CN109672407A - A kind of temperature compensating crystal oscillator - Google Patents
A kind of temperature compensating crystal oscillator Download PDFInfo
- Publication number
- CN109672407A CN109672407A CN201811591781.0A CN201811591781A CN109672407A CN 109672407 A CN109672407 A CN 109672407A CN 201811591781 A CN201811591781 A CN 201811591781A CN 109672407 A CN109672407 A CN 109672407A
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- CN
- China
- Prior art keywords
- crystal oscillator
- temperature
- pedestal
- temperature compensating
- compensating crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000013078 crystal Substances 0.000 title claims abstract description 56
- 239000010453 quartz Substances 0.000 claims abstract description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 34
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 7
- 230000032683 aging Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/02—Details
- H03B5/04—Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The present invention discloses a kind of temperature compensating crystal oscillator comprising: pedestal；The pad being set on pedestal；The temperature compensation chip being set on pedestal, the pin of temperature compensation chip are electrically connected with pad；The quartz vibrator being set on pedestal；And it is welded in the metal cover board at the top of pedestal, for covering temperature compensation chip and quartz vibrator.Compensation crystal oscillator solves the problems, such as to be unable to satisfy in traditional temperature compensating crystal oscillator in -55 DEG C~+85 DEG C wide temperature range frequency stabilities≤± 1ppm in the present invention, by the structure and adjustment method that optimize product, realize crystal oscillator in -55 DEG C~+85 DEG C wide temperature range frequency stabilities≤± 1ppm index, by miniaturization and integrated design, the SMD5032 outer dimension of product is realized.
Description
Technical field
The present invention relates to crystal oscillator technologies fields.More particularly, to a kind of temperature compensating crystal oscillator.
Background technique
Crystal oscillator has a wide range of applications in electronic product, it is often referred as the heart of electronic product, it
Output frequency stability directly influence electronic system performance quality.With communications industry in recent years, Beidou GPS satellite
Navigation industry, the development of the instrument and meter industries such as signal generator and digital frequency meter require higher output frequency stability
Crystal oscillator accurate standard frequency and time reference be provided for electronic system, if as main in above equipment
The frequency of the crystal oscillator of standard frequency and time reference is unstable, just will have a direct impact on stability, the satellite of communication system
Accuracy, the measurement accuracy of measuring instrument of position.
Change due to its resonance frequency variation with temperature of crystal resonator used in present crystal oscillator, regardless of
It is common AT cut type and the cut types such as SC cut type or other X, DT, CT, XY, their frequency within the scope of larger temperature
It is all had a greater change with temperature, humidity province especially remoter in reference point temperature T0 of the temperature T away from crystal resonator, crystal
The resonance frequency of resonator is bigger with the variable quantity that unit temperature changes, therefore is used the technologies such as temperature-compensating to mention
The output frequency stability of high crystal oscillator, but technology does not still meet electronic product system to wide temperature model at present
There is the requirement of higher output frequency stability in enclosing.
With the extensive use of high-precision temperature compensating crystal oscillator in electronic equipment, to temperature compensating crystal oscillator in volume, temperature, frequency temperature
Stability etc. proposes increasingly higher demands.Traditional temperature compensating crystal oscillator meets frequency stabilization in operating environment requirements product
≤ ± 1ppm is spent in -40 DEG C~+85 DEG C temperature ranges, is unable to satisfy in -55 DEG C~+85 DEG C wide temperature range frequency stabilities
The demand of≤± 1ppm, therefore it is unable to satisfy the high-precision demand of compensation crystal oscillator under the conditions of wide temperature.
Therefore, in order to meet temperature compensating crystal oscillator the product requirement of high stability and product miniaturization side under the conditions of wide temperature
The requirement in face, it is necessary to the miniaturization and high performance characteristics of product are realized in the design that miniaturization and high-precision aspect are carried out to product,
Meet the related request of electronic equipment.
