CN114499452A - Miniaturized temperature compensation crystal oscillator - Google Patents
Miniaturized temperature compensation crystal oscillator Download PDFInfo
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- CN114499452A CN114499452A CN202111550124.3A CN202111550124A CN114499452A CN 114499452 A CN114499452 A CN 114499452A CN 202111550124 A CN202111550124 A CN 202111550124A CN 114499452 A CN114499452 A CN 114499452A
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- 239000013078 crystal Substances 0.000 title claims abstract description 180
- 239000003990 capacitor Substances 0.000 claims abstract description 33
- 230000010355 oscillation Effects 0.000 claims abstract description 10
- 230000000295 complement effect Effects 0.000 claims abstract description 7
- 238000001914 filtration Methods 0.000 claims abstract description 7
- 239000010453 quartz Substances 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 42
- 239000000919 ceramic Substances 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000011222 crystalline ceramic Substances 0.000 claims description 9
- 229910002106 crystalline ceramic Inorganic materials 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 4
- 238000009501 film coating Methods 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 5
- 239000000306 component Substances 0.000 description 31
- 238000000576 coating method Methods 0.000 description 6
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- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/205—Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
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- Oscillators With Electromechanical Resonators (AREA)
Abstract
The embodiment of the invention discloses a miniaturized temperature compensation crystal oscillator, which comprises: the temperature compensation device comprises a base, a first crystal resonator component, a second crystal resonator component, a temperature compensation chip and a filter capacitor component, wherein the first crystal resonator component, the second crystal resonator component, the temperature compensation chip and the filter capacitor component are arranged on the base and are electrically connected through the base; the first crystal resonator component is complementary to the second crystal resonator component to counteract oscillation; the temperature compensation chip is used for carrying out temperature compensation on the first crystal resonator component and the second crystal resonator component; and the filter capacitor assembly is used for filtering the temperature compensation chip. The two complementary crystal resonators are arranged, so that the phase noise deterioration degree of the crystal resonator under the severe vibration condition is optimized, the requirements of electronic equipment on miniaturization, high precision and vibration resistance of the temperature compensation crystal oscillator are met, and the crystal resonator has a wide application prospect.
Description
Technical Field
The invention relates to the technical field of oscillators. And more particularly, to a miniaturized temperature compensated crystal oscillator.
Background
With the wide application of high-precision temperature compensation crystal oscillators in electronic equipment, higher requirements are put forward on the aspects of volume, temperature, frequency temperature stability, vibration resistance, impact resistance and the like of the temperature compensation crystal oscillators, so that the crystal oscillators need to be designed on the aspects of miniaturization, high precision and vibration resistance, the miniaturization, high index and high reliability of products are realized, and the related requirements of the electronic equipment are met.
In a working environment with violent vibration, vibration transmitted to the crystal oscillator of the traditional temperature compensation crystal oscillator affects the stability of an output signal, so that the output frequency generates deviation, the system performance is reduced, and the phenomenon of abnormal work of an electronic system can occur in severe cases. Therefore, the requirement of high precision of the temperature compensated crystal oscillator under the condition of severe vibration cannot be met.
Disclosure of Invention
In order to solve at least one of the above problems, the present application proposes a miniaturized temperature compensated crystal oscillator including: a base, a first crystal resonator component, a second crystal resonator component, a temperature compensation chip and a filter capacitor component which are arranged on the base, wherein,
the first crystal resonator component, the second crystal resonator component, the temperature compensation chip and the filter capacitor component are electrically connected through the base;
the first crystal resonator component is complementary to the second crystal resonator component to counteract oscillation;
the temperature compensation chip is used for carrying out temperature compensation on the first crystal resonator component and the second crystal resonator component;
and the filter capacitor assembly is used for filtering the temperature compensation chip.
In one particular embodiment, the first crystal resonator assembly includes: the first crystal ceramic base, the first crystal quartz chip, the first crystal gold electrode and the first crystal metal cover plate.
