CN216752031U

CN216752031U - Vibrating diaphragm and MEMS device

Info

Publication number: CN216752031U
Application number: CN202220216471.6U
Authority: CN
Inventors: 叶梦灵; 孟燕子; 荣根兰
Original assignee: Memsensing Microsystems Suzhou China Co Ltd
Current assignee: Memsensing Microsystems Suzhou China Co Ltd
Priority date: 2022-01-26
Filing date: 2022-01-26
Publication date: 2022-06-14
Anticipated expiration: 2032-01-26

Abstract

A diaphragm and MEMS device are disclosed, wherein, the movable area of the diaphragm comprises a central area, an edge area and a connecting area between the central area and the edge area; the connecting area is provided with a grain film structure; the marginal zone is equipped with fan-shaped structure, fan-shaped structure is used for disappointing. According to the MEMS device provided by the utility model, the fan-shaped structure is formed in the edge area of the vibrating diaphragm, the grain film structure is formed in the connecting area, when the vibrating diaphragm is subjected to larger impact force, the fan-shaped structure is used for accelerating air removal, reducing the stress of the vibrating diaphragm and balancing the stress of the vibrating diaphragm through the first grain film, so that the mechanical reliability of a product is improved.

Description

Vibrating diaphragm and MEMS device

Technical Field

The utility model relates to the technical field of microphones, in particular to a vibrating diaphragm and an MEMS device.

Background

In recent years, MEMS microphones integrated by using an MEMS (micro Electro Mechanical system) process have been widely used in electronic products such as mobile phones, tablet computers, cameras, hearing aids, smart toys, and monitoring devices because of their advantages of small package size, high reliability, low cost, and the like.

The MEMS microphone is provided with a vibrating diaphragm and a back plate which are oppositely arranged at one opening of the acoustic cavity. Have the interval between vibrating diaphragm and the back plate and form electric capacity, the sound vibration of different intensity leads to the acoustic pressure difference between vibrating diaphragm and the back plate to lead to the vibrating diaphragm to take place the vibration of different degrees, and then make and detect the electric capacity change, through the change of sound control chip perception detection electric capacity, thereby realize converting sound signal into the signal of telecommunication, realize the detection to sound.

The existing MEMS microphone can cause uneven sound pressure between the existing MEMS microphone and a back plate due to different vibration amplitudes of the periphery and the middle of a vibrating diaphragm, so that the performance of converting a sound signal into an electric signal by the existing MEMS microphone is influenced.

SUMMERY OF THE UTILITY MODEL

In view of the foregoing problems, an object of the present invention is to provide a diaphragm and an MEMS device, in which a fan-shaped structure is formed in an edge area of the diaphragm, so that when the diaphragm receives a large impact force, air is exhausted through the fan-shaped structure, and the stress on the diaphragm is reduced, thereby improving the mechanical reliability of the product.

According to an aspect of the present invention, there is provided a diaphragm, wherein the movable region of the diaphragm includes a central region, an edge region, and a connecting region therebetween; the connecting area is provided with a grain film structure; the marginal zone is equipped with fan-shaped structure, fan-shaped structure is used for disappointing.

Optionally, the diaphragm center is used as a circle center, and the schlieren structures are annularly distributed in the connection area.

Optionally, the number of the schlieren structures is not less than 3.

Optionally, the film structures are equally spaced.

Optionally, the pitch of the textured structures decreases in a direction away from the central region.

Optionally, the schlieren structure comprises at least one of a raised structure, a recessed structure and a corrugated structure.

Optionally, the number of the fan-shaped structures is not less than 3.

Optionally, the fan-shaped structures are uniformly distributed annularly along the edge region.

Optionally, the sector structure comprises a diaphragm and a gap surrounding a portion of the circumference of the diaphragm to separate the diaphragm from the diaphragm, and another portion of the circumference of the diaphragm is fixedly connected to the diaphragm.

Optionally, the gap is an openable and closable slit or a slit having a certain width.

Optionally, the width of the fixed part of the diaphragm and the diaphragm is less than or equal to the maximum width of the diaphragm.

Optionally, a portion of the diaphragm fixedly connected to the diaphragm faces the central region and/or the edge region.

Optionally, the shape of the flap comprises rectangular, elliptical, trapezoidal.

Optionally, the edge region includes a plurality of schlieren structures distributed annularly.

Optionally, the schlieren structure is located between adjacent fan structures.

Optionally, the film structure is arc-shaped, and a plurality of film structures are located on concentric circles.

