CN217788353U - Cooling device for semiconductor sputtering table - Google Patents
Cooling device for semiconductor sputtering table Download PDFInfo
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- CN217788353U CN217788353U CN202222059553.7U CN202222059553U CN217788353U CN 217788353 U CN217788353 U CN 217788353U CN 202222059553 U CN202222059553 U CN 202222059553U CN 217788353 U CN217788353 U CN 217788353U
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Abstract
The utility model discloses a cooling device for semiconductor sputtering platform, include: the water inlet main pipe is provided with a plurality of first water inlet holes and second water inlet holes, and the first water inlet holes are connected with the first water inlet branch pipes; the second water inlet hole is connected with the second water inlet branch pipe; the water outlet main pipe is provided with a plurality of first water outlet holes and second water outlet holes, the first water outlet holes are connected with first water outlet branch pipes, each first water outlet branch pipe is respectively communicated with a corresponding first water inlet branch pipe, the second water outlet holes are connected with second water outlet branch pipes, and each second water outlet branch pipe is respectively communicated with a corresponding second water inlet branch pipe; the gas pipeline is communicated with the water inlet main pipe, and the electromagnetic valve is arranged on the gas pipeline and used for controlling the gas pipeline to introduce gas into the water inlet main pipe so as to discharge all water in the cooling device. The cooling device has a simple structure, is convenient for realizing independent control on different cooling positions, and is convenient for maintenance and repair.
Description
Technical Field
The utility model relates to a semiconductor processing field especially relates to a cooling device for semiconductor sputtering platform.
Background
The semiconductor sputtering station is provided with a cooling device for cooling a target, a chamber door, a heater, a matching box, and the like. However, in the existing cooling device, the water in the cooling device can not be completely discharged in the process of maintaining and repairing the equipment, thereby influencing the maintenance of the equipment.
Disclosure of Invention
In order to overcome the defect among the prior art, the embodiment of the utility model provides a cooling device for semiconductor sputtering platform, this cooling device simple structure is convenient for realize independent control, be convenient for maintain, maintain to different cooling positions.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a cooling apparatus for a semiconductor sputtering station, comprising:
the target material cooling device comprises a water inlet main pipe, wherein the water inlet main pipe is provided with a plurality of first water inlet holes and second water inlet holes, the first water inlet holes are connected with first water inlet branch pipes and used for cooling a target material, and the second water inlet holes are connected with second water inlet branch pipes and used for cooling a component;
the water outlet main pipe is provided with a plurality of first water outlet holes and second water outlet holes, the first water outlet holes are connected with first water outlet branch pipes, each first water outlet branch pipe is respectively communicated with one corresponding first water inlet branch pipe, the second water outlet holes are connected with second water outlet branch pipes, and each second water outlet branch pipe is respectively communicated with one corresponding second water inlet branch pipe;
the gas pipeline, the gas pipeline with the water inlet main is linked together be equipped with the solenoid valve on the gas pipeline for control the gas pipeline to let in gas in the water inlet main to discharge the water in the cooling device is whole.
Preferably, a blowing valve is provided on the gas pipe for adjusting the pressure of the compressed gas in the gas pipe.
In the above technical scheme, the diameter of the gas pipeline is 5 mm-7 mm.
In the above technical solution, the first water inlet branch pipe is a 1/2 inch pipe.
In the above technical solution, the second water inlet branch pipe is a 3/8 inch pipe.
Preferably, each outlet pipe branch pipe is provided with a digital display flow meter.
Further preferably, a first digital display flowmeter is arranged on the first water outlet branch pipe, and the model number of the first digital display flowmeter is SMC PF2W740-N04-67; and a second digital flowmeter is arranged on the second water outlet branch pipe, and the model of the second digital flowmeter is SMC PF2W704-N03-67.
In the above technical scheme, the water outlet main pipe comprises a water collecting pipe connected with the water outlet branch pipe, a three-way pipe connected with the bottom end of the water collecting pipe, and a water return pipe and a water discharge pipe respectively connected with the water outlet of the three-way pipe.
Preferably, the water inlet main pipe and the water outlet main pipe are stainless steel pipes.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the utility model discloses in through connect gas piping on the inlet manifold, let in compressed gas in to gas piping, utilize compressed gas to discharge the water in inlet manifold, water inlet branch pipe, outlet manifold, the outlet branch pipe is whole to be convenient for maintenance, the maintenance of equipment.
