CN217846379U

CN217846379U - Chip testing system

Info

Publication number: CN217846379U
Application number: CN202220993910.4U
Authority: CN
Inventors: 蔡灿承; 冯利民; 曹成范; 潘铁伟
Original assignee: Suzhou HYC Technology Co Ltd
Current assignee: Suzhou HYC Technology Co Ltd
Priority date: 2022-04-27
Filing date: 2022-04-27
Publication date: 2022-11-18
Anticipated expiration: 2032-04-27

Abstract

The application discloses chip test system includes: a loading and unloading device and a transfer device; the feeding and discharging device comprises a feeding and discharging drive, and a first bearing mechanism and a second bearing mechanism which are arranged at the movable end of the feeding and discharging drive, wherein the first bearing mechanism is driven by the feeding and discharging drive to move between a feeding station and a transfer station in a reciprocating manner, and the second bearing mechanism is driven by the feeding and discharging drive to move between the transfer station and a discharging station in a reciprocating manner; the transfer device comprises a transfer drive, a first transfer mechanism and a second transfer mechanism, wherein the first transfer mechanism and the second transfer mechanism are arranged at the movable end of the transfer drive; first bear the weight of mechanism, first move and carry mechanism and second and move and carry the mechanism and all include: the second bearing mechanism comprises a heating module. The chip can be tested at different temperatures.

Description

Chip testing system

Technical Field

The utility model relates to an automation equipment technical field especially relates to a chip test system.

Background

The chip testing is an important link in the chip manufacturing process, defective products can be removed in time through accurate testing, waste of packaging testing cost is reduced, and the product yield is improved. Different chips may be applied to a high-temperature operation environment or a low-temperature operation environment, so that the working state of the chips in the high-temperature or low-temperature operation environment needs to be accurately known before the chips leave a factory, and the stability of the chips is ensured.

When the chip detection equipment is used for performance test of a product to be tested, a stable working environment needs to be provided for a test chip, and the chip can be ensured to be maintained within an optimal temperature value range in the moving and testing processes so as to ensure the test effect of the product to be tested. The existing chip testing system only has a single high-temperature detection function or a single refrigeration environment function, and can not meet the testing requirements of different chips.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a chip testing system for solving the problem of single function of the chip testing system in the prior art.

A chip test system, comprising: the two groups of feeding and discharging devices are arranged in parallel, and the shifting device is positioned above the feeding and discharging devices; wherein,

the feeding and discharging device comprises a feeding and discharging drive, and a first bearing mechanism and a second bearing mechanism which are arranged at the movable end of the feeding and discharging drive, wherein the first bearing mechanism is driven by the feeding and discharging drive to move between a feeding station and a transfer station in a reciprocating manner, and the second bearing mechanism is driven by the feeding and discharging drive to move between the transfer station and a discharging station in a reciprocating manner;

the transfer device comprises a transfer drive, a first transfer mechanism and a second transfer mechanism, wherein the first transfer mechanism and the second transfer mechanism are arranged at the movable end of the transfer drive;

first bear the weight of the mechanism, first move and carry the mechanism and the second moves and carries the mechanism and all include: the second bearing mechanism comprises a heating module.

Preferably, the refrigeration module comprises: cold drawing, refrigeration face with the first refrigeration chip of cold drawing contact, the second refrigeration chip of refrigeration face and the heating surface contact of first refrigeration chip and do the heating surface refrigerated heating panel of second refrigeration chip is provided with the pipeline that is used for letting in cooling liquid in the heating panel.

Preferably, the heating module includes mounting panel and heating chip, the mounting panel with the refrigeration module is connected and keep away from on the mounting panel that refrigeration module one side is provided with a plurality of holding tanks that are used for holding the heating chip.

Preferably, the first transfer mechanism and the second transfer mechanism further include: be connected to the mounting panel just has the pressure head subassembly of a plurality of pressure heads, be provided with the vacuum adsorption pipeline jointly in the cold drawing of pressure head subassembly, mounting panel and refrigeration module, outside vacuum source passes through the vacuum adsorption pipeline will await measuring the chip and adsorb the pressure head department of fixing to the pressure head subassembly.

