CN203661007U - An all-metal-packaged quartz crystal resonator pad - Google Patents
An all-metal-packaged quartz crystal resonator pad Download PDFInfo
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- CN203661007U CN203661007U CN201320857777.0U CN201320857777U CN203661007U CN 203661007 U CN203661007 U CN 203661007U CN 201320857777 U CN201320857777 U CN 201320857777U CN 203661007 U CN203661007 U CN 203661007U
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- metal
- quartz crystal
- crystal resonator
- spacer body
- insulation spacer
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Abstract
The utility model discloses and provides an all-metal-packaged quartz crystal resonator pad which is simple in structure, high in production efficiency, superior in performance and suitable for scale production and which can promote all-metal-packaged SMD products to develop towards being miniaturized and being of chip-type. The all-metal-packaged quartz crystal resonator pad comprises an insulation pad body (1) made of non-metallic materials and metal electrodes (2) arranged on the insulation pad body (1). The insulation pad body (1) and the metal electrodes (2) are molded through one body injection. The insulation pad body (1) is provided with leading wire apertures (3) for pins to go through and leading wire grooves (4) connected with the conductive wire apertures (3). The all-metal-packaged quartz crystal resonator pad of the utility model can be widely applied to chip-type metal packaged quartz crystal resonators.
Description
Technical field
The utility model relates to a kind of all-metal encapsulated quartz crystal resonator pad.
Background technology
Quartz wafer resonator claims again quartz wafer, is to utilize the piezoelectric effect of quartz wafer and the resonant element made, and it uses together with Resistor-Capacitor Unit with semiconductor device, forms quartz wafer oscillator.Quartz wafer oscillator is the oscillator of high accuracy and high stability, be widely used in all kinds of oscillating circuits such as television set, computer, automobile, and in communication system for frequency generator, provide reference signal for data processing clocking with for particular system.
At present, on surface-mounted integrated circuit, often can use 3225 type chip type SMD quartz wafer resonators, as shown in Figure 1, this quartz-like wafer resonator generally comprises base of ceramic, metal shell, quartz wafer, conducting resinl and metal electrode and makes, this product exists following deficiency: 1, because base of ceramic is different from the thermal coefficient of expansion of metal shell, must eliminate stress through twice high annealing if realize high-precision product requirement, the cost of equipment and the energy consumption that need are higher; 2, packaging technology is complicated; 3, base of ceramic cost is higher, and base of ceramic, mainly by Japanese import, holds at high price at present; 4, quartz wafer adopts the mode of one end 2 glue, anti-drop a little less than.The Miniaturized crystal resonator of the electric resistance welding packaged type generally using in existing electronic applications, product that only can package pin type in electric resistance welding encapsulation process, do not reach the surface mount requirement of modern electronic product, cannot substitute the crystal resonance with base of ceramic.
Utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, provide a kind of simple in structure, production efficiency is high, superior performance, be produced on a large scale, can promote the all-metal encapsulated quartz crystal resonator pad of metal package SMD product to miniaturization and chip type future development.
The technical scheme that the utility model adopts is: the utility model comprises the insulation spacer body of being made up of nonmetallic materials and is arranged on the metal electrode on described insulation spacer body, described insulation spacer body and described metal electrode are integrated injection mo(u)lding, are provided with the fairlead that can pass for pin and the wire lead slot being connected with described fairlead on described insulation spacer body.
Described metal electrode is provided with two, and two described metal electrodes are symmetricly set on described insulation spacer body diagonal angle place.
Described insulation spacer body is made as rectangular configuration, and described fairlead is made as square, rectangle or circular configuration.
Described fairlead is provided with two, and the hole center distance of two described fairleads is 1～5 millimeter.
Described wire lead slot is provided with two, and two described wire lead slots all tilt and are arranged in parallel, and it is 0.1～0.6 millimeter that the width of described wire lead slot is 0.2～1 millimeter, the degree of depth.
The thickness of described insulation spacer body is between 0.35 millimeter to 0.55 millimeter.
Described nonmetallic materials are at least one in polyphenylene sulfide or polyterephthalamide or liquid crystal polymer LCP material.