In a particular embodiment, the second crystal resonator assembly comprises: a second crystal ceramic base, a second crystal quartz chip, a second crystal gold electrode and a second crystal metal cover plate.
In a specific embodiment, the first crystal gold electrode is arranged on the first crystal quartz wafer through a coating process to form a first crystal quartz resonator;
the first crystal quartz oscillator is connected to the first crystal ceramic base through a conductive adhesive;
the first crystalline metal cover plate is soldered to the first crystalline ceramic base by a parallel solder packaging technique to form a first crystalline resonator component.
In a specific embodiment, the second crystalline gold electrode is disposed on the second crystalline quartz wafer through a plating process to form a second crystalline quartz resonator;
the second crystal quartz oscillator is adhered to the second crystal ceramic base through conductive glue;
the second crystalline metal cap is bonded to the second crystalline ceramic base by a parallel bond encapsulation technique to form a second crystalline resonator component.
In one embodiment, the filter capacitor assembly comprises: first filter capacitor, second filter capacitor and third filter capacitor, wherein, the filter capacitor subassembly through electrically conductive glue connect in the electric capacity pad of base is in order to realize right the temperature compensation chip carries out the filtering.
In a specific embodiment, the temperature compensation chip is adhered to a groove in the base through conductive glue;
and the pins of the temperature compensation chip are electrically connected with the bonding pads of the base in a gold wire bonding mode.
In a specific embodiment, the first crystal resonator and the second crystal resonator are bonded to the bonding pad of the base by conductive glue to complete the assembly of the miniaturized temperature compensated crystal oscillator.
In a specific embodiment, the first and second crystalline ceramic mounts are model SMD3225 crystalline mounts.
In one embodiment, the base is an SMD7050 crystal base.
The invention has the following beneficial effects:
the small-sized temperature compensation crystal oscillator is formulated to solve the existing problems at present, phase noise deterioration degree of the small-sized temperature compensation crystal oscillator under the severe vibration condition is optimized by arranging two complementary crystal resonators, the requirements of electronic equipment on miniaturization, high precision and vibration resistance of the temperature compensation crystal oscillator are met, and the small-sized temperature compensation crystal oscillator has wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows a schematic structural diagram of a miniaturized temperature-compensated crystal oscillator according to an embodiment of the present application.
FIG. 2 illustrates a schematic structural diagram of a first crystal resonator assembly according to one embodiment of the present application.
Figure 3 shows a schematic structural diagram of a second crystal resonator assembly according to an embodiment of the present application.
Fig. 4 shows a schematic diagram of a packaged temperature compensated crystal oscillator according to an embodiment of the present application.
Detailed Description
In order to more clearly illustrate the present application, the present application is further described below in conjunction with the preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not intended to limit the scope of the present application.
In order to meet the requirements of high stability of a temperature compensation crystal oscillator product under severe vibration conditions and the miniaturization of the product, the miniaturization and high-precision design of the product is required, and the invention provides a miniaturized temperature compensation crystal oscillator, as shown in fig. 1, which comprises the following components:
the crystal resonator comprises a base 10, a first crystal resonator component 20, a second crystal resonator component 30, a temperature compensation chip 40 and a filter capacitor component 50, wherein the first crystal resonator component 20, the second crystal resonator component 30, the temperature compensation chip 40 and the filter capacitor component 50 are arranged on the base 10.
In this embodiment, the base 10 is used for placing the first crystal resonator assembly 20, the second crystal resonator assembly 30, the temperature compensation chip 40, and the filter capacitor assembly 50, and electrically connecting the respective assemblies and providing a final input/output port. The first crystal resonator component 20, the second crystal resonator component 30, the temperature compensation chip 40 and the filter capacitor component 50 are electrically connected through the base 10.
Those skilled in the art can understand that the miniaturization of the surface-mounted double-crystal temperature-compensated ceramic base determines the final external dimension, so the miniaturization of the surface-mounted double-crystal resonator temperature-compensated ceramic base in the present embodiment is the basis for realizing the SMD7050 packaging, in other words, the model of the base is the SMD7050 crystal base.
