CN204272052U - A kind of base construction of SMD quartz resonator of external thermistor - Google Patents

A kind of base construction of SMD quartz resonator of external thermistor Download PDF

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Publication number
CN204272052U
CN204272052U CN201420784246.8U CN201420784246U CN204272052U CN 204272052 U CN204272052 U CN 204272052U CN 201420784246 U CN201420784246 U CN 201420784246U CN 204272052 U CN204272052 U CN 204272052U
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electrode
substrate
groove
external
base construction
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辜达元
何天仕
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Hongxing Technology Group Co ltd
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HANGZHOU HOSONIC ELECTRONICS CO Ltd
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Abstract

The utility model relates to a kind of base construction of SMD quartz resonator of external thermistor, comprises substrate, and the front and back of substrate is provided with electrode; The back side and the sidewall of substrate are provided with conductive trough, in conductive trough, be printed with conducting wire; Offer the groove A of attachment quartz wafer in substrate front side, offer the groove B of attachment thermistor at substrate back; Interior electrode is arranged on the one end in groove A, and the other end in groove A is provided with support portion, and middle electrode is located at the two ends in substrate back groove B.Compared with prior art, the groove A and groove B that mount quartz wafer and thermistor respectively are directly opened in the front and back of substrate by the utility model, reduce the integral thickness of product, simplify board structure, make product more miniaturized, avoid the bad product caused due to wafer contamination when Total Product encapsulates simultaneously; In groove A, be provided with support portion, the height of support portion is identical with the height of interior electrode, ensure that its stability.

