CN217849674U - Microphone assembly and electronic equipment - Google Patents

Abstract

The application discloses microphone subassembly and electronic equipment. The microphone assembly comprises a substrate, a vibrating diaphragm and a back plate, wherein the vibrating diaphragm and the back plate are positioned on the same side of the substrate; be provided with first anti-sticking structure, second anti-sticking structure and third anti-sticking structure on the back plate, first anti-sticking structure is corresponding with the marginal zone of sound wave sensitive area in the position, and second anti-sticking structure is corresponding with the extension in the position and is close to a partial region of vibrating diaphragm body, and the third anti-sticking structure is corresponding with the non-marginal zone of sound wave sensitive area in the position, and the density of first anti-sticking structure, the density of second anti-sticking structure all are greater than the density that the third anti-sticking constructed. The technical scheme that this application disclosed has effectively solved current vibrating diaphragm and has been located the peripheral region of disappointing structure and easily takes place the adhesion with the back plate, leads to the problem that the microphone became invalid.

Description

Microphone assembly and electronic equipment

Technical Field

The application relates to the technical field of microphones, in particular to a microphone assembly and electronic equipment.

Background

Currently, the market demand of consumer electronics products is sharply increased, and audio input devices are widely applied to various electronic products, such as mobile phones, notebook computers, tablet computers, cameras, video cameras, and the like, so that a large number of microphones are required to be integrated into these products. MEMS microphones gradually replace electret condenser microphones with advantages of smaller size, lower cost, higher integration level, shock resistance, heat resistance and the like, and become the future development trend of microphones in the field of consumer electronics.

The working principle of the capacitor silicon microphone is that a constant bias voltage is added between a back plate and a vibrating diaphragm, the back plate and the vibrating diaphragm can keep a constant distance at the moment, when air vibration is caused by a sound signal, the vibrating diaphragm is vibrated by the air vibration, the distance between the back plate and the vibrating diaphragm can generate displacement under the action of sound pressure, and therefore the capacitance value between the two plates is changed to generate an alternating electric signal. Wherein, in order to guarantee that the vibrating diaphragm can in time lose heart when bearing high acoustic pressure and assault, set up the structure of losing heart on the vibrating diaphragm, but the vibrating diaphragm is located the region of losing heart around the structure, and the adhesion takes place for easy and back plate to lead to the microphone inefficacy, make the reliability greatly reduced of microphone.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a microphone subassembly and electronic equipment to effectively solve current vibrating diaphragm and be located the peripheral region of disappointing structure and easily take place the adhesion with the back plate, lead to the problem that the microphone became invalid.

According to one aspect of the present application, there is provided a microphone assembly comprising a substrate, and a diaphragm and a backplate located on the same side of the substrate, and the diaphragm is located in a space surrounded by the backplate and the substrate;

the vibrating diaphragm comprises a vibrating diaphragm body and a plurality of extension parts, wherein one ends of the extension parts are fixedly connected with the vibrating diaphragm body and are circumferentially distributed around the vibrating diaphragm body, and the vibrating diaphragm body comprises a sound wave sensitive area;

the back plate is provided with a first anti-sticking structure, a second anti-sticking structure and a third anti-sticking structure, the first anti-sticking structure corresponds to the edge area of the sound wave sensitive area in position, the second anti-sticking structure corresponds to a part of area of the extension part close to the vibrating diaphragm body in position, and the third anti-sticking structure corresponds to the non-edge area of the sound wave sensitive area in position;

and the distribution density of the first anti-sticking structure and the distribution density of the second anti-sticking structure are both greater than the distribution density of the third anti-sticking structure.

Further, on a plane perpendicular to the thickness direction of the substrate, the projection of the first release structure is located within the projection of the acoustically sensitive area, and the projection of the first release structure is located at an edge of the projection of the acoustically sensitive area, the projection of the second release structure is located within the projection of the extension, and the projection of the third release structure is located within the projection of the acoustically sensitive area.

Further, the first anti-adhesion structure, the second anti-adhesion structure and the third anti-adhesion structure are all formed by a plurality of concave points arranged on the back plate, wherein the openings of the concave points face the side, away from the diaphragm, of the back plate, and the concave points extend in the thickness direction of the substrate.

