JP2020120190A - Crystal element, crystal device, and electronic apparatus - Google Patents

Abstract

To provide a crystal element that can ensure stable frequency characteristics by reducing variations in substantial external dimensions.SOLUTION: A crystal element 10 comprises: a crystal piece 12 that has, in plan view, long sides 11a, 11b and short sides 11c, 11d and has an approximately rectangular shape; when two opposing surfaces surrounded by the long sides 11a, 11b and the short sides 11c, 11d are principal surfaces 13e, 13f, and the remaining four surfaces are side faces 13a, 13b, 13c, 13d, excitation electrodes 14e, 14f that are located on the two principal surfaces 13e, 13f, and first groove parts 15ae, 15be, 15af, 15bf that extend along the long sides 11a, 11b on the principal surfaces 13e, 13f.SELECTED DRAWING: Figure 1

Description

The present invention relates to a crystal element, a crystal device including the crystal element, and electronic equipment including the crystal device. Examples of the crystal device include a crystal oscillator or a crystal oscillator.

The thickness-shear vibration mode crystal element has a metal film pattern formed on an AT-cut crystal piece. This crystal piece is obtained by dividing one AT-cut crystal wafer into a large number by wet etching. The crystal device generates a specific frequency by utilizing the piezoelectric effect and the inverse piezoelectric effect of the crystal element. A general crystal device has a structure in which a crystal element is housed in a package and is hermetically sealed by a lid (for example, Patent Document 1).

JP, 2016-139901, A

In the process of manufacturing a crystal piece, a corrosion resistant film pattern of chromium or the like is formed on a crystal wafer and the crystal wafer is immersed in a hydrofluoric acid-based etching solution. As a result, the part of the crystal not covered with the corrosion resistant film is etched until it penetrates (outer shape processing step). At this time, the adhesion of the corrosion resistant film to the crystal wafer may become non-uniform due to oxidation of the corrosion resistant film or the like. The so-called jagged scratches are formed on the outer periphery of the crystal piece by etching progressing from the place where the adhesion is weak. As a result, the crystal elements at the time of mass production have substantial variations in outer dimensions, and the frequency characteristics of the crystal elements also vary.

Therefore, an object of the present invention is to provide a crystal element or the like that can secure stable frequency characteristics by suppressing substantial variations in external dimensions.

The crystal element according to the present invention has a substantially rectangular flat plate-shaped crystal piece having a long side and a short side in plan view, and two opposing surfaces surrounded by the long side and the short side as main surfaces, When the remaining four surfaces are side surfaces, the excitation electrodes located on the two main surfaces and the groove portion extending along at least one of the long side and the short side on the main surface are provided. ..

The crystal device according to the present invention includes the crystal element according to the present invention, and the electronic device according to the present invention includes the crystal device according to the present invention.

According to the crystal element of the present invention, by providing the groove portion extending along at least one of the long side and the short side on the main surface of the crystal piece, the groove portion eliminates the influence of scratches generated from the outer circumference to the inside of the crystal piece. As a result, it is possible to suppress substantial variations in external dimensions and secure stable frequency characteristics.

1A is a perspective view showing the crystal element of the first embodiment, and FIG. 1B is an enlarged sectional view taken along line Ib-Ib in FIG. 1A. 2A is a perspective view showing the crystal element of the second embodiment, FIG. 2B is an enlarged sectional view taken along line IIb-IIb in FIG. 2A, and FIG. FIG. 2B is an enlarged cross-sectional view taken along line IIc-IIc in FIG. FIG. 3A is a perspective view showing the crystal element of the third embodiment, and FIG. 3B is an enlarged sectional view taken along line IIIb-IIIb in FIG. 3A. FIG. 4A is a perspective view showing the crystal element of the fourth embodiment, and FIG. 4B is an enlarged sectional view taken along line IVb-IVb in FIG. 4A. 5A is a perspective view showing the crystal device of the fifth embodiment, and FIG. 5B is a sectional view taken along line Vb-Vb in FIG. 5A. FIG. 6A is a front view showing a first example of the electronic device of the sixth embodiment, and FIG. 6B is a front view showing a second example of the electronic device of the sixth embodiment. FIG. 7A is a partial plan view showing a case where there is no first groove portion in the crystal element of Embodiment 1, and FIG. 7B is a portion showing a case where there is a first groove portion in the crystal element of Embodiment 1. It is a top view.

