CN204392206U - Quartz oscillator base with thermistor and quartz oscillator packaging body structure - Google Patents
Quartz oscillator base with thermistor and quartz oscillator packaging body structure Download PDFInfo
- Publication number
- CN204392206U CN204392206U CN201420842610.1U CN201420842610U CN204392206U CN 204392206 U CN204392206 U CN 204392206U CN 201420842610 U CN201420842610 U CN 201420842610U CN 204392206 U CN204392206 U CN 204392206U
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- CN
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- Prior art keywords
- quartz
- controlled
- oscillator
- thermistor
- thick
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 97
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 34
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model relates to a quartz oscillator base with thermistor and a quartz oscillator packaging body structure with thermistor. A quartz oscillator base with a thermistor includes: a substrate; and a thick film thermistor. The quartz oscillator package structure with a thermistor includes: a substrate; a thick film thermistor; a quartz oscillator chip; and an airtight cover. The thermistor is fixedly arranged on the base below the quartz oscillator chip in a thick film mode, so that the fixation of the thermistor can be prevented from falling off, the smoothness of the whole quartz oscillator base or quartz oscillator packaging body structure is improved, and the application range and the use reliability are improved.
Description
Technical field
The utility model relates to and a kind ofly has the quartz (controlled) oscillator pedestal of thermistor and a kind of quartz (controlled) oscillator package body structure with thermistor, particularly a kind of quartz (controlled) oscillator pedestal with thermistor with the first following layer that inorganic matter formed and the second following layer and becket.
Background technology
Quartz (controlled) oscillator is in the application of electronic product, and use amount very large, nearly all electronic product all will be used quartz (controlled) oscillator and use to produce active members all in the clock supplied for electronic product of characteristic frequency.And when using quartz (controlled) oscillator, usually need at least one thermistor, when variation of ambient temperature, carry out revising to clock frequency and finely tune.
But, take a broad view of the framework of the electronic product of existing use, all thermistor to be welded in additional mode or SMT is adhered to on the pedestal of quartz (controlled) oscillator chip position different surfaces.Its shortcoming not only makes the welding of whole pedestal have an impact, and more because the measuring temp representativeness of different surfaces easily has error, therefore thermistor and quartz (controlled) oscillator chip is arranged at different surfaces, and it is very large to the error amount of frequency adjustment for variations in temperature.
In view of this, development and create a kind of can sense the actual temperature of quartz (controlled) oscillator chip and the clock frequency of quartz (controlled) oscillator chip is correctly finely tuned, adhere firm, easy to use, and can be high temperature resistant, what can not affect again integral solder has the quartz (controlled) oscillator pedestal of thermistor and has the quartz (controlled) oscillator package body structure of thermistor, just becomes an important topic on quartz (controlled) oscillator and electronic application product design now.
Summary of the invention
The purpose of this utility model is, a kind of the quartz (controlled) oscillator pedestal with thermistor and quartz (controlled) oscillator package body structure of new structure are provided, technical problem to be solved makes its actual temperature that can sense quartz (controlled) oscillator chip, and can be high temperature resistant, quartz (controlled) oscillator pedestal and the package body structure of integral solder can not be affected again, thus be more suitable for practicality.
The purpose of this utility model and solve its technical problem be adopt following technical scheme realize.According to a kind of quartz (controlled) oscillator pedestal with thermistor that the utility model proposes, it comprises: substrate, it has first surface, the second surface relative with first surface and runs through majority the conductive through hole of substrate to second surface from first surface, substrate includes again: plurality of wires, is formed at first surface and is electrically connected described conductive through hole; Most the first weld pads, to be formed on first surface and to be electrically connected with described wire; And most the second weld pads, be formed on second surface, each second weld pad is corresponding with the first weld pad and is electrically connected by conductive through hole; And thick-film thermistor, be fixedly arranged on first surface, and form series circuit with wire.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid quartz (controlled) oscillator pedestal, wherein this substrate is ceramic substrate.
Aforesaid quartz (controlled) oscillator pedestal, wherein said conductive through hole all fills up with metal paste.
Aforesaid quartz (controlled) oscillator pedestal, wherein this quartz (controlled) oscillator chip is bonded to this first surface with conductive silver glue, not with this thick-film thermistor short circuit.
Aforesaid quartz (controlled) oscillator pedestal, wherein this thick-film thermistor is thick-film type negative tempperature coefficient thermistor.