Further, the pitch of two adjacent dots in the first release structure is less than the pitch of two adjacent dots in the third release structure.

Further, the interval between two adjacent concave points in the first anti-adhesion structure is 10-50 μm.

Further, the distance between two adjacent concave points in the third bonding structure is 50-100 μm.

Further, the recessed points in the first release structure and the recessed points in the third release structure are arranged in an array having aligned rows and columns.

Further, the distance between two adjacent concave points in the second anti-adhesion structure is 10-50 μm.

Further, the cross-sectional shape of the pits is circular, elliptical, or polygonal.

Furthermore, a supporting body for supporting the diaphragm is arranged on one side, close to the diaphragm, of the substrate, and the supporting body is located on the edge of the diaphragm;

the back electrode plate comprises a conductive part and a step part, the conductive part is opposite to the vibrating diaphragm and arranged at intervals, the step part is arranged on the periphery of the conductive part, one end of the step part is fixedly connected with the conductive part, the other end of the step part is fixedly connected with the substrate, and part of inner step surfaces of the step part are respectively abutted with the support body and the vibrating diaphragm;

the back plate and the diaphragm form a variable capacitor.

Further, the substrate has a back cavity penetrating through the substrate in a thickness direction, and a projection of the acoustic wave sensitive region at least partially overlaps a projection of the back cavity on a plane perpendicular to an axis of the back cavity.

Further, the diaphragm body is rectangular, and the extending portions are respectively located at four corners of the diaphragm body.

According to another aspect of the present application, there is provided an electronic device comprising a microphone assembly as described in any of the embodiments of the present application.

The utility model has the advantages of, through set up first anti-sticking structure on the back plate, the problem that the adhesion easily takes place with the back plate in the sound wave sensitive region of current vibrating diaphragm has been solved to second anti-sticking structure and third bonding structure, and then improve the reliability of microphone work greatly, and simultaneously, anti-sticking structure's density is different along with the position in sound wave sensitive region, the marginal area in sound wave sensitive region is softer, also more easily with the 30 adhesions of back plate, so first anti-sticking structure's density, second anti-sticking structure's density all is greater than the density of third bonding structure, thereby effectively avoid the edge and the back plate adhesion in sound wave sensitive region. Illustratively, the first anti-adhesion structure corresponds in position to an edge region of the acoustic wave sensitive area, the second anti-adhesion structure corresponds in position to a portion of the extension portion near the diaphragm body, and the third anti-adhesion structure corresponds in position to a non-edge region of the acoustic wave sensitive area, so that the first anti-adhesion structure is utilized to effectively prevent the edge region of the acoustic wave sensitive area from being adhered to the back plate.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a top view of a microphone assembly provided by some embodiments of the present application;

FIG. 2 isbase:Sub>A cross-sectional view taken along A-A of FIG. 1;

fig. 3 is a top view of the diaphragm provided in the embodiment of fig. 1.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

At least one embodiment of the present application provides a microphone assembly, which includes a substrate, and a diaphragm and a back plate located on the same side of the substrate, and the diaphragm is located in a space surrounded by the back plate and the substrate;

the vibrating diaphragm comprises a vibrating diaphragm body and a plurality of extension parts, wherein one ends of the extension parts are fixedly connected with the vibrating diaphragm body and are circumferentially distributed around the vibrating diaphragm body, and the vibrating diaphragm body comprises a sound wave sensitive area;

the back plate is provided with a first anti-sticking structure, a second anti-sticking structure and a third anti-sticking structure, the first anti-sticking structure corresponds to the edge area of the sound wave sensitive area in position, the second anti-sticking structure corresponds to a part of area of the extension part close to the vibrating diaphragm body in position, and the third anti-sticking structure corresponds to the non-edge area of the sound wave sensitive area in position;

and the distribution density of the first anti-adhesion structure and the distribution density of the second anti-adhesion structure are both greater than the distribution density of the third anti-adhesion structure.