The beneficial effects of the utility model are: because the utility model comprises the insulation spacer body of being made up of nonmetallic materials and is arranged on the metal electrode on described insulation spacer body, described insulation spacer body and described metal electrode are integrated injection mo(u)lding, on described insulation spacer body, be provided with the fairlead that can pass for pin and the wire lead slot being connected with described fairlead, the utility model is applied in all-metal encapsulated quartz crystal resonator, insulation spacer can be realized respectively insulation with metal pins and be connected two kinds of functions with circuit, can meet metal shell and metal base and carry out electric resistance welding mode, can fully coordinate mounting of electric resistance welding mode Miniaturized crystal resonator surface, substitute the crystal resonator with base of ceramic, so the utility model is simple in structure, production efficiency is high, superior performance, be produced on a large scale, can promote metal package SMD product to little Xingization ﹑ chip type future development.
Accompanying drawing explanation
Fig. 1 is Facad structure schematic diagram of the present utility model;
Fig. 2 is upward view of the present utility model.
Embodiment
As Fig. 1, shown in Fig. 2, the utility model comprises the insulation spacer body 1 of being made up of nonmetallic materials and is arranged on the metal electrode 2 on described insulation spacer body 1, described insulation spacer body 1 is integrated injection mo(u)lding with described metal electrode 2, on described insulation spacer body 1, be provided with the fairlead 3 that can pass for pin and the wire lead slot 4 being connected with described fairlead 3, described metal electrode 2 is provided with two, two described metal electrodes 2 are symmetricly set on described insulation spacer body 1 diagonal angle place, described insulation spacer body 1 is made as rectangular configuration, described fairlead 3 is made as square, rectangle or circular configuration, described fairlead 3 is provided with two, the hole center distance of two described fairleads 3 is 1～5 millimeter, described wire lead slot 4 is provided with two, two described wire lead slots 4 all tilt and are arranged in parallel, the width of described wire lead slot 4 is 0.2～1 millimeter, the degree of depth is 0.1～0.6 millimeter, the thickness of described insulation spacer body 1 is between 0.35 millimeter to 0.55 millimeter, described nonmetallic materials are at least one in polyphenylene sulfide or polyterephthalamide or liquid crystal polymer LCP material.
The utility model can be widely used in chip type metal-packaged quartz crystal resonator.
Claims (6)
1. an all-metal encapsulated quartz crystal resonator pad, described pad comprises the insulation spacer body (1) of being made up of nonmetallic materials and is arranged on the metal electrode (2) on described insulation spacer body (1), described insulation spacer body (1) is integrated injection mo(u)lding with described metal electrode (2), is provided with the fairlead (3) that can pass for pin and the wire lead slot (4) being connected with described fairlead (3) on described insulation spacer body (1).
2. all-metal encapsulated quartz crystal resonator pad according to claim 1, is characterized in that: described metal electrode (2) is provided with two, and two described metal electrodes (2) are symmetricly set on described insulation spacer body (1) diagonal angle place.
3. all-metal encapsulated quartz crystal resonator pad according to claim 1, is characterized in that: described insulation spacer body (1) is made as rectangular configuration, and described fairlead (3) is made as square, rectangle or circular configuration.
4. all-metal encapsulated quartz crystal resonator pad according to claim 1, is characterized in that: described fairlead (3) is provided with two, and the hole center distance of two described fairleads (3) is 1～5 millimeter.
5. all-metal encapsulated quartz crystal resonator pad according to claim 1, it is characterized in that: described wire lead slot (4) is provided with two, two described wire lead slots (4) all tilt and are arranged in parallel, and it is 0.1～0.6 millimeter that the width of described wire lead slot (4) is 0.2～1 millimeter, the degree of depth.
6. all-metal encapsulated quartz crystal resonator pad according to claim 1, is characterized in that: the thickness of described insulation spacer body (1) is between 0.35 millimeter to 0.55 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320857777.0U CN203661007U (en) | 2013-12-24 | 2013-12-24 | An all-metal-packaged quartz crystal resonator pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320857777.0U CN203661007U (en) | 2013-12-24 | 2013-12-24 | An all-metal-packaged quartz crystal resonator pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203661007U true CN203661007U (en) | 2014-06-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320857777.0U Expired - Fee Related CN203661007U (en) | 2013-12-24 | 2013-12-24 | An all-metal-packaged quartz crystal resonator pad |
Country Status (1)
| Country | Link |
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| CN (1) | CN203661007U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716006A (en) * | 2013-12-24 | 2014-04-09 | 珠海东精大电子科技有限公司 | All-metal packaging quartz crystal resonator pad |
-
2013
- 2013-12-24 CN CN201320857777.0U patent/CN203661007U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103716006A (en) * | 2013-12-24 | 2014-04-09 | 珠海东精大电子科技有限公司 | All-metal packaging quartz crystal resonator pad |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20181224 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |