CN217770472U - Bendable thermoelectric separation copper substrate - Google Patents
Bendable thermoelectric separation copper substrate Download PDFInfo
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- CN217770472U CN217770472U CN202221643247.1U CN202221643247U CN217770472U CN 217770472 U CN217770472 U CN 217770472U CN 202221643247 U CN202221643247 U CN 202221643247U CN 217770472 U CN217770472 U CN 217770472U
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- sided board
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- copper substrate
- thermosetting adhesive
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Abstract
A bendable thermoelectric separation copper substrate, comprising: the flexible copper-clad single-sided board comprises a copper substrate, BT25 thermosetting adhesive, a flexible copper-clad single-sided board and solder mask ink, wherein the BT25 thermosetting adhesive is arranged above the copper substrate, the flexible copper-clad single-sided board is arranged on the BT25 thermosetting adhesive, and the solder mask ink is arranged on the flexible copper-clad single-sided board. The bottom of the copper substrate is provided with a bending groove, the copper substrate is provided with an etching groove, and BT25 thermosetting adhesive, a flexible copper-clad single-sided board and solder mask ink are arranged in the etching groove. Compared with the prior art, the utility model, at the back of thermoelectric separation copper base plate, adopt and drag for groove technology, realize the function that thermoelectric separation copper base plate buckled, the demand of the design of buckling of adaptation automobile-used car light.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to thermal-electric separation copper base plate can buckle.
Background
The design of the car lamp has higher and higher requirements on appearance and attractive appearance of the light, and the design also brings higher requirements on heat dissipation and bending of a thermoelectric separation copper substrate for the car lamp. The conventional thermoelectric separation copper substrate belongs to a planar hard plate, can meet the requirement of high heat dissipation, but cannot be bent, and in order to solve the bending requirement of the thermoelectric separation copper substrate, a bendable thermoelectric separation copper substrate needs to be developed.
In order to solve the above problems, we have made a series of improvements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a design of the separation of heat and electricity copper base plate of can buckling to overcome the above-mentioned shortcoming and not enough that prior art exists.
A bendable thermoelectric separation copper substrate, comprising: the flexible copper-clad single-sided board comprises a copper substrate, BT25 thermosetting adhesive, a flexible copper-clad single-sided board and welding-resistant ink, wherein the BT25 thermosetting adhesive is arranged above the copper substrate, the flexible copper-clad single-sided board is arranged on the BT25 thermosetting adhesive, and the welding-resistant ink is arranged on the flexible copper-clad single-sided board;
the copper substrate is provided with a bending groove at the bottom, an etching groove is formed in the copper substrate, and BT25 thermosetting adhesive, a flexible copper-clad single-sided board and solder resist ink are arranged in the etching groove.
Furthermore, the groove width of the bending groove is 2-2.5mm, the groove depth of the bending groove is 2/3 mm-3/4 mm, and the bending angle of the bending groove is 80-170 degrees.
Further, the flexible copper-clad single-sided board is composed of a copper plate, glue and a PI film.
The utility model has the advantages that:
compared with the prior art, the utility model, at the back of thermoelectric separation copper base plate, the groove technology is dragged for in the adoption, realizes the function that thermoelectric separation copper base plate buckled, adapts to the demand of the design of buckling of automobile-used car light.
Description of the drawings:
fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the bending groove.
Fig. 3 is a schematic view of the bending state of the present invention.
Reference numerals are as follows:
a copper substrate 100, a bending groove 110, and an etch groove 120.
BT25 thermosetting adhesive 200, flexible copper-clad single-sided board 300, copper plate 310, adhesive 320, PI film 330 and solder mask ink 400.
Detailed Description
The present invention will be further described with reference to the following specific examples. It should be understood that the following examples are only for illustrating the present invention and are not intended to limit the scope of the present invention.
Example 1
Fig. 1 is a schematic structural diagram of the present invention. Fig. 2 is a schematic structural view of a bending groove. Fig. 3 is a schematic view of the bending state of the present invention.
As shown in fig. 1, a bendable copper substrate for thermoelectric separation comprises: the flexible copper-clad single-sided board comprises a copper substrate 100, BT25 thermosetting adhesive 200, a flexible copper-clad single-sided board 300 and solder mask ink 400, wherein the BT25 thermosetting adhesive 200 is arranged above the copper substrate 100, the flexible copper-clad single-sided board 300 is arranged on the BT25 thermosetting adhesive 200, and the solder mask ink 400 is arranged on the flexible copper-clad single-sided board 300.