Optionally, the fan-shaped structure and the boundary of the diaphragm have the film texture structure therebetween.

According to another aspect of the present invention, there is provided a MEMS device comprising a substrate, a first sacrificial layer, a second sacrificial layer, a back plate and a diaphragm as described in any preceding claim, the back plate comprising a conductive layer.

Optionally, a projection of the conductive layer on the surface of the diaphragm coincides with the central region and the connection region of the diaphragm.

Optionally, the back plate comprises a plurality of through holes penetrating through the back plate, and the diameter of the through holes gradually decreases from the center to the edge of the back plate.

The movable area of the vibrating diaphragm comprises a central area, an edge area and a connecting area positioned between the central area and the edge area, wherein a plurality of film-patterned structures are formed on the connecting area, a plurality of fan-shaped structures are formed on the edge area, and a gap is formed between the fan-shaped structures and the part separated from the vibrating diaphragm. If the fan-shaped structure is located in the central area or the connecting area, the effective capacitance area formed by the vibrating diaphragm and the back plate can be reduced, and meanwhile, if the fan-shaped structure is torn and damaged, the reliability and the performance of the device are seriously affected. The diaphragm structure is used for balancing the vibration amplitude uniformity of the central area and the edge area of the diaphragm, and meanwhile, the fan-shaped structure is matched with the diaphragm structure to effectively improve stress and improve the reliability of the diaphragm.

Furthermore, a plurality of line membrane structures use the centre of a circle of vibrating diaphragm as the center, and annular joining region at the vibrating diaphragm distributes, can be evenly distributed, also can be the distribution that the interval reduces gradually, and a plurality of line membrane structures set up according to the difference of vibrating diaphragm, can further improve the ability of the balanced vibration range of vibrating diaphragm to improve the reliability of vibrating diaphragm.

Further, the diaphragm structure adopts a structure of protrusion, groove or corrugation to reduce the probability of the diaphragm breaking, wherein the protrusion structure improves the reliability of the diaphragm by enhancing the stress bearing capacity of the diaphragm; the groove structure improves the reliability of the diaphragm, for example, through deformation, and the corrugated structure has the functions of a convex structure and a groove structure.

Further, a plurality of fan-shaped structures are the annular along the marginal area of vibrating diaphragm and distribute, the stress that receives at reduction vibrating diaphragm edge that can be comparatively even to improve the reliability of vibrating diaphragm.

Further, fan-shaped structure includes lamella and clearance, just the lamella with the width less than or equal to of vibrating diaphragm rigid coupling part the maximum width of lamella to when the vibrating diaphragm received big impact force, thereby fan-shaped structure can be comparatively easy emergence deformation enlarge the interval in clearance, makes the speed that the air current passes through the clearance accelerate, reduces the atress of vibrating diaphragm, thereby improves the mechanical reliability of product.

In another embodiment, the clearance between fan-shaped structure and the vibrating diaphragm is in the closed state when not receiving the impact or assaulting less, and only when the impact that fan-shaped structure received is great, the clearance between fan-shaped structure and the vibrating diaphragm just can be opened to let out gas, reduce the stress that the vibrating diaphragm received, therefore the fan-shaped structure of this application possess good sensitivity and anti manic ability, can improve the mechanical reliability of product simultaneously.

In another embodiment, a diaphragm structure is also included between adjacent sector structures of the edge region or between a sector structure and the boundary of the diaphragm, for enhancing the reliability of the diaphragm in the edge region and further equalizing the stress to which the diaphragm in the edge region is subjected.

Preferably, the diaphragm structures of the connecting region and the edge region are located on concentric rings, so that, in the case of simultaneously having at least two diaphragms, the force applied to the diaphragm can be further equalized, thereby improving the reliability of the diaphragm.

Further, a back plate in the MEMS device includes an upper dielectric layer, a conductive layer, and a lower dielectric layer, wherein a boundary of the conductive layer projected on the surface of the diaphragm is located between the textured structure and the fan-shaped structure of the diaphragm, that is, the projection of the conductive layer on the surface of the diaphragm coincides with the central area and the connection area of the diaphragm, or the projection of the conductive layer on the surface of the diaphragm coincides with the central area, the connection area, and a part of the edge area of the diaphragm, so that in the variable capacitor formed by the diaphragm and the back plate, an average value of displacement between the variable capacitors formed by the diaphragm and the back plate is optimized, thereby reducing parasitic capacitance and improving product performance.