Summary of the invention
The purpose of the present invention is to provide a kind of compact high precision compensation crystal oscillators, solve nothing in traditional temperature compensating crystal oscillator
Method meets -55 DEG C~+85 DEG C wide temperature range frequency stabilities≤± 1ppm the problem of, passes through the structure and tune of optimization product
Method for testing realizes crystal oscillator in -55 DEG C~+85 DEG C wide temperature range frequency stabilities≤± 1ppm index, by small
Type and integrated design realize the SMD5032 outer dimension of product.
In order to achieve the above objectives, the present invention adopts the following technical solutions:
A kind of temperature compensating crystal oscillator, the temperature compensating crystal oscillator include:
Pedestal；
Pad is set to the pad on pedestal；
The temperature compensation chip being set on pedestal, the pin of temperature compensation chip are electrically connected with pad；
The quartz vibrator being set on pedestal；And
It is welded in the metal cover board at the top of pedestal, for covering temperature compensation chip and quartz vibrator.
Preferably, which is ceramic base.
It is further preferred that being provided with a groove on pedestal, temperature compensation chip passes through conductive adhesive to the recessed of ceramic base
In slot.
It is further preferred that the pin and pad of temperature compensation chip are electrically connected by way of gold wire bonding.
Preferably, the gold electrode that quartz vibrator includes quartz wafer and is plated on quartz wafer by coating process.
It is further preferred that being additionally provided with quartz wafer placement platform on ceramic base, quartz wafer passes through conductive gluing
It is connected on the quartz wafer placement platform of ceramic base.
Preferably, the packing forms of temperature compensating crystal oscillator are SMD5032.
Preferably, the length of temperature compensating crystal oscillator is 5.0mm ± 0.2mm.
Preferably, the width of temperature compensating crystal oscillator is 3.2mm ± 0.2mm.
Preferably, the height of temperature compensating crystal oscillator is not higher than 2.0mm.
Beneficial effects of the present invention are as follows:
A kind of compact high precision compensation crystal oscillator in the present invention solves to be unable to satisfy in traditional temperature compensating crystal oscillator -55
DEG C~+85 DEG C of wide temperature range frequency stabilities≤± 1ppm the problem of, pass through optimization product structure and adjustment method, realize
Crystal oscillator is in -55 DEG C~+85 DEG C wide temperature range frequency stabilities≤± 1ppm index, by miniaturization and integrated
Design, realize the SMD5032 outer dimension of product.
Detailed description of the invention
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing.
Fig. 1 shows a kind of structural schematic diagram of compact high precision compensation crystal oscillator.
Specific embodiment
In order to illustrate more clearly of the present invention, the present invention is done further below with reference to preferred embodiments and drawings
It is bright.Similar component is indicated in attached drawing with identical appended drawing reference.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
The present invention provides a kind of temperature compensating crystal oscillators, specifically include pedestal；Pad, pad are set to pedestal
On；The temperature compensation chip being set on pedestal, the pin of temperature compensation chip are electrically connected with pad；The quartz vibrator being set on pedestal；
And it is welded in the metal cover board at the top of pedestal, for covering temperature compensation chip and quartz vibrator.The middle-size and small-size high precision temp of the present invention
Mend crystal oscillator, solve be unable to satisfy in traditional temperature compensating crystal oscillator -55 DEG C~+85 DEG C wide temperature range frequency stabilities≤
The problem of ± 1ppm, realizes crystal oscillator in -55 DEG C~+85 DEG C wide temperature by optimizing the structure and adjustment method of product
Range frequencies stability≤± 1ppm index realizes the SMD5032 shape of product by miniaturization and integrated design
Size.
As shown in Figure 1, the following will be described with reference to a specific embodiment
A kind of compact high precision compensation crystal oscillator, including ceramic base 101, temperature compensation chip 102, quartz wafer 103,
Gold electrode 104 and metal cover board 105.Wherein
Ceramic base 101: for placing temperature compensation chip, quartz vibrator and metal cover board, and various pieces are carried out electrical
Connection and offer finally enter output port.