Hereinafter, modes for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and the drawings, substantially the same components are designated by the same reference numerals, and the description thereof will be omitted as appropriate. The shapes drawn in the drawings are drawn so as to be easily understood by those skilled in the art, and therefore, they may not necessarily match the actual dimensions and ratios.

<Embodiment 1>
As shown in FIGS. 1A and 1B, the crystal element 10 according to the first embodiment has a substantially rectangular flat crystal piece having long sides 11a and 11b and short sides 11c and 11d in plan view. 12, two opposing surfaces surrounded by the long sides 11a, 11b and the short sides 11c, 11d are major surfaces 13e, 13f, and the remaining four surfaces are side surfaces 13a, 13b, 13c, 13d, Excitation electrodes 14e and 14f located on the two main surfaces 13e and 13f and groove portions extending along at least one of the long sides 11a and 11b and the short sides 11c and 11d on the main surfaces 13e and 13f are provided. The groove portion in the first embodiment includes first groove portions 15ae, 15be, 15af, 15bf extending along the long sides 11a, 11b on the main surfaces 13e, 13f.

Further, the two side surfaces 13a, 13b including the long sides 11a, 11b are substantially parallel to the thickness direction of the crystal piece 12 and the slope portions 16a, 16b inclined in the thickness direction of the crystal piece 12 (Y'-axis direction). And side surfaces 17a and 17b. The slope portions 16a and 16b are m-planes of the crystal planes, and the side surface portions 17a and 17b include a plane perpendicular to the R-plane of the crystal planes.

Next, the crystal element 10 will be described in more detail.

The crystal piece 12 is an AT-cut crystal piece. That is, in a crystal, a Cartesian coordinate system XYZ composed of an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis) is set to 30° or more and 50° or less (for example, 35° 15′) When rotated to define the Cartesian coordinate system XY′Z′, the wafer cut in parallel to the XZ′ plane becomes the raw material of the crystal blank 12. The long sides 11a and 11b are parallel to the X axis, the short sides 11c and 11d are parallel to the Z'axis, and the thickness direction is parallel to the Y'axis. As an example of the external dimensions of the crystal piece 12, the long sides 11a and 11b are 650 to 920 μm, the short sides 11c and 11d are 550 to 690 μm, and the thickness is 59 to 62 μm.

The pair of excitation electrodes 14e and 14f are made of a conductive material such as metal, have a rectangular shape in a plan view, and are provided at substantially the center of both main surfaces 13e and 13f. From the excitation electrodes 14e and 14f, extraction electrodes 14a and 14b for connection that do not contribute to excitation extend along the long sides 11a and 11b to the short side 11c. That is, the extraction electrode 14a is electrically connected to the excitation electrode 14e, and the extraction electrode 14b is electrically connected to the excitation electrode 14f.

The first groove portions 15ae, 15be, 15af, 15bf linearly extend from the short side 11c to the short side 11d in parallel with the long sides 11a, 11b, and have a width 15w and a depth 15d of 1 to 10 μm, respectively. The first groove portion 15ae is provided near the long side 11a of the main surface 13e, the first groove portion 15be is provided near the long side 11b of the main surface 13e, and the first groove portion 15af is near the long side 11a of the main surface 13f. The first groove portion is provided in the vicinity of the long side 11b of the main surface 13f of 15bf. Here, the “vicinity” means a position where the action and effect described later are exhibited.

The method for forming the first groove portions 15ae,... May be any method such as wet etching, dry etching, or laser processing. When wet etching is used, the etching is extremely shallow as compared with the etching that penetrates the quartz wafer (outer shape processing step), so the influence of the variation in the adhesion of the corrosion resistant film can be ignored. The time points at which the first groove portions 15ae,... Are formed may be before, after, or simultaneously with the outer shape processing step. If it is formed at the same time as the outer shape processing step, wet etching is performed, so it is necessary to use a pattern for suppressing etching.