Further, the diameter of the plurality of through holes penetrating through the back plate is gradually reduced from the center to the edge of the back plate, that is, the diameter of the through holes is smaller as the through holes are closer to the edge of the back plate, which helps to improve the strength at the boundary of the back plate, so that the back plate is not easily broken.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

FIG. 1 shows a schematic structural diagram of a MEMS device according to an embodiment of the utility model;

fig. 2a and 2b show a top view and a partial enlargement of a diaphragm according to a first embodiment of the utility model;

FIG. 3 shows an enlarged partial view of a diaphragm according to a second embodiment of the utility model;

FIG. 4 shows a top view of a diaphragm according to a third embodiment of the utility model;

fig. 5 shows a top view of a diaphragm according to a fourth embodiment of the utility model.

Detailed Description

The utility model will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown. For simplicity, the semiconductor structure obtained after several steps can be described in one figure.

It will be understood that when a layer or region is referred to as being "on" or "over" another layer or region in describing the structure of the device, it can be directly on the other layer or region or intervening layers or regions may also be present. And, if the device is turned over, that layer, region, or regions would be "under" or "beneath" another layer, region, or regions.

If for the purpose of describing the situation directly above another layer, another area, the expression "directly above … …" or "above and adjacent to … …" will be used herein.

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples.

FIG. 1 shows a schematic structural diagram of a MEMS device in accordance with an embodiment of the utility model; fig. 2a and 2b show a top view and a partial enlargement of a diaphragm according to a first embodiment of the utility model.

Referring to fig. 1, a MEMS device 100 of an embodiment of the utility model includes: a substrate 110, a back cavity 112 extending through the substrate 110; a first sacrificial layer 121 disposed on the first surface of the substrate 110 around the back cavity 112; a diaphragm 130 located on the surface of the first sacrificial layer 121 and covering the first sacrificial layer 121 and the area corresponding to the back cavity 112; a second sacrificial layer 122 on the surface of the diaphragm 130 and in a region corresponding to the first sacrificial layer 121; and a back plate 140 disposed above the second sacrificial layer 122 and covering a region of the second sacrificial layer 122 corresponding to the back cavity 112. In other embodiments, the positions of the diaphragm 130 and the back plate 140 may be interchanged, which is not limited in this application.

The first sacrificial layer 121 and the second sacrificial layer 122 are respectively a first acoustic cavity 123 and a second acoustic cavity 124 in the areas corresponding to the back cavity 112, and the second surface of the diaphragm 130 is communicated with the outside through the first acoustic cavity 123 and the back cavity 112. A plurality of through holes 144 are formed in the backplate 140 in a region corresponding to the second sound cavity 124, so that the first surface of the diaphragm 130 communicates with the outside via the second sound cavity 124 and the through holes 144.

The region of the diaphragm 130 corresponding to the first acoustic cavity 123 and the second acoustic cavity 124 is a movable region of the diaphragm 130. When the diaphragm 130 is impacted, the movable region of the diaphragm 130 vibrates, and the variable capacitance formed between the variable capacitance and the back plate 140 changes due to the distance, and the capacitance value also changes, thereby converting the sound signal into an electrical signal.

The back plate 140 includes a lower dielectric layer 141, a conductive layer 142 and an upper dielectric layer 143, wherein the upper dielectric layer 143 and the lower dielectric layer 141 are insulating layers, and the conductive layer 142 is located between the upper dielectric layer 143 and the lower dielectric layer 141. And the boundary of the conductive layer 142 projected on the surface of the diaphragm 130 is located in the movable region of the diaphragm 130, as shown by the dotted line in fig. 1.

In addition, the diameter of the through holes 144 in the back plate 140 varies according to the positions of the through holes. For example, the diameter of via 144 is largest in the central region of backplate 140, the diameter of via 144 is smallest in the region of backplate 140 near second sacrificial layer 122, and the diameter of via 144 gradually decreases from the center to the edge of backplate 140. The through hole 144 structure arranged in this way can effectively improve the strength of the boundary of the back plate 140, so that the back plate 140 is not easy to break.

Further, on the movable region of the diaphragm 130, including the central region, the edge region and the connecting region therebetween, the connecting region is formed with a plurality of film structures 131, the plurality of film structures 131 are, for example, in a concentric ring shape distributed at intervals, and the plurality of film structures 131 are, for example, uniformly distributed, or distributed with gradually decreasing pitches. When the diaphragm 130 is subjected to a large impact, the vibration amplitude of the central region may be larger than that of the edge region, and thus, the edge region of the diaphragm 130 is subjected to a larger stress. The film structure 131 separates the center region from the edge region, and thus, the uniformity of the vibration amplitudes of the center region and the edge region of the diaphragm 130 can be equalized to some extent, thereby reducing the stress of the edge region of the diaphragm.

