CN217363311U

CN217363311U - Anti-interference packaging structure of silicon microphone

Info

Publication number: CN217363311U
Application number: CN202220620092.3U
Authority: CN
Inventors: 李干平
Original assignee: Shenzhen Zhuobin Electronics Co ltd
Current assignee: Shenzhen Zhuobin Electronics Co ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-09-02
Anticipated expiration: 2032-03-21

Abstract

The application discloses anti-interference packaging structure of silicon microphone, including base plate, absorbing layer, dustproof construction, silicon microphone electronic equipment, shielding layer, sound inlet hole and shell body, fixed connection absorbing layer, silicon microphone electronic equipment, shielding layer and shell body on the top lateral wall of base plate, silicon microphone electronic equipment is located the inside of shell body, shielding layer fixed connection is on the lateral wall of shell body, absorbing layer fixed connection is on the lateral wall of shielding layer. This application graphite alkene can absorb or weaken its surperficial received electromagnetic wave energy by a wide margin, the copper product has better electromagnetic wave shielding effect, be convenient for protect the inside electronic equipment of silicon microphone, avoid silicon microphone to receive the interference, lead to not hearing the sound in the earphone, this application dirt proof boot can block the dust, the dust screen can further block the dust, be convenient for effectually prevent that the dust from getting into in the silicon microphone.

Description

Anti-interference packaging structure of silicon microphone

Technical Field

The application relates to the field of microphones, in particular to an anti-interference packaging structure of a silicon microphone.

Background

Silicon microphones are MEMS microphones, which are microphones manufactured based on MEMS technology. The surface-mounted circuit board is manufactured by adopting a surface-mounted process, can bear high reflow soldering temperature, and is easy to integrate with a CMOS (complementary metal oxide semiconductor) process and other audio circuits.

Traditional silicon microphone easily receives the interference, and the electric current sound of "nourishing" appears, leads to not hearing the sound in the earphone clearly, and in addition, traditional silicon microphone does not set up dustproof construction, and the dust is easily through entering inside the silicon microphone of sound hole entering. Therefore, an anti-interference packaging structure of a silicon microphone is provided for solving the above problems.

Disclosure of Invention

The anti-interference packaging structure of the silicon microphone is used for solving the problem that the traditional silicon microphone is easy to interfere in the prior art, so that the sound and dust in the earphone cannot be heard easily and enter the silicon microphone through the sound inlet hole.

According to an aspect of the application, an anti-interference packaging structure of silicon microphone is provided, including base plate, absorbing layer, dustproof construction, silicon microphone electronic equipment, shielding layer, sound inlet hole and shell body, fixed connection absorbing layer, silicon microphone electronic equipment, shielding layer and shell body on the top lateral wall of base plate, silicon microphone electronic equipment is located the inside of shell body, shielding layer fixed connection is on the lateral wall of shell body, absorbing layer fixed connection is on the lateral wall of shielding layer, the sound inlet hole has been seted up at the top of shell body, the inside of sound inlet hole is provided with dustproof construction.

Furthermore, the wave-absorbing layer is made of graphene materials.

Furthermore, the shielding layer is made of a copper material.

Further, dustproof construction includes a screw thread section of thick bamboo, dust screen, dirt proof boot and the elastic sleeve ring, screw thread section of thick bamboo threaded connection is in advancing the sound hole, the top fixed connection dust screen of a screw thread section of thick bamboo, the elastic sleeve ring has been cup jointed on the screw thread section of thick bamboo, the last fixed connection dirt proof boot of the elastic sleeve ring.

Furthermore, the dust-proof sleeve is made of sponge.

Furthermore, the elastic lantern ring is made of rubber.

Through the above-mentioned embodiment of this application, adopted absorbing layer, dustproof construction and shielding layer, solved traditional silicon microphone and easily received the interference, leaded to not hearing the sound in the earphone and the dust easily gets into the inside problem of silicon microphone through advancing the sound hole, gained be convenient for effectually prevent that the dust from getting into in the silicon microphone and be convenient for protect the inside electronic equipment of silicon microphone, avoided the silicon microphone to receive the effect of interference.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic overall perspective view of an embodiment of the present application;

FIG. 2 is a schematic diagram of the overall internal structure of an embodiment of the present application;

fig. 3 is a schematic perspective view of a threaded cylinder according to an embodiment of the present application.

In the figure: 1. a substrate; 2. a wave-absorbing layer; 3. a dust-proof structure; 301. a threaded barrel; 302. a dust screen; 303. a dust-proof sleeve; 304. an elastic collar; 4. silicon microphone electronics; 5. a shielding layer; 6. a sound inlet hole; 7. an outer housing.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1-3, an anti-interference packaging structure for a silicon microphone comprises a substrate 1, a wave-absorbing layer 2, a dustproof structure 3, a silicon microphone electronic device 4, a shielding layer 5, a sound inlet hole 6 and a shell 7, wherein the wave-absorbing layer 2, the silicon microphone electronic device 4, the shielding layer 5 and the shell 7 are fixedly connected to the outer side wall of the top of the substrate 1, the silicon microphone electronic device 4 is located inside the shell 7, the shielding layer 5 is fixedly connected to the outer side wall of the shell 7, the wave-absorbing layer 2 is fixedly connected to the outer side wall of the shielding layer 5, the sound inlet hole 6 is formed in the top of the shell 7, and the dustproof structure 3 is arranged inside the sound inlet hole 6.