The four first groove portions 15ae, etc. do not necessarily have to be provided, and may have a dotted line shape, a broken line shape, or a curved shape instead of a straight line shape, or may be provided only in a part from the short side 11c to the short side 11d. Of course, the long sides 11a and 11b may not be parallel to each other but may be slightly inclined.

The slope portions 16a, 16b and the side surface portions 17a, 17b slightly shift the mask (corrosion resistant film) of the main surface 13e and the mask (corrosion resistant film) of the main surface 13f in the Z'-axis direction during wet etching (outer shape processing step). Obtained by

The crystal element 10 can be manufactured by using, for example, a photolithography technique and an etching technique. Here, a case will be described in which the first groove portions 15ae,... Are formed by wet etching before the outer shape processing step.

First, a corrosion resistant film is provided on an AT-cut crystal wafer, and a photoresist is provided thereon. Subsequently, a mask on which the pattern of the first groove portions 15ae,... Is drawn is superimposed on the photoresist, and exposure and development are performed to expose the corrosion resistant film. In this state, the corrosion resistant film is wet-etched, and then the quartz is wet-etched to form the first groove portions 15ae,....

Then, after removing the remaining anticorrosion film and the photoresist, a new anticorrosion film and the photoresist are again provided on the crystal wafer, a mask on which the pattern of the crystal piece 12 is drawn is superimposed on the photoresist, and the exposure and The corrosion resistant film is exposed by developing. In this state, the corrosion-resistant film is wet-etched, and then the crystal is wet-etched to form the outer shape of the crystal piece 12 (outer shape processing step).

After that, the photoresist is removed, a new photoresist is provided again, and a mask on which the patterns of the excitation electrodes 14e and 14f are drawn is exposed and developed to expose the corrosion resistant film, and then the excitation electrode 14e is exposed. , 14f are provided. After that, the unnecessary corrosion resistant film and the unnecessary photoresist are removed to form a plurality of crystal elements 10 on the crystal wafer. Finally, the crystal element 10 is obtained by dividing the crystal wafer into individual crystal elements 10.

The operation of the crystal element 10 is as follows. An alternating voltage is applied to the crystal blank 12 via the excitation electrodes 14e and 14f. Then, the crystal blank 12 causes thickness shear vibration so that the two principal surfaces 13e and 13f are displaced from each other, and a specific frequency is generated. As described above, the crystal element 10 operates so as to output a signal of a constant frequency by utilizing the piezoelectric effect and the inverse piezoelectric effect of the crystal piece 12.

Next, the operation and effect of the crystal element 10 will be described.

In the process of manufacturing the crystal piece 12, a corrosion resistant film pattern of chromium or the like is formed on the crystal wafer and the crystal wafer is immersed in a hydrofluoric acid-based etching solution. As a result, the portion of the crystal not covered with the corrosion resistant film is etched until it penetrates. At this time, the adhesion of the corrosion-resistant film to the quartz wafer may become non-uniform due to the oxidation of the corrosion-resistant film or the like, and the etching progresses from the place where the adhesion is weak. Therefore, as shown in FIGS. 7A and 7B, a so-called jagged scratch 70 is formed on the outer periphery of the crystal blank 12.

As a result, as shown in FIG. 7A, when the first groove portions 15ae,... Are not provided, the crystal element during mass production has a substantial variation in external dimensions, and the frequency characteristic of the crystal element also varies. Will occur.

On the other hand, the crystal element 10 includes the first groove portions 15ae, 15be, 15af, 15bf extending along the long sides 11a, 11b on the main surfaces 13e, 13f of the crystal piece 12, so that the crystal element 12 shown in FIG. ], the influence of the scratches 70 generated from the outer circumference to the inner side of the crystal blank 12 is eliminated by the first groove portions 15ae, 15be, 15af, 15b, so that substantial variation in outer dimensions is suppressed and stable frequency characteristics are obtained. Can be secured.

This will be described in more detail. 7A and 7B, a part of the main surface 13e is extracted and shown. As shown in FIG. 7A, when the first groove portion 15be is not provided, the jagged scratch 70 due to etching deeply penetrates inward from the side surface 13b (side surface portion 17b). On the other hand, as shown in FIG. 7B, by forming the first groove portion 15be, the surface that greatly affects the frequency characteristics is changed from the jagged surface that varies during mass production to the flat surface that is constant during mass production.

