CN217983385U

CN217983385U - LED packaging shell capable of obliquely emitting light

Info

Publication number: CN217983385U
Application number: CN202222304117.1U
Authority: CN
Inventors: 廖烨星
Original assignee: Fujian Dingke Photoelectric Technology Co ltd
Current assignee: Fujian Dingke Photoelectric Technology Co ltd
Priority date: 2022-08-31
Filing date: 2022-08-31
Publication date: 2022-12-06
Anticipated expiration: 2032-08-31

Abstract

The utility model relates to a LED packaging shell of slope light-emitting, including the main casing body, the filler block and install the electric conductor between the main casing body and filler block, the light trough that is used for holding LED wafer is offered to the upside of the main casing body, the electric conductor includes electrode layer and pin, the electrode layer extends to in the light trough, the pin is buckled and is wrapped up on the filler block, the electric conductor includes at least one positive electrode electric conductor and at least one negative electrode electric conductor, the electrode layer of positive electrode electric conductor and negative electrode electric conductor all is the type of falling V, it is connected with the pin to go up domatic and the pin on the type of falling V electrode layer, the downhill path of falling V electrode layer extends to in the light trough, LED wafer arranges down domaticly on, therefore, make the light-emitting of LED packaging shell have certain inclination, satisfy customer specific demand, it can play separation steam infiltration simultaneously and prevent that LED from appearing the lamp phenomenon of dying.

Description

LED packaging shell capable of obliquely emitting light

Technical Field

The utility model belongs to the technical field of the LED lamp encapsulation and specifically relates to indicate a LED packaging shell of slope light-emitting.

Background

Current LED wafer packaging shell is glued including the main casing body of taking the light trough, filling block, the conductor of two at least different electrodes, LED wafer and encapsulation and is constituteed, and the conductor is through pre-buried between main casing body and filling block, because the LED wafer is openly to arrange in the light trough bottom flatly, and the LED packaging shell is the packaging structure of positive light-emitting, and the light type generally is the lambertian light type of symmetry. However, in order to meet some specific requirements in the market, such as a certain illumination angle of the LEDs on the edge of the matrix lamp panel or the lamp strip, the prior art generally adds a secondary optical lens, or inclines the edge of the lamp panel or the lamp strip, and the LED package shell is obliquely placed on the edge of the lamp panel or the lamp strip. However, the use of the secondary optical lens will increase the cost and volume, and the change of the edge shapes of the lamp panel and the lamp strip will limit the modeling, assembly, application occasions and the like of the lamp panel and the lamp strip. In addition, under the environment of outdoor morning, steam (water molecule content) is many in the air to because the electrode layer of electric conductor is in the level extends to the light trough, during steam permeates the clearance between encapsulation glue and the light trough inner bottom from the upper surface of metallic conductor's pin easily, the wafer in the light trough is damaged to steam easily, makes LED appear the lamp phenomenon of dying of weing.

SUMMERY OF THE UTILITY MODEL

The utility model provides a LED packaging shell of slope light-emitting, its main aim at provide the LED encapsulation that has certain angle of illumination, satisfy the user demand, still can solve the problem of steam infiltration simultaneously.

In order to solve the technical problem, the utility model adopts the following technical scheme:

the utility model provides a LED packaging shell of slope light-emitting, includes the main casing body, filling block and installs the electric conductor between the main casing body and filling block, the light trough that is used for holding the LED wafer is offered to the upside of the main casing body, the electric conductor includes electrode layer and pin, the electrode layer extends to in the light trough, the pin buckle wrap up in on the filling block, the electric conductor includes at least one positive electrode electric conductor and at least one negative electrode electric conductor, the positive electrode electric conductor is arranged one side of the main casing body, the negative electrode electric conductor is arranged the opposite side of the main casing body, the electrode layer of positive electrode electric conductor and negative electrode electric conductor all is the type of falling V, and the slope surface on the type of falling V electrode layer is connected with the pin, and the downhill path face on the type of falling V electrode layer extends to in the light trough, the LED wafer is arranged on the slope surface under the type electrode layer of positive electrode electric conductor or negative electrode electric conductor.

Further, a wafer groove for placing the LED wafer is formed on the electrode layer through stamping.

Furthermore, a reinforcing rib is arranged between the end parts of the electrode layers of the positive electrode conductor and the negative electrode conductor.

Furthermore, the reinforcing ribs are T-shaped, the end parts of the electrode layers of the positive electrode conductor and the negative electrode conductor are respectively pressed at two ends of each T-shaped reinforcing rib, and the bottoms of the T-shaped reinforcing ribs extend into the filling blocks.

Furthermore, the number of the positive electrode conductors is three, the three positive electrode conductors are arranged on one side of the main shell body side by side at intervals, the number of the negative electrode conductors is three, and the three negative electrode conductors are arranged on the other side of the main shell body side by side at intervals.

Further, the length of the electrode layer of the positive electrode conductor is greater than the length of the electrode layer of the negative electrode conductor, and the LED chip is placed on the electrode layer of the positive electrode conductor.

