CN217825498U - Circuit board assembly and electronic device thereof - Google Patents

Abstract

The present application relates to a circuit board assembly and an electronic device thereof. The circuit board assembly comprises a substrate layer, components and parts and a noise shielding structure; the component is fixed on the substrate layer; the noise shielding structure is arranged on the component and comprises an insulating layer and a shielding layer; the insulating layer covers the surface of the component; the shielding layer is arranged on the insulating layer, and the orthographic projection area of the shielding layer on the base material layer completely covers the insulating layer. The insulating layer covers the surfaces of the components and the shielding layer is arranged on the insulating layer, so that each component on the circuit board assembly is shielded independently, and noise shielding among the components inside the circuit board assembly is realized.

Description

Circuit board assembly and electronic device thereof

Technical Field

The application relates to the technical field of noise protection, in particular to a circuit board assembly and an electronic device thereof.

Background

Noise refers to the collection of signals other than the target signal. The noise signal is large to a certain degree and is often changed into an interference signal, and the working performance of components on the circuit board assembly is influenced. Common noise hazards are control signal control errors or clock signal phase errors. Noise protection is therefore often provided in the area of IC devices on circuit boards in various consumer electronics products.

The noise protection measures on the existing circuit board assemblies are: a metal shielding support or a metal shielding cover is welded on the circuit board assembly, shielding materials such as copper foil and conductive cloth are attached to the outer layer of the metal shielding cover, and an insulating film layer is attached to the inner layer of the metal shielding cover to prevent the component from contacting the metal shielding cover.

The existing noise protection measures have the defects that: only noise from outside the circuit board assembly can be shielded, but there are still some noise interference between components inside the circuit board assembly.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned prior art problem, the present application provides a circuit board assembly and an electronic device thereof, which can solve the problem of noise interference between components inside the circuit board assembly.

The present application provides a circuit board assembly. The circuit board assembly comprises a base material layer, components and parts and a noise shielding structure. The component is fixed on the base material layer. The noise shielding structure is arranged on the component and used for shielding noise. The noise shielding structure comprises an insulating layer and a shielding layer. The insulating layer covers the surface of the component. The shielding layer is arranged on the insulating layer, and the orthographic projection area of the shielding layer on the substrate layer completely covers the insulating layer.

The application also provides an electronic device. The electronic device comprises a functional device and the circuit board assembly, wherein the circuit board assembly is electrically connected with the functional device.

Compared with the prior art, the application has at least the following beneficial effects:

the insulating layer covers the surfaces of the components and the shielding layer is arranged on the insulating layer, so that each component on the circuit board assembly is shielded independently, and noise shielding among the components inside the circuit board assembly is realized. The insulating layer is directly covered on the surface of the component, and the shielding layer is directly arranged on the insulating layer, so that the thickness of the whole circuit board assembly is much smaller than that of the circuit board assembly adopting the traditional noise protection measure.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of a circuit board assembly provided by an embodiment of the present application;

FIG. 2 is an exploded schematic view of the circuit board assembly of FIG. 1;

FIG. 3 is a schematic cross-sectional view of a circuit board assembly provided by another embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of a circuit board assembly provided in accordance with yet another embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a circuit board assembly provided by a further embodiment of the present application;

FIG. 6 is a schematic illustration of a prior art circuit board assembly calculating shield thickness;

FIG. 7 is a schematic illustration of a calculated shield thickness for the circuit board assembly of FIG. 3;

FIG. 8 is a schematic diagram of a prior art circuit board assembly calculating a safe pitch;

FIG. 9 is a schematic illustration of the circuit board assembly of FIG. 3 calculating a safety spacing;

FIG. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 11 isbase:Sub>A schematic cross-sectional structural view at A-A of the electronic device of FIG. 10;

fig. 12 is a block diagram illustrating the structure of the electronic device of fig. 10.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples of the present application, not all examples, and all other examples obtained by a person of ordinary skill in the art without making any creative effort fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

It should be noted that the terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to imply that the number of indicated technical features is high. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise. In the embodiment of the present application, all directional indicators (such as up, down, left, right, front, rear \8230;) are used only to explain the relative positional relationship between the components, the motion situation, etc. at a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The terminology used in the description is for the purpose of describing the embodiments of the application and is not intended to be limiting of the application. It is also to be understood that, unless otherwise expressly stated or limited, the terms "disposed," "connected," and "connected" are intended to be open-ended, i.e., may be fixedly connected, detachably connected, or integrally connected; they may be mechanically coupled, directly coupled, indirectly coupled through intervening media, or may be interconnected between two elements. The above-mentioned meanings specifically ascribed to the present application will be understood to those skilled in the art.