In an alternative example, as shown in fig. 2, the first crystal resonator assembly 20 includes: a first crystalline ceramic pedestal 200, a first crystalline quartz wafer 202, a first crystalline gold electrode 204, and a first crystalline metal lid 206, wherein, in the specific fabrication process,
first, a first crystal gold electrode 204 is disposed on the first crystal quartz wafer 202 through a film coating process to form a first crystal quartz resonator.
That is, the first crystal gold electrode 204 is used as an electrode of the first crystal quartz wafer 202 to produce a first crystal quartz resonator. It should be noted that, the adhesion force of the electrode film layer manufactured by the traditional evaporation coating is poor, and the stress existing inside the electrode film and between the electrode film and the wafer is large, which affects the aging rate of the product. By adopting the high vacuum ion beam sputtering coating process, the vacuum degree of the coating film is higher than that of the traditional evaporation coating, the coating film firmness is improved, the film stress is reduced, the film adhesion of an electrode film on the surface of a wafer is enhanced, the stress is reduced, the long-term stability of the product is improved, and the aging performance of the product is better. In the example, the ion etching fine adjustment is adopted, namely, the ion beam is adopted to etch a small amount of electrode materials, and the frequency is adjusted in a fine adjustment mode, so that the adhesion and film stress caused by secondary evaporation can be avoided, and the aging rate of the product is reduced.
In this example, a first crystal gold electrode is plated on the first crystal quartz wafer 202 to cooperate with a temperature compensation chip to generate an oscillation circuit. Because of the method of using register to control the multinomial coefficient, the required control voltage can only be formed according to the polynomial smooth curve, and the sudden jump of the resonator attached to the smooth curve cannot be compensated. Therefore, it is required that the frequency-temperature characteristic curve is smooth, and the frequency jump point must not exceed 1/2 of the required temperature frequency difference. The frequency temperature stability characteristic of the first quartz oscillator is optimized by adjusting the corner cut of the first quartz wafer, so that the first quartz oscillator is better matched with a temperature compensation chip compensation algorithm curve, the frequency jump variable of the quartz oscillator generated along with the temperature change is reduced by adjusting the width-thickness ratio of the wafer, the frequency temperature stability characteristic of a product is optimized, and the frequency jump point of the product is smaller than +/-0.5 ppm.
Next, the first crystal quartz resonator is bonded to the first crystal ceramic base 200 by a conductive adhesive. The first crystal ceramic base is an SMD3225 surface-mounted crystal ceramic base, is used for placing the first crystal quartz oscillator and the first crystal metal cover plate, and is used for electrically connecting each part and providing a final input/output port.
Finally, the first crystalline metal lid 206 is soldered to the first crystalline ceramic base 200 by a parallel solder packaging technique to form the first crystalline resonator component 20.
In an alternative example, as shown in fig. 3, the second crystal resonator assembly 30 includes: a second crystalline ceramic pedestal 300, a second crystalline quartz wafer 302, a second crystalline gold electrode 304, and a second crystalline metal lid 306, wherein, in the specific fabrication process,
firstly, a second crystal gold electrode 304 is arranged on the second crystal quartz wafer 302 through a film coating process to form a second crystal quartz oscillator;
namely, a second crystal gold electrode is plated on a second crystal quartz wafer and is used for being matched with a temperature compensation chip to generate an oscillation circuit; the second crystal gold electrode 304 is used as an electrode of the second crystal quartz wafer 302 to manufacture a second crystal quartz resonator.
Secondly, the second crystal quartz oscillator is bonded to the second crystal ceramic base through conductive glue; the second crystal ceramic base is an SMD3225 surface-mounted crystal ceramic base, is used for placing a second crystal quartz vibrator and a second crystal metal cover plate, and is electrically connected with each part and provides a final input/output port.
