support 42. In the second receiving groove, the first supporting member 41 and the second supporting member 42 are both rotatably connected to the housing body 14. A plurality of abutting grooves (not shown) are formed on the second supporting member 42, and when one end of the first supporting member 41 is engaged in the abutting groove, the heat dissipation bracket 100 can be stably supported. It should be noted that, a user can select a corresponding abutting groove according to a required height to adjust the supporting height of the supporting assembly 40, so as to meet the requirements of the user for different heights.

Of course, in other embodiments, the supporting component 40 may also be other supporting structures capable of adjusting the height, and the utility model discloses not limiting, the user can select according to the actual use condition.

Embodiment two of the heat dissipation bracket 100 of the present invention

The main technical features of the present embodiment are substantially the same as those of the first embodiment, and the main differences from the first embodiment are as follows:

in the second embodiment, the telescopic assembly 20 includes a driving member (not shown) and a connecting member (not shown), one end of the connecting member is in transmission connection with the driving member, and the other end of the connecting member is fixedly connected with the refrigerating sheet 31. Understandably, when the external device is required to be cooled, the external device is placed on the supporting surface of the shell 10, the driving piece drives the connecting piece to move towards the direction close to the external device, namely, the refrigerating piece 31 is driven to move towards the direction close to the external device, so that the heat conducting plate 33 deviates from the refrigerating surface, and is adsorbed on the bottom surface of the external device, and tightly attached to the bottom surface of the external device, thereby enhancing the heat conduction of the heat conducting plate 33 and the external device, and further improving the cooling effect of the refrigerating device 30 on the external device.

When the external device does not need to be cooled, the driving member drives the connecting member to move in a direction away from the external device, so that the connecting member drives the refrigerating sheet 31 to move in a direction away from the external device, and the abutting between the refrigerating device 30 and the external device is released.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (10)

1. The utility model provides a heat dissipation support which characterized in that, heat dissipation support includes:

the device comprises a shell, a first accommodating groove is formed in the shell, and an avoiding hole communicated with the first accommodating groove is formed in the shell;

the telescopic assembly is arranged in the first accommodating groove along the depth direction of the first accommodating groove;

a part of the refrigerating device is arranged in the first accommodating groove and is connected with the telescopic assembly; the refrigerating device comprises a refrigerating piece, a radiating assembly and a heat conducting plate, wherein the bottom surface of the refrigerating piece is a heating surface, and the top surface of the refrigerating piece is a refrigerating surface; the heat dissipation assembly is arranged on the heating surface of the refrigeration piece in a covering mode, and the heat conduction plate is arranged on the refrigeration surface of the refrigeration piece in a covering mode;

when external equipment is placed on the supporting surface of the shell, the heat conducting plate of the refrigerating device can be abutted against the bottom surface of the external equipment under the action of the telescopic assembly, and when the refrigerating device is attached to the external equipment, the refrigerating surface of the refrigerating sheet can refrigerate the external equipment through the heat conducting plate, and meanwhile, heat of the external equipment is reversely conducted to the heating surface of the refrigerating sheet through the heat conducting plate so as to be radiated through the radiating assembly.

2. The heat dissipation bracket of claim 1, wherein the thermally conductive plate protrudes fully or partially from the support surface of the housing when an external device is not placed on the support surface of the housing.

3. The heat dissipating bracket according to claim 2, wherein the telescopic assembly includes a first fixing member, a second fixing member and an elastic member, the first fixing member is mounted in the first receiving groove, the second fixing member is mounted on the first fixing member through the elastic member, and can cover the first fixing member to form a receiving cavity together with the first fixing member; the refrigerating sheet is inserted in the second fixing piece; the heat dissipation assembly is installed in the accommodating cavity.

4. The heat dissipation bracket as recited in claim 3, wherein the first fixing member is provided with an insertion portion, the second fixing member is provided with an insertion groove used in cooperation with the insertion portion, the elastic member is sleeved on the insertion portion, one end of the elastic member abuts against the first fixing member, and the other end of the elastic member abuts against the second fixing member.

5. The heat dissipating bracket as claimed in claim 4, wherein the first fixing member has a groove formed around the plug portion, and the elastic member is partially received in the groove when the elastic member is sleeved on the plug portion.

6. The heat dissipating bracket of claim 4, wherein a mounting groove is concavely formed on the top surface of the second fixing member, and a through hole is formed in the middle portion of the second fixing member at the bottom of the mounting groove; the heat conducting plate is accommodated in the mounting groove and is matched with the mounting groove;

the refrigeration piece is inserted in the through hole, the heating surface is exposed, the through hole is connected with the heat dissipation assembly in the accommodating cavity, and the refrigeration surface is connected with the bottom surface of the heat conduction plate in the installation groove.

7. The heat dissipating bracket of claim 1, wherein the heat conductive plate is a protective plate having a heat conductive property; or the refrigerating device further comprises a protection plate, and the protection plate is covered on one surface of the heat conduction plate, which is far away from the refrigerating surface; when the external equipment is arranged on the supporting surface of the shell, the protective plate is attached to the bottom surface of the external equipment.

8. The heat dissipation bracket of claim 6, wherein the heat dissipation assembly comprises a heat sink and a heat dissipation fan, wherein a top surface of the heat sink is disposed on the heat generating surface of the refrigeration plate, and a bottom surface of the heat sink is disposed with the heat dissipation fan;

the bottom of the first fixing piece is provided with an air inlet and an air outlet which are communicated with the accommodating cavity; the air inlet is used for supplying air to the cooling fan, and the air outlet is used for supplying air to the cooling fan.

9. The heat dissipation bracket of claim 1, wherein the telescopic assembly comprises a driving member and a connecting member, one end of the connecting member is in transmission connection with the driving member, and the other end of the connecting member is in fastening connection with the refrigeration sheet.

10. The heat dissipating bracket of any of claims 1 to 9, further comprising a height adjustable support assembly mounted on the housing.

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