CN217789957U - High-heat-dissipation double-sided circuit board - Google Patents
High-heat-dissipation double-sided circuit board Download PDFInfo
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- CN217789957U CN217789957U CN202122286384.6U CN202122286384U CN217789957U CN 217789957 U CN217789957 U CN 217789957U CN 202122286384 U CN202122286384 U CN 202122286384U CN 217789957 U CN217789957 U CN 217789957U
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- circuit board
- dust cover
- heat dissipation
- double
- heat
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Abstract
The utility model relates to a double-sided circuit board technical field discloses a high heat dissipation double-sided circuit board, which comprises a circuit board, circuit board upper end is provided with the dust cover, the dust cover upper end is provided with heat radiation fins, the mounting groove has been seted up to dust cover inner chamber bottom surface, the louvre has been seted up to dust cover surface both sides, circuit board upper end both sides parallel arrangement has the grafting post, the circuit board upper end is provided with electronic component, the inserting groove has been seted up to dust cover inner chamber wall both sides, the stopper is installed to inner chamber wall both sides in the inserting groove, the inside heat of its dust cover dispels the heat through heat radiation fins, and the louvre can dispel the heat equally, thereby improve the heat dispersion of circuit board.
Description
Technical Field
The utility model relates to a double-sided circuit board technical field specifically is a high heat dissipation double-sided circuit board.
Background
In high-tech development, people need electronic products with high performance, small size and multiple functions, and the manufacture of printed circuit boards is promoted to be light, thin, short and small, and has limited space, more functions, increased wiring density and smaller aperture.
When the existing double-sided circuit board is used, an electronic element arranged at the upper end of the circuit board can generate some heat, after the circuit board is used for a long time, the surface of the circuit board can be directly covered with a layer of dust, and the dust further influences the heat dissipation performance of the circuit board and the use of the circuit board.
The problems described above are addressed. Therefore, a high heat dissipation double-sided circuit board is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat dissipation double-sided circuit board, after the circuit board is accomplished in the installation, can cup joint the dust cover on the circuit board, the inside heat of its dust cover dispels the heat through heat radiation fins, and the louvre can dispel the heat equally to improve the heat dispersion of circuit board, thereby solved the problem among the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: the high-heat-dissipation double-sided circuit board comprises a circuit board, wherein a dust cover is arranged at the upper end of the circuit board, heat dissipation fins are arranged at the upper end of the dust cover, mounting grooves are formed in the bottom surface of an inner cavity of the dust cover, and heat dissipation holes are formed in two sides of the outer surface of the dust cover.
Preferably, the two sides of the upper end of the circuit board are provided with the insertion columns in parallel, and the upper end of the circuit board is provided with the electronic element.
Preferably, inserting grooves are formed in two sides of the inner cavity wall of the dust cover, and limiting blocks are installed on two sides of the inner cavity wall of each inserting groove.
Preferably, the inner cavity of the plug-in post is provided with a first through hole, four corners of the bottom surface of the circuit board are provided with support posts, the upper end of the circuit board is provided with a second through hole, and an opening at the upper end of the second through hole is communicated with the lower end of the first through hole.
Preferably, the openings at the upper ends of the pair of inserting grooves are communicated with connecting pipes.
Preferably, the limiting block is of a semicircular structure.
Preferably, the stopper is a member made of a rubber material.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model provides a pair of high heat dissipation double-sided circuit board, after the circuit board is accomplished in the installation, can cup joint the dust cover on the circuit board, the inside heat of its dust cover dispels the heat through heat radiation fins, and the louvre can dispel the heat equally to improve the heat dispersion of circuit board.
2. The utility model provides a pair of high heat dissipation double-sided circuit board need cup joint when circuit board upper end at the dust cover to the first through-hole and the second through-hole that make the spliced pole inner chamber set up communicate with each other with the inserting groove, thereby make the air current can get into the dust cover inner chamber, improve the radiating effect.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic diagram of the circuit board structure of the present invention;
FIG. 3 is a schematic diagram of a side-view internal structure of the circuit board of the present invention;
FIG. 4 is a schematic view of the dust cover of the present invention;
fig. 5 is a schematic view of the front view internal structure of the dust cover of the present invention.
In the figure: 1. a circuit board; 11. an electronic component; 12. inserting the columns; 121. a first through hole; 122. a second through hole; 13. a support column; 2. a dust cover; 21. heat dissipation fins; 22. inserting grooves; 221. a limiting block; 23. connecting pipes; 24. mounting grooves; 25. and (4) heat dissipation holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
In order to solve the technical problem that the dust covers the surface of the circuit board 1 to influence heat dissipation, as shown in fig. 1-2 and 4, the following preferred technical solutions are provided:
a high-heat-dissipation double-sided circuit board comprises a circuit board 1, wherein a dust cover 2 is arranged at the upper end of the circuit board 1, heat dissipation fins 21 are arranged at the upper end of the dust cover 2, a mounting groove 24 is formed in the bottom surface of an inner cavity of the dust cover 2, heat dissipation holes 25 are formed in two sides of the outer surface of the dust cover 2, and an electronic element 11 is arranged at the upper end of the circuit board 1.