2. The gas pipeline is provided with the electromagnetic valve and the blowing valve, so that compressed gas can be conveniently controlled, the pressure of the compressed gas can be adjusted, and the drainage efficiency can be improved.
3. A plurality of first water inlet holes and second water inlet holes are formed in the water inlet main pipe and are respectively connected with a first water inlet branch pipe and a second water inlet branch pipe which have different pipe diameters, and different requirements of different cooling positions on water quantity are met.
4. The water inlet branch pipes and the corresponding water outlet branch pipes are arranged, and a plurality of water paths arranged in parallel are formed in the cooling device, so that each water path is not influenced by each other and can be used independently.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cooling device for a semiconductor sputtering station according to the present invention.
Reference numerals of the above figures: 1. a water inlet main pipe; 11. a first water inlet hole; 12. a second water inlet hole; 2. a water outlet main pipe; 201. a water collection pipe; 202. a drain pipe; 203. a water return pipe; 21. a first water outlet branch pipe; 22. a second outlet branch pipe; 23. a first digital display flow meter; 24. a second digital flowmeter; 3. a gas conduit; 4. an electromagnetic valve; 5. and a blowing valve.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1, a cooling apparatus for a semiconductor sputtering station, includes:
the target material cooling device comprises a water inlet main pipe 1, wherein a plurality of first water inlet holes 11 and second water inlet holes 12 are formed in the water inlet main pipe 1, the first water inlet holes 11 are connected with first water inlet branch pipes and used for cooling a target material, and the second water inlet holes 12 are connected with second water inlet branch pipes and used for cooling a component;
the water outlet main pipe 2 is provided with a plurality of first water outlet holes and second water outlet holes, the first water outlet holes are connected with first water outlet branch pipes 21, each first water outlet branch pipe 21 is respectively communicated with a corresponding first water inlet branch pipe, the second water outlet holes are connected with second water outlet branch pipes 22, and each second water outlet branch pipe 22 is respectively communicated with a corresponding second water inlet branch pipe;
the gas pipeline 3 is communicated with the water inlet main pipe 1, and the gas pipeline 3 is provided with an electromagnetic valve 4 for controlling the gas pipeline 3 to introduce gas into the water inlet main pipe 1 so as to discharge all water in the cooling device.
Through connecting gas pipeline 3 on water inlet main 1, let in compressed gas in gas pipeline 3, utilize compressed gas to discharge water in water inlet main 1, water inlet branch pipe, water outlet main 2, the water outlet branch pipe is whole to be convenient for the maintenance, the maintenance of equipment.
Each water inlet branch pipe (not shown) is connected to a cooling structure such as a cooling plate where a corresponding cooling object is located, and is communicated with a corresponding water outlet branch pipe through the cooling structure such as the cooling plate. Referring to fig. 1, three first water inlet holes 11 may be provided above the water inlet main 1, and each first water inlet hole 11 is connected to a first water inlet branch pipe; four second water inlet holes 12 are formed below the water inlet main pipe 1, and each second water inlet hole 12 is connected with a second water inlet branch pipe. Similarly, three first water outlet holes can be arranged above the water outlet main pipe 2, and each first water outlet hole is connected with a first water outlet branch pipe 21; four second water outlet holes are formed below the water outlet main pipe 2, and each second water outlet hole is connected with a second water outlet branch pipe 22.
In an alternative embodiment, a purge valve 5 is provided on the gas conduit 3 for regulating the pressure of the compressed gas in the gas conduit 3. According to the actual use requirement, the pressure value of the compressed gas is generally adjusted to 80-120 psi by the blowing valve 5.
And a matched gas pipeline 3 is configured according to the diameter of the gas inlet on the water inlet main pipe 1. Specifically, the diameter of the gas pipeline 3 can be selected from 5mm to 7mm, and is preferably 6mm.
The requirements for cooling efficiency are different for different cooling objects such as target materials, cavity doors, heaters, matchers and the like. For example, for a target, a larger amount of cooling water is required. Therefore, the first water inlet branch pipe can be selected as a 1/2 inch pipe, and the second water inlet branch pipe can be selected as a 3/8 inch pipe. A plurality of water inlet branch pipes and corresponding water outlet branch pipes are arranged, and corresponding control valves are configured at the same time, so that a plurality of water ways arranged in parallel are formed in the cooling device, each water way is not influenced by each other, and the water inlet branch pipes and the corresponding water outlet branch pipes can be used independently.