The bottom of the copper substrate 100 is provided with a bending groove 110, the copper substrate 100 is provided with an etching groove 120, and the etching groove 120 is internally provided with BT25 thermosetting adhesive 200, a flexible copper-clad single-sided board 300 and solder mask ink 400.
As shown in fig. 2, the groove width of the bending groove 110 is 2-2.5mm, the groove depth of the bending groove 110 is 2/3 mm-3/4 mm, and the bending angle of the bending groove 110 is 80 ° -170 °.
The flexible copper-clad single panel 300 is composed of a copper plate 310, glue 320 and a PI film 330.
As shown in fig. 3, the conventional copper substrate for thermoelectric separation cannot be bent because it is a pure copper structure and has a very large thickness. Therefore, the utility model discloses at first carry out the institutional advancement to copper base plate 100, design out the bending groove 110 structure. In the present embodiment, the bending groove 110 has a groove width: 2mm, groove depth: total thickness of product 2/3mm, bending angle: 110 to 170 degrees. The design is that the thickness of the original very thick copper plate is greatly reduced at partial positions, so that the copper plate can be bent without being broken. Meanwhile, in order to match with the structure, the BT25 thermosetting adhesive 200 is used for replacing a traditional prepreg, and the effect of the BT25 thermosetting adhesive is that the prepreg can be bent after being solidified, and similarly, traditional hard ink is replaced by soft solder-resisting ink 400, and a traditional pure copper structure is replaced by a flexible copper-clad single-sided board 300. The flexible copper-clad single-sided board 300 is made of a combination of copper, glue and a PI film, wherein the copper is a high-tensile electrolytic copper foil or a rolled copper foil and is very thin. The PI film 330 bending also ensures that the material does not crack, so the flexible copper clad single faceplates 300 can be bent as compared to conventional copper plates. Finally, the thermoelectric separation copper substrate can be bent after the electronic components are assembled; or the electronic components can be assembled by bending the electronic components firstly and then avoiding the bent part by the clamp.
Example 2
In the present embodiment, the technical parameters of the bending groove 110 may also be that the groove width: 2.5mm, groove depth: total thickness of product 3/4mm, bending angle: 80-170 degrees. The rest corresponds to example 1.
The above description has been made of the embodiments of the present invention, but the present invention is not limited thereto, and various changes may be made without departing from the spirit of the present invention.
Claims (3)
1. A bendable thermoelectric separation copper substrate, comprising: the copper-clad laminate comprises a copper substrate (100), BT25 thermosetting adhesive (200), a flexible copper-clad single-sided board (300) and anti-welding ink (400), wherein the BT25 thermosetting adhesive (200) is arranged above the copper substrate (100), the flexible copper-clad single-sided board (300) is arranged on the BT25 thermosetting adhesive (200), and the anti-welding ink (400) is arranged on the flexible copper-clad single-sided board (300);
the flexible copper-clad single-sided board is characterized in that a bending groove (110) is formed in the bottom of the copper substrate (100), an etching groove (120) is formed in the copper substrate (100), and BT25 thermosetting adhesive (200), a flexible copper-clad single-sided board (300) and anti-welding ink (400) are arranged in the etching groove (120).
2. The bendable thermo-electric separation copper substrate according to claim 1, wherein: the groove width of the bending groove (110) is 2-2.5mm, the groove depth of the bending groove (110) is 2/3 mm-3/4 mm, and the bending angle of the bending groove (110) is 80-170 degrees.
3. The bendable thermoelectric separation copper substrate according to claim 1, wherein: the flexible copper-clad single-sided board (300) is composed of a copper plate (310), glue (320) and a PI film (330).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221643247.1U CN217770472U (en) | 2022-06-29 | 2022-06-29 | Bendable thermoelectric separation copper substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221643247.1U CN217770472U (en) | 2022-06-29 | 2022-06-29 | Bendable thermoelectric separation copper substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217770472U true CN217770472U (en) | 2022-11-08 |
Family
ID=83896825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221643247.1U Active CN217770472U (en) | 2022-06-29 | 2022-06-29 | Bendable thermoelectric separation copper substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217770472U (en) |
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2022
- 2022-06-29 CN CN202221643247.1U patent/CN217770472U/en active Active
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