CN217507378U

CN217507378U - LED wafer packaging shell capable of enhancing adhesive sealing grabbing force

Info

Publication number: CN217507378U
Application number: CN202121194775.9U
Authority: CN
Inventors: 张坤地
Original assignee: Fujian Dingke Photoelectric Technology Co ltd
Current assignee: Fujian Dingke Photoelectric Technology Co ltd
Priority date: 2021-05-31
Filing date: 2021-05-31
Publication date: 2022-09-27
Anticipated expiration: 2031-05-31

Abstract

The utility model provides a can strengthen sealing glue LED wafer packaging shell of grabbing power, including the main casing body, fill piece and a plurality of install the electric conductor between the main casing body and fill piece, the light trough that is used for holding LED wafer and encapsulation to glue is offered to the upside of the main casing body, narrow cup light trough under the width is enclosed into by a plurality of inclined plane to the light trough, transitional coupling has a transition inclined plane between two adjacent inclined planes, the sunken step portion that forms in upper portion on transition inclined plane, the lateral wall of step portion is equipped with the mat face, during the encapsulation, the encapsulation is glued and is filled step portion and closely laminate with the mat face of step portion lateral wall, form four and detain the foot, and detain the foot and closely laminate with the mat face and further strengthen grabbing power, thereby when increasing substantially the fastness of encapsulation glue and light trough, the design of sunken step portion can also avoid the mat face to influence the spotlight effect of light trough.

Description

LED wafer packaging shell capable of enhancing adhesive sealing grabbing force

Technical Field

The utility model belongs to the technical field of the LED lamp encapsulation and specifically relates to indicate a can strengthen sealing glue LED wafer packaging shell of grabbing power.

Background

With the increasing development of LED lighting technology, LEDs are increasingly widely used in people's daily life due to their advantages of long service life, small size, high brightness, etc. The existing LED packaging wafer is generally composed of a packaging shell with a metal conductive electrode, an LED wafer and packaging glue, wherein the packaging shell is provided with a lamp groove, the wafer is placed in the lamp groove and connected with the metal conductive electrode through a metal wire during production, and finally the lamp groove is filled with the transparent packaging glue in a sealing manner to wrap the wafer. However, because the LED is used for long-term illumination or in an outdoor complex environment, after the packaging adhesive is used in an extreme environment of long-term heat radiation or sudden cooling and heating, under the action of internal stress in the cavity, a gap is easily generated between the adhesive and the wall of the cavity, so that the packaging adhesive is loosened or even degummed, and the service life of the LED is affected.

SUMMERY OF THE UTILITY MODEL

The utility model provides a can strengthen sealing glue LED wafer packaging shell of grabbing power, the encapsulation that its main aim at overcome in the current LED wafer packaging shell is glued and the problem that the packaging shell breaks away from easily.

In order to solve the technical problem, the utility model adopts the following technical scheme:

the utility model provides a can strengthen sealing glue LED wafer packaging shell of grabbing power, includes the main casing body, filling block and a plurality of installs the electric conductor between the main casing body and filling block, the light trough that is used for holding LED wafer and encapsulation to glue is offered to the upside of the main casing body, narrow cup light trough under the width is enclosed into by a plurality of inclined plane to the light trough, and transitional coupling has a transition inclined plane between two adjacent inclined planes, the sunken step portion that forms in upper portion on transition inclined plane, the lateral wall of step portion is equipped with the mat face.

Further, the transition inclined plane is an inclined plane or an inclined curved surface.

Further, the inclined curved surface is convex towards the center direction of the lamp groove to form an inclined convex surface.

Furthermore, the inclined curved surface is concave towards the center of the lamp groove in the opposite direction to form an inclined concave surface.

Furthermore, the inclined planes are four inclined planes, the transition inclined planes are four transition inclined planes, the four inclined planes and the four transition inclined planes enclose a rectangular cup-shaped lamp slot, the four inclined planes form four sides of the lamp slot, and the four transition inclined planes form four corners of the lamp slot.

Furthermore, the transition inclined plane of one group of opposite angles of the lamp groove is the inclined convex surface, and the transition inclined plane of the other group of opposite angles of the lamp groove is the inclined concave surface.