It should be noted that, since the dual-crystal resonator with low acceleration sensitivity is the core component of the whole crystal oscillator, two first crystal resonator component 20 and second crystal resonator component 30 with similar acceleration sensitivity performance must be selected to be combined symmetrically, so that their acceleration sensitivities can be cancelled out, in other words, the first crystal resonator component 20 and second crystal resonator component 30 are complementary, specifically, referring to fig. 2 and 3, the first crystal quartz crystal lens 202 and the second crystal quartz crystal plate 302 are opposite in direction when they are assembled, so as to cancel the oscillation, and optimize the phase noise deterioration degree under severe vibration condition, so as to meet the requirements of electronic devices on miniaturization, high precision and vibration resistance of the temperature compensated crystal oscillator.
Finally, the second crystalline metal cap is soldered to the second crystalline ceramic base by a parallel solder packaging technique to form a second crystalline resonator component.
In an alternative example, the temperature compensation chip 40 is used to compensate the temperature of the first crystal resonator assembly 20 and the second crystal resonator assembly 30. In other words, the temperature compensation chip 40 is used for cooperating with the first crystal quartz resonator and the second crystal quartz resonator to generate an oscillation circuit, and performing temperature compensation calculation on the two crystal quartz resonators, and finally outputting a high-precision frequency signal.
In the embodiment, in order to realize the microminiaturization of the crystal quartz oscillator, all parts of the circuit are designed in an integrated manner, wherein the main oscillation circuit, the filter circuit and the compensation network are integrated on a temperature compensation chip, and the accuracy of temperature compensation is greatly improved by designing a compensation algorithm curve of a high-order term, so that the crystal oscillator can realize the index of the frequency stability of less than or equal to +/-1 ppm within the wide temperature range of-55 ℃ to +85 ℃.
It should also be noted that the temperature compensation chip is adhered to the groove in the base through the conductive adhesive; and the pins of the temperature compensation chip are electrically connected with the bonding pads of the base in a gold wire bonding mode. In order to protect the temperature compensation chip, epoxy resin is filled into a groove in the ceramic base of the temperature compensation crystal oscillator through a glue filling process, and the temperature compensation chip is sealed and protected.
In an alternative example, the filter capacitor assembly 50 is used for filtering the temperature compensation chip 40. As shown in fig. 1, it includes: the temperature compensation chip comprises a first filter capacitor 500, a second filter capacitor 502 and a third filter capacitor 503, wherein the filter capacitor assembly is adhered to a capacitor bonding pad of the base through a conductive adhesive to filter the temperature compensation chip.
It should be noted that, the number of the filter capacitors is not limited in the present application, as long as the filter capacitor assembly 50 can perform the filtering function on the temperature compensation chip 40.
In this embodiment, the first crystal resonator component, the second crystal resonator component, and the filter capacitor component are bonded to the bonding pad of the base through the conductive adhesive, and the temperature compensation chip is assembled in the base through the processes of chip mounting, chip bonding, and packaging, so as to complete the assembly of the miniaturized temperature compensation crystal oscillator, and form a physical miniaturized low-acceleration sensitivity temperature compensation crystal oscillator product as shown in fig. 4, which has an external dimension of SMD7050, length × width × height: 7mm 5mm 2mm (max), the product is packaged by ceramic metal, and is a split TCXO structure. The split TCXO structure resonator and the oscillation circuit chip are packaged respectively, the upper half part of the split TCXO structure resonator and the oscillation circuit chip is a double-crystal resonator and a capacitor, the lower half part of the split TCXO structure resonator and the oscillator circuit chip is a ceramic base packaged with a temperature compensation chip, and the two parts are assembled through conductive adhesive bonding.
And after the assembly is finished, debugging and testing the temperature compensation crystal oscillator, such as wide temperature compensation debugging. After debugging, testing the normal-temperature electrical property index and the frequency-temperature stability, eliminating products with unqualified electrical property indexes and frequency-temperature stability indexes, and enabling the normal-temperature electrical property and the frequency-temperature stability of the crystal oscillator to meet target requirements, so that the stability of the product is better than +/-1 ppm at the temperature of-55 ℃ to +85 ℃, and the phase noise deterioration degree of the crystal oscillator under the severe vibration condition is optimized.
