CN217875761U - 一种fcob灯带压电分离线路载板 - Google Patents
一种fcob灯带压电分离线路载板 Download PDFInfo
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- CN217875761U CN217875761U CN202221989070.0U CN202221989070U CN217875761U CN 217875761 U CN217875761 U CN 217875761U CN 202221989070 U CN202221989070 U CN 202221989070U CN 217875761 U CN217875761 U CN 217875761U
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- 238000000926 separation method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000002131 composite material Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 118
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000024121 nodulation Effects 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- -1 lambda =397 w/m.k Chemical compound 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202221989070.0U CN217875761U (zh) | 2022-07-30 | 2022-07-30 | 一种fcob灯带压电分离线路载板 |
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CN202221989070.0U CN217875761U (zh) | 2022-07-30 | 2022-07-30 | 一种fcob灯带压电分离线路载板 |
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CN217875761U true CN217875761U (zh) | 2022-11-22 |
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CN202221989070.0U Active CN217875761U (zh) | 2022-07-30 | 2022-07-30 | 一种fcob灯带压电分离线路载板 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117082728A (zh) * | 2023-09-04 | 2023-11-17 | 江西省鑫聚能科技有限公司 | 单面fcob线路载板叠构及制作工艺 |
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- 2022-07-30 CN CN202221989070.0U patent/CN217875761U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117082728A (zh) * | 2023-09-04 | 2023-11-17 | 江西省鑫聚能科技有限公司 | 单面fcob线路载板叠构及制作工艺 |
CN117082728B (zh) * | 2023-09-04 | 2024-03-19 | 江西省鑫聚能科技有限公司 | 单面fcob线路载板叠构及制作工艺 |
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GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240520 Address after: 337009 Ganxiang Cooperation Industrial Park (Shangli Industrial Park), Jinshan Town, Shangli County, Pingxiang City, Jiangxi Province Patentee after: Jiangxi Xinju Energy Technology Co.,Ltd. Country or region after: China Address before: 518000 3rd floor, No.53, Dapu 2nd Road, Ho yigangtou Industrial Zone, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XIN JU NENG ELECTRONICS CO.,LTD. Country or region before: China |