In this embodiment, the connecting region is located at a half radius of the movable region of the diaphragm 130 and extends toward the boundary of the diaphragm 130, so that the plurality of diaphragm structures 131 also extend from the half radius of the movable region of the diaphragm 130 toward the boundary of the diaphragm 130, and therefore the diaphragm structures 131 can better balance the vibration amplitude of the diaphragm 130 and increase the strength of the diaphragm 130.

The projection boundary of the conductive layer 142 in the back plate 140 on the surface of the diaphragm 130 is located between the film-patterned structure 131 and the fan-shaped structure 132 of the diaphragm, that is, the projection of the conductive layer 142 on the surface of the diaphragm 130 coincides with the central area and the connection area of the diaphragm 130, and in other embodiments, may also coincide with a part of the edge area of the diaphragm 130, so that in the variable capacitor formed by the diaphragm 130 vibrating and the back plate 140, the displacement average value of the diaphragm 130 may be optimized, thereby improving the product performance.

In the embodiment shown in fig. 2a, the plurality of film structures 131 are arranged in a uniform concentric array, however, the embodiments of the present application are not limited thereto, and the plurality of film structures 131 may also be arranged in an array in which the distance between the film structures gradually decreases along the central region toward the edge region while maintaining the concentric arrangement.

In this embodiment, referring to fig. 1, the schlieren structure 131 is, for example, an annular protrusion on the first surface of the diaphragm 130. In other embodiments, the film structure 131 is, for example, located on the second surface of the diaphragm 130, or the film structure 131 is at least one of wavy annular protrusions, grooves or corrugations located on the first surface and/or the second surface of the diaphragm 130, so as to increase the reliability of the diaphragm 130 by increasing the ability of the diaphragm 130 to bear stress or by deforming the diaphragm 130.

Further, in the edge region of the diaphragm 130, a fan-shaped structure 132 is formed, as shown in fig. 2 a. When the diaphragm 130 is subjected to a large impact, the air flow can rapidly pass through the diaphragm 130 through the gap 1322 in the fan-shaped structure 132, so that the risk of membrane rupture of the diaphragm 130 in the edge region under the large impact is avoided.

Specifically, referring to fig. 2a and 2b, the fan-shaped structures 132 are uniformly distributed between the boundary of the diaphragm 130 and the diaphragm structure 131, and the fan-shaped structures 132 are distributed in an annular array along the edge of the diaphragm 130. The fan-shaped structure 132 includes a diaphragm 1321 and a gap 1322, a portion of the outer periphery of the diaphragm 1321 in the fan-shaped structure 132 is fixedly connected to the diaphragm 130, a portion of the outer periphery is separated from the diaphragm 130, the portion where the diaphragm 1321 is separated from the diaphragm 130 is the gap 1322, the gap 1322 has a certain width, so that the diaphragm 1321 and the diaphragm 130 on both sides of the gap 1322 are not in contact, when the diaphragm 130 is greatly impacted, the airflow quickly passes through the gap 1322, and thus, the purpose of reducing the stress of the diaphragm 130 is achieved.

In addition, the length of the fixed part of the diaphragm 1321 and the diaphragm 130 is smaller than the maximum width of the diaphragm 1321, that is, the length of a straight line between two end points of the gap 1322 is smaller than the maximum width of a figure enclosed by the gap 1322, so that when the diaphragm 130 is impacted, the airflow can rapidly pass through the gap 1322; when the vibration diaphragm 130 is subjected to a larger impact, the length of the fixed connection of the valve 1321 to the vibration diaphragm 130 in the fan-shaped structure 132 is smaller, so that the valve 1321 is easily deformed along the fixed connection part, the width of the gap 1322 is increased, the air flow is accelerated to pass through the gap 1322, and the stress on the edge part of the vibration diaphragm 130 is reduced.

Further, referring to fig. 2b, the shape of the membrane 1321 in the fan-shaped structure 132 is similar to a fan shape, and a gap 1322 exists between the side with the larger side length and the diaphragm 130, the side with the smaller side length is fixedly connected to the diaphragm 130, and the gap 1322 is located at a side away from the schlieren structure 131. When the impact is large, the diaphragm 1321 deforms, increasing the size of the gap 1322 between the diaphragm 1321 and the diaphragm 130, so that the airflow can pass through more quickly and the stress on the diaphragm 130 is reduced.