Description

A kind of base construction of SMD quartz resonator of external thermistor
Technical field
The utility model relates to quartz resonator, particularly relates to a kind of base construction mounting the SMD quartz resonator of thermistor.
Background technology
Quartz products is the frequency oscillator and clock devices that generally use in the market, all this series products will be used in a large number from the simplest toy, household electrical appliances, clock and watch to the communication, air equipment at the computer of complexity, mobile phone, satellite navigation and tip, therefore along with continuous expansion and the development of application, quartz products is not only towards the direction evolution of small-sized SMD, and be no longer satisfied with traditional grade in working temperature and frequency accuracy, thus high-precision Temp .-compensation type crystal oscillator and TCXO arise at the historic moment; Current TCXO market development is rapid, but the manufacture craft of the TCXO of this band simple function integrated circuit requires high, and price also costly, therefore comparatively tend to traditional to match the SMD quartz resonator applied with application end multifunctional integrated circuit by market.
The core position of SMD quartz resonator is exactly piezolectric crystal unit and temperature-sensing element (device), i.e. quartz wafer and thermistor, and the mounting base of SMD quartz resonator is as wherein one of of paramount importance building block, manufacturing and designing of it is just particularly important, the utility model adopts the pedestal of the SMD quartz resonator of the built-in thermistor of 2016 type, it is more complicated relative to the base construction of the SMD quartz resonator of the built-in thermistor of existing 2520 type, distribution space is less, machinery wiring is also stricter between layers, so processing technology more complicated, and easily cause became uneven after multiple-layer stacked, be easy to after encapsulation cause gas leakage, foaming phenomena, therefore to technique, temperature, equipment etc. have very high requirement, conforming product rate is lower.
In order to solve the problems such as base construction complex process, became uneven of the SMD quartz resonator of the built-in thermistor of above-mentioned 2016 type, the utility model proposes a kind of rational in infrastructure and base construction of the SMD quartz resonator of the external thermistor of easily processing.
Utility model content
The utility model overcomes above-mentioned the deficiencies in the prior art, proposes a kind of rational in infrastructure and base construction of the SMD quartz resonator of the external thermistor of easily processing.
The technical solution of the utility model is achieved in that
A base construction for the SMD quartz resonator of external thermistor, includes substrate, is provided with interior electrode in the front of substrate, electrode and external electrode in the back side of substrate is provided with; The back side and sidewall of substrate are equipped with conductive trough, and be printed with in conductive trough be communicated with in electrode and conducting wire a, the conducting wire b of external electrode and conducting wire c, the conducting wire d of electrode and external electrode in being communicated with; Offer the groove A of an attachment quartz wafer at the middle part of described substrate front side, offer the groove B of an attachment thermistor at the middle part of substrate back; Described interior electrode is arranged on the one end in groove A, and the other end in groove A is provided with support portion, and described middle electrode is arranged on the two ends in substrate back groove B.
The groove A and groove B that mount quartz wafer and thermistor respectively are directly opened in the front and back of substrate, not only reduce the integral thickness of product, simplify board structure, make product more miniaturized, avoid the bad product caused due to wafer contamination when Total Product encapsulates simultaneously; In addition, in groove A, be also provided with support portion, the height of described support portion is identical with the height of interior electrode, thus when quartz wafer can be made to be arranged in groove A, can not produce rugged phenomenon, thus ensure that its stability.
As preferably, described interior electrode comprises two spaced positive electrodes and negative electrode, and when mounting quartz wafer in groove A, positive electrode and the negative electrode of interior electrode can be connected negative electrode and the positive electrode of quartz wafer respectively.
As preferably, described middle electrode comprises positive electrode and negative electrode in order to mount thermistor.
As preferably, described external electrode comprises the PAD of four corner matrix distribution.
As preferably, the height of described support portion is identical with the height of interior electrode.
As preferably, the conductive trough at the described back side is opened in the edge of substrate, and the conductive trough on sidewall is opened on the sidewall rib of substrate.
As preferably, around substrate, be provided with via hole.
As preferably, described substrate is made up of pottery.
The beneficial effect that the utility model have employed technique scheme is:
The utility model proposes a kind of rational in infrastructure and base construction of the SMD quartz resonator of the external thermistor of easily processing.The groove A and groove B that mount quartz wafer and thermistor respectively are directly opened in the front and back of substrate by the utility model, not only reduce the integral thickness of product, simplify board structure, make product more miniaturized, avoid the bad product caused due to wafer contamination when Total Product encapsulates simultaneously; In addition, in groove A, be also provided with support portion, the height of described support portion is identical with the height of interior electrode, thus when quartz wafer can be made to be arranged in groove A, can not produce rugged phenomenon, thus ensure that its stability.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the utility model pedestal;
Fig. 2 is the overall structure schematic diagram of the utility model pedestal;
Fig. 3 is the rearview of Fig. 2;
Fig. 4 is the structural representation that the utility model S/R can cut down cover plate;
Fig. 5 is the utility model attachment quartz wafer inner electrode schematic diagram;
Fig. 6 is electrode and external electrode conductive line structure schematic diagram in the utility model;
Fig. 7 is the utility model attachment thermistor and middle electrode and external electrode conductive line structure schematic diagram;
Fig. 8 is the structural representation of the utility model external electrode.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail:
Embodiment: a kind of base construction of SMD quartz resonator of external thermistor, as shown in Fig. 1 ~ 8, comprises the substrate 1 be made up of pottery, is provided with interior electrode 2 in the front of substrate 1, electrode 3 and external electrode 4 in the back side of substrate 1 is provided with; The back side and sidewall of substrate 1 are provided with conductive trough 5, conductive trough 5 specifically comprises conductive trough a51, conductive trough b52, conductive trough c53 and conductive trough d54, conducting wire a6 and the conducting wire b7 of electrode 2 and external electrode 4 in being communicated with is printed with in conductive trough 5, and the conducting wire c8 of electrode 3 and external electrode 4 and conducting wire d9 in being communicated with, around substrate 1, be provided with via hole 10, described via hole 10 comprises via hole a101, via hole b102 and via hole c103; Offer the groove A12 of an attachment quartz wafer 11 at the middle part in described substrate 1 front, offer the groove B14 of an attachment thermistor 13 at the middle part at substrate 1 back side; Described interior electrode 2 is arranged on the one end in groove A12, and the other end in groove A12 is provided with support portion 15, and the height of described support portion 15 is identical with the height of interior electrode 2; Described middle electrode 3 is arranged on the two ends in the groove B14 of substrate 1 back side.
Specifically, described interior electrode 2 comprises two spaced positive electrodes 21 and negative electrode 22, and when mounting quartz wafer 11 in groove A12, positive electrode 21 and the negative electrode 22 of interior electrode 2 can be connected negative electrode and the positive electrode of quartz wafer 11 respectively; Middle electrode 3 comprises positive electrode 31 and negative electrode 32 for mounting thermistor 13; External electrode 4 comprises the PAD16 of four corner matrix distribution, and described PAD16 comprises PADa161, PADb162, PADc163 and PADd164; The conductive trough 5 at the described back side is opened in the edge of substrate 1, and the conductive trough 5 on sidewall is opened on the sidewall rib of substrate 1.Above SMD quartz resonator, be provided with S/R can cut down cover plate 17.
Owing to after the encapsulation of SMD quartz resonator needing interior electrode 2, middle electrode 3 outwards to draw electric function, specifically as shown in figures 5-8, the positive electrode 21 in interior electrode 2 is finally connected with PADa161 by via hole a101, conductive trough a51 after the a6 of conducting wire; Negative electrode 22 in interior electrode 2 is finally connected with PADb162 by via hole b102, conductive trough b52 after the b7 of conducting wire; Positive electrode 31 in middle electrode 3 is finally connected with PADc163 after conducting wire c8, conductive trough c53; Negative electrode 32 in middle electrode 3 is finally connected with PADd164 after conducting wire d9, conductive trough d54; In addition, external electrode PADd164 can be cut down cover plate 17 and be communicated by conductive trough d54, via hole c103 and S/R, to play the effect of shielding.
The groove A12 and groove B14 that mount quartz wafer 11 and thermistor 13 respectively are directly opened in the front and back of substrate 1 by the utility model, not only reduce the integral thickness of product, simplify substrate 1 structure, make product more miniaturized, avoid the bad product caused because quartz wafer 11 pollutes when Total Product encapsulates simultaneously; In addition, in groove A12, be also provided with support portion 15, the height of described support portion 15 is identical with the height of interior electrode 2, thus when quartz wafer 11 can be made to be arranged in groove A12, can not produce rugged phenomenon, thus ensure that its stability.

