CN217917103U

CN217917103U - Low-water-absorption copper-clad plate

Info

Publication number: CN217917103U
Application number: CN202222138185.5U
Authority: CN
Inventors: 张继祖; 张笑吟
Original assignee: Laizhou Pengzhou Electronics Co ltd
Current assignee: Laizhou Pengzhou Electronics Co ltd
Priority date: 2022-08-15
Filing date: 2022-08-15
Publication date: 2022-11-29
Anticipated expiration: 2032-08-15

Abstract

The utility model discloses a low water absorption type copper-clad plate has better heat resistance, and flame retardant efficiency is good, has higher peel strength and lower hydroscopicity simultaneously, has improved product production efficiency, the cost is reduced, including base plate and copper foil, the substrate surface covers there is the heat-conducting layer, the copper foil covers heat-conducting layer surface, base plate from interior to exterior includes paper base, back up coat, fire-retardant layer and compound epoxy layer in proper order, the epoxy layer will including paper base, back up coat, fire-retardant layer parcel. The copper-clad plate has good heat resistance and good flame-retardant effect, and simultaneously has high peel strength and low water absorption, so that the production efficiency of the product is improved, and the cost is reduced.

Description

Low-water-absorption copper-clad plate

Technical Field

The utility model relates to an electronic components technical field, specifically low water absorption type copper-clad plate.

Background

The copper clad laminate is a plate-shaped material which is prepared by soaking a reinforcing material in resin, covering one or two surfaces of the reinforcing material with copper foil and performing hot pressing, and is called a copper clad laminate. The Copper Clad Laminate is a basic material in the electronic industry, is mainly used for manufacturing printed circuit boards and is widely used in electronic products such as televisions, radios, computers, mobile communication and the like, a Copper Clad Laminate (CCL for short in English) is a product formed by using wood pulp paper or glass fiber cloth and the like as a reinforcing material, soaking the wood pulp paper or the glass fiber cloth with resin, coating Copper foil on one side or two sides and carrying out hot pressing, and the Copper Clad Laminate is a basic material in the electronic industry, is mainly used for processing and manufacturing Printed Circuit Boards (PCBs), is widely used in electronic products such as televisions, radios, computers, mobile communication and the like, is easy to break and has an unstable structure.

The copper-clad plate needs to have lower water absorption performance and higher thermal conductivity. The Polytetrafluoroethylene (PTFE) has extremely low water absorption rate and is a very good resin matrix for the high-performance copper-clad plate. The main method for improving the thermal conductivity of the copper-clad plate is to add filler. The larger the addition amount of the filler, the more beneficial the thermal conductivity of the plate is. The probability of microscopic pores on the surface and inside of the plate can be increased by simply increasing the addition amount of the filler, the copper-clad plate has high water absorption after being affected with damp, and the dielectric constant and dielectric loss of the copper-clad plate are affected, so that the signal rate and transmission efficiency are affected, and particularly, the long-acting stability of the water absorption of the copper-clad plate is poor in a high-humidity environment.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above-mentioned not enough, the utility model provides a low water absorption type copper-clad plate herein has better heat resistance, and flame retardant efficiency is good, has higher peel strength and lower hydroscopicity simultaneously, has improved product production efficiency, the cost is reduced.

The utility model is realized in such a way that a low water absorption type copper-clad plate is constructed, which comprises a substrate and a copper foil, wherein the surface of the substrate is covered with a heat conduction layer, and the copper foil is covered on the surface of the heat conduction layer;

the base plate sequentially comprises a paper base, a reinforcing layer, a flame-retardant layer and a composite epoxy resin layer from inside to outside, and the paper base, the reinforcing layer and the flame-retardant layer are wrapped by the epoxy resin layer.

Furthermore, the composite epoxy resin layer is made of a composite material added with 6% of bismaleimide and high brominated epoxy resin EC-14 with bromine content of 8%.

Further, the heat conducting layer is made of heat conducting graphite.

The purpose of this setting is that heat conduction graphite has good heat conductivility, can lead out the heat that the copper-clad plate produced fast.

