CN203661010U - A 3225-type chip-type SMD quartz crystal resonator - Google Patents
A 3225-type chip-type SMD quartz crystal resonator Download PDFInfo
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- CN203661010U CN203661010U CN201320857779.XU CN201320857779U CN203661010U CN 203661010 U CN203661010 U CN 203661010U CN 201320857779 U CN201320857779 U CN 201320857779U CN 203661010 U CN203661010 U CN 203661010U
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Abstract
The utility model discloses and provides a 3225-type chip-type SMD quartz crystal resonator which is small in size, superior in performance, strong in anti-falling-off performance, simple in packaging technology and relatively low in cost. The quartz crystal resonator comprises a metal pedestal (21), a metal casing (28) arranged on the metal pedestal (21) and welded with the metal pedestal, two oscillators (22) fixedly arranged on the two sides of the metal pedestal (21), a quartz wafer (24) arranged between the two oscillators (22) and an insulation spacer (23) arranged on the bottom portion of the metal pedestal (21). An aperture is arranged in the metal pedestal (21), and an insulator is packaged in the aperture. Leading-out conductive wires of the oscillators (22) are imbedded in the insulator. The leading-out conductive wires are connected to a metal electrode (26) of the quartz wafer (24) through conducting resin (25). The 3225-type chip-type SMD quartz crystal resonator can be widely applied to the field of quartz crystal resonators.
Description
Technical field
The utility model relates to a kind of 3225 type chip type SMD quartz-crystal resonators.
Background technology
Quartz-crystal resonator claims again quartz wafer, is to utilize the piezoelectric effect of quartz wafer and the resonant element made, and it uses together with Resistor-Capacitor Unit with semiconductor device, forms quartz wafer oscillator.Quartz wafer oscillator is the oscillator of high accuracy and high stability, be widely used in all kinds of oscillating circuits such as television set, computer, automobile, and in communication system for frequency generator, provide reference signal for data processing clocking with for particular system.
At present, on surface-mounted integrated circuit, often can use 3225 type chip type SMD quartz-crystal resonators, this quartz-like crystal resonator generally comprises base of ceramic, metal shell, quartz wafer, conducting resinl and metal electrode and makes, this product exists following deficiency: 1, because base of ceramic is different from the thermal coefficient of expansion of metal shell, must eliminate stress through twice high annealing if realize high-precision product requirement, the cost of equipment and the energy consumption that need are higher; 2, packaging technology is complicated; 3, base of ceramic cost is higher, and base of ceramic, mainly by Japanese import, holds at high price at present; 4, quartz wafer adopts the mode of one end 2 glue, anti-drop a little less than.The Miniaturized crystal resonator of the electric resistance welding packaged type generally using in existing electronic applications, product that only can package pin type in electric resistance welding encapsulation process, do not reach the surface mount requirement of modern electronic product, cannot substitute the crystal resonance with base of ceramic.
utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, provides that a kind of volume is smaller, superior performance, anti-dropping capability is strong, packaging technology is simple, cost compare is low 3225 type chip type SMD quartz-crystal resonators.
The technical scheme that the utility model adopts is: the utility model comprises metal base, be arranged on described metal base and the metal shell of its welding, be fixedly installed on both sides on described metal base two oscillators, be arranged on two quartz wafers between described oscillator and be arranged on the insulation spacer of described metal base bottom, described metal base is provided with hole, in described hole, be packaged with insulator, in described insulator, be embedded with the wire of drawing of oscillator, described in draw wire and be connected with the metal electrode on described quartz wafer by conducting resinl.
Described in described quartz wafer is fixed on, draw on the T-shape head of wire, by described conducting resinl with described in draw wire and be connected, thereby make described oscillator, described quartz wafer, described metal electrode form a loop.
Between described metal base and described metal shell, adopt electric resistance welding soldering and sealing structure to be welded and fixed.
Described insulation spacer is insulating glass pearl.
Described metal shell is made up of the punching press of Zn-Cu-Ni alloy strip material.
Described metal base is made up of the punching press of cold-rolled steel sheet material.
The beneficial effects of the utility model are: because the utility model comprises metal base, be arranged on described metal base the metal shell with its welding, be fixedly installed on two oscillators of both sides on described metal base, be arranged on two quartz wafers between described oscillator and be arranged on the insulation spacer of described metal base bottom, described metal base is provided with hole, in described hole, be packaged with insulator, in described insulator, be embedded with the wire of drawing of oscillator, the described wire of drawing is connected with the metal electrode on described quartz wafer by conducting resinl, described quartz wafer and be attached to described metal electrode on described quartz wafer with described in draw wire formation work loop, described metal base and described metal shell composition protection cavity, isolated outside, described insulation spacer makes work loop and cavity insulation, install in the circuit board described oscillator lower end, quartz-crystal resonator and semiconductor device, Resistor-Capacitor Unit forms quartz wafer oscillator, compared with prior art, the metal base that the utility model adopts replaces base of ceramic in the past, the price comparison of producing is low, material is more extensive and difficult to find, leading basic material is without being controlled by foreign enterprise, described metal base is identical with the thermal coefficient of expansion of described metal shell, without eliminating stress through twice high annealing, the cost of equipment and the energy consumption that need are reduced greatly, described metal base and described metal shell can adopt electric resistance welding soldering and sealing and packaging technology is simple, quartz wafer adopts the mode of two-end-point glue, wafer easily produces and breaks when being not easy because of high pressure or impacting, anti-drop is strong, so the utility model volume is smaller, superior performance, anti-dropping capability is strong, packaging technology is simple, cost compare is low.