Referring to fig. 1, an embodiment of the present disclosure provides a circuit board assembly 110, where the circuit board assembly 110 may include, but is not limited to, a substrate layer 111, a component 112, and a noise shielding structure 113. The component 112 is fixed to the base material layer 111. The noise shielding structure 113 is disposed on the component 112 and used for shielding noise. Noise shielding structure 113 may include, but is not limited to, an insulating layer 1131 and a shielding layer 1132. An insulating layer 1131 covers the surface of the component 112. The shielding layer 1132 is disposed on the insulating layer 1131, and an orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131. In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110, so that noise interference between the components 112 on the circuit board assembly 110 can be effectively avoided.

Further, referring to fig. 1 and 2, the insulating layer 1131 may include, but is not limited to, a first surface 1131a and a second surface 1131b disposed opposite to each other, and a first end surface 1131c connecting the first surface 1131a and the second surface 1131b. The first surface 1131a is attached to the surface of the component 112. The first end surface 1131c is bonded to the surface of the base material layer 111.

Alternatively, the material of the insulating layer 1131 may be one of polyurethane and ethylene terephthalate. When polyurethane or polyethylene terephthalate is in the form of paint, the insulating layer 1131 may be sprayed onto the surface of the component 112. When the polyurethane or polyethylene terephthalate is in the form of a film, the insulating layer 1131 may be covered on the surface of the component 112 by means of a molding die.

It is understood that polyurethane and polyethylene terephthalate are good insulating materials, so the insulating layer 1131 covering the surface of the component 112 can effectively prevent the shielding layer 1132 from short-circuiting and touching the component 112 or the network on the circuit board assembly 110.

It is understood that the polyurethane or polyethylene terephthalate in the form of a film has shape plasticity, so that a compliant cover film layer can be formed on the circuit board assembly 110 according to the three-dimensional shape of the board surface.

Optionally, in view of heat dissipation, a heat conductive material may be added to the insulating layer 1131 to improve the heat conductive performance of the insulating layer 1131, and avoid the heat dissipation problem from affecting the working performance of the component 112. In particular, the heat conductive material may be a heat conductive silicone grease.

Further, referring to fig. 1 and fig. 2, the shielding layer 1132 may include, but is not limited to, a third surface 1132a and a fourth surface 1132b that are disposed opposite to each other, and a second end surface 1132c connecting the third surface 1132a and the fourth surface 1132 b. The ground pad 1111 is provided on the surface of the base material layer 111. The third surface 1132a is conformed to the second surface 1131b. The second end surface 1132c is attached to the surface of the ground pad 1111, so that the noise signal can be conducted away through the shielding layer 1132 and the ground pad 1111.

Additionally, the ground pad 1111 may be provided with a via penetrating through the ground pad 1111 and the substrate layer 111 to improve the heat dissipation efficiency.

Alternatively, the material of shield layer 1132 may be a blend of polyurethane and silver-coated copper powder or a blend of polyethylene terephthalate and silver-coated copper powder. When the blend of polyurethane and silver-coated copper powder is in a coating form, shielding layer 1132 may be spray coated over second surface 1131b of insulating layer 1131. When the mixture of polyurethane and silver-coated copper powder is in a thin film form, the shielding layer 1132 may cover the second surface 1131b of the insulating layer 1131 by means of compression molding.

It is understood that the silver-coated copper powder is a conductive particle, and the second end surface 1132c of the shielding layer 1132 is in electrical communication with the ground pad 1111 on the substrate layer 111 through the silver-coated copper powder. Thus, noise signals from outside of the circuit board assembly 110 and noise signals from inside of the circuit board assembly 110 are conducted away through the shielding layer 1132 and the ground pad 1111, thereby achieving noise shielding. The silver-coated copper powder has excellent conductivity, is low in price compared with pure silver powder, is difficult to oxidize compared with pure copper powder, and is suitable for being used as conductive particles commonly used in industry.

It is understood that the conductivity of shield layer 1132 depends on the filling rate of the conductive particles. In this embodiment, the conductivity of the shielding layer 1132 depends on the filling rate of the silver-coated copper powder. The higher the filling ratio of the silver-coated copper powder, the higher the conductivity of shield layer 1132 is. The size and uniformity of the conductive particles may affect the conductive characteristics of shield layer 1132. Specifically, if the particle diameter of the conductive particles is too large, too few conductive particles may be brought into contact with the ground pad 1111; if the particle diameter of the conductive particles is too small, it may result in easy aggregation of the conductive particles in the shield layer 1132. Therefore, the particle size of the conductive particles should be selected to be a suitable size, and specifically, the particle size of the silver-coated copper powder is 4 to 6 μm.