The effect of the first groove portion 15be is not based on the assumption that the tip of the scratch 70 contacts the first groove portion 15be. However, when the tip of the scratch 70 contacts the first groove portion 15be, the following two actions are performed. First, if the first groove 15be is formed before or at the same time as the occurrence of the scratch 70, the progress of the scratch 70 is stopped by the first groove 15be. Secondly, if the first groove 15be is formed after the scratch 70 is generated, the tip of the scratch 70 is removed by the first groove 15be.

Explaining with reference to FIG. 1B, although the width W, which is the dimension of the short sides 11c and 11d, varies, it is the width We that is the dimension between the first groove portions 15be and 15ae and the dimension between the first groove portions 15bf and 15af. Variation in a certain width Wf can be suppressed. Therefore, the thickness shear vibration generated between the excitation electrodes 14e and 14f of the crystal element 12 is reflected by the first groove portions 15ae, 15be, 15af, and 15bf, so that the width We and width Wf have a frequency characteristic rather than the width W. Since it has an influence, a stable frequency characteristic can be secured. For example, it is possible to suppress spurious and frequency fluctuations at operating temperature.

Further, since the vibration is reflected by the first groove portions 15ae, 15be, 15af, 15bf, the vibration displacement attenuation amount at both end portions (both side surfaces 13a, 13b) of the crystal piece 12 becomes large, so that the center of the crystal piece 12 is increased. The vibration energy can be easily trapped in the portion, and the CI (crystal impedance) value can be reduced. Due to this effect, it is not necessary to adopt a structure such as a so-called convex shape, bevel shape, or mesa shape, so that the manufacturing process can be simplified.

In addition, since the slope portions 16a and 16b which are m-planes of the crystal planes and the side surface portions 17a and 17b including the planes perpendicular to the R-plane of the crystal planes are provided, both end portions (both side surfaces 13a and 13b) are Since it is substantially thin, the vibration displacement at both ends (both sides 13a, 13b) is greatly damped. Therefore, the synergistic effect with the first groove portions 15ae,... Further improves the vibration energy confinement effect, so that the CI value can be further reduced. This effect is maximized when the thickness of the slope portions 16a, 16b and the thickness of the side surface portions 17a, 17b are equal in the thickness direction (Y'-axis direction) of the crystal blank 12. At this time, as shown in FIG. 1B, since the left and right are point-symmetric with respect to the center of gravity of the crystal blank 12, the upper half and the lower half of the crystal blank 12 have the same vibration state. Vibration balance can be improved.

<Embodiment 2>
As shown in FIGS. 2A, 2B, and 2C, the crystal element 20 according to the second embodiment extends along the long sides 11a and 11b on the main surfaces 13e and 13f, and It differs from the first embodiment in that the second groove portions 25ae, 25be, 25af, 25bf located inside the groove portions 15ae, 15be, 15af, 15bf are provided.

Further, the crystal element 20 also extends along the short sides 11c and 11d on the main surfaces 13e and 13f, and also has the second groove portions 25ce, 25de, 25cf and 25df located inside the first groove portions 15ae, 15be, 15af and 15bf. I have it. Both ends of the second groove portion 25ce are in contact with the second groove portions 25ae and 25be, respectively, and both ends of the second groove portion 25de are also in contact with the second groove portions 25ae and 25be, respectively, and surround the excitation electrode 14e in a rectangular frame shape as a whole. Similarly, both ends of the second groove portion 25cf are in contact with the second groove portions 25af and 25bf, respectively, and both ends of the second groove portion 25df are also in contact with the second groove portions 25af and 25bf, respectively, and surround the excitation electrode 14f in a rectangular frame shape as a whole. .. The lead electrodes 14a and 14b also pass through the second groove portions 25ce and 25cf, respectively.

The second groove portions 25ae, 25be, 25af, 25bf extend linearly in parallel to the long sides 11a, 11b, and have the same width and depth, for example, as the first groove portions 15ae,. The second groove portions 25ce, 25de, 25cf, 25df linearly extend in parallel with the short sides 11c, 11d, and have the same width and depth, for example, as the first groove portions 15ae,. The second groove portions 25ae and 25be are located between the long sides 11a and 11b and the excitation electrode 14e, respectively, and the second groove portions 25af and 25bf are located between the long sides 11a and 11b and the excitation electrode 14f, respectively. The second groove portions 25ce and 25de are located between the short sides 11c and 11d and the excitation electrode 14e, respectively, and the second groove portions 25cf and 25df are located between the short sides 11c and 11d and the excitation electrode 14f, respectively.