The purpose of this utility model and solve its technical problem and also adopt following technical scheme to realize.According to a kind of quartz (controlled) oscillator package body structure with thermistor that the utility model proposes, it comprises: substrate, it has first surface, the second surface relative with first surface and runs through majority the conductive through hole of substrate to second surface from first surface, substrate includes again: plurality of wires, is formed at first surface and is electrically connected described conductive through hole; Most the first weld pads, to be formed on first surface and to be electrically connected with described wire; And most the second weld pads, be formed on second surface, each second weld pad is corresponding with first weld pad and is electrically connected by conductive through hole; Thick-film thermistor, is fixedly arranged on first surface, and forms series circuit with wire; Quartz (controlled) oscillator chip, is fixedly arranged on first surface, and is electrically connected with described first weld pad; And air sealing cover, surface thereof have depression and the set limit around this depression, air sealing cover and be bonded to first surface from set limit with airtight involution layer and accommodating quartz (controlled) oscillator chip and thick-film thermistor within depression, wherein quartz (controlled) oscillator chip cover thick-film thermistor not with the short circuit of thick-film thermistor phase, and described wire, described conductive through hole, thick-film thermistor and quartz (controlled) oscillator chip form series/parallel circuit jointly.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid quartz (controlled) oscillator package body structure, wherein this substrate is ceramic substrate.
Aforesaid quartz (controlled) oscillator package body structure, wherein this quartz (controlled) oscillator chip is bonded to this first surface with conductive silver glue, not with this thick-film thermistor short circuit.
Aforesaid quartz (controlled) oscillator package body structure, wherein this thick-film thermistor is thick-film type negative tempperature coefficient thermistor.
Aforesaid quartz (controlled) oscillator package body structure, wherein this air sealing cover by pottery or metal material formed.
Aforesaid quartz (controlled) oscillator package body structure, wherein this airtight involution layer is formed by glass or gold-tin alloy material.
Aforesaid quartz (controlled) oscillator package body structure, wherein this airtight involution layer is square shape.
The utility model compared with prior art has obvious advantage and beneficial effect.By enforcement of the present utility model, following progressive effect can be reached:
1, guarantee that thermistor set does not come off.
2, increase the planarization of overall quartz (controlled) oscillator pedestal or quartz (controlled) oscillator package body structure, increase range of application.
3, the reliability of the application of overall quartz (controlled) oscillator pedestal or quartz (controlled) oscillator package body structure is increased.
4, reduce sensing temperature error, increase the fine setting accuracy of thermistor, reaching the clock frequency that exports quartz (controlled) oscillator chip according to variations in temperature can effect of precise vernier adjustment.
Understand technology contents of the present utility model to make any relevant art of haveing the knack of and implement according to this, and content disclosed by this specification, claim and graphic, any relevant art of haveing the knack of can understand the relevant object of the utility model and advantage easily, therefore will describe detailed features of the present utility model and advantage in embodiments in detail.
Accompanying drawing explanation
Figure 1A is a kind of exploded perspective schematic diagram with the quartz (controlled) oscillator pedestal of thermistor of the utility model embodiment.
Figure 1B is a kind of cross-sectional schematic with the quartz (controlled) oscillator pedestal of thermistor of the utility model embodiment.
Fig. 2 A is a kind of exploded perspective schematic diagram with the quartz (controlled) oscillator package body structure of thermistor of the utility model embodiment.
Fig. 2 B is the schematic perspective view of a kind of air sealing cover of the utility model embodiment.
Fig. 3 is a kind of cross-sectional schematic with the quartz (controlled) oscillator package body structure of thermistor of the utility model embodiment.
[main element symbol description]
100: the quartz (controlled) oscillator pedestal with thermistor
200: the quartz (controlled) oscillator package body structure with thermistor
10: substrate
11: first surface
12: second surface
14: wire
15: the first weld pads
16: the second weld pads
20: conductive through hole
30: thick-film thermistor
40: quartz (controlled) oscillator chip
41: conductive silver glue
50: air sealing cover
51: depression
52: set limit
60: airtight involution layer
Embodiment
As shown in Figure 1A, the present embodiment is a kind of quartz (controlled) oscillator pedestal 100 with thermistor, and it comprises: substrate 10; And thick-film thermistor 30.
As illustrated in figures ia and ib, substrate 10, its majority conductive through hole 20 that there is first surface 11, the second surface 12 relative with first surface 11 and run through substrate 10 to second surface 12 from first surface 11, substrate 10 includes again: plurality of wires 14, is formed at first surface 11 and is electrically connected described conductive through hole 20; Most the first weld pads 15, to be formed on first surface 11 and to be electrically connected with described wire 14; And most the second weld pads 16, be formed on second surface 12, each second weld pad 16 is corresponding with first weld pad 15 and is electrically connected by conductive through hole 20.