Preferably, the first transfer mechanism and the second transfer mechanism further include: the buffer part passes through the heat insulation block and the refrigeration module is connected, the buffer part is connected to the transfer drive through the connecting block.

Preferably, the heating module adopts a heating plate, and the first bearing mechanism and the second bearing mechanism both comprise: a carrier plate connected to the heating plate and having a plurality of receiving cavities for placing chips.

Preferably, a distance adjusting piece is further arranged between the heating plate and the refrigeration module, so that the heating plate and the refrigeration module are in contact with each other during refrigeration and are separated during heating.

Preferably, heat insulation partition plates are arranged between the feeding station and the transfer station and between the transfer station and the discharging station.

Preferably, the feeding and discharging drive comprises: the driving piece, the synchronous belt, the linear guide rail and the sliding block which is arranged on the linear guide rail and is respectively connected with the first bearing mechanism and the second bearing mechanism, wherein the first bearing mechanism and the second bearing mechanism are connected with each other or pass through the sliding block, the driving piece drives the first bearing mechanism and the second bearing mechanism to synchronously move on the linear guide rail through the synchronous belt.

Preferably, the transfer drive includes: the first driving component drives the first transfer mechanism to lift, the second driving component drives the second transfer mechanism to lift, and the third driving component drives the first transfer mechanism and the second transfer mechanism to move between the transfer station and the detection station.

Compared with the prior art, the chip testing system can test the chips under different temperature environments, can automatically receive the chips to be tested at the loading station, transfers the chips to be tested to the detection station for compression joint testing, and transfers the chips to the unloading station after the testing is completed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic diagram of a chip test system according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of an unloading and loading device in a chip testing system according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram illustrating a transfer apparatus of a chip testing system according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a first transfer mechanism/a second transfer mechanism in a chip testing system according to an embodiment of the present application;

FIG. 5 is a schematic diagram illustrating a structure of a cooling module in a chip testing system according to an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a first carrying mechanism in a chip testing system according to an embodiment of the present disclosure;

fig. 7 is an exploded view of a first carrier mechanism in a chip testing system according to an embodiment of the present application.

Shown in the figure:

100. a loading and unloading device;

11. driving feeding and discharging; 111. a drive member; 112. a synchronous belt; 113. a linear guide rail; 114. a slider; 115. connecting blocks;

12. a first bearing mechanism; 121. a carrier plate; 122. a spacing adjustment member; 123. carrying a plate; 13. a second bearing mechanism;

200. a transfer device;

21. carrying and driving; 211. a support frame; 212. a first drive mechanism; 213. a second drive mechanism; 214. a third drive mechanism; 215. a first guide mechanism; 216. a second guide mechanism;

22. a first transfer mechanism;

221. a refrigeration module; 2211. a cold plate; 2212. a first refrigeration chip; 2213. a second refrigeration chip; 2214. a heat dissipation plate; 2215. a heat insulating pad;

222. a heating module; 2221. mounting a plate; 22211. accommodating grooves; 2222. heating the plate;

223. connecting blocks; 224. a buffer member; 225. a heat insulation block;

226. a ram assembly; 2261. a pressure head; 2262. a press head seat;

23. a second transfer mechanism; 24. a support arm; 25. a heat insulation clapboard.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

The application discloses chip test system can receive the chip that awaits measuring in material loading station department automatically, transfers the chip that awaits measuring to the detection station and carries out the crimping test to transfer the chip to unloading station after the test is accomplished. As shown in fig. 1, the chip testing system of the present application includes: two sets of loading and unloading devices 100 arranged in parallel and a transfer device 200 positioned above the loading and unloading devices 100. The loading and unloading device 100 is used for receiving a product to be tested from the loading station, transferring the product to be tested to the transfer station, and transferring the detected chip from the transfer station to the unloading station. The transfer device 200 is used for transferring the chip to be detected at the transfer station to the detection station for detection, and returning the detected product to the transfer station.

