CN214851819U - Micro-electromechanical structure, microphone and terminal - Google Patents
Micro-electromechanical structure, microphone and terminal Download PDFInfo
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- CN214851819U CN214851819U CN202121267953.6U CN202121267953U CN214851819U CN 214851819 U CN214851819 U CN 214851819U CN 202121267953 U CN202121267953 U CN 202121267953U CN 214851819 U CN214851819 U CN 214851819U
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Abstract
The application discloses micro-electromechanical structure, microphone and terminal, this micro-electromechanical structure includes: a substrate having a cavity; a first support part on the substrate; a diaphragm positioned on the first support part; the second supporting part is positioned on the vibrating diaphragm; and the back plate is positioned on the second supporting part, a gap is formed between the back plate and the vibrating diaphragm, the vibrating diaphragm is provided with at least one open groove, each open groove is communicated with the cavity and the gap, and each open groove is positioned outside the orthographic projection range of the cavity on the vibrating diaphragm. This micro-electromechanical structure is through forming the fluting that communicates cavity and clearance on the vibrating diaphragm to reach and lose heart in order to balance the purpose of vibrating diaphragm both sides pressure through the fluting, because fluting and substrate cavity stagger each other again, reduced the influence of fluting to the vibrating diaphragm, thereby improved the low frequency response characteristic of product.
Description
Technical Field
The present application relates to the field of semiconductor device manufacturing, and more particularly to microelectromechanical structures, microphones, and terminals.
Background
Devices manufactured based on Micro Electro Mechanical Systems (MEMS) are called MEMS devices, and the MEMS devices mainly include a diaphragm and a backplate with a gap therebetween. The change of atmospheric pressure can lead to the vibrating diaphragm to warp, and the capacitance value between vibrating diaphragm and the electrode board changes to convert the signal of telecommunication output into.
In the prior art, in order to balance the pressure on the two sides of the diaphragm, an air release groove needs to be formed on the diaphragm, but the arrangement of the air release groove can reduce the low-frequency response characteristic of the MEMS device.
Accordingly, it is desirable to provide an improved microelectromechanical structure to improve the performance of the product.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an improved micro-electromechanical structure, microphone and terminal has reduced the influence of fluting to the vibrating diaphragm through staggering fluting and substrate cavity each other to the low frequency response characteristic of product has been improved.
According to the utility model discloses an aspect provides a micro electromechanical structure, include: a substrate having a cavity; a first support part on the substrate; the vibrating diaphragm is positioned on the first supporting part; the second supporting part is positioned on the vibrating diaphragm; and the back plate is positioned on the second supporting part, a gap is formed between the back plate and the vibrating diaphragm, the vibrating diaphragm is provided with at least one open groove, each open groove is communicated with the cavity and the gap, and each open groove is positioned outside the orthographic projection range of the cavity on the vibrating diaphragm.
Optionally, the back plate has at least one through hole, and an orthographic projection of each through hole on the diaphragm is misaligned with each open groove and is distributed in a non-overlapping manner.
Optionally, the number of the slots is multiple, and the diaphragm includes: the fixed part is fixedly connected with the substrate through the first supporting part and fixedly connected with the back plate through the second supporting part; and the sensing part and the beam structure are arranged, wherein the orthographic projection of the cavity on the vibrating diaphragm is positioned on the sensing part, and the beam structure is positioned between the adjacent slots and is respectively connected with the fixing part and the sensing part.
Optionally, the plurality of slots surround the sensing portion.
Optionally, the sensing part does not have a gas release channel communicating the gap with the cavity.
Optionally, an orthographic projection of each through hole on the diaphragm is located on the sensing portion.
Optionally, the number of the through holes is multiple, wherein the size of the through hole adjacent to the slot in the orthographic projection on the diaphragm is smaller than the size of the other through holes.
Optionally, in the plurality of slots, the spacing between adjacent slots is the same.
Optionally, an edge of an orthographic projection of the cavity on the diaphragm is spaced from the slot by a preset distance.
According to a second aspect of embodiments of the present invention, there is provided a microphone comprising a microelectromechanical structure as described above.
According to a third aspect of the embodiments of the present invention, there is provided a terminal, comprising the microphone as described above.