Aforesaid substrate 10, can be ceramic substrate, have the advantages such as high temperature resistant, not yielding and airtight.And substrate 10 runs through the conductive through hole 20 of first surface 11 and second surface 12, then can all fill up with metal paste, avoid conductive through hole 20 because leave space, cause extraneous air or moisture to infiltrate, have impact on the reliability that entirety has the quartz (controlled) oscillator pedestal 100 of thermistor.
Again as illustrated in figures ia and ib, thick-film thermistor 30, is fixedly arranged on first surface 11, and forms series circuit with wire 14.Set firmly easily due to thick-film thermistor 30 and account for volume hardly, therefore after thick-film thermistor 30 is fixedly arranged on first surface 11, first surface 11 is still very smooth.
The thick-film thermistor 30 used can be a kind of thick-film type negative tempperature coefficient thermistor.And after thick-film thermistor 30 is fixedly arranged on first surface 11, the mode of laser cutting can change the width of thick-film thermistor 30, to adjust the resistance value of thick-film thermistor 30 to required scope or required special value.
Equally with reference to as illustrated in figures ia and ib, when practical application, quartz (controlled) oscillator chip 40 please can be fixedly arranged on the first surface 11 of the quartz (controlled) oscillator pedestal 100 with thermistor, and be electrically connected with described first weld pad 15.Quartz (controlled) oscillator chip 40 and at least one wire 14 are electrically connected, quartz (controlled) oscillator chip 40 and cover thick-film thermistor 30 and not with the short circuit of thick-film thermistor 30 phase.
So, described wire 14, described conductive through hole 20, thick-film thermistor 30 and quartz (controlled) oscillator chip 40 can jointly be formed series/parallel circuit (that is sections in series, part in parallel circuit), and provide and have according to ambient temperature, automatic frequency aligning rate produces the clock signal of fine adjustment function.
What is more, because thick-film thermistor 30 and quartz (controlled) oscillator chip 40 are all positioned on same surface, thick-film thermistor 30 can be finely tuned according to the frequency of oscillation of the actual temperature of quartz (controlled) oscillator chip 40 to quartz (controlled) oscillator chip 40, really can reduce temperature error, guarantee the accuracy of finely tuning.
And as shown in Figure 1B, quartz (controlled) oscillator chip 40 is bonded to the mode of the first surface 11 of the quartz (controlled) oscillator pedestal 100 with thermistor, can be with conductive silver glue 41, quartz (controlled) oscillator chip 40 is bonded on first surface 11.
Then please refer to as shown in Fig. 2 A and Fig. 3, the present embodiment is a kind of quartz (controlled) oscillator package body structure 200 with thermistor, and it comprises: substrate 10; Thick-film thermistor 30; Quartz (controlled) oscillator chip 40; And air sealing cover 50.
The quartz (controlled) oscillator package body structure 200 with thermistor as shown in Fig. 2 A to Fig. 3, the wherein technical characteristic of substrate 10, conductive through hole 20, thick-film thermistor 30 and quartz (controlled) oscillator chip 40 and mutual connection relationship, all identical with aforementioned substrate 10, conductive through hole 20, thick-film thermistor 30 and the quartz (controlled) oscillator chip 40 with the quartz (controlled) oscillator pedestal 100 of thermistor, do not repeat them here.
As shown in Fig. 2 A, Fig. 2 B and Fig. 3, air sealing cover 50, surface thereof have depression 51 and the set limit 52 around depression 51, air sealing cover 50 is also bonded to the first surface 11 of substrate 10 with airtight involution layer 60 from set limit 52, and accommodating quartz (controlled) oscillator chip 40 and thick-film thermistor 30 are within depression 51.
Air sealing cover 50 as shown in Fig. 2 A, Fig. 2 B and Fig. 3, can be formed by pottery or metal material.Airtight involution layer 60 can be formed by glass or gold-tin alloy material again.Moreover for reaching best airtight effect, airtight involution layer 60 can be formed as square shape.
The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solutions of the utility model, according to technical spirit of the present utility model to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (12)
1. there is a quartz (controlled) oscillator pedestal for thermistor, it is characterized in that it comprises:
Substrate, it has first surface, the second surface relative with this first surface and runs through majority the conductive through hole of this substrate to this second surface from this first surface, and this substrate includes again:
Plurality of wires, is formed at this first surface and is electrically connected described conductive through hole;
Most the first weld pads, to be formed on this first surface and to be electrically connected with described wire; And
Most the second weld pads, are formed on this second surface, and each second weld pad is corresponding with first weld pad and is electrically connected by this conductive through hole; And
Thick-film thermistor, is fixedly arranged on this first surface, and forms series circuit with this wire.
