CN217849673U - Microphone assembly and electronic equipment - Google Patents
Microphone assembly and electronic equipment Download PDFInfo
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- CN217849673U CN217849673U CN202221669434.7U CN202221669434U CN217849673U CN 217849673 U CN217849673 U CN 217849673U CN 202221669434 U CN202221669434 U CN 202221669434U CN 217849673 U CN217849673 U CN 217849673U
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Abstract
The application discloses microphone subassembly and electronic equipment. The microphone assembly comprises a substrate, a vibrating diaphragm and a back plate, wherein the vibrating diaphragm and the back plate are positioned on the same side of the substrate; the substrate is provided with a back cavity penetrating through the substrate in the thickness direction, and on a plane perpendicular to the axis of the back cavity, the projection of the sound wave sensitive area at least partially overlaps with the projection of the back cavity; the back plate is provided with at least one air leakage hole penetrating through the back plate in the thickness direction; wherein, on a plane perpendicular to the thickness direction of the substrate, the projection of the at least one air-escape hole, the projection of the back cavity and the projections of the plurality of air-escape structures at least partially overlap. The utility model discloses a technical scheme has effectively solved the structure of disappointing on the current vibrating diaphragm and has had disappointing smoothly, is difficult to quick pressure release in order to maintain the balanced problem of vibrating diaphragm both sides atmospheric pressure.
Description
Technical Field
The application relates to the technical field of microphones, in particular to a microphone assembly and an electronic device.
Background
Currently, the market demand of consumer electronics products is sharply increased, and audio input devices are widely applied to various electronic products, such as mobile phones, notebook computers, tablet computers, cameras, video cameras, and the like, so that a large number of microphones are required to be integrated into these products. MEMS microphones gradually replace electret condenser microphones with advantages of smaller size, lower cost, higher integration level, shock resistance, heat resistance and the like, and become the future development trend of microphones in the field of consumer electronics.
The working principle of the capacitor type silicon microphone is that a constant bias voltage is added between a back plate and a vibrating diaphragm, the back plate and the vibrating diaphragm can keep a constant distance at the moment, when an acoustic signal causes air vibration, the air vibration causes the vibrating diaphragm to vibrate, the distance between the back plate and the vibrating diaphragm can generate displacement under the action of sound pressure, and therefore a capacitance value between the two plates changes to generate an alternating electric signal. Wherein, in order to guarantee that the vibrating diaphragm can in time lose heart when bearing high acoustic pressure and strike, set up the structure of losing heart on the vibrating diaphragm to make the air current pass, reduce the possibility of vibrating diaphragm rupture of membranes, but the current structure of losing heart has the not smooth problem of losing heart, is difficult to quick pressure release in order to maintain atmospheric pressure balance, and then causes the influence to the reliability of product.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a microphone subassembly and electronic equipment to there is disappointing not smooth in the structure of disappointing on effectively solving current vibrating diaphragm, is difficult to quick pressure release in order to maintain vibrating diaphragm both sides atmospheric pressure balanced problem.
According to an aspect of the present application, there is provided a microphone assembly comprising a substrate, and a diaphragm and a backplate positioned on the same side of the substrate, and the diaphragm is positioned in a space surrounded by the backplate and the substrate;
the vibrating diaphragm comprises a vibrating diaphragm body and a plurality of extending parts, wherein one ends of the extending parts are fixedly connected with the vibrating diaphragm body and are distributed in the circumferential direction around the vibrating diaphragm body;
the substrate is provided with a back cavity penetrating through the substrate in the thickness direction, and the projection of the sound wave sensitive region and the projection of the back cavity at least partially overlap on a plane perpendicular to the axis of the back cavity;
the back plate is provided with at least one air leakage hole penetrating through the back plate in the thickness direction;
wherein a projection of the at least one venting hole, a projection of the back cavity, and a projection of the plurality of venting structures at least partially overlap in a plane perpendicular to the thickness direction of the substrate.
Further, on a plane perpendicular to the thickness direction of the substrate, the projections of the plurality of air leakage structures are all located in the projection of the back cavity.