Referring to fig. 2, the loading and unloading device 100 includes a loading and unloading drive 11, and a first bearing mechanism 12 and a second bearing mechanism 13 disposed at a movable end of the loading and unloading drive 11, wherein the first bearing mechanism 12 is driven by the loading and unloading drive 11 to reciprocate between a loading station and a transfer station, and the second bearing mechanism 13 is driven by the loading and unloading drive 11 to reciprocate between the transfer station and the unloading station.

With continued reference to fig. 2, the loading and unloading drive 11 includes: the device comprises a driving piece 111, a synchronous belt 112, a linear guide rail 113 and a slide block 114 which is arranged on the linear guide rail 113 and is respectively connected with the first bearing mechanism 12 and the second bearing mechanism 13. The driving member 111 preferably adopts a motor, a movable end of the motor is meshed with a synchronous belt 112 through a gear, the synchronous belt 112 is connected to a slider 114 on the linear guide 113 through a connecting block 115, and the first bearing mechanism 12 and the second bearing mechanism 13 are connected to each other or connected to each other through the slider 114, so that the driving member 111 can drive the first bearing mechanism 12 and the second bearing mechanism 13 to synchronously move on the linear guide 113 through the synchronous belt 112.

The working process of the loading and unloading device 100 is as follows: the first bearing mechanism 12 is located at the feeding station and is used for receiving a product to be tested. Meanwhile, the second bearing mechanism 13 is located at the transfer station and is used for receiving the tested products. After receiving the product, the first carrying mechanism 12 and the second carrying mechanism 13 move simultaneously, and the first carrying mechanism 12 moves to the transfer station to wait for the transferring device 200 to pick up the chip to be tested. Meanwhile, the second bearing mechanism 13 moves to a blanking station to wait for product blanking. After the to-be-detected product and the product blanking are picked up by the transferring device 200, the first bearing mechanism 12 and the second bearing mechanism 13 return at the same time to wait for receiving the product, and the steps are repeated in such a circulating way, so that the automatic feeding, transferring, detecting and blanking of the product are realized. By arranging the first bearing mechanism 12 and the second bearing mechanism 13 at the same time, the feeding time of a product to be detected can be saved, and the detection efficiency of the product is improved.

As shown in fig. 3, the transfer device 200 includes a transfer drive 21, and a first transfer mechanism 22 and a second transfer mechanism 23 provided at the movable end of the transfer drive 21, and the first transfer mechanism 22 and the second transfer mechanism 23 are driven by the transfer drive 21 to reciprocate between the transfer station and the inspection station.

With reference to fig. 1 and fig. 3, the transferring drive 21 includes a support frame 211, a first driving mechanism 212 disposed on the support frame 211 and used for driving the first transferring mechanism 22 to ascend and descend, a second driving mechanism 213 used for driving the second transferring mechanism 23 to ascend and descend, and a third driving mechanism 214 used for driving the first transferring mechanism 22 and the second transferring mechanism 23 to shift between the transfer station and the detection station. Further, the transfer drive 21 further includes a first guide mechanism 215 for providing a first direction guide for the first transfer mechanism 22 and the second transfer mechanism 23, and a second guide mechanism 216 for providing a second direction guide for the first transfer mechanism 22, the second transfer mechanism 23, and the first guide mechanism 215, wherein the first direction is a vertical direction, and the second direction is parallel to a linear direction formed by the transfer station and the detection station. Specifically, the first transfer mechanism 22 and the second transfer mechanism 23 are each slidably connected to the first guide mechanism 215 via a support arm 24, the top of the support arm 24 connected to the first transfer mechanism 22 is connected to the first drive mechanism 212 via the second guide mechanism 216, and the top of the support arm 24 connected to the second transfer mechanism 23 is connected to the second drive mechanism 213 via the second guide mechanism 216. Further, the first guiding mechanism 215 is slidably disposed on the supporting frame 211 through the second guiding mechanism 216, and the first guiding mechanism 215 is further connected to the movable end of the third driving mechanism 214. That is, the third driving mechanism 214 can drive the supporting arm 24, the first transfer mechanism 22 and the second transfer mechanism 23 to move in the second direction through the first guiding mechanism 215, the first driving mechanism 212 can drive the supporting arm 24, the second guiding mechanism 216 and the first transfer mechanism 22 to move in the first direction, and the second driving mechanism 213 can drive the supporting arm 24, the second guiding mechanism 216 and the second transfer mechanism 23 to move in the first direction. Preferably, the first driving mechanism 212 and the second driving mechanism 213 are preferably linear modules, and the third driving mechanism 214 is preferably screw-driven. The first guide mechanism 215 and the second guide mechanism 216 preferably employ a linear guide mechanism.