2. quartz (controlled) oscillator pedestal according to claim 1, is characterized in that wherein this substrate is ceramic substrate.
3. quartz (controlled) oscillator pedestal according to claim 1, is characterized in that wherein said conductive through hole all fills up with metal paste.
4. quartz (controlled) oscillator pedestal according to claim 1, is characterized in that wherein this quartz (controlled) oscillator chip is bonded to this first surface with conductive silver glue, not with this thick-film thermistor short circuit.
5. quartz (controlled) oscillator pedestal according to claim 1, is characterized in that wherein this thick-film thermistor is thick-film type negative tempperature coefficient thermistor.
6. there is a quartz (controlled) oscillator package body structure for thermistor, it is characterized in that it comprises:
Substrate, it has first surface, the second surface relative with this first surface and runs through majority the conductive through hole of this substrate to this second surface from this first surface, and this substrate includes again:
Plurality of wires, is formed at this first surface and is electrically connected described conductive through hole;
Most the first weld pads, to be formed on this first surface and to be electrically connected with described wire; And
Most the second weld pads, are formed on this second surface, and each second weld pad is corresponding with first weld pad and is electrically connected by this conductive through hole;
Thick-film thermistor, is fixedly arranged on this first surface, and forms series circuit with this wire;
Quartz (controlled) oscillator chip, is fixedly arranged on this first surface, and is electrically connected with described first weld pad; And
Air sealing cover, surface thereof has depression and around the set limit of this depression, this air sealing cover and be bonded to this first surface from this set limit with airtight involution layer and this quartz (controlled) oscillator chip accommodating and this thick-film thermistor within this depression,
Wherein this quartz (controlled) oscillator chip cover this thick-film thermistor not with this thick-film thermistor phase short circuit, and described wire, described conductive through hole, this thick-film thermistor and this quartz (controlled) oscillator chip form series/parallel circuit jointly.
7. quartz (controlled) oscillator package body structure according to claim 6, is characterized in that wherein this substrate is ceramic substrate.
8. quartz (controlled) oscillator package body structure according to claim 6, is characterized in that wherein this quartz (controlled) oscillator chip is bonded to this first surface with conductive silver glue, not with this thick-film thermistor short circuit.
9. quartz (controlled) oscillator package body structure according to claim 6, is characterized in that wherein this thick-film thermistor is thick-film type negative tempperature coefficient thermistor.
10. quartz (controlled) oscillator package body structure according to claim 6, it is characterized in that wherein this air sealing cover by pottery or metal material formed.
11. quartz (controlled) oscillator package body structures according to claim 6, is characterized in that wherein this airtight involution layer is formed by glass or gold-tin alloy material.
12. quartz (controlled) oscillator package body structures according to claim 6, is characterized in that wherein this airtight involution layer is square shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103211978U TWM491947U (en) | 2014-07-04 | 2014-07-04 | Thermistor embedded crystal oscillator substrate and thermistor embedded crystal oscillator package structure |
| TW103211978 | 2014-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204392206U true CN204392206U (en) | 2015-06-10 |
Family
ID=52576937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420842610.1U Expired - Fee Related CN204392206U (en) | 2014-07-04 | 2014-12-26 | Quartz oscillator base with thermistor and quartz oscillator packaging body structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3193837U (en) |
| CN (1) | CN204392206U (en) |
| TW (1) | TWM491947U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170054010A (en) * | 2015-11-09 | 2017-05-17 | 삼성전기주식회사 | Crystal device package and method of manufacturing the same |
| US10297544B2 (en) * | 2017-09-26 | 2019-05-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated fan-out package and method of fabricating the same |
| JP6925223B2 (en) * | 2017-10-02 | 2021-08-25 | 京セラ株式会社 | Piezoelectric oscillator |
-
2014
- 2014-07-04 TW TW103211978U patent/TWM491947U/en not_active IP Right Cessation
- 2014-08-08 JP JP2014004230U patent/JP3193837U/en not_active Expired - Fee Related
- 2014-12-26 CN CN201420842610.1U patent/CN204392206U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWM491947U (en) | 2014-12-11 |
| JP3193837U (en) | 2014-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150610 Termination date: 20171226 |