Further, a plurality of air release holes are arranged on the back plate, and at least one air release hole in the plurality of air release holes is positioned right above the air release structure in the thickness direction of the substrate.
Further, the diaphragm body is rectangular, and the extending portions are respectively located at four corners of the diaphragm body.
Further, the air leakage structure is a rectangular air leakage groove.
Furthermore, a supporting body for supporting the diaphragm is arranged on one side, close to the diaphragm, of the substrate, and the supporting body is located on the edge of the diaphragm;
the back electrode plate comprises a conductive part corresponding to the sound wave sensitive area of the vibrating diaphragm and a step part arranged around the conductive part, one end of the step part is fixedly connected with the conductive part, the other end of the step part is fixedly connected with the substrate, and part of inner step surfaces of the step part are respectively abutted against the support body and the vibrating diaphragm;
the back plate and the diaphragm form a variable capacitor.
Further, on a plane perpendicular to the thickness direction of the substrate, a projection of the conductive portion is located within a projection of the acoustic wave sensitive region.
Further, an anti-sticking structure is arranged on the back plate.
Further, the anti-sticking structure comprises at least one concave point arranged on the back plate, wherein the opening of the concave point faces to the side of the back plate far away from the diaphragm.
Furthermore, the quantity of rectangle gas leakage groove is four, a plurality of disappointing holes center on back of the body polar plate circumference distributes in order to form four array of disappointing, four array of disappointing are in the position with four rectangle gas leakage groove one-to-ones, and four array of disappointing are located respectively directly over four rectangle gas leakage grooves.
According to another aspect of the present application, there is provided an electronic device comprising a microphone assembly as described in any of the embodiments of the present application.
The utility model provides an advantage lies in, through on the plane of perpendicular to basement thickness direction, sets up the projection in the hole of disappointing, the projection in back of the body chamber and a plurality of at least partial overlaps in the projection of disappointing the structure make the hole of disappointing, back of the body chamber and lose the disappointing passageway that forms the intercommunication between the structure to make the air current can be fast through the vibrating diaphragm, the air current need not to diffract, thereby realizes disappointing fast, improves product reliability. Exemplarily, the projection through the structure of disappointing is located the back of the body intracavity, and the air current that gets into from the back of the body intracavity need not to diffract, can directly lose heart through the structure of disappointing fast, has reduced the impact time of air current to the vibrating diaphragm to it tears and leads to tearing risk to reduce the vibrating diaphragm to appear tearing. In addition, lie in directly over the structure of disappointing through at least one hole that loses heart, utilize the hole that loses heart to discharge the air current fast to make the disappointing that the vibrating diaphragm can be better under the atmospheric pressure effect, so that the atmospheric pressure of vibrating diaphragm both sides is balanced, can also improve the frequency response performance of product simultaneously.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a top view of a microphone assembly provided by some embodiments of the present application;
FIG. 2 isbase:Sub>A cross-sectional view taken along A-A of FIG. 1;
fig. 3 is a top view of the diaphragm provided in the embodiment of fig. 1.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
At least one embodiment of the present application provides a microphone assembly, which includes a substrate, and a diaphragm and a back plate located on the same side of the substrate, and the diaphragm is located in a space surrounded by the back plate and the substrate;
the vibrating diaphragm comprises a vibrating diaphragm body and a plurality of extending parts, wherein one ends of the extending parts are fixedly connected with the vibrating diaphragm body and are distributed in the circumferential direction around the vibrating diaphragm body;
the substrate is provided with a back cavity penetrating through the substrate in the thickness direction, and the projection of the sound wave sensitive region and the projection of the back cavity are at least partially overlapped on a plane perpendicular to the axis of the back cavity;
the back plate is provided with at least one air leakage hole penetrating through the back plate in the thickness direction;
wherein, on a plane perpendicular to the thickness direction of the substrate, the projection of the at least one air-escape hole, the projection of the back cavity and the projections of the plurality of air-escape structures at least partially overlap.