Furthermore, a containing groove is formed in the lower side of the main shell, the upper portion of the electric conductor is embedded in the containing groove, the upper portion of the electric conductor bends and extends into the lamp groove, the filling block is filled in the inner side of the electric conductor, the lower portion of the electric conductor bends to form a foot covering portion, the foot covering portion extends to the lower portion of the filling block, and the filling block is clamped on the inner side of the electric conductor.

Further, the lower end of the main shell abuts against the upper end of the foot wrapping part of the conductor.

Compared with the prior art, the utility model discloses the beneficial effect who produces lies in:

1. the utility model discloses a sunken formation step portion in the upper portion on transition inclined plane, the lateral wall of step portion sets up the mat surface, when packing the encapsulation glue and encapsulating toward the light trough intussuseption, the encapsulation glue is filled step portion and closely laminates with the mat surface of step portion lateral wall, form four and detain the foot, and detain the foot and closely laminate with the mat surface and further strengthen grabbing power, thereby when increasing substantially the fastness of encapsulation glue and light trough, the mat surface sets up in the step portion lateral wall of sunken design, can also avoid the mat surface to influence the spotlight effect of light trough.

2. The utility model discloses transition inclined plane adopts slope convex surface and two kinds of design of slope concave surface, and at the packing in-process that the encapsulation was glued, slope convex surface and slope concave surface can form two kinds of symmetries and unique knot foot to further increase the area of contact that the encapsulation was glued and light trough, strengthen the gluey grasp power of encapsulation, further improve the utility model discloses the fastness of structure.

Drawings

Fig. 1 is a top view of the present invention.

Fig. 2 is a sectional view a-a of fig. 1.

Wherein the reference numbers in the figures are: the light-emitting diode comprises a main shell 1, a conductor 2, a filling block 3, an insulating tape 4, a lamp groove 11, a containing groove 12, an electrode layer 21, a foot wrapping part 22, an avoiding groove 31, a lightening groove 32, an inclined surface 111, a transition inclined surface 112, a step part 113, an inclined convex surface 1121 and an inclined concave surface 1122.

Detailed Description

The following describes embodiments of the present invention with reference to the drawings.

Referring to fig. 1 and 2, an LED chip package capable of enhancing adhesive adhesion force includes a main housing 1, a filling block 3, and a plurality of conductors 2 disposed between the main housing 1 and the filling block 3. The upper side of the main housing 1 is provided with a lamp groove 11 for accommodating the LED chip and the packaging adhesive, and the lower side of the main housing 1 is provided with an accommodating groove 12. The upper part of the conductor 2 is embedded in the containing groove 12, the electrode layer 21 on the upper part of the conductor 2 is bent and extended into the lamp groove 11, and the electrode layers 21 of the conductor 2 in the lamp groove 11 are separated from each other by the insulating tape 4. The inside of the electric conductor 2 is filled with the filling block 3, the lower part of the electric conductor 2 is bent to form a wrapping foot part 22, the wrapping foot part 22 extends to the lower part of the filling block 3, the bottom of the filling block 3 is provided with a plurality of avoiding grooves 31, the extending end of the wrapping foot part 22 sinks into the avoiding grooves 31, and therefore the filling block 3 is clamped on the inner side of the electric conductor 2. The lower end of the main case 1 abuts against the upper end of the leg 22 of the conductor 2. The filling block 3 is also provided with a lightening slot 32 for reducing the overall weight of the packaging shell.

Referring to fig. 1 and 2, the light trough 11 is a cup-shaped light trough 11 with a wide upper part and a narrow lower part, the two adjacent light troughs 111 are connected with a transition inclined plane 112 in a transition manner, the upper part of the transition inclined plane 112 is recessed to form a step part 113, and the side wall surface of the step part 113 is provided with a rough surface. The inclined plane 111 of the utility model is a smooth plane, and the transitional inclined plane 112 is a smooth inclined plane or an inclined curved surface, so that the LED lamp can reflect light and focus light; in addition, step portion 113 through the sunken formation in transition inclined plane 112's upper portion, and the mat surface that step portion 113 lateral wall surface set up, when filling the encapsulation glue and encapsulating toward light trough 11, the encapsulation glue is filled step portion 113 and is closely laminated with the mat surface of step portion 113 lateral wall, form four and detain the foot, and detain the foot and closely laminate with the mat surface and further strengthen grabbing power, thereby when increasing substantially encapsulation glue and light trough 11's fastness, the mat surface sets up in the step portion 113 lateral wall of sunken design, can also avoid the mat surface to influence the spotlight effect of light trough 11.

