CN217954319U - Semiconductor refrigeration piece difference in temperature testing arrangement - Google Patents
Semiconductor refrigeration piece difference in temperature testing arrangement Download PDFInfo
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- CN217954319U CN217954319U CN202222109980.1U CN202222109980U CN217954319U CN 217954319 U CN217954319 U CN 217954319U CN 202222109980 U CN202222109980 U CN 202222109980U CN 217954319 U CN217954319 U CN 217954319U
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Abstract
The utility model discloses a belong to refrigeration piece technical field, specifically be a semiconductor refrigeration piece difference in temperature testing arrangement, it includes base and rack, the top of base is provided with power supply unit and mounting bracket, the top of mounting bracket is provided with the roof, the bottom of roof is provided with the cylinder, the bottom of cylinder is provided with the push rod, the bottom of push rod is provided with the clamp plate, in this application file, be convenient for when the test of semiconductor refrigeration piece difference in temperature, according to the temperature value detection cold face of semiconductor refrigeration piece hot side heat dissipation back different temperatures under to carry out the difference in temperature test to hot side and cold side under the different temperatures, application scope is wide.
Description
Technical Field
The utility model relates to a refrigeration piece technical field specifically is a semiconductor refrigeration piece difference in temperature testing arrangement.
Background
The semiconductor refrigerating sheet is a cooling device composed of semiconductors, and utilizes the characteristics of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple respectively absorb heat and emit heat to realize the purpose of refrigeration.
In the prior art, before semiconductor refrigeration pieces are produced and delivered from factories, temperature difference test needs to be carried out on the semiconductor refrigeration pieces, the semiconductor refrigeration pieces are connected with linear current, cold faces and hot faces are realized on the semiconductor refrigeration pieces through the polarity of the direct current, the higher the temperature of the hot faces of the semiconductor refrigeration pieces is, the higher the temperature of the cold faces is, the temperature difference test is inconvenient to carry out according to the temperature conditions of the cold faces of the hot faces at different temperatures.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the abstract and the title of the present application to avoid obscuring the purpose of this section, the abstract and the title of the present application, and such simplifications or omissions cannot be used to limit the scope of the present invention.
The present invention has been made in view of the above and/or other problems that exist in the existing refrigeration sheet.
Therefore, the utility model aims at providing a semiconductor refrigeration piece difference in temperature testing arrangement can be convenient for when semiconductor refrigeration piece difference in temperature is tested, detects the temperature of cold face according to the temperature value under the different temperatures of semiconductor refrigeration piece hot side heat dissipation back to carry out the difference in temperature test to hot side and cold face under the different temperatures, application scope is wide.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
the utility model provides a semiconductor refrigeration piece difference in temperature testing arrangement, includes base and rack, the top of base is provided with power supply unit and mounting bracket, the top of mounting bracket is provided with the roof, the bottom of roof is provided with the cylinder, the bottom of cylinder is provided with the push rod, the bottom of push rod is provided with the clamp plate, first temperature sensor is installed in the bottom embedding of clamp plate, the rack sets up the top at the base, the inner wall of rack is provided with places the board, the top embedding of placing the board is installed and is second temperature sensor, the bottom of rack inner chamber is provided with the radiating seat, be provided with the conducting strip on the radiating seat, the both sides of rack all are provided with the fan, the output of fan is provided with the tuber pipe, the lateral wall that the rack runs through the tuber pipe, the lateral wall of base is provided with the controller, first temperature sensor (, cylinder, fan and second temperature sensor and controller electric connection.
As a semiconductor refrigeration piece difference in temperature testing arrangement an preferred scheme, wherein: the bottom of the push rod is provided with a buffer plate, the bottom of the buffer plate is provided with a spring, and the pressing plate is arranged at one end of the spring.
As a semiconductor refrigeration piece difference in temperature testing arrangement an preferred scheme, wherein: the rack is provided with heat dissipation holes.