It is from top to bottom, through on the plane of perpendicular to basement thickness direction, set up the projection in the hole of disappointing, the projection in back of the body chamber and the at least partial overlap of projection of a plurality of structures of disappointing makes the disappointing passageway that loses heart between hole, back of the body chamber and the structure of disappointing form the intercommunication to make the air current can pass through the vibrating diaphragm fast, the air current need not to diffract, thereby realizes disappointing fast, improves product reliability.
Fig. 1 isbase:Sub>A top view ofbase:Sub>A microphone assembly according to some embodiments of the present disclosure, fig. 2 isbase:Sub>A cross-sectional view taken alongbase:Sub>A directionbase:Sub>A-base:Sub>A in fig. 1, and fig. 3 isbase:Sub>A top view ofbase:Sub>A diaphragm according to the embodiment in fig. 1.
As shown in fig. 1 and 2, the microphone assembly includes a substrate 10, and a diaphragm 20 and a backplate 30 located on the same side of the substrate 10, and the diaphragm 20 is located in a space surrounded by the backplate 30 and the substrate 10;
the diaphragm 20 includes a diaphragm body 210, and a plurality of extending portions 220 having one end fixedly connected to the diaphragm body 210 and circumferentially distributed around the diaphragm body 210, where the diaphragm body 210 includes a sound wave sensitive area 2101 and a plurality of relief structures 2101 surrounding the sound wave sensitive area 2101, and the plurality of extending portions 220 and the plurality of relief structures 2101 are distributed alternately;
the back plate 30 is provided with at least one air leakage hole 310 which penetrates through the back plate 30 in the thickness direction;
wherein a projection of the at least one relief hole 310, a projection of the back cavity 110, and a projection of the plurality of relief structures 2101 at least partially overlap in a plane perpendicular to the thickness direction of the substrate 10.
In this embodiment, the projections of the plurality of relief structures 2101 are all located within the projection of back cavity 110 in a plane perpendicular to the thickness of substrate 10. The projection through disappointing structure 2101 is located back of the body chamber 110, and the air current that gets into from back of the body chamber 110 need not to diffract, can directly lose heart through disappointing the structure fast, has reduced the impact time of air current to vibrating diaphragm 20 to make vibrating diaphragm 20 can be better lose heart under the atmospheric pressure effect, reduce vibrating diaphragm 20 appear tearing and lead to the risk of inefficacy.
In this embodiment, a plurality of relief holes 310 are provided on the back plate 30, and at least one relief hole 310 of the plurality of relief holes 310 is located directly above the relief structure 2101 in the thickness direction of the substrate 10. It should be noted that, by locating at least one air release hole 310 directly above the air release structure 2101, the air flow is quickly discharged through the air release hole 310, so as to balance the air pressure on both sides of the diaphragm 20, thereby further reducing the risk of tearing the diaphragm 20 and improving the frequency response performance.
As shown in fig. 3, in the present embodiment, the diaphragm body 210 has a rectangular shape, and the extension portions 220 are respectively located at four corners of the diaphragm body 210. It should be noted that, on a plane perpendicular to the thickness direction of the substrate 10, the projected shape of the diaphragm 20 is similar to the projected shape of the back plate 30.
In this embodiment, the venting structure 2101 is a rectangular venting channel. The air leakage structure 2101 is arranged to ensure that the diaphragm 20 can be timely leaked when bearing sound pressure.
In this embodiment, the number of the rectangular air leakage grooves is four, the plurality of air leakage holes 310 are circumferentially distributed around the back plate 30 to form four air leakage arrays, the four air leakage arrays are in one-to-one correspondence with the four rectangular air leakage grooves in position, and the four air leakage arrays are respectively located right above the four rectangular air leakage grooves. Through setting up four disappointing arrays and four rectangle grooves one-to-one correspondences that bleed respectively, increase the projected overlap area of disappointing hole 310 and disappointing structure, enlarge the passageway that bleeds, make the air current discharge fast to make the atmospheric pressure of vibrating diaphragm 20 both sides balance as early as possible.