Further, referring to fig. 1, the insulating layer 1131 has a uniform thickness. The thickness of the insulating layer 1131 is 0.05 to 0.2mm. The method specifically comprises the following steps: 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, etc. Shield layer 1132 is of uniform thickness. The thickness of the shielding layer is 0.01-0.15mm. The method specifically comprises the following steps: the method specifically comprises the following steps: 0.01mm, 0.12mm, 0.13mm, 0.15mm, and the like. The thicknesses of the insulating layer 1131 and the shielding layer 1132 are set to ensure that the normal performance of the component 112 is not affected. In addition, the thickness of insulating layer 1131 and shielding layer 1132 should also have some structural strength and rigidity.

Further, referring to fig. 1, the minimum distance between one side of the ground pad 1111 facing the edge of the substrate layer 111 and the component 112 is 0.1-0.5mm.

Referring to fig. 3, another embodiment of the present disclosure provides a circuit board assembly 110, where the circuit board assembly 110 may include, but is not limited to, a substrate layer 111, a component 112, and a noise shielding structure 113. The component 112 is fixed to the base material layer 111. The noise shielding structure 113 is disposed on the component 112 and used for shielding noise. The noise shielding structure 113 includes an insulating layer 1131 and a shielding layer 1132. An insulating layer 1131 covers the surface of the components 112 and the gaps between the components 112. The shielding layer 1132 is disposed on the insulating layer 1131, and an orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131. In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110, and noise interference between the components 112 on the circuit board assembly 110 can be effectively avoided.

The circuit board assembly 110 of the other embodiment differs from the circuit board assembly 110 of the one embodiment in that: the insulating layer 1131 also covers the gaps between the components 112.

It is understood that when the density of the components 112 on the circuit board assembly 110 is low and the components are spaced relatively far apart, the insulating layer 1131 only covers the surface of the components 112. When the density of the components 112 on the circuit board assembly 110 is high and the spacing is relatively close, the insulating layer 1131 covers the surface of the components 112 and the spacing between the components 112.

Referring to fig. 4, in another embodiment of the present application, a circuit board assembly 110 is provided, where the circuit board assembly 110 may include, but is not limited to, a substrate layer 111, a component 112, and a noise shielding structure 113. The component 112 is fixed to the base material layer 111. The noise shielding structure 113 is disposed on the component 112 for shielding noise. The noise shielding structure 113 includes an insulating layer 1131 and a shielding layer 1132. An insulating layer 1131 covers the surface of the components 112 and the gaps between the components 112. The shielding layer 1132 is disposed on the insulating layer 1131, and an orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131. In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110, so that noise interference between the components 112 on the circuit board assembly 110 can be effectively avoided. The insulating layer 1131 has a non-uniform thickness. The thickness of shield layer 1132 is also not uniform.

The circuit board assembly 110 of the further embodiment differs from the circuit board assembly 110 of the first embodiment in that: the thickness of the insulating layer 1131 and the shield layer 1132 is not uniform.

It is understood that when some components 112 on the circuit board assembly 110 are relatively high in heat dissipation requirements for normal operation, the thicknesses of the insulating layer 1131 and the shielding layer 1132 may be relatively small to ensure the heat dissipation capability of such components 112. When the requirements for heat dissipation are low for normal operation of other components 112 on the circuit board assembly 110, the thicknesses of the insulating layer 1131 and the shielding layer 1132 may be relatively large to ensure certain structural strength and rigidity.

Alternatively, when the noise signals generated by some components 112 on the circuit board assembly 110 are relatively large or sensitive to the noise signals, the thickness of the shielding layer 1132 covering such components 112 may be relatively large; conversely, the thickness of shield layer 1132 may be relatively small.