The second groove portions 25ae,... Are not necessarily provided in all eight, and may have a dotted line shape, a broken line shape, or a curved shape instead of a straight line shape, may not be in contact with each other at both ends, and may have long sides 11a, 11b or short sides. The sides 11c and 11d may not be parallel to each other but may be slightly inclined. The first groove portions 15ae,... Are not necessarily required, and only the second groove portions 25ae,.

According to the crystal element 20, since the second groove portions 25ae,... Are provided, the vibration energy trapping effect is further improved by the synergistic action of the first groove portions 15ae,... And the slope portions 16a, 16b and the side surface portions 17a, 17b. Therefore, the CI value can be further reduced. Other configurations, operations, and effects of the second embodiment are similar to those of the first embodiment.

<Embodiment 3>
As shown in FIGS. 3A and 3B, in the crystal element 30 of the third embodiment, the third groove portions 35ce, 35de, 35cf, which extend along the short sides 11c, 11d in the main surfaces 13e, 13f, It is different from the first embodiment in that it has 35 df. The third groove portions 35ce, 35de, 35cf, 35df are in contact with the first groove portions 15ae, 15be, 15af, 15bf without intersecting. Both ends of the third groove portion 35ce are in contact with the first groove portions 15ae and 15be, respectively, and both ends of the third groove portion 35de are also in contact with the first groove portions 15ae and 15be, respectively, and surround the excitation electrode 14e in a rectangular frame shape as a whole. Similarly, both ends of the third groove portion 35cf are in contact with the first groove portions 15af and 15bf, respectively, and both ends of the third groove portion 35df are also in contact with the first groove portions 15af and 15bf, respectively, and surround the excitation electrode 14f in a rectangular frame shape as a whole. .. The lead electrodes 14a and 14b also pass through the inside of the third groove portions 35ce and 35cf, respectively.

The third groove portions 35ce, 35de, 35cf, 35df extend linearly in parallel to the short sides 11c, 11d, and have the same width and depth, for example, as the first groove portions 15ae,. The third groove 35ce is provided near the short side 11c of the main surface 13e, the third groove 35de is provided near the short side 11d of the main surface 13e, and the third groove 35cf is near the short side 11c of the main surface 13f. And the third groove is provided near the short side 11d of the main surface 13f of 35df. Here, the “vicinity” means a position where the action and effect described later are exhibited.

The third groove portions 35ce,... Are not necessarily provided in all four, and may be in a dotted line shape, a broken line shape, or a curved shape instead of a straight line shape, and both ends may not contact the first groove portions 15ae,. The sides 11c and 11d may not be parallel to each other but may be slightly inclined. The first groove portions 15ae,... Are not necessarily required, and only the third groove portions 35ae,.

According to the crystal element 30, the third grooves 35ce, 35de, 35cf, and 35df extending along the short sides 11c and 11d in the main surfaces 13e and 13f are provided, so that the short sides 11c and 11d are generated inward by etching. Since the influence of scratches is eliminated by the third groove portions 35ce, 35de, 35cf, 35df, the substantial dimensional variation of the long sides 11a, 11b is suppressed.

Explaining with FIG. 3B, although the length L which is the dimension of the long sides 11a and 11b varies, the length Le which is the dimension between the third groove portions 35ce and 35de and between the third groove portions 35cf and 35df. Variation in the length Lf, which is a dimension, can be suppressed. Therefore, since the thickness shear vibration generated in the crystal piece 12 is reflected by the third groove portions 35ce, 35de, 35cf, 35df, the dimensions of the length Le and the length Lf rather than the length L affect the frequency characteristic. It is possible to secure stable frequency characteristics. Therefore, a more stable frequency characteristic can be secured by the synergistic action with the first groove portions 15ae,....