Furthermore, a plurality of avoiding grooves used for the pins to sink into are formed in the lower side surface of the filling block.

Furthermore, the lower side surface of the filling block is provided with a weight reduction groove.

Compared with the prior art, the utility model discloses the beneficial effect who produces lies in:

1. the utility model discloses positive and negative electrode layer adopts the design of the type of falling V, the type of falling V is gone up domaticly and is connected with the pin, the downhill path extends to the light trough to one side, the LED wafer is put down domaticly on, thereby make the light-emitting of LED packaging shell have certain inclination, satisfy customer specific demand, the last domatic accessible separation steam that goes up of electrode layer simultaneously, make steam be difficult to permeate the light trough in, the interior condensation drop on light trough and LED wafer can't be in the air promptly, thereby avoid the LED encapsulation to wet the damage.

2. The utility model discloses be equipped with T type strengthening rib between the positive and negative electrode layer, T type strengthening rib can play the effect of suppressing positive, negative conductor electrode layer, when preventing that the electric conductor pin from buckling or after the long-term use of LED encapsulation, the problem of the electrode layer tip perk of light inslot electric conductor, and then structure zonulae occludens and the steadiness of strengthening the LED encapsulation shell. In addition, the top surface of the T-shaped reinforcing rib is higher than that of the electrode layer, so that the problem of short circuit caused by the fact that conductive silver adhesive overflows the electrode layer when the LED wafer is installed can be prevented.

3. The utility model discloses the wafer recess that is used for placing the LED wafer is formed in the punching press on the electric conductor electrode layer to wafer location installation and bit conductive silver glue.

Drawings

Fig. 1 is a top view of the present invention.

Fig. 2 isbase:Sub>A sectional view taken along the linebase:Sub>A-base:Sub>A in fig. 1.

Fig. 3 is a bottom view of the present invention.

Wherein the reference numbers in the figures are: the LED chip comprises a main shell 10, a lamp groove 11, a conductor 20, a positive electrode conductor 201, a negative electrode conductor 202, an electrode layer 21, a pin 22, a chip groove 23, a filling block 30, a relief groove 31, a lightening groove 32, an insulating tape 40, a reinforcing rib 50 and an LED chip 60.

Detailed Description

The following describes embodiments of the present invention with reference to the drawings.

Referring to fig. 1 to 3, an oblique light emitting LED package includes a main housing 10, a filling block 30, and an electrical conductor 20 disposed between the main housing 10 and the filling block 30. The upper side of the main housing 10 is opened with a lamp slot 11 for accommodating the LED chip 60, the conductor 20 includes an electrode layer 21 and pins 22, and the electrode layer 21 and the pins 22 are integrally formed. The electrode layer 21 extends into the lamp trough 11, and the leads 22 are bent and wrapped on the filling blocks 30. The conductor 20 comprises at least one positive electrode conductor 201 and at least one negative electrode conductor 202, the positive electrode conductor 201 is arranged on one side of the main shell 10, the negative electrode conductor 202 is arranged on the other side of the main shell 10, the electrode layer 21 of the positive electrode conductor 201 or the electrode layer 21 of the negative electrode conductor 202 adopts an inverted V-shaped design, the upper slope surface of the inverted V-shaped electrode layer 21 is integrally formed with the pin 22, the lower slope surface of the inverted V-shaped electrode layer 21 extends into the lamp slot 11, and the LED chip 60 is arranged on the lower slope surface of the inverted V-shaped electrode layer 21 of the positive electrode conductor 201 or the negative electrode conductor 202. The lower side surface of the filling block 30 is provided with a plurality of avoiding grooves 31, and the pins 22 of the electric conductors 20 are bent to wrap the filling block 30 and then sunken into the avoiding grooves 31, so that the electric conductors 20 firmly grasp the filling block 30, and the structural stability of the packaging shell is improved. The lower side surface of the filling block 30 is further provided with a lightening groove 32, and the lightening groove 32 is used for reducing the weight of the whole packaging shell.

Referring to fig. 1 and 2, in the present embodiment, there are three positive electrode conductors 201, and the three positive electrode conductors 201 are arranged side by side at intervals on one side of the main case 10; the number of the negative electrode conductors 202 is three, and the three negative electrode conductors 202 are arranged on the other side of the main case 10 side by side at intervals. The electrode layers 21 of the adjacent conductors 20 are separated from each other by an insulating tape 40. The length of the electrode layer 21 of the positive electrode conductor 201 is greater than the length of the electrode layer 21 of the negative electrode conductor 202, and the LED chip 60 is placed on the downward slope of the inverted-V-shaped electrode layer 21 of the positive electrode conductor 201. The length of the electrode layer 21 of the positive electrode conductor 201 in the lamp groove 11 is designed to be long, so that the LED chip 60 can be conveniently placed, and the positive and negative electrodes of the conductor 20 can be conveniently and rapidly identified. The electrode layers 21 of the positive and negative electrode conductors (201, 202) form a V-shaped groove bottom design in the lamp groove 11, and the V-shaped groove bottom design enables the space of the lamp groove 11 to be larger, so that the LED wafer 60 can be conveniently placed; meanwhile, by matching with the horn opening with a wide top and a narrow bottom of the lamp groove 11, the horn opening is slightly inclined towards the negative electrode conductor 202, and the design can also enable diffused light to be more easily collected and inclined to emit light when the LED chip 60 is inclined to emit light. In addition, the pins 22 of the electric conductor 20 are connected with the upper slope surface of the electrode layer 21, and water vapor (water molecules in the air) is blocked by the upper slope surface and is difficult to permeate into the lamp trough 11, i.e. water vapor cannot condense water drops on the lamp trough 11 and the LED wafer 60, so that the LED package is prevented from being affected with damp and damaged.