The two complementary crystal resonators are arranged, so that the phase noise deterioration degree of the crystal resonator under the severe vibration condition is optimized, the requirements of electronic equipment on miniaturization, high precision and vibration resistance of the temperature compensation crystal oscillator are met, and the crystal resonator has a wide application prospect.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (10)
1. A miniaturized temperature compensated crystal oscillator, comprising: a base, a first crystal resonator component, a second crystal resonator component, a temperature compensation chip and a filter capacitor component which are arranged on the base, wherein,
the first crystal resonator component, the second crystal resonator component, the temperature compensation chip and the filter capacitor component are electrically connected through the base;
the first crystal resonator component is complementary to the second crystal resonator component to counteract oscillation;
the temperature compensation chip is used for carrying out temperature compensation on the first crystal resonator component and the second crystal resonator component;
and the filter capacitor assembly is used for filtering the temperature compensation chip.
2. The temperature compensated crystal oscillator of claim 1, wherein the first crystal resonator assembly comprises: the first crystal ceramic base, the first crystal quartz chip, the first crystal gold electrode and the first crystal metal cover plate.
3. The temperature compensated crystal oscillator of claim 2, wherein the second crystal resonator assembly comprises: a second crystal ceramic base, a second crystal quartz chip, a second crystal gold electrode and a second crystal metal cover plate.
4. The temperature compensated crystal oscillator according to claim 2,
the first crystal gold electrode is arranged on the first crystal quartz wafer through a film coating process to form a first crystal quartz vibrator;
the first crystal quartz oscillator is connected to the first crystal ceramic base through a conductive adhesive;
the first crystalline metal cover plate is soldered to the first crystalline ceramic base by a parallel solder packaging technique to form a first crystalline resonator component.
5. The temperature compensated crystal oscillator according to claim 3,
the second crystal gold electrode is arranged on the second crystal quartz wafer through a film coating process to form a second crystal quartz vibrator;
the second crystal quartz oscillator is adhered to the second crystal ceramic base through conductive glue;
the second crystalline metal cap is bonded to the second crystalline ceramic base by a parallel bond encapsulation technique to form a second crystalline resonator component.
6. The crystal oscillator as claimed in claim 1, wherein the filter capacitor assembly comprises: first filter capacitor, second filter capacitor and third filter capacitor, wherein, filter capacitor assembly through the electrically conductive glue connect in the electric capacity pad of base is in order to realize right the temperature compensation chip carries out the filtering.
7. The temperature compensated crystal oscillator according to claim 1,
the temperature compensation chip is adhered to the groove in the base through the conductive adhesive;
and the pins of the temperature compensation chip are electrically connected with the bonding pads of the base in a gold wire bonding mode.
8. The crystal oscillator according to claim 1, wherein the first crystal resonator and the second crystal resonator are bonded to the bonding pads of the base by conductive glue to complete the assembly of the miniaturized crystal oscillator.
9. The temperature compensated crystal oscillator of claim 2, wherein the first and second crystal ceramic bases are SMD3225 crystal bases.
10. The temperature compensated crystal oscillator of claim 2, wherein the pedestal is an SMD7050 crystal pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111550124.3A CN114499452A (en) | 2021-12-17 | 2021-12-17 | Miniaturized temperature compensation crystal oscillator |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111550124.3A CN114499452A (en) | 2021-12-17 | 2021-12-17 | Miniaturized temperature compensation crystal oscillator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115276565A (en) * | 2022-09-29 | 2022-11-01 | 成都世源频控技术股份有限公司 | High-stability meter-attached quartz crystal oscillator |
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2021
- 2021-12-17 CN CN202111550124.3A patent/CN114499452A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115276565A (en) * | 2022-09-29 | 2022-11-01 | 成都世源频控技术股份有限公司 | High-stability meter-attached quartz crystal oscillator |
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