Since the two sets of loading and unloading devices 100 are provided at the same time, the first transfer mechanism 22 and the second transfer mechanism 23 correspond to one set of loading and unloading devices 100, respectively. That is to say, the first transferring mechanism 22 and the second transferring mechanism 23 correspond to a transfer station, the detection station is disposed between the two sets of loading and unloading devices 100, and the first transferring mechanism 22 and the second transferring mechanism 23 alternately transfer the product to be detected to the detection station for performing the compression test. The working processes of the first transfer mechanism 22 and the second transfer mechanism 23 are as follows: the first transfer mechanism 22 is located at a transfer station corresponding to one of the loading and unloading devices 100, and is used for picking up a product to be tested in the first transfer mechanism. Meanwhile, a second transfer mechanism 23 is located at the inspection station for picking up the inspected product. Then, the first transferring mechanism 22 moves to the detection station for placing the product to be detected on the detection station. Meanwhile, the second transferring mechanism 23 moves to a transfer station corresponding to another group of loading and unloading devices 100, and is used for placing the detected product at the transfer station. After the product detection is finished, the first transfer mechanism 22 picks up the tested product, and meanwhile, the second transfer mechanism 23 picks up the product to be tested at the transfer station. Then, the first transfer mechanism 22 returns to the corresponding transfer station, and places the tested product at the transfer station. Meanwhile, the second transfer mechanism 23 moves to the detection station, and the product to be tested is placed at the detection station, so that the test is completed. The above actions are repeated, and the flow test of the product can be realized.

Further, a heat insulation partition plate 25 is arranged on the support frame 211, and the heat insulation partition plate 25 is respectively located between the feeding station and the transfer station and between the transfer station and the discharging station. Preferably, in order to ensure the heat preservation effect, an automatic valve may be further disposed on the heat preservation partition 25 at a position corresponding to the loading and unloading device 100, and the automatic valve is opened only when the first carrying mechanism 12 and the second carrying mechanism 13 move, and is closed otherwise.

Because the chip test system of this application need carry out different temperature environment tests such as high temperature, low temperature or normal atmospheric temperature to the product, when carrying out high temperature or low temperature test, need guarantee the temperature stability of product. Based on this, the first carrier mechanism 12, the first transfer mechanism 22, and the second transfer mechanism 23 each include: a cooling module 221 and a heating module 222 for providing different working environments for the product to be tested. The second supporting mechanism 13 includes a heating module 222. That is, the whole processes of loading, transferring and detecting the product are all kept within a certain range, and the final test effect is ensured. The second bearing mechanism 13 can drive the product to be discharged and enables the product to be slowly recovered to a normal temperature state after the product is detected at a high temperature or a low temperature, so as to avoid the water vapor condensed inside the product after the test is finished due to too large temperature difference.

The first transfer mechanism 22 and the second transfer mechanism 23 have the same structure, and both include: the cooling module 221, the heating module 222, a buffer 224 connected to the transfer drive 21 through a connecting block 223, a heat insulating block 225 disposed between the cooling module 221 and the buffer 224, and a pressing head assembly 226 having a plurality of pressing heads 2261.