The embodiment of the utility model provides a fluting homoenergetic that micro-electromechanical structure formed on the vibrating diaphragm can communicate cavity and clearance to let each fluting realize disappointing effect, thereby reach the purpose of balanced vibrating diaphragm both sides pressure.
Meanwhile, each slot is positioned outside the orthographic projection range of the cavity on the vibrating diaphragm, so that each slot is staggered with the cavity of the substrate, when air pressure acts on the vibrating diaphragm corresponding to the cavity, the influence of the slots on the vibrating diaphragm is reduced, the air leakage problem of the vibrating diaphragm is improved, when the micro-electromechanical structure is applied to a microphone, the damping of a sound channel can be increased, and the low-frequency response with stable low frequency is obtained.
Because the design that every fluting all staggers each other with the cavity of substrate has improved the gas leakage problem of this part vibrating diaphragm, consequently can suitably increase the grooved quantity, when the vibrating diaphragm meets great acoustic pressure, the more groove of losing heart of quantity can further improve the whole ability of losing heart of vibrating diaphragm to the reliability of product has been strengthened.
Because the orthographic projection of each through hole on the vibrating diaphragm is staggered with each groove and is not overlapped, each groove is staggered with each backboard through hole, when air pressure acts on the vibrating diaphragm corresponding to the backboard through hole through the backboard through hole, the influence of the groove on the part of the vibrating diaphragm is reduced, thereby improving the air leakage problem of the part of the vibrating diaphragm, further increasing the damping of a sound channel and further obtaining the low-frequency response with more stable low frequency.
The plurality of slots are arranged at intervals, the part of the vibrating membrane penetrating through the adjacent slots is used as a beam structure for connecting the fixed part and the sensing part in the vibrating membrane, and the design of the beam structure is beneficial to releasing the internal stress of the vibrating membrane, so that the sensitivity of a product is improved. Preferably, the plurality of slots surround the sensing part, and the distance between the adjacent slots is set to be the same, so that the internal stress of the vibrating membrane is further released, the stress uniformity of the vibrating membrane is increased, and the sensitivity and the reliability of a product are further improved.
The sensing part of the vibrating membrane is set to be of a whole membrane structure without any air leakage channel for communicating the gap with the cavity, so that the direct leakage of sound pressure from the sensing part is avoided.
Because the orthographic projection of the back plate through hole on the vibrating diaphragm is located in the sensing part, the sound pressure can act on the sensing part of the vibrating diaphragm more efficiently through the limited back plate through hole.
Because the size of the backboard through hole close to the vibrating diaphragm slot is smaller than that of other through holes, the sound pressure reaching the slot through the backboard through hole close to the vibrating diaphragm slot is reduced, the damping of a sound channel can be further increased, and the low-frequency response with stable low frequency is further obtained.
In addition, the preset distance between the cavity and the vibrating diaphragm slot can be increased, so that the slot is closer to the edge of the vibrating diaphragm, the damping of a sound channel is further increased, and the low-frequency response with low frequency stability is further obtained. And, the utility model discloses a scheme only need design the position of backplate through-hole and vibrating diaphragm fluting, simple structure, and the process flow step is simple and convenient, can not increase extra structure in order to improve the low frequency response characteristic in the micro electromechanical structure, consequently has higher reliability and lower cost.
Therefore, the utility model provides a micro-electromechanical structure, microphone and terminal can improve the performance of product greatly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting on the present application.
Fig. 1 shows a top view of a micro-electromechanical structure according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view taken along line AA in fig. 1.
Fig. 3 and fig. 4 show schematic diagrams of a diaphragm structure of a micro electromechanical structure according to an embodiment of the present invention.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown. For simplicity, the semiconductor structure obtained after several steps can be described in one figure.
It will be understood that when a layer or region is referred to as being "on" or "over" another layer or region in describing the structure of the device, it can be directly on the other layer or region or intervening layers or regions may also be present. And, if the device is turned over, that layer, region, or regions would be "under" or "beneath" another layer, region, or regions.
If for the purpose of describing the situation directly on another layer, another area, the expressions "directly on … …" or "on … … and adjacent thereto" will be used herein.
Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of the devices are described below in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
The present invention may be presented in a variety of forms, some of which are described below.
Fig. 1 is a top view of a micro-electromechanical structure according to an embodiment of the present invention, and fig. 2 is a cross-sectional view taken along line AA in fig. 1, wherein a dotted line in fig. 2 represents a central axis of the cavity 10 perpendicular to the diaphragm 120 and the backplate 130.
As shown in fig. 1 and fig. 2, the micro-electromechanical structure according to the embodiment of the present invention includes: a substrate 101, a first support part 111, a diaphragm 120, a second support part 112, and a back plate 130. The substrate 101 has a cavity 10.
The first support 111 is located at an edge of the substrate 101, and has an inner sidewall close to a central axis of the chamber 10 and an outer sidewall far from the central axis of the chamber 10.
The diaphragm 120 is located on the first supporting portion 111 and covers the cavity 10, wherein the diaphragm 120 has at least one slot 20, and each slot 20 is located outside an orthographic projection range of the cavity 10 on the diaphragm 120. As shown in fig. 2, the edge of the orthographic projection of the cavity 10 on the diaphragm 120 is spaced from the slot 20 by a preset distance, so that the slot 20 is staggered from the cavity 10, and the distance from the slot 20 to the central axis of the cavity is greater than the distance from the edge of the cavity 10 to the central axis of the cavity, so that the slot 20 is located at a position of the diaphragm 120 close to the edge, and a person skilled in the art can set the preset distance as required.
The second supporting portion 112 is located on the diaphragm 120, and the position of the second supporting portion corresponds to the position of the first supporting portion 111, and the second supporting portion 112 has an inner sidewall close to the central axis of the cavity 10 and an outer sidewall far from the central axis of the cavity 10.
The back plate 130 is located on the second supporting portion 112, and has a gap 30 with the diaphragm 120. The distance from the inner side wall of the first supporting portion 111 and the inner side wall of the second supporting portion 112 to the central axis of the cavity is greater than the distance from the slots 20 to the central axis of the cavity, so that each slot 20 can communicate the cavity 10 and the gap 30.
In this embodiment, the first supporting portion 111 is a portion left on the substrate 101 after the sacrificial layer is released, the first supporting portion 111 is located on the peripheral edge of the substrate 110, and the diaphragm 120 located above the first supporting portion 111 is supported on the substrate 101 in a manner that the peripheral edge is fully supported. The second supporting portion 112 is a portion left on the diaphragm 120 after the sacrificial layer is released, the second supporting portion 112 is located on the peripheral edge of the diaphragm 120, and the back plate 130 located above the second supporting portion 112 is supported and fixed by a full-clamped manner of the peripheral edge.
Further, the backplate 130 has at least one through hole 40, and an orthographic projection of each through hole 40 on the diaphragm 120 is offset from and distributed in a non-overlapping manner with each slot 20, so that each slot 20 and each backplate through hole 40 are completely offset from each other.
As shown in fig. 2, the distance from the slot 20 to the central axis of the cavity is greater than the distance from the through hole 20 at the extreme edge to the central axis of the cavity. As shown in figures 1 and 2 of the drawings,
the back plate 130 has a plurality of through holes 40 arranged in a circular array, wherein the size of one circle of through holes at the outermost periphery adjacent to the slot 20 is smaller than the size of other internal through holes. Of course, other arrangements of the number and arrangement of the through holes 40 may be made by those skilled in the art as desired.
Further, the micro-electromechanical structure of the embodiment of the present invention further includes an anti-sticking portion 140, which is located on the surface of the backplate 130 close to the diaphragm 120, and prevents the backplate 130 from adhering to the diaphragm 120. The mems further includes a plurality of bonding pads (not shown) on the backplate 130 for electrical connection to the backplate 130 and the diaphragm 120.
In the present embodiment, the material of the first supporting portion 111 and the second supporting portion 112 is an insulating material, including but not limited to silicon oxide. The material of the diaphragm 120 includes, but is not limited to, polysilicon. In some embodiments, the substrate 101 is a silicon substrate, and the chamber 10 is located in the middle of the substrate 101 and communicates with two opposite surfaces of the substrate 101. Of course, the position, shape, etc. of the cavity 10 can be set by those skilled in the art according to the needs, and is not limited herein.