Specifically, after the circuit board 1 is mounted, the dust cover 2 can be covered on the upper end of the circuit board 1, the dust cover 2 can prevent dust from directly falling on the surface of the circuit board 1 to affect the heat dissipation performance, the heat dissipation fins 21 are arranged at the upper end of the dust cover 2, heat inside the dust cover 2 is dissipated through the heat dissipation fins 21, and the heat dissipation holes 25 can also dissipate heat, so that the heat dissipation performance of the circuit board 1 is improved.
In order to further solve the technical problem that the dust covers the surface of the circuit board 1 to influence heat dissipation, as shown in fig. 2-3 and fig. 5, the following preferred technical solutions are provided:
plug-in posts 12 are arranged in parallel on two sides of the upper end of the circuit board 1, plug-in grooves 22 are formed in two sides of the inner cavity wall of the dust cover 2, limiting blocks 221 are mounted on two sides of the inner cavity wall of each plug-in groove 22, first through holes 121 are formed in the inner cavity of each plug-in post 12, supporting columns 13 are arranged at four corners of the bottom surface of the circuit board 1, second through holes 122 are formed in the upper end of the circuit board 1, upper-end openings of the second through holes 122 are communicated with the lower ends of the first through holes 121, connecting pipes 23 are communicated with upper-end openings of the pair of plug-in grooves 22, the limiting blocks 221 are of semicircular structures, and the limiting blocks 221 are members made of rubber materials.
Specifically, when the dust cover 2 needs to be covered on the upper end of the circuit board 1, the inserting grooves 22 formed in the two sides of the inner cavity of the dust cover 2 are sleeved on the outer surface of the inserting column 12, so that the first through hole 121 and the second through hole 122 formed in the inner cavity of the inserting column 12 are communicated with the inserting grooves 22, air flow can enter the inner cavity of the dust cover 2, the heat dissipation effect is improved, and the upper ends of the pair of inserting grooves 22 are communicated with each other through the connecting pipe 23, so that the heat dissipation effect is further improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a high heat dissipation double-sided circuit board, includes circuit board (1), its characterized in that: the dustproof cover is characterized in that the dustproof cover (2) is arranged at the upper end of the circuit board (1), the radiating fins (21) are arranged at the upper end of the dustproof cover (2), the bottom surface of the inner cavity of the dustproof cover (2) is provided with a mounting groove (24), and radiating holes (25) are formed in two sides of the outer surface of the dustproof cover (2).
2. The double-sided circuit board with high heat dissipation according to claim 1, wherein: plug-in columns (12) are arranged on two sides of the upper end of the circuit board (1) in parallel, and electronic elements (11) are arranged on the upper end of the circuit board (1).
3. The high heat dissipation double-sided circuit board of claim 2, wherein: inserting grooves (22) are formed in two sides of the inner cavity wall of the dust cover (2), and limiting blocks (221) are mounted on two sides of the inner cavity wall of each inserting groove (22).
4. The double-sided circuit board with high heat dissipation according to claim 3, wherein: the inner cavity of the plug column (12) is provided with a first through hole (121), four corners of the bottom surface of the circuit board (1) are provided with support columns (13), the upper end of the circuit board (1) is provided with a second through hole (122), and an opening at the upper end of the second through hole (122) is communicated with the lower end of the first through hole (121).
5. The double-sided circuit board with high heat dissipation according to claim 4, wherein: the openings of the upper ends of the pair of inserting grooves (22) are communicated with connecting pipes (23).
6. The double-sided circuit board with high heat dissipation according to claim 3, wherein: the limiting block (221) is of a semicircular structure.
7. The high heat dissipation double-sided circuit board of claim 6, wherein: the stopper (221) is a member made of a rubber material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122286384.6U CN217789957U (en) | 2021-09-22 | 2021-09-22 | High-heat-dissipation double-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122286384.6U CN217789957U (en) | 2021-09-22 | 2021-09-22 | High-heat-dissipation double-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217789957U true CN217789957U (en) | 2022-11-11 |
Family
ID=83905321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122286384.6U Active CN217789957U (en) | 2021-09-22 | 2021-09-22 | High-heat-dissipation double-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217789957U (en) |
-
2021
- 2021-09-22 CN CN202122286384.6U patent/CN217789957U/en active Active
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