It is from top to bottom visible, through set up first adhesion promoter structure on the back plate, the sound wave sensitive area that current vibrating diaphragm had been solved to second adhesion promoter structure and third bonding promoter structure easily takes place the problem of adhesion with the back plate, and then improve the reliability of microphone work greatly, and simultaneously, adhesion promoter structure's density is different along with the position of sound wave sensitive area, avoid too few because of adhesion promoter structure, can not play the effect of effectively preventing the adhesion, also avoid too much because of adhesion promoter structure simultaneously, influence the normal deflection of vibrating diaphragm, thereby guarantee the reliability of microphone work.

Fig. 1 isbase:Sub>A top view ofbase:Sub>A microphone assembly according to an embodiment of the present disclosure, fig. 2 isbase:Sub>A cross-sectional view taken alongbase:Sub>A directionbase:Sub>A-base:Sub>A in fig. 1, and fig. 3 isbase:Sub>A top view ofbase:Sub>A diaphragm according to the embodiment in fig. 1.

As shown in fig. 1 and 2, the microphone assembly includes a substrate 10, and a diaphragm 20 and a backplate 30 located on the same side of the substrate 10, and the diaphragm 20 is located in a space surrounded by the backplate 30 and the substrate 10;

the diaphragm 20 includes a diaphragm body 210 and a plurality of extension portions 220, one end of each extension portion is fixedly connected to the diaphragm body 210 and is distributed around the circumference of the diaphragm body 210, the diaphragm body 210 includes a sound wave sensitive region 230 and a plurality of air release structures 2101 surrounding the sound wave sensitive region 230, and the plurality of extension portions 220 and the plurality of air release structures 2101 are distributed in a staggered manner;

the back plate 30 is provided with a first anti-adhesion structure 310, a second anti-adhesion structure 320 and a third anti-adhesion structure 330, the first anti-adhesion structure 310 corresponds in position to an edge region of the acoustic wave sensitive region 230, the second anti-adhesion structure 320 corresponds in position to a part of the extension portion 220 close to the diaphragm body 210, and the third anti-adhesion structure 330 corresponds in position to a non-edge region of the acoustic wave sensitive region 230;

wherein, the distribution density of the first release structure 310 and the distribution density of the second release structure 320 are both greater than the distribution density of the third release structure 330. It should be noted that the edge region of the acoustically active region 230 is softer and is more likely to adhere to the back plate 30, so the dense first release structure 310 is made to correspond to the edge region of the acoustically active region 230.

The density of the anti-sticking structure is set according to the difference of the positions of each area of the sound wave sensitive area 230, the phenomenon that the anti-sticking structure is too few and cannot effectively prevent adhesion is avoided, and meanwhile, the phenomenon that the normal deformation of the vibrating diaphragm 20 is influenced due to too many anti-sticking structures is also avoided, so that the working reliability of the microphone is ensured.

In the present embodiment, on a plane perpendicular to the thickness direction of the substrate 10, the projection of the first release structure 310 is located within the projection of the acoustically sensitive area 230, and the projection of the first release structure 310 is located at the edge of the projection of the acoustically sensitive area 230, the projection of the second release structure 320 is located within the projection of the extension 220, and the projection of the third release structure 330 is located within the projection of the acoustically sensitive area 230.

In the present embodiment, the first anti-adhesion structure 310, the second anti-adhesion structure 320, and the third anti-adhesion structure 330 are each composed of a plurality of concave points 340 provided on the back plate 30, wherein the openings of the concave points 340 face the side of the back plate 30 away from the diaphragm 20 and the concave points 340 extend in the thickness direction of the substrate 10.

In this embodiment, the spacing between adjacent two of the recessed points 340 in the first release structure 310 is less than the spacing between adjacent two of the recessed points 340 in the third release structure 330. Illustratively, in this embodiment, the pitch between two adjacent pits 340 in the first anti-adhesive structure 310 is 10-50 μm. Illustratively, in the present embodiment, the pitch between two adjacent concave points 340 in the third adhesion structure 330 is 50-100 μm.

Illustratively, in this embodiment, the recessed points 340 in the first release structure 310 and the recessed points 340 in the third release structure 330 are arranged in an array that is aligned in rows and columns.