Referring to fig. 4 and 5, the refrigeration module 221 includes: a cold plate 2211, a first cooling chip 2212, a second cooling chip 2213 and a heat dissipation plate 2214. The first refrigeration chip 2212 and the second refrigeration chip 2213 preferably adopt TEC ceramic sheets, the TEC ceramic sheets have a heating surface and a refrigeration surface, and the TEC ceramic sheets in this embodiment are used as refrigeration chips to provide a low-temperature working environment for products to be tested. Specifically, the refrigeration face of first refrigeration chip 2212 does through cold drawing 2211 the pressure head subassembly 226 cooling, the refrigeration face of second refrigeration chip 2213 contacts with the heating face of first refrigeration chip 2212 for the heating face cooling of first refrigeration chip 2212 provides good operational environment for first refrigeration chip 2212, avoids first refrigeration chip 2212 to damage because of the high temperature, the heating face of second refrigeration chip 2213 with heating panel 2214 contacts, by heating panel 2214 is its cooling. Preferably, a pipeline communicated with the outside is arranged inside the heat dissipation plate 2214, and by introducing circulating cooling gas/cooling liquid into the pipeline, heat of the heating surface of the second refrigeration chip 2213 can be taken away, so as to provide a good working environment for the second refrigeration chip 2213.

The size of the first refrigeration chip 2212 is overlapped on the surface of the second refrigeration chip 2213 and is smaller than that of the second refrigeration chip 2213, so that the cost can be saved under the same effect.

In order to ensure the cooling effect of the first cooling chip 2212 and avoid the influence of the external environment cooling module 221, it is preferable to provide thermal insulation pads 2215 between the cold plate 2211 and the second cooling chip 2213, between the cold plate 2211 and the cooling plate 2214, and around the cold plate.

The buffer member 224 is preferably a diaphragm cylinder having a certain compression amount, which can absorb the impact of the pressure head assembly 226 when the product is taken or placed. The heat insulation block 225 is arranged between the diaphragm cylinder and the refrigeration module 221, so that the influence of the temperature of the heat dissipation plate 2214 on the diaphragm cylinder is avoided.

The heating module 222 includes a mounting plate 2221 and a heating chip, the mounting plate 2221 is connected to the cold plate 2211 of the refrigeration module 221, and a plurality of receiving grooves 22211 for receiving the heating chip are disposed on one side of the mounting plate 2221 away from the refrigeration module 221. The heater chip is in contact with the ram assembly 226 to facilitate heat transfer to the product under test. Meanwhile, due to the installation plate 2221 and the cold plate 2211, the influence of the heating chip on the first refrigeration chip 2212 and the second refrigeration chip 2213 can be avoided. The heating chip is preferably made of mica sheets.

The ram assembly 226 includes; the pressing head 2261 and the pressing head seat 2262 are provided with a containing area for bearing a product at a position corresponding to the pressing head 2261 on the pressing head seat 2262, and the number of the pressing heads 2261 can be adjusted according to actual requirements. The ram assembly 226 may be replaced as a unitary structure when adjusted. Further, a vacuum adsorption pipeline is jointly arranged in the pressure head assembly 226, the mounting plate 2221 and the cold plate 2211 of the refrigeration module 221, and an external vacuum source adsorbs and fixes the chip to be tested to a pressure head 2261 of the pressure head assembly 226 through the vacuum adsorption pipeline. That is, the first transfer mechanism 22 and the second transfer mechanism 23 have not only a pressure bonding function but also an adsorption function, so that the products can be moved and pressure-measured easily.