The wave-absorbing layer 2 can absorb or greatly weaken the electromagnetic wave energy received on the surface of the wave-absorbing layer, the interference of the electromagnetic wave can be reduced, the interference on the silicon microphone electronic equipment 4 inside the outer shell 7 can be avoided, the shielding layer 5 has better shielding effect of the electromagnetic wave, the interference on the silicon microphone electronic equipment 4 inside the outer shell 7 can be further avoided, the electronic equipment inside the silicon microphone can be protected, the interference on the silicon microphone can be avoided, the sound in a receiver can not be heard, the dust-proof sleeve 303 can block dust, the dust can be prevented from entering the silicon microphone through the threaded barrel 301, the dust-proof net 302 can further block the dust, the dust can be further prevented from entering the silicon microphone through the threaded barrel 301, the dust can be effectively prevented from entering the silicon microphone

The wave-absorbing layer 2 is made of graphene materials, and the graphene can absorb or greatly weaken electromagnetic wave energy received by the surface of the graphene, so that the interference of the electromagnetic wave can be reduced, and the silicon microphone electronic equipment 4 in the outer shell 7 can be prevented from being interfered.

The shielding layer 5 is made of a copper material, the copper material has a good electromagnetic wave shielding effect, and the silicon microphone electronic equipment 4 inside the shell 7 can be further prevented from being interfered.

Dustproof construction 3 includes a screw thread section of thick bamboo 301, dust screen 302, dirt proof boot 303 and elastic sleeve ring 304, screw thread section of thick bamboo 301 threaded connection is in advancing sound hole 6, the top fixed connection dust screen 302 of a screw thread section of thick bamboo 301, the elastic sleeve ring 304 has been cup jointed on a screw thread section of thick bamboo 301, the last fixed connection dirt proof boot 303 of elastic sleeve ring 304, dirt proof boot 303 can block the dust, avoids the dust to get into silicon microphone through a screw thread section of thick bamboo 301 in, and dirt proof boot 302 can further block the dust.

The dust-proof sleeve 303 is made of sponge, and the sponge is light and can block dust.

The elastic sleeve ring 304 is made of rubber, the rubber has good elasticity, and the dustproof sleeve 303 can be sleeved on the threaded cylinder 301.

When the utility model is used, the wave-absorbing layer 2 is made of graphene material, the graphene can absorb or greatly weaken the electromagnetic wave energy received by the surface of the wave-absorbing layer, the interference of the electromagnetic wave can be reduced, the silicon microphone electronic equipment 4 in the shell 7 can be prevented from being interfered, the shielding layer 5 is made of copper material, the copper material has better shielding effect of the electromagnetic wave, the silicon microphone electronic equipment 4 in the shell 7 can be further prevented from being interfered, the electronic equipment in the silicon microphone can be protected conveniently, the silicon microphone can be prevented from being interfered, the sound in a receiver can not be heard, the sound inlet hole 6 can communicate the sound, the dust cover 303 can block the dust, the dust can be prevented from entering the silicon microphone through the threaded cylinder 301, the dust can be further blocked by the dust screen 302, the dust is further prevented from entering the silicon microphone through the threaded cylinder 301, which is convenient for effectively preventing dust from entering the silicon microphone.

The application has the advantages that:

1. this application is rational in infrastructure, graphite alkene can absorb or weaken its surperficial received electromagnetic wave energy by a wide margin, the interference of reducible electromagnetic wave, can avoid the inside silicon microphone electronic equipment of shell body to receive the interference, the copper product material has the shielding effect of better electromagnetic wave, can be further avoid the inside silicon microphone electronic equipment of shell body to receive the interference, be convenient for protect the inside electronic equipment of silicon microphone, avoid the silicon microphone to receive the interference, lead to not hearing the sound in the earphone.

2. This application is rational in infrastructure, and the dirt proof boot can block the dust, avoids in the dust passes through a screw section of thick bamboo entering silicon microphone, the dust screen can further block the dust, further avoids in the dust passes through a screw section of thick bamboo entering silicon microphone, is convenient for effectually prevent in the dust gets into silicon microphone.

The modules referred to are prior art and are fully implemented by those skilled in the art, and it is not necessary to state that the present invention is not directed to software and process improvements.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. The utility model provides an anti-interference packaging structure of silicon microphone which characterized in that: including base plate (1), absorbing layer (2), dustproof construction (3), silicon microphone electronic equipment (4), shielding layer (5), advance sound hole (6) and shell body (7), fixed connection absorbing layer (2), silicon microphone electronic equipment (4), shielding layer (5) and shell body (7) on the top lateral wall of base plate (1), silicon microphone electronic equipment (4) are located the inside of shell body (7), shielding layer (5) fixed connection is on the lateral wall of shell body (7), absorbing layer (2) fixed connection is on the lateral wall of shielding layer (5), advance sound hole (6) have been seted up at the top of shell body (7), the inside of advancing sound hole (6) is provided with dustproof construction (3).

2. The anti-tamper packaging structure for the silicon microphone of claim 1, wherein: the wave-absorbing layer (2) is made of graphene materials.

3. The anti-tamper packaging structure for the silicon microphone of claim 1, wherein: the shielding layer (5) is made of a copper material.

4. The anti-tamper packaging structure for the silicon microphone of claim 1, wherein: dustproof construction (3) include a screw thread section of thick bamboo (301), dust screen (302), dirt proof boot (303) and elastic sleeve ring (304), screw thread section of thick bamboo (301) threaded connection is in sound inlet hole (6), top fixed connection dirt proof boot (302) of a screw thread section of thick bamboo (301), the elastic sleeve ring (304) has been cup jointed on a screw thread section of thick bamboo (301), last fixed connection dirt proof boot (303) of elastic sleeve ring (304).

5. The anti-tamper packaging structure for a silicon microphone of claim 4, wherein: the dustproof sleeve (303) is made of sponge.

6. The anti-tamper packaging structure for a silicon microphone of claim 4, wherein: the elastic sleeve ring (304) is made of rubber.