Claims (8)

1. a base construction for the SMD quartz resonator of external thermistor, includes substrate, it is characterized in that: be provided with interior electrode in the front of substrate, electrode and external electrode in the back side of substrate is provided with; The back side and sidewall of substrate are equipped with conductive trough, and be printed with in conductive trough be communicated with in electrode and conducting wire a, the conducting wire b of external electrode and conducting wire c, the conducting wire d of electrode and external electrode in being communicated with; Offer the groove A of an attachment quartz wafer at the middle part of described substrate front side, offer the groove B of an attachment thermistor at the middle part of substrate back; Described interior electrode is arranged on the one end in groove A, and the other end in groove A is provided with support portion, and described middle electrode is arranged on the two ends in substrate back groove B.
2. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, it is characterized in that: described interior electrode comprises two spaced positive electrodes and negative electrode, when mounting quartz wafer in groove A, positive electrode and the negative electrode of interior electrode can be connected negative electrode and the positive electrode of quartz wafer respectively.
3. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, is characterized in that: described middle electrode comprises positive electrode and negative electrode in order to mount thermistor.
4. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, is characterized in that: described external electrode comprises the PAD of four corner matrix distribution.
5. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, is characterized in that: the height of described support portion is identical with the height of interior electrode.
6. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, is characterized in that: the conductive trough at the described back side is opened in the edge of substrate, and the conductive trough on sidewall is opened on the sidewall rib of substrate.
7. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, is characterized in that: around substrate, be provided with via hole.
8. the base construction of the SMD quartz resonator of a kind of external thermistor according to claim 1, is characterized in that: described substrate is made up of pottery.
CN201420784246.8U 2014-12-11 2014-12-11 A kind of base construction of SMD quartz resonator of external thermistor Active CN204272052U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107888160A (en) * 2017-12-26 2018-04-06 东晶锐康晶体(成都)有限公司 A kind of H type pedestals applied to TCXO

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107888160A (en) * 2017-12-26 2018-04-06 东晶锐康晶体(成都)有限公司 A kind of H type pedestals applied to TCXO

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Address after: No. 2880, Moganshan Road, Liangzhu street, Yuhang District, Hangzhou, Zhejiang 310000

Patentee after: Hongxing Technology (Group) Co.,Ltd.

Address before: No. 242, Liangbo Road, Liangzhu Street, Yuhang District, Hangzhou City, Zhejiang Province 311113

Patentee before: HANGZHOU HOSONIC ELECTRONICS Co.,Ltd.