Furthermore, the material of the reinforcing layer is aluminum-titanium alloy.

The aluminum-titanium alloy has the characteristics of high strength, no fracture, strong flexibility and light specific gravity.

Furthermore, the flame-retardant layer is made of unsaturated resin.

The purpose of this arrangement is that the unsaturated ester will be degraded by a certain amount of heat, resulting in chain degradation or chain breakage, with consequent occurrence of flammable hydrocarbon gases such as styrene, polystyrene dimer, etc., and in addition, there is a non-volatile residue, with escape of flammable gas molecules, many holes are left on the resin body, oxygen in the air is immediately replenished into the resin body, the resin will be further oxidized and degraded by oxygen, and heat energy is released, the temperature of the resin matrix rises, with absorption of external radiant heat and enhancement of oxidative degradation, the reverberation will be developed to the outside from time to time, when this effect reaches a certain level, namely, when encountering external fire source, or the temperature at all accumulates to the critical temperature, the onset of scene extinction will be certainly raised.

Further, the thickness of the copper foil is 7-20 μm, the thickness of the paper base is 10-40 μm, the thickness of the heat conducting layer is 20-30 μm, the thickness of the reinforcing layer is 30-35 μm, the thickness of the flame retardant layer is 20-50 μm, and the thickness of the epoxy resin layer is 5-25 μm.

The purpose of this setting lies in, the performance of copper-clad plate reaches the best under this thickness.

The utility model has the advantages of as follows: the utility model provides a low water absorption type copper-clad plate herein, through setting up compound epoxy layer, epoxy layer can adopt by adding 6% bismaleimide and the high brominated epoxy EC-14's that bromine content is 8% combined material to make for the copper-clad plate has better heat resistance, and flame retardant efficiency is good, has higher peel strength and lower hydroscopicity simultaneously, has improved product production efficiency, thereby the cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 1. paper base; 2. a reinforcement layer; 3. a flame retardant layer; 4. a composite epoxy resin layer; 5. a heat conductive layer; 6. copper foil.

Detailed Description

The present invention will be described in detail with reference to the accompanying fig. 1, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a low water absorption type copper-clad plate through improvement, which comprises a substrate and a copper foil 6, wherein a heat conduction layer 5 is covered on the surface of the substrate, and the copper foil 6 is covered on the surface of the heat conduction layer 5; the substrate sequentially comprises a paper base 1, a reinforcing layer 2, a flame-retardant layer 3 and a composite epoxy resin layer 4 from inside to outside, wherein the paper base 1, the reinforcing layer 2 and the flame-retardant layer 3 are wrapped in the epoxy resin layer 4; the copper-clad plate has better heat resistance and good flame retardant effect when implemented in the mode shown in figure 1, and has higher peel strength and lower water absorption, thereby improving the production efficiency of products and reducing the cost.

In the implementation, the material of the composite epoxy resin layer 4 can be a composite material added with 6% of bismaleimide and high brominated epoxy resin EC-14 with bromine content of 8%.

During implementation, the heat conducting layer 5 is made of heat conducting graphite which has good heat conducting performance and can rapidly guide out heat generated by the copper-clad plate.

During implementation, the reinforcing layer 2 is made of an aluminum-titanium alloy, and the aluminum-titanium alloy has the characteristics of high strength, no fracture, strong flexibility and light specific gravity.

In the implementation, the material of the flame retardant layer 3 is unsaturated resin, unsaturated ester is degraded under the action of certain heat, chain degradation or chain breakage is formed, combustible hydrocarbon gas such as styrene, dimeric styrene and the like is generated as a result, in addition, non-volatile residues are generated, along with the escape of combustible gas molecules, a plurality of holes are left on the resin body, oxygen in the air is immediately supplemented into the resin body, the resin is oxidized and degraded under the action of oxygen, heat energy is released, the temperature of the resin body is increased, along with the absorption of external radiant heat and the enhancement of the oxidative degradation, the reverberation is occasionally carried out to the outside, and when the effect reaches a certain level, namely when an external fire source is met, or the basic temperature is accumulated to the critical temperature, the outbreak of extinguishing scene is certainly caused.