As a semiconductor refrigeration piece difference in temperature testing arrangement an preferred scheme, wherein: the lateral wall of base is provided with the display screen, display screen and controller electric connection.
As a semiconductor refrigeration piece difference in temperature testing arrangement an preferred scheme, wherein: the placing plate is provided with semiconductor refrigerating pieces, and the heat conducting pieces are connected with the side walls of the semiconductor refrigerating pieces.
As a semiconductor refrigeration piece difference in temperature testing arrangement an preferred scheme, wherein: the bottom of base is provided with the support frame, the support frame passes through bolt threaded connection with the bottom of base.
Compared with the prior art: in this application document, 1, be convenient for provide the electric quantity for the semiconductor refrigeration piece through power supply unit, power supply unit passes through the wire with the semiconductor refrigeration piece and is connected, be convenient for operate the push rod through the cylinder, promote the clamp plate through the push rod, make the cold face contact of first temperature sensor on the clamp plate with the semiconductor refrigeration piece, be convenient for detect cold face temperature through first temperature sensor, be convenient for install the semiconductor refrigeration piece through placing the board, the cold face of semiconductor refrigeration piece is hot face up downwards, detect hot face temperature through the second temperature sensor, be convenient for install the conducting strip through the radiating seat, be connected with hot face through the conducting strip, be convenient for transmit the heat of hot face to the radiating seat, discharge heat through the radiating seat, form the circulation cavity through the multiunit conducting strip, be convenient for the circulation of the wind of fan output, thereby be convenient for dispel the heat to the heat on the radiating seat, carry in the tuber pipe, when testing the mounting bracket, be convenient for detect the cold face temperature condition under the different temperature conditions after the heat dissipation of hot face, thereby when testing the temperature difference of the cooling face, it is wide to be convenient for the temperature to reduce the temperature difference and the pressure loss under the buffer plate, thereby it is wide to press the hot plate to reduce the temperature difference of the temperature and the buffer plate, thereby it is wide to be convenient for the temperature to press the temperature to be convenient for the temperature.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
fig. 1 is a schematic structural view of the semiconductor refrigeration sheet temperature difference testing device of the present invention;
fig. 2 is an exploded view of the structure of the temperature difference testing device for semiconductor chilling plates of the present invention;
fig. 3 is a schematic view of a first temperature sensor of the semiconductor refrigeration sheet temperature difference testing device of the present invention;
fig. 4 is a schematic view of a heat-conducting plate of the semiconductor refrigerating plate temperature difference testing device of the present invention;
fig. 5 is the utility model relates to a semiconductor refrigeration piece difference in temperature testing arrangement's spring schematic diagram.
In the figure: 100 bases, 110 power supply equipment, 120 mounting racks, 130 top plates, 140 air cylinders, 150 push rods, 160 pressing plates, 170 first temperature sensors, 200 placing racks, 210 placing plates, 220 second temperature sensors, 230 radiating seats, 240 heat conducting fins, 250 fans, 260 air pipes, 270 controllers, 300 buffer plates, 310 springs, 400 radiating holes and 500 display screens.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the schematic drawings, and in order to describe the embodiments of the present invention in detail, the sectional views showing the device structure will not be enlarged partially according to the general scale for convenience of description, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The utility model provides a semiconductor chilling plate temperature difference testing device, please refer to fig. 1-5, including a base 100 and a rack 200, the top of the base 100 is provided with a power supply device 110 and a mounting rack 120, the top of the mounting rack 120 is provided with a top plate 130, the bottom of the top plate 130 is provided with a cylinder 140, the bottom of the cylinder 140 is provided with a push rod 150, the bottom of the push rod 150 is provided with a press plate 160, the bottom of the press plate 160 is embedded with a first temperature sensor 170, the rack 200 is arranged on the top of the base 100, the inner wall of the rack 200 is provided with a placing plate 210, the top of the placing plate 210 is embedded with a second temperature sensor 220, the bottom of the inner cavity of the rack 200 is provided with a heat dissipation seat 230, the heat dissipation seat 230 is provided with a heat conducting fin 240, both sides of the rack 200 are provided with