CN217904379U

CN217904379U - Double-frequency quartz crystal resonator

Info

Publication number: CN217904379U
Application number: CN202221796670.5U
Authority: CN
Inventors: 李挺; 徐亮; 余有前; 吴兵; 潘小龙
Original assignee: Anhui Jingsai Technology Holding Co ltd
Current assignee: Anhui Jingsai Technology Holding Co ltd
Priority date: 2022-07-12
Filing date: 2022-07-12
Publication date: 2022-11-25
Anticipated expiration: 2032-07-12

Abstract

The utility model discloses a dual-frequency quartz crystal syntonizer, including the base, the protruding second locating platform that is used for fixing the first locating platform of first wafer and is used for fixed second wafer that is equipped with in the installation cavity of base, first locating platform and second locating platform highly stagger so that first wafer and second wafer position dodge. The utility model discloses arrange the location platform height of base both sides staggers to make the fixed back opposition that highly staggers of syntonizer of two kinds of different frequencies arrange and position each other and dodge, install the syntonizer of two sets of different frequencies in limited base space, thereby make the changeable back of a syntonizer product possess the frequency of two kinds of differences, reduced the area occupied of circuit board by a wide margin, make things convenient for subsequent circuit design.

Description

Double-frequency quartz crystal resonator

Technical Field

The utility model relates to a semiconductor field specifically is a dual-frequency quartz crystal syntonizer.

Background

The quartz crystal resonator is one kind of electronic element utilizing the piezoelectric effect of quartz crystal to produce high precision oscillation frequency, and belongs to the field of passive element.

Quartz crystal resonators are widely used in integrated circuits as industrial salts. Two resonators, one Mhz product and one Khz product are required to be used simultaneously in many circuit designs, the two products are independently packaged and independently assembled on a circuit board, the area of the circuit board is occupied, and troubles are brought to the circuit design simultaneously, so that a great deal of solution is needed.

Disclosure of Invention

In order to avoid and overcome the technical problems in the prior art, the utility model provides a dual-frequency quartz crystal resonator. The utility model discloses combine the syntonizer product of two kinds of different frequencies, reduced the area occupied of circuit board by a wide margin, convenient subsequent circuit design.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a dual-frequency quartz crystal resonator, includes the base, and the protruding first location platform that is used for fixed first wafer and the second location platform that is used for fixed second wafer that is equipped with in the installation cavity of base, first location platform and second location platform highly stagger so that first wafer and second wafer position dodge.

As a further aspect of the present invention: the height of the first positioning platform is lower than that of the second positioning platform, two groups of the first positioning platforms and two groups of the second positioning platforms are arranged, the two first positioning platforms are arranged at two corner ends of one side of the base installation cavity, and the two second positioning platforms are arranged at two corner ends of the other side of the base installation cavity; the first wafer is a tuning fork type Khz wafer, and the second wafer is a Mhz wafer.

As a further aspect of the present invention: the crystal face of the second wafer is provided with a frequency modulation hole, the vibration arm of the first wafer is located in the projection range of the frequency modulation hole along the vertical direction, the vibration arms of the first wafer and the second wafer are both in a suspension shape, and a gap exists between the second positioning platforms for the insertion of the vibration arm of the first wafer.

As a further aspect of the present invention: and the first positioning platform and the second positioning platform are both provided with adhesive tape holes.

As a further aspect of the present invention: the opening of the base is covered and sealed by the cover body.

As the utility model discloses further scheme again: the base is a ceramic base and is formed by sintering ceramic and a circuit.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses arrange the location platform height of base both sides staggers to can highly stagger after making the syntonizer of two kinds of different frequencies fixed the opposition of highly staggering arrange and position each other dodges, install the syntonizer of two sets of different frequencies in limited base space, thereby make the changeable back of a syntonizer product possess the frequency of two kinds of differences, reduced the area occupied of circuit board by a wide margin, make things convenient for subsequent circuit design.

2. The utility model discloses a two kinds of wafers are the Khz wafer and the Mhz wafer of tuning fork type respectively, through offering the frequency modulation hole on the crystal face at the Mhz wafer for the frequency modulation hole corresponds with the position of vibrating arm, and after two kinds of wafers are fixed, accessible frequency modulation hole is to the first ion etching fine setting frequency of Kkz wafer, and at the Mhz wafer ion etching fine setting frequency to the top, two kinds of wafer frequencies that make the syntonizer all reach the best standard.

3. The utility model discloses the vibration arm that the clearance between two second location platforms can supply first wafer just inserts, and the installation space of the base that the maximize utilized, two sets of wafer highly staggered and the suspension form is arranged, make the product size of syntonizer compacter.