Referring to fig. 5, in another embodiment of the present application, a circuit board assembly 110 is provided, where the circuit board assembly 110 may include, but is not limited to, a substrate layer 111, a component 112, and a noise shielding structure 113. The component 112 is fixed to the base material layer 111. The noise shielding structure 113 is disposed on the component 112 and used for shielding noise. Noise shielding structure 113 includes an insulating layer 1131 and a shielding layer 1132. An insulating layer 1131 covers the surface of the components 112 and the gaps between the components 112. The shielding layer 1132 is disposed on the insulating layer 1131, and an orthographic projection area of the shielding layer 1132 on the substrate layer 111 completely covers the insulating layer 1131. In this way, the shielding layer 1132 and the insulating layer 1131 individually encapsulate and shield the components 112 on the circuit board assembly 110, so that noise interference between the components 112 on the circuit board assembly 110 can be effectively avoided. The circuit board assembly 110 further includes a copper foil layer 114 and an ink layer 115. The copper foil layer 114 is provided on the base material layer 111. The component 112 is electrically connected to the copper foil layer 114. The ink layer 115 is disposed on the copper foil layer 114 to protect the copper foil layer 114.

The circuit board assembly 110 of the further embodiment differs from the circuit board assembly 110 of the further embodiment in that: the circuit board assembly 110 further includes a copper foil layer 114 and an ink layer 115. The copper foil layer 114 is provided on the base material layer 111. The component 112 is electrically connected to the copper foil layer 114. The ink layer 115 is disposed on the copper foil layer 114 to protect the copper foil layer 114.

As can be appreciated, the copper foil layer 114 forms a circuit network on the circuit board assembly 110 to communicate with the component 112. The ink layer 115 disposed on the copper foil layer 114 can protect the circuit network on the circuit board assembly 110.

Further, referring to fig. 6, in the prior art, the circuit board assembly 210 may include, but is not limited to, a substrate layer 211, a component 212, and a noise shielding structure 213. The component 212 is fixed to the base material layer 211. The base material layer 211 is provided with a pad. The noise shielding structure 213 is soldered to the base material layer 211 through a pad. The noise shielding structure 213 may include, but is not limited to, a shielding layer 2131, an insulating layer 2132, and a metal shielding cover 2133. The metal shielding cover 2133 may include, but is not limited to, a top plate and a side plate, which form a receiving cavity, and the component 212 is received in the receiving cavity. The side of the top plate facing away from the component 212 is covered with a shielding layer 2131. The side of the top plate facing the component 212 is covered with an insulating layer 2132 to prevent the component 212 from contacting the metal shielding lid 2133.

In the circuit board assembly 210 in the prior art, the thickness of the metal layer of the metal shielding cover 2133 is 0.15-0.2mm, the thickness of the insulating layer 2132 is 0.04-0.05mm, the top gap between the highest point of the component 212 and the lower surface of the insulating layer 2132 is 0.1-0.2mm, and the thickness of the shielding layer 2131 is 0.01-0.15mm, so that the shielding thickness H1= the thickness of the metal layer + the thickness of the insulating layer 2132 + the thickness of the top gap + the thickness of the shielding layer 2131 =0.3-0.5mm.

Referring to fig. 7, in another embodiment of the present application, a shielding thickness H2 of the circuit board assembly 110 = a thickness of the insulating layer 1131 + a thickness of the shielding layer 1132 =0.06-0.35mm. It can be seen that the shielding thickness of circuit board assembly 110 is reduced by more than 50% from the shielding thickness of circuit board assembly 210, which leaves more room for the layout of other modules within the electronic device or reduces the overall thickness of the electronic device.

It can be understood that, referring to fig. 8, in the circuit board assembly 210 of the prior art, the width of the pad is 0.2-0.5mm, the gap distance between the side of the pad facing the component 212 and the component 212 is 0.1-0.3mm, and the reserved distance between the side of the pad facing away from the component 212 and the edge of the substrate layer 211 is 0.1-0.3mm, so that the safety distance D1= the pad width + the gap distance + the reserved distance =0.4-1.1mm.

Referring to fig. 9, another embodiment of the present disclosure provides a safe pitch of the circuit board assembly 110, which is a minimum distance between the side of the ground pad 1111 facing the edge of the substrate layer 111 and the component 112, so that the safe distance D2=0.1-0.5mm of the circuit board assembly 110. It can be seen that the safety pitch of the circuit board assembly 110 is reduced by more than 50% compared to the safety pitch of the circuit board assembly 210, which makes more space for the layout of other modules inside the electronic device or saves more space for the electronic device.

It can be appreciated that another embodiment of the present application provides a circuit board assembly 110 that has a much lighter overall weight than the prior art circuit board assembly 210 due to the absence of a metal shield frame or metal shield cover.