Further, according to the crystal element 30, since the vibration is reflected by the third groove portions 35ce, 35de, 35cf, 35df by providing the third groove portions 35ce,..., Both end portions (both side surfaces 13c, 13d of the crystal piece 12) are reflected. ), the amount of vibration displacement attenuation increases. Therefore, the synergistic action of the first groove portions 15ae,... And the slope portions 16a, 16b and the side surface portions 17a, 17b further improves the vibration energy confinement effect, so that the CI value can be further reduced.

Further, when the third groove portions 35ce,... Cross the first groove portions 15ae,..., complex, minute, and fragile structures are formed at the four corners of the crystal blank 12, so that the crystal blank 12 is easily chipped. In the third embodiment, the third groove portions 35ce,... Are in contact with the first groove portions 15ae,.. Other configurations, operations, and effects of the third embodiment are similar to those of the first and second embodiments.

<Embodiment 4>
As shown in FIGS. 4A and 4B, in the crystal element 40 of the fourth embodiment, in the crystal piece 12, a part of the main surfaces 13e and 13f is in the thickness direction of the crystal piece 12 (Y′ axis direction). ), and the excitation electrodes 14e and 14f are provided on the protrusions 41e and 41f, respectively, which is different from the first embodiment. Such a structure can be obtained by two times of etching, that is, wet etching for forming the convex portions 41e and 41f and wet etching for forming the outer shape of the crystal blank 12.

According to the crystal element 40, since the vibration energy is confined in the convex portions 41e, 41f by providing the convex portions 41e, 41f, the first groove portions 15ae,... And the slope portions 16a, 16b and the side surface portions 17a, 17b. By virtue of the synergistic effect with, the vibration energy confinement effect can be further improved and the CI value can be further reduced. Other configurations, operations, and effects of the fourth embodiment are similar to those of the first to third embodiments.

<Fifth Embodiment>
As shown in FIGS. 5A and 5B, a crystal device 50 according to the fifth embodiment includes a crystal element 10 according to the first embodiment, a base 51 on which the crystal element 10 is located, and a crystal element together with the base 51. And a lid 52 that hermetically seals 10. The base body 51, which is also called a package, includes a substrate 51a and a frame body 51b. A space surrounded by the upper surface of the substrate 51a, the inner side surface of the frame 51b, and the lower surface of the lid 52 serves as a housing portion 53 of the crystal element 10. The crystal element 10 outputs, for example, a reference signal used in an electronic device or the like.

In other words, the crystal device 50 includes a substrate 51a having a pair of electrode pads 51d on the upper surface and four external terminals 51c on the lower surface, a frame body 51b located along the outer peripheral edge of the upper surface of the substrate 51a, and a pair of electrode pads. The crystal element 10 is mounted on 51d via a conductive adhesive 51e, and a lid 52 for hermetically sealing the crystal element 10 together with the frame 51b.

The substrate 51a and the frame 51b are made of a ceramic material such as alumina ceramics or glass ceramics, and are integrally formed to form the base 51. The base body 51 and the lid body 52 are substantially rectangular in plan view. The external terminal 51c, the electrode pad 51d, and the lid 52 are electrically connected to each other through a conductor formed inside or on the side surface of the base body 51. Specifically, the external terminals 51c are located at the four corners of the lower surface of the substrate 51a. Two of the external terminals 51c are electrically connected to the crystal element 10, and the other two external terminals 51c are electrically connected to the lid 52. The external terminal 51c is used for mounting on a printed wiring board or the like of an electronic device or the like.

As described above, the crystal element 10 includes the crystal piece 12, the excitation electrode 14e formed on the upper surface of the crystal piece 12, and the excitation electrode 14f formed on the lower surface of the crystal piece 12. The crystal element 10 is bonded onto the electrode pad 51d via the conductive adhesive 51e, and plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and piezoelectric effect.

The electrode pads 51d are for mounting the crystal element 10 on the base 51, and a pair of electrode pads are adjacently arranged along one side of the substrate 51a. Then, the pair of electrode pads 51d are respectively connected to the extraction electrodes 14a and 14b to make one end of the crystal element 10 a fixed end and the other end of the crystal element 10 a free end separated from the upper surface of the substrate 51a. The crystal element 10 is fixed on the substrate 51a by a cantilevered support structure.