In this embodiment, the pitch of two adjacent pits 340 in the second release structure 320 is 10-50 μm. It should be noted that, in the present application, the distance between two adjacent concave points 340 in the second anti-adhesion structure 320 may be equal to or different from the distance between two adjacent concave points 340 in the first anti-adhesion structure 310, and the present application is not limited thereto.

In the present embodiment, the cross-sectional shape of the pits 340 is circular, elliptical, or polygonal.

In this embodiment, a support 40 for supporting the diaphragm 20 is disposed on one side of the substrate 10 close to the diaphragm 20, and the support 40 is located on an edge of the diaphragm 20; the back plate 30 includes a conductive portion 350 opposite to the diaphragm 20 and disposed at an interval, and a step portion 360 disposed around the conductive portion 350, one end of the step portion 360 is fixedly connected to the conductive portion 350, and the other end is fixedly connected to the substrate 10, and a step surface in a portion of the step portion 360 is respectively abutted to the support 40 and the diaphragm 20; the back plate 30 and the diaphragm 20 form a variable capacitor.

The supporting body 40 and the step portion 360 of the back plate 30 are both made of an electrically insulating material, the conductive portion 350 of the back plate 30 includes a polysilicon material, and a polysilicon conductive layer is formed by the polysilicon material. It should be noted that the back plate 30 is provided with at least one through hole (not shown) penetrating through the back plate 30.

In the present embodiment, the substrate 10 has a back cavity penetrating the substrate 10 in the thickness direction, and the projection of the acoustic wave sensitive region 230 and the projection of the back cavity at least partially overlap on a plane perpendicular to the axis of the back cavity.

As shown in fig. 3, in the present embodiment, the diaphragm body 210 is rectangular, and the extending portions 220 are respectively located at four corners of the diaphragm body 210. Note that, in a plane perpendicular to the thickness direction of the substrate 10, the projected shape of the diaphragm 20 is similar to the projected shape of the back plate 30.

In this embodiment, the venting structure 2101 is a rectangular venting channel. Guarantee vibrating diaphragm 20 and can in time lose heart when bearing the acoustic pressure through setting up disappointing structure 2101, avoid leading to vibrating diaphragm 20 to tear because of the acoustic pressure is too big.

It is from top to bottom visible, through set up first anti-sticking structure on the back plate, second anti-sticking structure and third bonding structure have solved the problem that the adhesion easily takes place with the back plate in the sound wave sensitive region of current vibrating diaphragm, and then improve the reliability of microphone work greatly, and simultaneously, anti-sticking structure's density is different along with sound wave sensitive region's position, the marginal area of sound wave sensitive region is softer, also more easily with the back plate adhesion, so first anti-sticking structure's density, second anti-sticking structure's density all is greater than the density of third bonding structure, thereby effectively avoid the edge and the back plate adhesion of sound wave sensitive region. Illustratively, the first anti-adhesion structure corresponds in position to an edge region of the acoustic wave sensitive area, the second anti-adhesion structure corresponds in position to a portion of the extension portion near the diaphragm body, and the third anti-adhesion structure corresponds in position to a non-edge region of the acoustic wave sensitive area, so that the first anti-adhesion structure is utilized to effectively prevent the edge region of the acoustic wave sensitive area from being adhered to the back plate.

At least one embodiment of the present application further provides an electronic device including the microphone assembly of any of the embodiments of the present application. For example, the electronic device is an artificial intelligence end product.

In various embodiments of the present application, unless otherwise specified or conflicting, terms or descriptions between different embodiments have consistency and may be mutually referenced, and technical features in different embodiments may be combined to form a new embodiment according to their inherent logical relationships. In the present application, "at least one" means one or more, "a plurality" means two or more.

It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of the present application. The sequence numbers of the above processes do not mean the execution sequence, and the execution sequence of the processes should be determined by the functions and the inherent logic.