Preferably, the thickness of the copper foil is 7-20 μm, the thickness of the paper base 1 is 10-40 μm, the thickness of the heat conducting layer is 20-30 μm, the thickness of the reinforcing layer 2 is 30-35 μm, the thickness of the flame retardant layer 3 is 20-50 μm, and the thickness of the epoxy resin layer 4 is 5-25 μm, so that the performance of the copper clad laminate is optimal under the thickness.

The working principle is as follows: by arranging the composite epoxy resin layer 4, the epoxy resin layer is made of a composite material added with 6% of bismaleimide and high-brominated epoxy resin EC-14 with bromine content of 8%, so that the copper-clad plate has better heat resistance and good flame retardant effect, and meanwhile, the copper-clad plate has higher peel strength and lower water absorption, improves the production efficiency of products and reduces the cost. The heat conducting layer 5 disperses heat generated by the copper clad laminate, the copper clad laminate is prevented from being over-high in temperature, the heat conducting graphite has good heat conducting performance, the heat generated by the copper clad laminate can be rapidly led out, the flame-retardant layer 3 can prevent the copper clad laminate from spontaneous combustion when the temperature of the copper clad laminate is over-high, the copper clad laminate can be prevented from burning even if the copper clad laminate is on fire, the flame-retardant layer 3 is made of unsaturated resin, unsaturated grease is degraded under the action of certain heat to form chain degradation or chain fracture, combustible hydrocarbon gas such as styrene and polystyrene dimer is generated as a result, in addition, non-volatile residues are also generated, along with the escape of combustible gas molecules, a plurality of holes are reserved on the resin body, oxygen in the air is immediately supplemented into the resin, the resin is subjected to oxidative degradation under the action of oxygen and releases heat energy, the temperature of the resin substrate rises, along with the absorption of external radiant heat and the enhancement of the oxidative degradation, the reverberation is carried out from time to the outside, when the effect reaches a certain level, namely, the external fire source is encountered, or the critical temperature is accumulated to completely push the onset of extinguishment, the reinforcing layer 2 improves the deformation strength, the reinforcing layer 2 is not easy to generate the titanium-aluminum alloy material, and the titanium-aluminum alloy material has the characteristic of light alloy, and the titanium alloy material has the characteristic of light weight and the high strength of the copper clad laminate.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A low water absorption type copper-clad plate is characterized in that; the heat conduction structure comprises a substrate and a copper foil (6), wherein a heat conduction layer (5) is covered on the surface of the substrate, and the copper foil (6) covers the surface of the heat conduction layer (5); the base plate sequentially comprises a paper base (1), a reinforcing layer (2), a flame-retardant layer (3) and a composite epoxy resin layer (4) from inside to outside, wherein the paper base (1), the reinforcing layer (2) and the flame-retardant layer (3) are wrapped by the epoxy resin layer (4).

2. The copper-clad plate with low water absorption according to claim 1, characterized in that; the composite epoxy resin layer (4) is made of a composite material added with 6% of bismaleimide and 8% of high brominated epoxy resin EC-14 containing bromine.

3. The copper-clad plate with low water absorption according to claim 1, characterized in that; the heat conducting layer (5) is made of heat conducting graphite.

4. The copper-clad plate with low water absorption according to claim 1, characterized in that; the material of the reinforcing layer (2) is aluminum-titanium alloy.

5. The copper-clad plate with low water absorption according to claim 1, characterized in that; the flame-retardant layer (3) is made of unsaturated resin.

6. The copper-clad plate with low water absorption according to claim 1, characterized in that; the thickness of the copper foil (6) is 7-20 micrometers, the thickness of the paper base (1) is 10-40 micrometers, the thickness of the heat conducting layer is 20-30 micrometers, the thickness of the reinforcing layer (2) is 30-35 micrometers, the thickness of the flame retardant layer (3) is 20-50 micrometers, and the thickness of the epoxy resin layer (4) is 5-25 micrometers.