4. The utility model discloses the setting in point gluey hole when convenient point is glued, has improved the adhesion with the wafer, resistance when having reduced the wafer vibration for the wafer obtains more excellent electrical property parameter.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an exploded view of the present invention.

In the figure:

1. a base; 11. a first positioning platform; 12. a second positioning stage; 13. dispensing holes;

2. a first wafer; 3. a second wafer; 31. frequency modulation holes; 4. a cover body.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, in an embodiment of the present invention, a dual frequency quartz crystal resonator includes a base 1, the base 1 is formed by sintering ceramic and a circuit, and the base 1 is plated with gold after the forming. When the base 1 is sintered, two groups of first positioning platforms 11 are formed at two corner ends of one side of an installation cavity of the base 1 respectively, and two groups of second positioning platforms 12 are formed at two corner ends of the other side of the installation cavity respectively.

First locating platform 11 and second locating platform 12 all are provided with two sets ofly, two first locating platform 11 sets up two angle ends in wherein one side in the installation cavity of base 1, two second locating platform 12 sets up two angle ends at the installation cavity opposite side of base 1.

The height of the first positioning platform 11 is lower than that of the second positioning platform 12, the first wafer 2 is a tuning fork type Khz wafer and is fixed on the first positioning platform 11 through conductive adhesive, and the second wafer 3 is an Mhz wafer and is fixed on the second positioning platform 12 through conductive adhesive.

For dispensing, the first positioning platform 11 and the second positioning platform 12 are pre-provided with dispensing holes 13, and after conductive adhesive is dispensed in the dispensing holes 13, the first wafer 2 and the second wafer 3 are carried on the first positioning platform 11 and the second positioning platform 12 and are cured at high temperature.

After the first wafer 2 and the second wafer 3 are fixed, they are opposite to each other in position and are staggered in height, and the main body portion is in a suspended shape.

There is a spacing between the two second positioning stages 12 that is greater than the width of the first wafer 2, so that the vibrating arms of the first wafer 2 are located between the two second positioning stages 12. The second wafer 3 is provided with a tuning hole 31 in advance, and the tuning hole 31 corresponds to the first wafer 2 in the vertical direction.

After the first wafer 2 and the second wafer 3 are fixed, the vibrating arm of the first wafer 2 is subjected to ion etching through the frequency modulation hole 31 to finely adjust the frequency, then the second wafer 3 is subjected to ion etching to finely adjust the frequency, and high-temperature annealing is performed after the frequency fine adjustment is completed to release the stress of the first wafer 2 and the second wafer 3.

The opening of the base 1 is covered and sealed by a cover body 4, the cover body 4 is made of alloy material, and the base is manufactured by electroplating after pressure bearing and forming.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, devices, systems referred to in this application are only used as illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by one skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably herein. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

Claims

1. The dual-frequency quartz crystal resonator is characterized by comprising a base (1), wherein a first positioning platform (11) used for fixing a first wafer (2) and a second positioning platform (12) used for fixing a second wafer (3) are convexly arranged in an installation cavity of the base (1), and the first positioning platform (11) and the second positioning platform (12) are staggered in height so that the first wafer (2) and the second wafer (3) can avoid positions.

2. The dual-frequency quartz crystal resonator according to claim 1, characterized in that the height of the first positioning platform (11) is lower than that of the second positioning platform (12), two sets of the first positioning platform (11) and the second positioning platform (12) are provided, two first positioning platforms (11) are provided at two corner ends of one side of the mounting cavity of the base (1), two second positioning platforms (12) are provided at two corner ends of the other side of the mounting cavity of the base (1); the first wafer (2) is a tuning fork type Khz wafer, and the second wafer (3) is an Mhz wafer.

3. The dual-frequency quartz crystal resonator according to claim 2, wherein a crystal plane of the second wafer (3) is provided with a frequency modulation hole (31), the vibrating arm of the first wafer (2) is located within a projection range of the frequency modulation hole (31) along a vertical direction, the vibrating arms of the first wafer (2) and the second wafer (3) are both in a suspension shape, and a gap is formed between the two second positioning platforms (12) for the vibrating arm of the first wafer (2) to be inserted.

4. The dual-frequency quartz crystal resonator according to any one of claims 1 to 3, characterized in that the first positioning platform (11) and the second positioning platform (12) are provided with dispensing holes (13).

5. A dual frequency quartz crystal resonator according to any of claims 1-3, characterized in that the opening of the base (1) is sealed by a lid (4).

6. The dual frequency quartz crystal resonator according to any of claims 1-3, characterized in that the base (1) is a ceramic base, sintered from ceramic and circuit.