In some specific embodiments, the back plate 130 includes an insulating layer and an electrode plate. The electrode plate is located on the insulating layer, and the insulating layer is in contact with the diaphragm 120 to separate the electrode plate from the diaphragm 120, wherein the material of the insulating layer includes silicon nitride. Of course, on the premise of keeping the electrode plate spaced apart from the diaphragm 120, a person skilled in the art may also perform other arrangements on the structure and the material of the back plate 130 as needed, which is not limited herein.
As shown in fig. 2 and fig. 3, the diaphragm 120 of the embodiment of the present invention includes: a fixed part 121, a sensing part 122, and a beam structure 123. The fixing portion 121 is fixedly connected to the substrate 101 through the first supporting portion 111, and is fixedly connected to the back plate 130 through the second supporting portion 112. The orthographic projection of the cavity 10 on the diaphragm 120 is located on the sensing part 121, and the beam structure 123 is located between the adjacent slots 20 and is connected with the fixing part 121 and the sensing part 122 respectively. The sensing part 122 does not have a discharge passage communicating the gap 30 with the cavity 10. The orthographic projection of each through hole 40 on the diaphragm 120 is located on the sensing part 121. Of course, one skilled in the art may also locate only the orthographic projection of a portion of the through hole 40 on the diaphragm 120 on the sensing portion 121.
In the present embodiment, a plurality of slots 20 surround the sensing part 121, and preferably, in the plurality of slots 20, the intervals of the adjacent slots 20 are the same. The shape of the slot 20 includes, but is not limited to, at least one of a circular arc slot, an S-shaped slot, a circular hole, and a rectangular slot. For example, slots 20 are each S-shaped slots, as shown in FIG. 3. Alternatively, the slots 20 are circular holes and rectangular slots arranged at intervals, as shown in fig. 4.
The utility model also provides a microphone, include as above the micro-electromechanical structure.
The utility model also provides a terminal, include as above the microphone.
The embodiment of the utility model provides a fluting homoenergetic that micro-electromechanical structure formed on the vibrating diaphragm can communicate cavity and clearance to let each fluting realize disappointing effect, thereby reach the purpose of balanced vibrating diaphragm both sides pressure.
Meanwhile, each slot is positioned outside the orthographic projection range of the cavity on the vibrating diaphragm, so that each slot is staggered with the cavity of the substrate, when air pressure acts on the vibrating diaphragm corresponding to the cavity, the influence of the slots on the vibrating diaphragm is reduced, the air leakage problem of the vibrating diaphragm is improved, when the micro-electromechanical structure is applied to a microphone, the damping of a sound channel can be increased, and the low-frequency response with stable low frequency is obtained.
Because the design that every fluting all staggers each other with the cavity of substrate has improved the gas leakage problem of this part vibrating diaphragm, consequently can suitably increase the grooved quantity, when the vibrating diaphragm meets great acoustic pressure, the more groove of losing heart of quantity can further improve the whole ability of losing heart of vibrating diaphragm to the reliability of product has been strengthened.
Because the orthographic projection of each through hole on the vibrating diaphragm is staggered with each groove and is not overlapped, each groove is staggered with each backboard through hole, when air pressure acts on the vibrating diaphragm corresponding to the backboard through hole through the backboard through hole, the influence of the groove on the part of the vibrating diaphragm is reduced, thereby improving the air leakage problem of the part of the vibrating diaphragm, further increasing the damping of a sound channel and further obtaining the low-frequency response with more stable low frequency.
The plurality of slots are arranged at intervals, the part of the vibrating membrane penetrating through the adjacent slots is used as a beam structure for connecting the fixed part and the sensing part in the vibrating membrane, and the design of the beam structure is beneficial to releasing the internal stress of the vibrating membrane, so that the sensitivity of a product is improved. Preferably, the plurality of slots surround the sensing part, and the distance between the adjacent slots is set to be the same, so that the internal stress of the vibrating membrane is further released, the stress uniformity of the vibrating membrane is increased, and the sensitivity and the reliability of a product are further improved.
