CN218838896U

CN218838896U - Copper-clad plate used in high-temperature-resistant and high-humidity environment

Info

Publication number: CN218838896U
Application number: CN202222594921.8U
Authority: CN
Inventors: 徐秀; 熊祖弟; 李诚雨; 袁艳龙; 曹天林; 陈亚军
Original assignee: Linzhou Chengyu Electronic Material Co ltd
Current assignee: Linzhou Chengyu Electronic Material Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-04-11
Anticipated expiration: 2032-09-29

Abstract

The utility model belongs to the technical field of the copper-clad plate is used, concretely relates to copper-clad plate that uses under high temperature resistant, the high humidity environment. The fireproof insulation board comprises a copper foil layer, a flame-retardant layer, a reinforcing layer and a base layer, wherein the copper foil layer, the flame-retardant layer, the reinforcing layer and the base layer are arranged from top to bottom, the main material of the flame-retardant layer is epoxy resin, and the main material of the reinforcing layer is modified phenolic resin. The utility model discloses a main material on fire-retardant layer is epoxy, has the fire resistance, can improve resin cross-linking density simultaneously, and the main material of enhancement layer is modified phenolic resin, can improve the glass transition temperature of gained epoxy cured object, and then improves the dimensional stability, heat resistance, the chemical resistance nature of product, and the main material of basic unit is glass fiber, adds certain aluminium hydroxide simultaneously, has improved the resistant electric leakage mark appearance nature of material, still has certain heat conduction effect.

Description

Copper-clad plate used in high-temperature-resistant and high-humidity environment

Technical Field

The utility model belongs to the technical field of the copper-clad plate is used, concretely relates to copper-clad plate that uses under high temperature resistant, the high humidity environment.

Background

Along with the requirements of people on the use safety and reliability of electronic and electric products, the use environment of the electronic and electric products is more and more severe and has certain uncertainty, and especially if the electronic and electric products are required to be used in occasions of high pressure, high temperature, humidity, filth and the like, the electronic and electric products have certain requirements on the working strength of electronic elements in severe environment.

However, the existing electronic and electrical products are generally difficult to cool and dehumidify, and the copper-clad plate is easy to damage in the long-term work under the high-temperature and high-humidity environment, which causes the shutdown of the electronic and electrical products, so that the copper-clad plate which can be used in the high-temperature and high-humidity environment and can work for a long time under the high-temperature and high-humidity environment needs to be designed.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defect that the existing copper-clad plate works for a long time in high-temperature and high-humidity environments, the technical problem to be solved is as follows: the copper-clad plate can work for a long time in high-temperature and high-humidity environments.

In order to achieve the above object, the utility model provides a following technical scheme: the copper-clad plate used in high temperature and high humidity resistant environment is characterized in that: the fireproof heat-insulating layer comprises a copper foil layer, a flame-retardant layer, an enhancement layer and a base layer, wherein the copper foil layer, the flame-retardant layer, the enhancement layer and the base layer are arranged from top to bottom.

Preferably, a heat dissipation plate is arranged on one side of the base layer, the heat dissipation plate is provided with a plurality of transverse gaps and longitudinal gaps, and the transverse gaps and the longitudinal gaps are arranged in a crossed mode.

Preferably, a waterproof film is attached to the surface of the copper foil layer.

Preferably, the joints of the copper foil layer, the flame-retardant layer, the reinforcing layer, the base layer and the heat dissipation plate are coated with heat-conducting silicone grease.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a main material on fire-retardant layer is epoxy, has the fire resistance, can improve resin cross-linking density simultaneously, and the main material of enhancement layer is modified phenolic resin, can improve the glass transition temperature of gained epoxy cured object, and then improves the dimensional stability, heat resistance, the chemical resistance nature of product, and the main material of basic unit is glass fiber, adds certain aluminium hydroxide simultaneously, has improved the resistant electric leakage mark appearance nature of material, still has certain heat conduction effect.

2. The waterproof membrane is pasted on the surface of the copper-clad plate body, the copper-clad plate body is protected, the heat dissipation plate is arranged at the bottom of the copper-clad plate body, and the bottom of the heat dissipation plate is provided with a criss-cross gap, so that the heat dissipation effect is further improved.