Referring to fig. 6 and 7, the refrigeration module 221 in the first carrier mechanism 12 has the same structure as the refrigeration module 221 in the first transfer mechanism 22 and the second transfer mechanism 23, and the heating module 222 in the first carrier mechanism 12 and the second carrier mechanism 13 uses a heating plate 2222. The first support means 12 therefore comprise: a carrier plate 121 having a plurality of receiving cavities for placing chips, a heating plate 2222, and the cooling module 221. Correspondingly, the second bearing mechanism 13 includes: a carrier plate 121 having a plurality of receiving cavities for placing chips and a heating plate 2222. The carrier plate 121 is fixed above the heating plate 2222. Heating plate 2222 in first bearing mechanism 12 is connected with cold plate 2211 of refrigeration module 221 through interval regulating part 122, through control interval regulating part 122 can be at the heating plate 2222 during operation, will heating plate 2222 with cold plate 2211 separates, avoids the heat transfer of heating plate 2222 to first refrigeration chip 2212 and second refrigeration chip 2213 to avoid causing the influence to first refrigeration chip 2212 second refrigeration chip 2213. When hot plate 2222 is out of work, first refrigeration chip 2212 and second refrigeration chip 2213 during operation, control interval regulating part 122 makes hot plate 2222 and the laminating of cold plate 2211, and then give first refrigeration chip 2212's low temperature the product that awaits measuring. The refrigeration module 221 of the first carrying mechanism 12 and the heating plate 2222 of the second carrying mechanism 13 are connected to the slider 114 of the feeding and discharging drive 11 through the bearing plate 123.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A chip test system, comprising: the two groups of feeding and discharging devices are arranged in parallel, and the transfer device is positioned above the feeding and discharging devices; wherein,

the feeding and discharging device comprises a feeding and discharging drive, and a first bearing mechanism and a second bearing mechanism which are arranged at the movable end of the feeding and discharging drive, wherein the first bearing mechanism is driven by the feeding and discharging drive to reciprocate between a feeding station and a transfer station, and the second bearing mechanism is driven by the feeding and discharging drive to reciprocate between the transfer station and a discharging station;

first bear the weight of mechanism, first move and carry mechanism and second and move and carry the mechanism and all include: the second bearing mechanism comprises a heating module.

2. The chip testing system according to claim 1, wherein the cooling module comprises: cold drawing, refrigeration face with the first refrigeration chip of cold drawing contact, the second refrigeration chip of refrigeration face and the heating surface contact of first refrigeration chip and do the heating surface refrigerated heating panel of second refrigeration chip is provided with the pipeline that is used for letting in cooling liquid in the heating panel.

3. The chip testing system according to claim 1 or 2, wherein the heating module comprises a mounting plate and a heating chip, the mounting plate is connected with the refrigerating module, and a plurality of accommodating grooves for accommodating the heating chip are arranged on one side of the mounting plate away from the refrigerating module.

4. The chip testing system according to claim 3, wherein the first and second transfer mechanisms further comprise: be connected to the mounting panel just has the pressure head subassembly of a plurality of pressure heads, be provided with the vacuum adsorption pipeline jointly in the cold drawing of pressure head subassembly, mounting panel and refrigeration module, the outside vacuum source passes through the vacuum adsorption pipeline will await measuring the chip and adsorb the pressure head department of fixing to the pressure head subassembly.

5. The chip test system according to claim 1, wherein the first and second transfer mechanisms further comprise: the buffer part passes through the heat insulation block and the refrigeration module is connected, the buffer part is connected to the transfer drive through the connecting block.

6. The chip testing system of claim 1, wherein the heating module employs a heating plate, and the first and second carrying mechanisms each comprise: a carrier plate connected to the heating plate and having a plurality of receiving cavities for placing chips.

7. The chip testing system according to claim 6, wherein a distance adjuster is further provided between the heating plate and the cooling module, so that the heating plate and the cooling module are in contact with each other during cooling and are separated during heating.

8. The chip testing system of claim 1, wherein thermal insulation barriers are arranged between the loading station and the transfer station and between the transfer station and the unloading station.

9. The chip testing system as claimed in claim 1, wherein the loading and unloading drive comprises: the driving piece, the synchronous belt, the linear guide rail and the sliding block which is arranged on the linear guide rail and is respectively connected with the first bearing mechanism and the second bearing mechanism, wherein the first bearing mechanism and the second bearing mechanism are connected with each other or pass through the sliding block, the driving piece drives the first bearing mechanism and the second bearing mechanism to synchronously move on the linear guide rail through the synchronous belt.

10. The chip test system according to claim 1, wherein the transfer drive comprises: the first driving component drives the first transfer mechanism to lift, the second driving component drives the second transfer mechanism to lift, and the third driving component drives the first transfer mechanism and the second transfer mechanism to move between the transfer station and the detection station.