Referring to fig. 1 and 2, in order to further enhance the adhesive capturing force, the transition slope 112 is preferably a slant curved surface in this embodiment. The light trough 11 is a rectangular cup-shaped light trough 11 surrounded by four inclined surfaces 111 and four inclined curved surfaces, the four inclined surfaces 111 form four sides of the light trough 11, and the four inclined curved surfaces form four corners of the light trough 11. Among them, a set of diagonal inclined curved surfaces of the lamp trough 11 is preferably set as inclined convex surfaces 1121 formed by protruding towards the center direction of the lamp trough 11; the other set of diagonal inclined curved surfaces of the lamp well 11 is preferably provided as inclined concave surfaces 1122 formed by recessing in the opposite direction toward the center of the lamp well 11. Slope convex surface 1121 and slope concave surface 1122 can form two kinds of symmetries and unique knot foot at the packing in-process that the encapsulation was glued to further increase the area of contact who encapsulates gluey and light trough 11, strengthen the gluey power of grabbing of encapsulation, further improve the utility model discloses the fastness of structure.

The above-mentioned be the utility model discloses a concrete implementation way, nevertheless the utility model discloses a design concept is not limited to this, and the ordinary use of this design is right the utility model discloses carry out immaterial change, all should belong to the act of infringement the protection scope of the utility model.

Claims

1. The utility model provides a can strengthen sealing glue LED wafer packaging shell of grabbing power, includes main casing body, filling block and a plurality of and installs the electric conductor between main casing body and filling block, the lantern groove that is used for holding LED wafer and encapsulation to glue is offered to the upside of main casing body, its characterized in that: the lamp groove is a cup-shaped lamp groove which is wide at the top and narrow at the bottom and is formed by a plurality of inclined planes, a transition inclined plane is connected between every two adjacent inclined planes in a transition mode, the upper portion of each transition inclined plane is sunken to form a step portion, and the side wall of each step portion is provided with a rough surface.

2. The LED chip package capable of enhancing adhesive attachment force of claim 1, wherein: the transition inclined plane is an inclined plane or an inclined curved surface.

3. The LED chip package capable of enhancing adhesive grip according to claim 2, wherein: the inclined curved surface protrudes towards the center of the lamp trough to form an inclined convex surface, or the inclined curved surface is sunken towards the opposite direction of the center of the lamp trough to form an inclined concave surface.

4. The LED chip package case according to claim 3, wherein the adhesive grip of the LED chip package case is enhanced by: the four inclined planes are four inclined planes, the transition inclined planes are four transition inclined planes, the four inclined planes and the four transition inclined planes enclose a rectangular cup-shaped lamp slot, the four inclined planes form four sides of the lamp slot, and the four transition inclined planes form four corners of the lamp slot.

5. The LED chip package capable of enhancing adhesive grip of claim 4, wherein: the transition inclined planes of one group of opposite angles of the lamp groove are the inclined convex surfaces, and the transition inclined planes of the other group of opposite angles of the lamp groove are the inclined concave surfaces.

6. The LED chip package capable of enhancing adhesive attachment force of claim 1, wherein: the lamp holder is characterized in that a containing groove is formed in the lower side of the main shell, the upper portion of the electric conductor is embedded in the containing groove, the upper portion of the electric conductor bends and extends into the lamp groove, the filling block is filled in the inner side of the electric conductor, the lower portion of the electric conductor bends to form a foot covering portion, the foot covering portion extends to the lower portion of the filling block, and the filling block is clamped in the inner side of the electric conductor.

7. The LED chip package capable of enhancing adhesive grip of claim 6, wherein: the lower end of the main shell abuts against the upper end of the foot wrapping part of the conductor.