Drawings

FIG. 1 is a cross-sectional view of the copper-clad plate of the present invention;

fig. 2 is a schematic perspective view of the heat dissipating plate of the present invention;

in the figure: 2. a water-resistant film; 3. a copper foil layer; 4. a flame retardant layer; 5. an enhancement layer; 6. a base layer; 10. a heat sink.

Detailed description of the preferred embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides the following technical solutions: the copper-clad plate comprises a copper foil layer 3, a flame-retardant layer 4, an enhancement layer 5 and a base layer 6, wherein the enhancement layer 5 is arranged on the upper side of the base layer 6, the flame-retardant layer 4 is arranged on the upper side of the enhancement layer 5, and the copper foil layer 3 is arranged on the upper side of the flame-retardant layer 4, wherein the main material of the base layer 6 is glass fiber, certain aluminum hydroxide is added, the glass fiber is Lupeng silicate and is inorganic, the glass fiber is not carbonized and leaked to cause traces, the aluminum hydroxide can also cause oxidation-reduction reaction under the action of discharge, free carbon generated in the discharge is oxidized into volatile carbon, the effect of removing carbon on the surface of a substrate is achieved, the generated aluminum oxide has the catalytic effect and the heat conduction effect, the aluminum hydroxide can emit water vapor at high temperature, carbon particles deposited on the surface of the material can be flushed, the decomposition rate of a polymer insulating material and the formation rate of the carbon can be reduced, the tracking resistance of the material can be relatively improved, the main material of the flame-retardant layer 4 is epoxy resin, halogen in the epoxy resin has the flame retardance, the cross-resistant property can be improved, the cross-linked density of the modified phenolic resin, the water-resistant epoxy resin can be further, the size of a condensate film is improved, the heat-resistant and the size of a condensate can be improved, the heat-resistant and the heat-resistant condensate structure of a condensate can be improved, and the heat-resistant condensate can be improved.

The bottom of the base layer 6 is provided with a heat dissipation plate 10, the lower part of the heat dissipation plate 10 is provided with a plurality of transverse gaps and longitudinal gaps, and the transverse gaps and the longitudinal gaps are arranged in a crossed mode, so that the heat dissipation effect of the heat dissipation plate 10 is improved. The joints among the copper foil layer 3, the flame-retardant layer 4, the enhancement layer 5, the base layer 6 and the heat dissipation plate 10 are coated with heat-conducting silicone grease, so that the heat transfer is accelerated, the heat dissipation is carried out by the heat dissipation plate 10, and the working capacity of the copper-clad plate at high temperature is improved.

Through adopting above-mentioned technical scheme, waterproof membrane 2 can be isolated with steam and copper-clad plate surface, fire-retardant layer 4 can prevent that the copper-clad plate from receiving the damage because the temperature is too high, enhancement layer 5 can improve the intensity of copper-clad plate, improve the heat resistance and the chemical resistance nature of copper-clad plate simultaneously, prevent that the copper-clad plate from damaging under the exogenic action, heat conduction silicone grease can be with better the transmitting of heat, thereby on heat transfer to heating panel 10 with on the copper-clad plate, because heating panel 10 lower part has a plurality of transverse gaps and vertical clearance, thereby increase heating panel 10's surface area, make the better heat of following heating panel 10 lower part and discharge.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The copper-clad plate used in high temperature and high humidity resistant environment is characterized in that: the flame-retardant copper foil is characterized by comprising a copper foil layer (3), a flame-retardant layer (4), an enhancement layer (5) and a base layer (6), wherein the copper foil layer (3), the flame-retardant layer (4), the enhancement layer (5) and the base layer (6) are arranged from top to bottom.

2. The copper-clad plate used in high temperature and high humidity resistant environment according to claim 1, characterized in that: the heat dissipation plate (10) is arranged on one side of the base layer (6), the heat dissipation plate (10) is provided with a plurality of transverse gaps and longitudinal gaps, and the transverse gaps and the longitudinal gaps are arranged in a crossed mode.

3. The copper-clad plate used in high temperature and high humidity resistant environment according to claim 1, characterized in that: and the surface of the copper foil layer (3) is pasted with a waterproof film (2).

4. The copper-clad plate used in high temperature and high humidity resistant environment according to claim 2, wherein: and the joint of the copper foil layer (3), the flame-retardant layer (4), the enhancement layer (5), the base layer (6) and the heat dissipation plate (10) is coated with heat-conducting silicone grease.