The sensing part of the vibrating membrane is set to be of a whole membrane structure without any air leakage channel for communicating the gap with the cavity, so that the direct leakage of sound pressure from the sensing part is avoided.
Because the orthographic projection of the back plate through hole on the vibrating diaphragm is located in the sensing part, the sound pressure can act on the sensing part of the vibrating diaphragm more efficiently through the limited back plate through hole.
Because the size of the backboard through hole close to the vibrating diaphragm slot is smaller than that of other through holes, the sound pressure reaching the slot through the backboard through hole close to the vibrating diaphragm slot is reduced, the damping of a sound channel can be further increased, and the low-frequency response with stable low frequency is further obtained.
In addition, the preset distance between the cavity and the vibrating diaphragm slot can be increased, so that the slot is closer to the edge of the vibrating diaphragm, the damping of a sound channel is further increased, and the low-frequency response with low frequency stability is further obtained. And, the utility model discloses a scheme only need design the position of backplate through-hole and vibrating diaphragm fluting, simple structure, and the process flow step is simple and convenient, can not increase extra structure in order to improve the low frequency response characteristic in the micro electromechanical structure, consequently has higher reliability and lower cost.
Therefore, the utility model provides a micro-electromechanical structure, microphone and terminal can improve the performance of product greatly.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The embodiments of the present invention have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present invention, and these alternatives and modifications are intended to fall within the scope of the present invention.
Claims (11)
1. A microelectromechanical structure, comprising:
a substrate having a cavity;
a first support part on the substrate;
the vibrating diaphragm is positioned on the first supporting part;
the second supporting part is positioned on the vibrating diaphragm; and
a back plate located on the second support part and having a gap with the diaphragm,
the vibrating diaphragm is provided with at least one open groove, each open groove is communicated with the cavity and the gap, and each open groove is positioned outside the orthographic projection range of the cavity on the vibrating diaphragm.
2. The microelectromechanical structure of claim 1, characterized in that the back plate has at least one through hole, and an orthographic projection of each through hole on the diaphragm is offset from and distributed in a non-overlapping manner with each slot.
3. The microelectromechanical structure of claim 2, characterized in that the number of through holes is multiple, wherein the size of the through holes adjacent to the slot in orthographic projection on the diaphragm is smaller than the size of the other through holes.
4. The microelectromechanical structure of claim 1, characterized in that the number of slots is multiple, and the spacing between adjacent slots is the same.
5. A microelectromechanical structure of claim 2 or 3, characterized in that the diaphragm comprises:
the fixed part is fixedly connected with the substrate through the first supporting part and fixedly connected with the back plate through the second supporting part; and
the sensing part and the beam structure are arranged in the sensing part,
wherein the orthographic projection of the cavity on the diaphragm is positioned on the sensing part,
the beam structure is located between the adjacent slots and is respectively connected with the fixing part and the sensing part.
6. The microelectromechanical structure of claim 5, characterized in that the plurality of slots surround the sensing portion in case the number of slots is plural.
7. The microelectromechanical structure of claim 5, characterized in that the sensing portion does not have a venting channel connecting the gap and the cavity.
8. The microelectromechanical structure of claim 5, characterized in that an orthographic projection of each through hole on the diaphragm is located at the sensing portion of the diaphragm.
9. The microelectromechanical structure of any of claims 1-4, 6-8, characterized in that an edge of an orthographic projection of the cavity on the diaphragm is spaced a predetermined distance from the slot.
10. A microphone comprising a microelectromechanical structure of any of claims 1-9.
11. A terminal, characterized in that it comprises a microphone according to claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121267953.6U CN214851819U (en) | 2021-06-08 | 2021-06-08 | Micro-electromechanical structure, microphone and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121267953.6U CN214851819U (en) | 2021-06-08 | 2021-06-08 | Micro-electromechanical structure, microphone and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214851819U true CN214851819U (en) | 2021-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121267953.6U Active CN214851819U (en) | 2021-06-08 | 2021-06-08 | Micro-electromechanical structure, microphone and terminal |
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| Country | Link |
|---|---|
| CN (1) | CN214851819U (en) |
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2021
- 2021-06-08 CN CN202121267953.6U patent/CN214851819U/en active Active
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