Brief description of the drawings
Fig. 1 is cutaway view of the present utility model;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is the structural representation of the utility model insulation spacer.
Embodiment
As Fig. 1, Fig. 2, shown in Fig. 3, the utility model 3225 type chip type SMD quartz-crystal resonators comprise metal base 21, oscillator 22, insulation spacer 23, quartz wafer 24, conducting resinl 25, metal electrode 26, metal shell 28, described metal shell 28 is made up of the punching press of Zn-Cu-Ni alloy strip material, described metal base 21 is made up of the punching press of cold-rolled steel sheet material, described metal shell 28 is arranged on described metal base 21 and described metal base 21 electric resistance welding soldering and sealing, described metal base 21 and described metal shell 28 composition protection cavitys, isolated outside, described metal shell 28 is concave structure, described oscillator 22 is fixedly installed on described metal base 21, specifically, described metal base 21 is provided with two holes, described Kong Zhongjun is packaged with insulator, described oscillator 22 is arranged in described insulator, described quartz wafer 24 is arranged between two described oscillators 22, described oscillator 22 includes draws wire, stem and pin three parts, described insulator is wrapped on described stem, the described wire of drawing is " T " font, described in being fixed on, described quartz wafer 24 draws on wire, and by described conducting resinl 25 with described in draw wire and be connected, the described wire of drawing is connected with the metal electrode 26 on described quartz wafer 24 by conducting resinl 25, thereby make described oscillator 22, described quartz wafer 24, described metal electrode 26 forms a loop, described insulation spacer 23 is arranged on described metal base 21 bottoms, described insulation spacer 23 makes work loop and cavity insulation, comprise the insulation spacer body 1 of being made by nonmetallic materials and be arranged on the metal electrode 2 on described insulation spacer body 1, described insulation spacer body 1 is integrated injection mo(u)lding with described metal electrode 2, on described insulation spacer body 1, be provided with the fairlead 3 that can pass for pin and the wire lead slot 4 being connected with described fairlead 3, described metal electrode 2 is provided with two, two described metal electrodes 2 are symmetricly set on described insulation spacer body 1 diagonal angle place, described insulation spacer body 1 is made as rectangular configuration, described fairlead 3 is made as square, rectangle or circular configuration, described fairlead 3 is provided with two, the hole center distance of two described fairleads 3 is 1～5 millimeter, described wire lead slot 4 is provided with two, two described wire lead slots 4 all tilt and are arranged in parallel, the width of described wire lead slot 4 is 0.2～1 millimeter, the degree of depth is 0.1～0.6 millimeter, the thickness of described insulation spacer body 1 is between 0.35 millimeter to 0.55 millimeter, described nonmetallic materials are at least one in polyphenylene sulfide or polyterephthalamide or liquid crystal polymer LCP material.
Preparation technology of the present utility model is: main technique is on described metal base 21, in rammed two holes, to imbed described insulator, by be embedded in described oscillator 22 in described insulator described in draw wire and be connected with the metal electrode 26 on described quartz wafer 24 by conducting resinl 25, by described conducting resinl 25, described quartz wafer point adhesive curing is made it to form loop on described oscillator 22, thereafter described metal shell 28 is formed to closed containing cavity by electric resistance welding, finally on the bottom surface of described metal base 21, overlap the above insulation spacer 23.
The utility model can be widely used in quartz-crystal resonator field.
Claims (4)
1. a type chip type SMD quartz-crystal resonator, it is characterized in that: described quartz-crystal resonator comprises metal base (21), be arranged on described metal base (21) and the metal shell (28) of its welding, be fixedly installed on two oscillators (22) of the upper both sides of described metal base (21), be arranged on the quartz wafer (24) between two described oscillators (22) and be arranged on the insulation spacer (23) of described metal base (21) bottom, described metal base (21) is provided with hole, in described hole, be packaged with insulator, in described insulator, be embedded with the wire of drawing of oscillator (22), the described wire of drawing is connected with the metal electrode (26) on described quartz wafer (24) by conducting resinl (25).
2. 3225 type chip type SMD quartz-crystal resonators according to claim 1, it is characterized in that: described in described quartz wafer (24) is fixed on, draw on the T-shape head of wire, by described conducting resinl (25) with described in draw wire and be connected, thereby make described oscillator (22), described quartz wafer (24), described metal electrode (26) form a loop.
3. 3225 type chip type SMD quartz-crystal resonators according to claim 1, is characterized in that: between described metal base (21) and described metal shell (28), adopt electric resistance welding soldering and sealing structure to be welded and fixed.
4. 3225 type chip type SMD quartz-crystal resonators according to claim 1, is characterized in that: described insulation spacer (23) is insulating glass pearl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320857779.XU CN203661010U (en) | 2013-12-24 | 2013-12-24 | A 3225-type chip-type SMD quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320857779.XU CN203661010U (en) | 2013-12-24 | 2013-12-24 | A 3225-type chip-type SMD quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203661010U true CN203661010U (en) | 2014-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320857779.XU Expired - Fee Related CN203661010U (en) | 2013-12-24 | 2013-12-24 | A 3225-type chip-type SMD quartz crystal resonator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762955A (en) * | 2013-12-24 | 2014-04-30 | 珠海东精大电子科技有限公司 | 3225-type SMD quartz crystal resonator |
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2013
- 2013-12-24 CN CN201320857779.XU patent/CN203661010U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762955A (en) * | 2013-12-24 | 2014-04-30 | 珠海东精大电子科技有限公司 | 3225-type SMD quartz crystal resonator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20181224 |