In the present embodiment, a support 40 for supporting the diaphragm 20 is disposed on one side of the substrate 10 close to the diaphragm 20, and the support 40 is located on an edge of the diaphragm 20;
the back plate 30 comprises a conductive part 340 corresponding to the acoustic wave sensitive region 2101 of the diaphragm 20 and a step part 350 arranged around the conductive part 340, one end of the step part 350 is fixedly connected with the conductive part 340 and the other end is fixedly connected with the substrate 10, and partial inner step surfaces of the step part 350 are respectively abutted with the support body 40 and the diaphragm 20; the back plate 30 and the diaphragm 20 form a variable capacitor.
It should be noted that the supporting body 40 and the step portion 350 of the back plate 30 are both made of an electrically insulating material, the conductive portion 340 of the back plate 30 includes a polysilicon material, and a polysilicon conductive layer is formed by the polysilicon material.
In the present embodiment, the projection of the conductive portion 340 is located within the projection of the acoustic wave sensitive region 2101 on a plane perpendicular to the thickness direction of the substrate 10. The projection of the conducting part 340 is positioned in the projection of the acoustic wave sensitive region 2101, and the area of the conducting part 340 is smaller than that of the acoustic wave sensitive region 2101, so that the parasitic capacitance is effectively reduced, and the signal-to-noise ratio is improved.
In this embodiment, an anti-adhesion structure 320 is disposed on the back plate. Illustratively, in the present embodiment, the anti-adhesion structure 320 includes at least one concave point 330 disposed on the back plate 30, wherein an opening of the concave point 330 faces a side of the back plate 30 away from the diaphragm 20. The adhesion between the diaphragm 20 and the back plate 30 is avoided by the anti-adhesion structure 320. It should be noted that the cross-sectional shape of the concave point 330 is circular, elliptical, or polygonal.
It is from top to bottom, through on the plane of perpendicular to basement thickness direction, set up the projection in the hole of disappointing, the projection in back of the body chamber and the at least partial overlap of projection of a plurality of structures of disappointing makes the disappointing passageway that loses heart between hole, back of the body chamber and the structure of disappointing form the intercommunication to make the air current can pass through the vibrating diaphragm fast, the air current need not to diffract, thereby realizes disappointing fast, improves product reliability. Exemplarily, the projection through the structure of leaking out is located the back cavity, and the air current that gets into from the back cavity need not to diffract, can directly leak out fast through the structure of leaking out, has reduced the impact time of air current to the vibrating diaphragm to it tears and leads to tearing risk to reduce the vibrating diaphragm to appear tearing. In addition, lie in directly over the structure of disappointing through at least one hole of disappointing, utilize the hole of disappointing to discharge the air current fast to make the diaphragm can be better under the atmospheric pressure effect lose heart, so that the atmospheric pressure of diaphragm both sides is balanced, can also improve the frequency response performance of product simultaneously.
At least one embodiment of the present application further provides an electronic device including the microphone assembly of any one of the embodiments of the present application. For example, the electronic device is an artificial intelligence terminal product.
In various embodiments of the present application, unless otherwise specified or conflicting, terms or descriptions between different embodiments have consistency and may be mutually referenced, and technical features in different embodiments may be combined to form a new embodiment according to their inherent logical relationships. In the present application, "at least one" means one or more, "a plurality" means two or more.
It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for convenience of description and distinction and are not intended to limit the scope of the embodiments of the present application. The sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of the processes should be determined by their functions and inherent logic. The microphone assembly provided by the embodiments of the present application is described in detail above, and the principles and embodiments of the present application are described herein by applying specific examples, and the description of the embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
1. A microphone assembly, characterized in that the microphone assembly comprises a substrate (10), and a diaphragm (20) and a backplate (30) located on the same side of the substrate (10), and that the diaphragm (20) is located in a space surrounded by the backplate (30) and the substrate (10);
the diaphragm (20) comprises a diaphragm body (210) and a plurality of extending portions (220) with one ends fixedly connected with the diaphragm body (210) and distributed circumferentially around the diaphragm body (210), wherein the diaphragm body (210) comprises a sound wave sensitive area (2101) and a plurality of air release structures (2101) surrounding the sound wave sensitive area (2101), and the plurality of extending portions (220) and the plurality of air release structures (2101) are distributed in a staggered manner;
the substrate (10) has a back cavity (110) penetrating the substrate (10) in the thickness direction, and the projection of the sound wave sensitive region (2101) at least partially overlaps the projection of the back cavity (110) on a plane perpendicular to the axis of the back cavity (110);
the back plate (30) is provided with at least one air leakage hole (310) penetrating through the back plate (30) in the thickness direction;
wherein a projection of the at least one vent hole (310), a projection of the back cavity (110), and a projection of the plurality of vent structures (2101) at least partially overlap in a plane perpendicular to the thickness of the substrate (10).