In the present invention, since base size is smaller, and exit is more, through the special designing of exit, in pedestal
Portion devises circular serial ports access interface, and connection CS, DATA, CLOCK program end, effectively reduce pedestal volume, reduce
Wiring difficulty.
Further, since smaller its of serial ports access interface pad is located at and pedestal middle part, it is possible to prevente effectively from using
In due to welding caused by misconnection phenomenon, improve the reliability of product.
Further, since base size is smaller, and its internal connection line is more more complex, by increasing ceramic base
The wiring number of plies, optimize wiring path, the specific location of reasonable Arrangement serial ports incoming end effectively increases the electromagnetic compatibility of product
Ability.
Temperature compensation chip 102: temperature-compensating meter is carried out for cooperating quartz vibrator to generate oscillation circuit, and to quartz vibrator
It calculates, the high-precision frequency signal of final output.
In the present invention, in order to realize the microminaturization of quartz vibrator, circuit portions use Integration Design, wherein main vibration
Circuit, filter circuit and compensation network are integrated on a temperature compensation chip, by designing the backoff algorithm curve of high-order term, significantly
The precision of temperature-compensating is improved, so that crystal oscillator can be realized in -55 DEG C~+85 DEG C wide temperature range frequency stabilities
The index of≤± 1ppm.
Quartz wafer 103: plating gold electrode 104 on the quartz wafer 103, for cooperating the generation of temperature compensation chip to vibrate back
Road.
In the present invention, quartz wafer is designed using microminaturization silver shape, by adjusting the corner cut of chip, optimizes stone
The frequency temperature stability characteristic of English oscillator, so that itself and temperature compensation chip compensation algorithm curve more preferably match, and brilliant by adjusting
The width-thickness ratio of piece reduces the frequency hopping amount that quartz vibrator varies with temperature generation, optimizes the frequency temperature of product
Stability characteristic.
Gold electrode 104: for the electrode as quartz wafer, it is fabricated to quartz vibrator.
The electrode film layer poor adhesive force of traditional evaporation coating production exists inside electrode film, between electrode film and chip
Stress is big, affects the ageing rate of product.
In the present invention, gold electrode 104 is to be plated to quartz wafer 103 by coating process to constitute quartz vibrator.By using
High vacuum ion beam sputter coating, it is higher than traditional evaporation coating vacuum degree, improve plated film firmness, reduction film layer is answered
Power improves the long-time stability of product so that the film adhesion enhancing of the electrode film of wafer surface, stress reduce, so that
The ageing properties of product are more preferable.
Further, it is finely tuned by using ion etching, i.e., electrode material is etched using ion beam on a small quantity, with micro adjustment
Frequency, etching fine tuning can be to avoid secondary vapor deposition bring adhesive force and stress in thin film, to reduce the ageing rate of product.
Metal cover board 105: for being sealed together with ceramic base, the outer enclosure of product is formed.
The parallel sealing mouth of traditional inflated with nitrogen, interiors of products moisture content is relatively large, and the steam of interiors of products makes electrode
Slowly oxidation, which occurs, causes frequency drift i.e. frequency to change.
In the present invention, eliminated by using the parallel sealing mouth of high vacuum so that interiors of products moisture content is reduced to zero
Interiors of products steam and influence of other gases to ageing rate, take high vacuum packaged type, reduce the ageing rate of product.
It should be noted that temperature compensation chip is fixed on ceramic base by conductive adhesive in the present invention, to temperature compensation core
Piece is fixed；Temperature compensation chip top exit is connected to the electricity that circuit is realized on the pad of ceramic base by gold wire bonding
Gas connection；Quartz wafer is fixed on ceramic base by conductive adhesive quartz wafer to be fixed.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention may be used also on the basis of the above description for those of ordinary skill in the art
To make other variations or changes in different ways, all embodiments can not be exhaustive here, it is all to belong to this hair
The obvious changes or variations that bright technical solution is extended out are still in the scope of protection of the present invention.