In the illustration of FIG. 2a, a projection 1421 of the conductive layer 142 of the backplate onto the movable region of the diaphragm 130 is also shown. The projection 1421 coincides with the central area and the connecting area of the movable area of the diaphragm 130, so that in the variable capacitor formed by the diaphragm 130 and the back plate 140, the average displacement value formed by the vibration of the diaphragm 130 and the back plate 140 is an optimized value, the influence of the edge of the diaphragm 130 on the capacitance signal is reduced, and the yield of the device is improved.

Further, in other embodiments, the projection of the conductive layer 142 of the backplate 140 onto the movable region of the diaphragm 130 coincides not only with the central region and the coupling region of the movable region of the diaphragm 130, but also with a portion of the edge region of the diaphragm 130.

Furthermore, fig. 2a only shows an embodiment in which the number of fan-shaped structures 132 is 8, and in other embodiments, the number of fan-shaped structures 132 may be increased or decreased according to the situation of a specific MEMS device.

Further, the shape of the fan-shaped structure 132 may be changed according to the requirement, such as a trapezoid, a rectangle, an ellipse, a rectangle with round edges, and the like; or the gap 1322 between the fan-shaped structure 132 and the diaphragm 130 is located on the side of the diaphragm 130 close to the first schlieren 131; or the gaps 1322 between the fan-shaped structure 132 and the diaphragm 130 are alternately arranged on the side close to the membrane structure 131 and on the side close to the boundary.

In this embodiment, an anti-sticking structure is formed on the second surface of the back plate 140, for example, to prevent the diaphragm 130 from sticking to the back plate 140.

Fig. 3 shows a partial enlarged view of a diaphragm according to a second embodiment of the present invention, and compared with the first embodiment, a gap 1322 between the fan-shaped structure 132 and the diaphragm 130 in the second embodiment is an openable gap, which is not repeated herein and only the differences are described.

Referring to fig. 3, in the diaphragm 130 of the second embodiment, the fan-shaped structure 132 is located between the boundary of the diaphragm structure 131 and the diaphragm 130, and the diaphragm 1321 in the fan-shaped structure 132 includes a portion fixedly connected to the diaphragm 130 and a portion separated from the diaphragm 130. The part of the diaphragm 1321 separated from the diaphragm is a gap 1322 which can be opened and closed, and under normal conditions, the gap 1322 is in a closed state; when the diaphragm 130 and the valve 1321 are deformed by a large impact force, the gap 1322 is opened, and an air flow can rapidly flow through the gap 1322, so that the pressure applied to the diaphragm 130 is reduced.

In this embodiment, since the length of the fixed portion of the diaphragm 1321 and the diaphragm 130 in the fan-shaped structure 132 is smaller than the maximum width of the diaphragm 1321, even though the gap 1322 is normally in the closed state, when the diaphragm 130 is greatly impacted, the fan-shaped structure 132 is easily deformed, so as to open the gap 1322 and allow the airflow to pass through.

Fig. 4 shows a top view of a diaphragm according to a third embodiment of the utility model. In contrast to the first embodiment, in the third embodiment, the edge region also includes a textured structure.

Referring to fig. 4, in the movable region of the diaphragm 130, an attachment region surrounds the central region, and a fan-shaped structure 132 is disposed around the attachment region in the edge region of the diaphragm 130. However, between the adjacent fan-shaped structures 232 of the edge region, a plurality of striped film structures 233 are further included.

Fig. 4 shows a case where one film structure 233 is included between two adjacent sector structures 132, the film structure 233 is in the shape of a circular arc, and a plurality of film structures 233 are located on a concentric ring around the film structure 131 of the connection region.

In other embodiments, at least two of the film structures 233 may be further included between two adjacent fan-shaped structures 132, and the plurality of film structures 233 of the entire edge area are located on at least one concentric ring around the film structure 131 of the connection region.

In addition, in the third embodiment shown in fig. 4, the gap 1322 of the fan-shaped structure 132 may be located on the side facing the edge of the diaphragm, or may be located on the side facing the membrane structure 131; the gap 1322 of the fan-shaped structure 132 may be a gap with a certain width, or may be an openable gap; the shape of the petals 1321 in the fan-shaped structure 132 includes trapezoidal, rectangular, elliptical, rounded-edge rectangular, and the like.