2. A microphone assembly according to claim 1, characterized in that the projections of the plurality of venting structures (2101) are all located within the projection of the back cavity (110) in a plane perpendicular to the thickness direction of the substrate (10).
3. The microphone assembly according to claim 2, wherein the backplate (30) is provided with a plurality of the relief holes (310), and at least one relief hole (310) of the plurality of relief holes (310) is located directly above the relief structure (2101) in the thickness direction of the substrate (10).
4. The microphone assembly of claim 1, wherein the diaphragm body (210) is rectangular and the extensions (220) are located at four corners of the diaphragm body (210), respectively.
5. The microphone assembly of claim 1, wherein the venting structure (2101) is a rectangular venting channel.
6. The microphone assembly of claim 5, wherein the number of the rectangular air leakage grooves is four, the plurality of air leakage holes (310) are circumferentially distributed around the back plate (30) to form four air leakage arrays, the four air leakage arrays are in one-to-one correspondence in position with the four rectangular air leakage grooves, and the four air leakage arrays are respectively located right above the four rectangular air leakage grooves.
7. Microphone assembly according to one of claims 1 to 6, characterized in that the side of the substrate (10) that is close to the diaphragm (20) is provided with a support (40) for supporting the diaphragm (20), which support (40) is located on the edge of the diaphragm (20);
the back plate (30) comprises a conductive part (340) corresponding to the sound wave sensitive region (2101) of the diaphragm (20) and a step part (350) arranged around the conductive part (340), one end of the step part (350) is fixedly connected with the conductive part (340) and the other end is fixedly connected with the substrate (10), and partial inner step surfaces of the step part (350) are respectively abutted against the support body (40) and the diaphragm (20);
wherein the back plate (30) and the diaphragm (20) form a variable capacitance.
8. A microphone assembly according to claim 7, characterized in that the projection of the conductive part (340) is located within the projection of the acoustically sensitive area (2101) in a plane perpendicular to the thickness direction of the substrate (10).
9. The microphone assembly of claim 1, wherein the backplate is provided with an anti-adhesive structure (320).
10. A microphone assembly according to claim 9, wherein the anti-adhesive structure (320) comprises at least one indentation (330) provided on the backplate (30), wherein the indentation (330) opens towards a side of the backplate (30) facing away from the diaphragm (20).
11. An electronic device, comprising a microphone assembly according to any of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221669434.7U CN217849673U (en) | 2022-06-29 | 2022-06-29 | Microphone assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221669434.7U CN217849673U (en) | 2022-06-29 | 2022-06-29 | Microphone assembly and electronic equipment |
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| Publication Number | Publication Date |
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| CN217849673U true CN217849673U (en) | 2022-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221669434.7U Active CN217849673U (en) | 2022-06-29 | 2022-06-29 | Microphone assembly and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116986550A (en) * | 2023-09-26 | 2023-11-03 | 苏州敏芯微电子技术股份有限公司 | Airflow sensor and airflow sensor packaging structure |
-
2022
- 2022-06-29 CN CN202221669434.7U patent/CN217849673U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116986550A (en) * | 2023-09-26 | 2023-11-03 | 苏州敏芯微电子技术股份有限公司 | Airflow sensor and airflow sensor packaging structure |
| CN116986550B (en) * | 2023-09-26 | 2023-11-28 | 苏州敏芯微电子技术股份有限公司 | Airflow sensor and airflow sensor packaging structure |
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