fans 250, the output ends of the fans 250 are provided with air pipes 260, the air pipes 260 run through the side walls of the rack 200, the controller 270 is disposed on the side wall of the base 100, the first temperature sensor 170, the air cylinder 140, the fan 250 and the second temperature sensor 220 are electrically connected to the controller 270, specifically, the power supply device 110 is used for providing power to the semiconductor chilling plates, the power supply device 110 is connected to the semiconductor chilling plates through a wire, the push rod 150 is used for operating the air cylinder 140, the push rod 150 is used for pushing the press plate 160, so that the first temperature sensor 170 on the press plate 160 is in contact with the cold surfaces of the semiconductor chilling plates, the first temperature sensor 170 is used for detecting the cold surface temperature, the semiconductor chilling plates are used for installing the semiconductor chilling plates through the place plate 210, the cold surfaces of the semiconductor chilling plates face upwards and the hot surfaces downwards, the second temperature sensor 220 is used for detecting the hot surface temperature, the heat conducting plates 240 are used for installing the heat conducting plates 230, the heat conducting plates 240 are connected to the hot surfaces through the heat conducting plates 240, so that the heat of the hot surfaces is transferred to the heat sink 230, carry out the heat of discharging through radiating seat 230, form the circulation cavity through multiunit conducting strip 240, the wind body circulation of fan 250 output of being convenient for, thereby be convenient for dispel the heat to the heat on radiating seat 230, carry in mounting bracket 120 through tuber pipe 260, when the difference in temperature test, be convenient for detect the cold face temperature condition under the different temperature condition behind the hot face heat dissipation, thereby test the refrigeration effect of the cold face of back refrigeration piece of hot face heat dissipation, through controller 270 operating device.
Be provided with louvre 400 on the rack 200, it is specific, through louvre 400 heat in the rack 200 of being convenient for discharge, convenient operation.
The lateral wall of base 100 is provided with display screen 500, and display screen 500 and controller 270 electric connection, it is specific, and the temperature value that first temperature sensor 170 and second temperature sensor 220 detected conveys controller 270, conveys display screen 500 through controller 270, is convenient for observe the temperature value of semiconductor refrigeration piece hot side and cold side through display screen 500, conveniently observes the test.
Place and be provided with the semiconductor refrigeration piece on the board 210, the conducting strip 240 is connected with the lateral wall of semiconductor refrigeration piece, and is specific, through placing board 210 installation semiconductor refrigeration piece, is convenient for make the bottom of semiconductor refrigeration piece unsettled be connected with conducting strip 240, the convenient heat dissipation.
The bottom of base 100 is provided with the support frame, and bolt threaded connection is passed through with the bottom of base 100 to the support frame, and is concrete, is convenient for fixing device through the support frame, has improved the stability of device.
With reference to fig. 1 to 5, the semiconductor chilling plate temperature difference testing apparatus of the present embodiment has the following specific use process: put into the top of placing board 210 with the semiconductor refrigeration piece, the cold side of semiconductor refrigeration piece is up hot side down, use power supply unit 110 to be convenient for provide the electric quantity for the semiconductor refrigeration piece, power supply unit 110 passes through the wire with the semiconductor refrigeration piece and is connected, use cylinder 140 to be convenient for operate push rod 150, use push rod 150 to promote clamp plate 160, make the cold side contact of first temperature sensor 170 on clamp plate 160 and semiconductor refrigeration piece, use first temperature sensor 170 to be convenient for detect the cold side temperature, use second temperature sensor 220 to detect the hot side temperature, use conducting strip 240 to be connected with hot side, be convenient for transmit the heat of hot side to radiating seat 230, use radiating seat 230 to discharge heat, multiunit conducting strip 240 forms the circulation cavity, be convenient for the wind circulation of fan 250 output, thereby be convenient for dispel the heat to the heat on radiating seat 230, the temperature value that first temperature sensor 170 and second temperature sensor 220 detected conveys the controller 270, convey the display screen 500 through the display screen 500, be convenient for observe the hot side of semiconductor refrigeration piece and the cold side, be convenient for when testing the difference in the temperature of cold side, thereby the wide application scope of the cold side and the temperature difference under the test condition, thereby the test of cold side.