Referring to fig. 1 and 2, a wafer groove 23 for placing the LED wafer 60 is further punched on the lower slope surface of the inverted V-shaped electrode layer 21 of the positive electrode conductor 201, and the wafer groove 23 can facilitate the positioning and mounting of the LED wafer 60, for example, when the wafer is mounted, the conductive silver paste can be dropped into the wafer groove 23 in advance, and then the LED wafer 60 is placed into the wafer groove 23. In addition, a rib 50 is provided between the electrode layer 21 of the positive electrode conductor 201 and the electrode layer 21 of the negative electrode conductor 202, the rib 50 is T-shaped, both ends of the T-shaped rib 50 are respectively pressed against the end portions of the electrode layers 21 of the positive electrode conductor 201 and the negative electrode conductor 202, and the bottom portion of the T-shaped rib 50 extends into the filling block 30. In this embodiment, the T-shaped reinforcing rib 50 may be preferably formed by injection molding integrally with the filling block 30. The T-shaped reinforcing rib 50 can play a role in pressing the electrode layers 21 of the positive and negative conductors 20, so that the problem that the end parts of the electrode layers 21 of the conductors 20 in the lamp groove 11 are tilted when the pins 22 of the conductors 20 are bent or the LED package is used for a long time is prevented, and the tight connection and the stability of the structure of the LED package shell are further enhanced. Furthermore, the top surface of the T-shaped rib 50 is higher than the top surface of the electrode layer 21, and it is possible to prevent the conductive silver paste from overflowing the electrode layer 21 and causing a short circuit problem when the LED chip 60 is mounted.

The aforesaid is only the embodiment of the present invention, but the design concept of the present invention is not limited to this, and it is right to utilize this concept the present invention to perform insubstantial modification, and all belong to infringement the protection scope of the present invention.

Claims

1. The utility model provides a LED packaging shell of slope light-emitting, includes the main casing body, filling block and installs the electric conductor between the main casing body and filling block, the light trough that is used for the holding LED wafer is offered to the upside of the main casing body, the electric conductor includes electrode layer and pin, the electrode layer extends to in the light trough, the pin buckle wrap up in on the filling block, its characterized in that: the electric conductor comprises at least one positive electrode electric conductor and at least one negative electrode electric conductor, the positive electrode electric conductor is arranged on one side of the main shell body, the negative electrode electric conductor is arranged on the other side of the main shell body, the electrode layers of the positive electrode electric conductor and the negative electrode electric conductor are both inverted V-shaped, the upward slope surface of the inverted V-shaped electrode layer is connected with the pins, the downward slope surface of the inverted V-shaped electrode layer extends into the lamp groove, and the LED wafer is arranged on the downward slope surface of the inverted V-shaped electrode layer of the positive electrode electric conductor or the negative electrode electric conductor.

2. The LED package casing for inclined light emission according to claim 1, wherein: and stamping a wafer groove for placing the LED wafer on the electrode layer.

3. The LED package casing for inclined light emission according to claim 1, wherein: and a reinforcing rib is arranged between the end parts of the electrode layers of the positive electrode conductor and the negative electrode conductor.

4. The LED package casing for inclined light emission according to claim 3, wherein: the reinforcing ribs are T-shaped, the end parts of the electrode layers of the positive electrode conductor and the negative electrode conductor are respectively pressed at two ends of each T-shaped reinforcing rib, and the bottoms of the T-shaped reinforcing ribs extend into the filling blocks.

5. The LED package casing for inclined light emission according to claim 1, wherein: the number of the positive electrode conductors is three, the three positive electrode conductors are arranged on one side of the main shell body side by side at intervals, the number of the negative electrode conductors is three, and the three negative electrode conductors are arranged on the other side of the main shell body side by side at intervals.

6. The LED package casing for inclined light emission according to claim 1, wherein: the length of the electrode layer of the positive electrode conductor is larger than that of the electrode layer of the negative electrode conductor, and the LED chip is placed on the electrode layer of the positive electrode conductor.

7. The LED package casing for inclined light emission according to claim 1, wherein: the downside of filling block is seted up a plurality of and is used for the groove of dodging that the pin was absorbed in.

8. The LED package casing for inclined light emission according to claim 1, wherein: and a weight reduction groove is formed in the lower side surface of the filling block.