Referring to fig. 10 and 11, an electronic device 10 is further provided according to an embodiment of the present disclosure. Specifically, the electronic device 10 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like. The electronic device 10 may include, but is not limited to, a housing assembly 120, a display module 130, and a circuit board assembly 110. The housing assembly 120 may include a rear cover 121 and a middle frame 122. For a detailed structure of the circuit board assembly 110, please refer to the related description of the foregoing embodiments, which is not repeated herein. It should be noted that, in the embodiment of the present application, the electronic device 10 is only described as including the middle frame 122, and in other embodiments, the electronic device may not include the middle frame, that is, the rear cover 121 of the housing assembly 120 directly cooperates with the display screen module 130, and is not limited herein.

Optionally, the display screen module 130 and the rear cover 121 of the housing assembly 120 are respectively disposed on two opposite sides of the middle frame 122. The display module 130 and the housing assembly 120 cooperate to form an accommodating space 100, and the circuit board assembly 110 is disposed in the accommodating space 100. The circuit board assembly 110 is coupled to the display module 130, and the circuit board assembly 110 is used for controlling the operating state of the display module 130. The detailed technical features of the other parts of the electronic device 10 are within the understanding of those skilled in the art, and will not be described herein.

Referring to fig. 12, the electronic device 10 may include, but is not limited to, an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively coupled with the processor 980; the power supply 990 is used to supply power to the entire electronic device 10.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone (or microphone) 962 are coupled to the processor 980 via the audio circuit 960 for receiving and transmitting sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device.

The circuit board assembly 110 that this application provided covers on components and parts 112's surface and shielding layer 1132 through insulating layer 1131 and sets up on insulating layer 1131 for each components and parts 112 on circuit board assembly 110 all are shielded alone, thereby realize the noise shielding between the inside components and parts 112 of circuit board assembly 110.

The circuit board assembly 110 provided by the present application directly covers the surface of the component 112 through the insulating layer 1131, and the shielding layer 1132 is directly disposed on the insulating layer 1131, and the thicknesses of the insulating layer 1131 and the shielding layer 1132 are smaller, so that the overall thickness of the circuit board assembly 110 is much smaller than that of the conventional noise protection measure. Meanwhile, compared with the conventional noise shielding technical scheme adopting a metal shielding bracket or a metal shielding cover, the overall weight of the circuit board assembly 110 provided by the application is also much smaller.

The circuit board assembly 110 provided herein has a safety pitch of 0.1-0.5mm. While the safety spacing of the circuit board assembly 210 using the metal shield bracket or metal shield cover noise shielding scheme is 0.4-1.1mm. Therefore, the circuit board assembly 110 provided by the present application can save more than 50% of the occupied space compared to the conventional noise protection measures.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the contents of the specification and the drawings, or applied directly or indirectly to other related technical fields, are all included in the scope of the present application.

Claims (10)

1. A circuit board assembly, comprising:

a substrate layer;

the component is fixed on the base material layer;

noise shielding structure set up in on the components and parts for the shielding noise includes:

the insulating layer covers the surface of the component;

the shielding layer is arranged on the insulating layer, and the orthographic projection area of the shielding layer on the base material layer completely covers the insulating layer.

2. The circuit board assembly of claim 1, wherein the insulating layer covers gaps between the components and surfaces of the components.

3. The circuit board assembly of claim 1, wherein the insulating layer includes a first surface and a second surface disposed opposite to each other, and a first end surface connecting the first surface and the second surface, the first surface being attached to the surface of the component, and the first end surface being attached to the surface of the substrate layer.

4. The circuit board assembly according to claim 3, wherein the shielding layer comprises a third surface and a fourth surface which are opposite to each other, and a second end surface connecting the third surface and the fourth surface, the substrate layer surface is provided with a ground pad, the third surface is attached to the second surface, and the second end surface is attached to the ground pad surface.

5. The circuit board assembly of claim 4, wherein a minimum distance between a side of the ground pad facing the edge of the substrate layer and the component is 0.1-0.5mm.

6. The circuit board assembly of claim 1, wherein the insulating layer and the shielding layer are of uniform thickness.

7. The circuit board assembly of claim 1, wherein the insulating layer has a thickness of 0.05-0.2mm.

8. The circuit board assembly of claim 1, wherein the shielding layer has a thickness of 0.01-0.15mm.

9. The circuit board assembly of claim 1, further comprising a copper foil layer disposed on the substrate layer, the component electrically connected to the copper foil layer, and an ink layer disposed on the copper foil layer to protect the copper foil layer.

10. An electronic device comprising a functional device and the circuit board assembly of any one of claims 1-9, wherein the circuit board assembly is electrically connected to the functional device.

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