Fig. 5 shows the utility model relates to a structure schematic diagram of semiconductor refrigeration piece difference in temperature testing arrangement second kind embodiment, please refer to fig. 5, it is different from above-mentioned embodiment that, the bottom of push rod 150 is provided with buffer board 300, the bottom of buffer board 300 is provided with spring 310, clamp plate 160 sets up the one end at spring 310, specifically, be convenient for carry out the pressure buffering when clamp plate 160 pushes down through buffer board 300 and spring 310, the too big damage that causes the semiconductor refrigeration piece of pressure when preventing clamp plate 160 from pushing down, loss reduction.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (6)
1. The utility model provides a semiconductor refrigeration piece difference in temperature testing arrangement which characterized in that: comprises a base (100) and a placing rack (200), wherein the top of the base (100) is provided with a power supply device (110) and a mounting rack (120), a top plate (130) is arranged at the top of the mounting frame (120), a cylinder (140) is arranged at the bottom of the top plate (130), a push rod (150) is arranged at the bottom of the air cylinder (140), a pressure plate (160) is arranged at the bottom of the push rod (150), a first temperature sensor (170) is embedded and installed at the bottom of the pressure plate (160), the placing rack (200) is arranged on the top of the base (100), a placing plate (210) is arranged on the inner wall of the placing rack (200), a second temperature sensor (220) is embedded and installed at the top of the placing plate (210), the bottom of the inner cavity of the placing frame (200) is provided with a heat radiation seat (230), the heat radiating seat (230) is provided with a heat conducting fin (240), both sides of the placing rack (200) are provided with fans (250), an air pipe (260) is arranged at the output end of the fan (250), the air pipe (260) penetrates through the side wall of the placing rack (200), the side wall of the base (100) is provided with a controller (270), and the first temperature sensor (170), the air cylinder (140), the fan (250) and the second temperature sensor (220) are electrically connected with the controller (270).
2. The semiconductor chilling plate temperature difference testing device according to claim 1, wherein: the bottom of the push rod (150) is provided with a buffer plate (300), the bottom of the buffer plate (300) is provided with a spring (310), and the pressing plate (160) is arranged at one end of the spring (310).
3. The semiconductor chilling plate temperature difference testing device according to claim 1, wherein: the placing rack (200) is provided with heat dissipation holes (400).
4. The semiconductor chilling plate temperature difference testing device according to claim 1, wherein: the lateral wall of base (100) is provided with display screen (500), display screen (500) and controller (270) electric connection.
5. The semiconductor chilling plate temperature difference testing device according to claim 1, wherein: semiconductor refrigeration pieces are arranged on the placing plate (210), and the heat conducting pieces (240) are connected with the side walls of the semiconductor refrigeration pieces.
6. The semiconductor chilling plate temperature difference testing device according to claim 1, wherein: the bottom of base (100) is provided with the support frame, the support frame passes through bolt threaded connection with the bottom of base (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222109980.1U CN217954319U (en) | 2022-08-11 | 2022-08-11 | Semiconductor refrigeration piece difference in temperature testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222109980.1U CN217954319U (en) | 2022-08-11 | 2022-08-11 | Semiconductor refrigeration piece difference in temperature testing arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217954319U true CN217954319U (en) | 2022-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222109980.1U Active CN217954319U (en) | 2022-08-11 | 2022-08-11 | Semiconductor refrigeration piece difference in temperature testing arrangement |
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| Country | Link |
|---|---|
| CN (1) | CN217954319U (en) |
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- 2022-08-11 CN CN202222109980.1U patent/CN217954319U/en active Active
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