The conductive adhesive 51e is, for example, a binder such as a silicone resin containing conductive powder as a conductive filler. The lid body 52 is made of, for example, an alloy containing at least one of iron, nickel, and cobalt, and is joined to the frame body 51b by seam welding or the like to be in a vacuum state or a containing portion 53 filled with nitrogen gas or the like. Is hermetically sealed.

Since the crystal device 50 includes the crystal element 10, stable frequency characteristics can be exhibited.

<Sixth Embodiment>
As shown in FIGS. 6A and 6B, each of the electronic devices 61 and 62 of the sixth embodiment includes a crystal device 50. The electronic device 61 illustrated in FIG. 6A is a smartphone, and the electronic device 62 illustrated in FIG. 6B is a personal computer.

In the crystal device 50 configured as shown in FIG. 5, the bottom surfaces of the external terminals 51c are fixed to the printed circuit board by soldering, gold (Au) bumps, a conductive adhesive, or the like, so that the electronic devices 61 and 62 are mounted. It is mounted on the surface of the constituent printed circuit board. The crystal device 50 is used as an oscillation source in various electronic devices such as smartphones, personal computers, watches, game machines, communication devices, and vehicle-mounted devices such as car navigation systems.

According to the electronic devices 61 and 62, by including the crystal device 50, high-performance and highly reliable operation based on stable frequency characteristics can be realized.

<Other>
Although the present invention has been described with reference to the above exemplary embodiments, the present invention is not limited to these. Various changes that can be understood by those skilled in the art can be added to the configuration and details of the present invention. Further, the present invention also includes a combination of some or all of the configurations of the above-described respective embodiments as appropriate. For example, the second to third embodiments may be combined to include the first to third groove portions, or a fourth groove portion may be additionally provided between the second groove portion and the third groove portion or the first groove portion. Good.

10, 20, 30, 40 Crystal element 11a, 11b Long side 11c, 11d Short side 12 Crystal piece 13e, 13f Main surface 13a, 13b, 13c, 13d Side surface 14a, 14b Extraction electrode 14e, 14f Excitation electrode 15ae, 15be, 15af , 15bf First groove 25ae, 25be, 25ce, 25de, 25af, 25bf, 25cf, 25df Second groove 35ce, 35de, 35cf, 35df Third groove 16a, 16b Slope 17a, 17b Side 41e, 41f Convex 50 Quartz Device 51 Base 51a Substrate 51b Frame 51c External Terminal 51d Electrode Pad 51e Conductive Adhesive 52 Lid 53 Housing 61, 62 Electronic Equipment 70 W W, We, Wf, 15w Width L, Le, Lf Length 15d Depth

Claims (10)

A substantially rectangular flat crystal piece having a long side and a short side in a plan view,
When the opposing two surfaces surrounded by the long side and the short side are the main surfaces and the remaining four surfaces are the side surfaces, the excitation electrodes located on the two main surfaces,
A groove portion extending along at least one of the long side and the short side in the main surface,
A crystal element equipped with. The groove portion includes a first groove portion extending along the long side in the main surface,
A crystal element equipped with. The groove portion further includes a second groove portion that extends along the long side on the main surface and is located inside the first groove portion,
The crystal element according to claim 2. The groove portion further includes a third groove portion extending along the short side in the main surface,
The crystal element according to claim 2 or 3. The third groove portion is in contact with the first groove portion without intersecting,
The crystal element according to claim 4. The two side surfaces including the long side are composed of an inclined surface portion that is inclined in the thickness direction of the crystal piece, and a side surface portion that is substantially parallel to the thickness direction of the crystal piece.
The crystal element according to claim 1. The slope portion is the m-plane of the crystal plane, and the side surface portion includes a plane perpendicular to the R-plane of the crystal plane.
The crystal element according to claim 6. The crystal piece has a convex portion in which a part of the main surface protrudes in the thickness direction of the crystal piece,
The excitation electrode is located on the convex portion,
The crystal element according to claim 1. A crystal element according to any one of claims 1 to 8,
A base on which the crystal element is located,
A lid that hermetically seals the crystal element together with the base body,
Crystal device with. An electronic apparatus comprising the crystal device according to claim 9.

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