The microphone assembly provided by the embodiments of the present application is described in detail above, and the principles and embodiments of the present application are described herein by applying specific examples, and the description of the embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (13)

1. A microphone assembly, characterized in that the microphone assembly comprises a substrate (10), and a diaphragm (20) and a backplate (30) located on the same side of the substrate (10), and that the diaphragm (20) is located in a space surrounded by the backplate (30) and the substrate (10);

the diaphragm (20) comprises a diaphragm body (210) and a plurality of extension parts (220) with one ends fixedly connected with the diaphragm body (210) and circumferentially distributed around the diaphragm body (210), wherein the diaphragm body (210) comprises a sound wave sensitive area (230);

a first anti-sticking structure (310), a second anti-sticking structure (320) and a third anti-sticking structure (330) are arranged on the back plate (30), the first anti-sticking structure (310) corresponds to the edge area of the sound wave sensitive area (230) in position, the second anti-sticking structure (320) corresponds to a part of the area, close to the diaphragm body (210), of the extension part (220) in position, and the third anti-sticking structure (330) corresponds to the non-edge area of the sound wave sensitive area (230) in position;

wherein the first release structure (310) and the second release structure (320) are each distributed at a density greater than the third release structure (330).

2. The microphone assembly according to claim 1, wherein, in a plane perpendicular to the thickness direction of the substrate (10), the projection of the first release structure (310) is located within the projection of the acoustically sensitive area (230), and the projection of the first release structure (310) is located at the edge of the projection of the acoustically sensitive area (230), the projection of the second release structure (320) is located within the projection of the extension (220), and the projection of the third release structure (330) is located within the projection of the acoustically sensitive area (230).

3. The microphone assembly according to claim 2, wherein the first anti-adhesive structure (310), the second anti-adhesive structure (320), and the third anti-adhesive structure (330) are each composed of a plurality of concave points (340) provided on the backplate (30), wherein the concave points (340) open toward a side of the backplate (30) away from the diaphragm (20) and the concave points (340) extend in a thickness direction of the substrate (10).

4. The microphone assembly of claim 3, wherein a pitch of two adjacent concave dots (340) in the first anti-adhesive structure (310) is less than a pitch of two adjacent concave dots (340) in the third anti-adhesive structure (330).

5. The microphone assembly of claim 4, wherein the pitch of two adjacent pits (340) in the first anti-adhesive structure (310) is 10-50 μm.

6. The microphone assembly of claim 5, wherein a pitch of two adjacent concave points (340) in the third adhesion structure (330) is 50-100 μm.

7. The microphone assembly of claim 6 wherein the recessed points (340) in the first release structure (310) and the recessed points (340) in the third release structure (330) are arranged in an array of aligned rows and columns.

8. A microphone assembly according to claim 3, characterized in that the pitch of two adjacent pits (340) in the second anti-adhesive structure (320) is 10-50 μ ι η.

9. The microphone assembly according to any one of claims 3-8, wherein the cross-sectional shape of the concave spot (340) is circular, elliptical, or polygonal.

10. Microphone assembly according to claim 1, characterized in that the side of the substrate (10) close to the diaphragm (20) is provided with a support (40) for supporting the diaphragm (20), the support (40) being located on the edge of the diaphragm (20);

the back electrode plate (30) comprises conductive parts (350) which are opposite to the vibrating diaphragm (20) and arranged at intervals, and step parts (360) which are arranged on the periphery of the conductive parts (350), one end of each step part (360) is fixedly connected with the conductive part (350), the other end of each step part is fixedly connected with the substrate (10), and partial inner step surfaces of the step parts (360) are respectively abutted against the supporting body (40) and the vibrating diaphragm (20);

wherein the back plate (30) and the diaphragm (20) form a variable capacitance.

11. The microphone assembly according to claim 1, characterized in that the substrate (10) has a back cavity extending through the substrate (10) in the thickness direction, and the projection of the acoustic wave sensitive area (230) at least partially overlaps the projection of the back cavity on a plane perpendicular to the back cavity axis.

12. The microphone assembly of claim 1, wherein the diaphragm body (210) is rectangular, and the extensions (220) are located at four corners of the diaphragm body (210), respectively.

13. An electronic device, comprising a microphone assembly according to any one of claims 1-12.

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