Claims (10)
1. a kind of temperature compensating crystal oscillator, which is characterized in that the temperature compensating crystal oscillator includes:
Pedestal；
The pad is set to the pad on the pedestal；
The pin of the temperature compensation chip being set on the pedestal, the temperature compensation chip is electrically connected with the pad；
The quartz vibrator being set on the pedestal；And
It is welded in the metal cover board at the top of the pedestal, for covering the temperature compensation chip and quartz vibrator.
2. temperature compensating crystal oscillator according to claim 1, which is characterized in that the pedestal is ceramic base.
3. temperature compensating crystal oscillator according to claim 2, which is characterized in that it is recessed to be provided with one on the pedestal
Slot, the temperature compensation chip pass through in conductive adhesive to the groove of the ceramic base.
4. temperature compensating crystal oscillator according to claim 3, which is characterized in that the pin of the temperature compensation chip and institute
Pad is stated to be electrically connected by way of gold wire bonding.
5. temperature compensating crystal oscillator according to claim 2, which is characterized in that the quartz vibrator includes quartz-crystal
Piece and the gold electrode on the quartz wafer is plated to by coating process.
6. temperature compensating crystal oscillator according to claim 5, which is characterized in that be additionally provided on the ceramic base
Quartz wafer placement platform, the quartz wafer are placed flat by the quartz wafer of conductive adhesive to the ceramic base
On platform.
7. temperature compensating crystal oscillator according to claim 1 to 6, which is characterized in that the temperature-compensating
The packing forms of crystal oscillator are SMD5032.
8. temperature compensating crystal oscillator according to claim 1, which is characterized in that the temperature compensating crystal oscillator
Length be 5.0mm ± 0.2mm.
9. temperature compensating crystal oscillator according to claim 1, which is characterized in that the temperature compensating crystal oscillator
Width be 3.2mm ± 0.2mm.
10. temperature compensating crystal oscillator according to claim 1, which is characterized in that the temperature compensating crystal oscillation
The height of device is not higher than 2.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811591781.0A CN109672407A (en) | 2018-12-20 | 2018-12-20 | A kind of temperature compensating crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811591781.0A CN109672407A (en) | 2018-12-20 | 2018-12-20 | A kind of temperature compensating crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109672407A true CN109672407A (en) | 2019-04-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811591781.0A Pending CN109672407A (en) | 2018-12-20 | 2018-12-20 | A kind of temperature compensating crystal oscillator |
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| Country | Link |
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| CN (1) | CN109672407A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702019A (en) * | 2020-12-29 | 2021-04-23 | 北京无线电计量测试研究所 | Anti-irradiation differential crystal oscillator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201113922Y (en) * | 2007-07-27 | 2008-09-10 | 武汉海创电子股份有限公司 | High temperature high stability quartz crystal clock oscillator |
| CN103346749A (en) * | 2013-06-20 | 2013-10-09 | 电子科技大学 | LTCC integrated encapsulation surface mounting crystal oscillator |
| CN207977948U (en) * | 2018-03-23 | 2018-10-16 | 杭州鸿星电子有限公司 | A kind of compensation crystal oscillator |
-
2018
- 2018-12-20 CN CN201811591781.0A patent/CN109672407A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201113922Y (en) * | 2007-07-27 | 2008-09-10 | 武汉海创电子股份有限公司 | High temperature high stability quartz crystal clock oscillator |
| CN103346749A (en) * | 2013-06-20 | 2013-10-09 | 电子科技大学 | LTCC integrated encapsulation surface mounting crystal oscillator |
| CN207977948U (en) * | 2018-03-23 | 2018-10-16 | 杭州鸿星电子有限公司 | A kind of compensation crystal oscillator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702019A (en) * | 2020-12-29 | 2021-04-23 | 北京无线电计量测试研究所 | Anti-irradiation differential crystal oscillator |
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Application publication date: 20190423 |