Further, fig. 5 shows a top view of a diaphragm according to a fourth embodiment of the present invention. Compared to the first to third embodiments, the diaphragm 130 of the fourth embodiment also includes a diaphragm structure 334 in the edge region, and is different from the diaphragm structure 233 of the third embodiment in position.

Referring to fig. 5, the diaphragm 130 includes a central region, a connection region and an edge region, wherein the connection region surrounds the central region and includes at least one diaphragm structure therein; an edge region surrounding the connection region and including a plurality of fan-shaped structures 132 therein; at least one diaphragm structure 334 is also included outside the edge region, i.e., between the fan-shaped structure 132 and the boundary of the diaphragm 130.

In this embodiment, the bellows structure 334 in the edge region and the bellows structure 131 in the connection region are concentric rings.

In other embodiments, a plurality of arc-shaped film structures (not shown in fig. 5, such as the film structure 233 shown in fig. 4) are further included between adjacent fan-shaped structures in the edge region, and the film structures are located on a ring shape concentric with the film structure 131 in the connection region. In addition, one skilled in the art can set the number and position of the schlieren structures as desired, and also can set the shape, size, number, etc. of the fan-shaped structures 132 as desired.

Preferably, the diaphragm structures of the connecting region and the edge region are located on concentric rings, so that, in the case of simultaneously having at least two diaphragms, the stress of the diaphragm can be further equalized, thereby improving the reliability of the diaphragm.

In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the utility model to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model and various embodiments with various modifications as are suited to the particular use contemplated. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A diaphragm is characterized in that a diaphragm body is provided,

the movable area of the diaphragm comprises a central area, an edge area and a connecting area between the central area and the edge area;

the connecting area is provided with a grain film structure;

the marginal zone is equipped with fan-shaped structure, fan-shaped structure is used for disappointing.

2. The diaphragm of claim 1, wherein the corrugated film structures are annularly distributed in the connection region with the center of the diaphragm as a center.

3. The diaphragm of claim 2, wherein the number of the diaphragm structures is not less than 3.

4. The diaphragm of claim 3, wherein the corrugated film structures have equal pitch.

5. The diaphragm of claim 3 wherein the diaphragm structure pitch tapers away from the central region.

6. The diaphragm of claim 1, wherein the diaphragm structure includes at least one of a convex structure, a concave structure and a corrugated structure.

7. The diaphragm of claim 1, wherein the connecting region extends outward from a radius one-half of the movable region of the diaphragm.

8. The diaphragm of claim 1, wherein the number of the fan-shaped structures is not less than 3.

9. The diaphragm of claim 8 wherein the fan-shaped structures are uniformly annularly distributed along the edge region.

10. The diaphragm of claim 8 wherein the sector structure includes a diaphragm and a gap surrounding a portion of the diaphragm perimeter to separate the diaphragm from the diaphragm, another portion of the diaphragm perimeter being affixed to the diaphragm.

11. The diaphragm of claim 10, wherein the gap is an openable and closable gap or a gap having a certain width.

12. The diaphragm of claim 10, wherein the width of the diaphragm fixed portion is smaller than or equal to the maximum width of the diaphragm.

13. The diaphragm of claim 10, wherein a portion of the diaphragm fixedly connected to the diaphragm faces the central region and/or the edge region.

14. The diaphragm of claim 10 wherein the shape of the diaphragm comprises a rectangle, an ellipse, or a trapezoid.

15. The diaphragm of claim 8, wherein the edge region includes a plurality of diaphragm structures distributed in a ring shape.

16. The diaphragm of claim 15, wherein the corrugated film structure is located between adjacent fan-shaped structures.

17. The diaphragm of claim 16 wherein the diaphragm structure is arcuate and a plurality of diaphragm structures are located on concentric circles.

18. The diaphragm of claim 15 or 16, wherein the diaphragm structure is provided between the fan-shaped structure and a diaphragm boundary.

19. A MEMS device, characterized by:

comprising a substrate, a first sacrificial layer, a second sacrificial layer, a backplate comprising a conductive layer, and a diaphragm according to any one of claims 1 to 18.

20. A MEMS device as claimed in claim 19, wherein a projection of the conductive layer onto the diaphragm surface coincides with the central region and the connection region of the diaphragm.

21. The MEMS device, as recited in claim 19, wherein the backplate comprises a plurality of vias extending through the backplate, the vias having a diameter that decreases from center to edge of the backplate.