In a preferred embodiment, each water outlet pipe branch pipe is provided with a digital display flow meter, and the water flow corresponding to each water outlet pipe branch pipe can be known more accurately by using the digital display flow meter, so that the water flow signal feedback is more accurate, and the control mode is simpler and more convenient. Specifically, a first digital display flowmeter 23 is arranged on the first water outlet branch pipe 21, and the model number of the flowmeter is SMCPF2W740-N04-67; the second water outlet branch pipe 22 is provided with a second digital flowmeter 24, the model number of which is SMCPF2W704-N03-67.
Referring to fig. 1, the main water outlet pipe 2 includes a water collecting pipe 201 connected to the branch water outlet pipe, a tee pipe connected to the bottom end of the water collecting pipe 201, and a water return pipe 203 and a water discharge pipe 202 connected to the water outlet of the tee pipe, respectively.
In order to prolong the service life of the cooling device and save cost, the water inlet main pipe 1 and the water outlet main pipe 2 are preferably stainless steel pipes.
The present invention has been explained by using specific embodiments, and the explanation of the above embodiments is only used to help understand the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be changes in the specific embodiments and the application range, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. A cooling apparatus for a semiconductor sputtering station, comprising:
the target material cooling device comprises a water inlet main pipe, wherein the water inlet main pipe is provided with a plurality of first water inlet holes and second water inlet holes, the first water inlet holes are connected with first water inlet branch pipes and used for cooling a target material, and the second water inlet holes are connected with second water inlet branch pipes and used for cooling a component;
the water outlet main pipe is provided with a plurality of first water outlet holes and second water outlet holes, the first water outlet holes are connected with first water outlet branch pipes, each first water outlet branch pipe is respectively communicated with a corresponding first water inlet branch pipe, the second water outlet holes are connected with second water outlet branch pipes, and each second water outlet branch pipe is respectively communicated with a corresponding second water inlet branch pipe;
the gas pipeline, the gas pipeline with the water inlet main is linked together be equipped with the solenoid valve on the gas pipeline for control the gas pipeline to let in gas in the water inlet main to discharge the water in the cooling device is whole.
2. The cooling apparatus for a semiconductor sputtering station as recited in claim 1, wherein: and the gas pipeline is provided with a blowing valve for adjusting the pressure of the compressed gas in the gas pipeline.
3. The cooling apparatus for a semiconductor sputtering station according to claim 1, wherein: the diameter of the gas pipeline is 5 mm-7 mm.
4. The cooling apparatus for a semiconductor sputtering station as recited in claim 1, wherein: the first water inlet branch pipe is a 1/2 inch pipe.
5. The cooling apparatus for a semiconductor sputtering station according to claim 1, wherein: the second water inlet branch pipe is a 3/8 inch pipe.
6. The cooling apparatus for a semiconductor sputtering station according to claim 1, wherein: each water outlet pipe branch pipe is provided with a digital display flowmeter.
7. The cooling apparatus for a semiconductor sputtering station according to claim 1, wherein: a first digital display flowmeter is arranged on the first water outlet branch pipe, and the model number of the first digital display flowmeter is SMC PF2W740-N04-67; and a second digital display flowmeter is arranged on the second water outlet branch pipe, and the model number of the second digital display flowmeter is SMC PF2W704-N03-67.
8. The cooling apparatus for a semiconductor sputtering station as recited in claim 1, wherein: the water outlet main pipe comprises a water collecting pipe connected with the water outlet branch pipe, a three-way pipe connected with the bottom end of the water collecting pipe, and a water return pipe and a water discharge pipe which are respectively connected with the water outlet of the three-way pipe.
9. The cooling apparatus for a semiconductor sputtering station according to claim 1, wherein: the water inlet main pipe and the water outlet main pipe are stainless steel pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222059553.7U CN217788353U (en) | 2022-08-06 | 2022-08-06 | Cooling device for semiconductor sputtering table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222059553.7U CN217788353U (en) | 2022-08-06 | 2022-08-06 | Cooling device for semiconductor sputtering table |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217788353U true CN217788353U (en) | 2022-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222059553.7U Active CN217788353U (en) | 2022-08-06 | 2022-08-06 | Cooling device for semiconductor sputtering table |
Country Status (1)
| Country | Link |
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| CN (1) | CN217788353U (en) |
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2022
- 2022-08-06 CN CN202222059553.7U patent/CN217788353U/en active Active
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