CN217755872U

CN217755872U - Silicon wafer separating device

Info

Publication number: CN217755872U
Application number: CN202221806578.2U
Authority: CN
Inventors: 王建锁; 贾永前; 孙玉虎
Original assignee: Crystal Marine Semiconductor Materials Donghai Co ltd
Current assignee: Crystal Marine Semiconductor Materials Donghai Co ltd
Priority date: 2022-07-14
Filing date: 2022-07-14
Publication date: 2022-11-08
Anticipated expiration: 2032-07-14

Abstract

The utility model provides a silicon chip burst device, include: the carrier is provided with at least four first corner parts, wherein the four first corner parts correspond to four second corner parts of the silicon wafer one by one; the plurality of the sub-piece spray heads are the same as the first corner in number and are respectively arranged facing the first corner, and water spray holes are formed in the sub-piece spray heads and face the first corner; and the water inlet pipeline is communicated with the slicing spray head. According to the silicon wafer slicing device provided by the embodiment of the utility model, the slicing spray heads are arranged at the four corners of the carrier, so as to impact the four chamfers of the silicon wafer, thereby enabling the silicon wafer to be sliced to obtain more uniform slicing impact force and reducing the breakage rate of the silicon wafer slicing; furthermore, the utility model discloses silicon chip burst device simple structure, reliable and stable, easy to carry out.

Description

Silicon wafer separating device

Technical Field

The utility model relates to a photovoltaic silicon chip technical field, concretely relates to silicon chip burst device.

Background

Currently, in the solar energy field, silicon ingots need to be cut into silicon wafer materials with certain thicknesses, and due to the fact that the cost of the silicon materials is high, the cost is reduced by reducing the cutting thickness of the silicon wafers on the market. After cutting, the silicon wafers are stacked, the raw materials of the silicon wafers are stained with silicon wafer cutting fluid, surface tension exists between the silicon wafers, the thickness of the silicon wafers is thinner and thinner, the damage rate of the silicon wafers is gradually increased in the process of cleaning inserting pieces and separating the silicon wafers, and the qualified rate of the silicon wafers is seriously influenced.

In the prior art, the silicon wafers are separated by spraying water on one side of the stacked silicon wafers, but the separation effect of the silicon wafers is poor, and the breakage rate of the silicon wafers is high.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a silicon chip burst device is through setting up the burst shower nozzle in four bights departments of carrier to strike four bights departments of silicon chip, thereby make the silicon chip burst obtain comparatively even burst impact force, reduce the breakage rate of silicon chip burst.

In order to solve the technical problem, the utility model discloses a following technical scheme:

according to the utility model discloses silicon chip burst device, include:

the carrier is provided with at least four first corner parts, wherein the four first corner parts correspond to four second corner parts of the silicon wafers one to one;

the plurality of the sub-piece spray heads are the same as the first corner in number and are respectively arranged facing the first corner, and water spray holes are formed in the sub-piece spray heads and face the first corner; and

and the water inlet pipeline is communicated with the slicing spray head.

Further, the carrier includes:

the base plate is used for placing the stacked silicon wafers and provided with four corners, and the corners are used as the first corners;

the pair of side plates are vertically fixed on two sides of the chassis respectively;

the vertical rod is vertically fixed at the rear side of the chassis;

the four corners of the chassis are exposed from the side surfaces of the side plates and the side surfaces of the vertical rods.

Furthermore, a connecting piece is fixed at the top end of the vertical rod and the top surface of the side plate.

Further, the burst shower nozzle sets up the corner of chassis, the burst shower nozzle is the massive structure, water inlet channel has been seted up from last to bottom to the inside of burst shower nozzle, water inlet channel's top intercommunication water intake pipe, the hole for water spraying intercommunication water inlet channel.

Furthermore, a first chamfer is arranged in the vertical direction of the vertical edge of one side of the slicing spray head facing the corner of the chassis, and the water spray hole is formed in the surface where the first chamfer is located.

Further, the water jetting holes are formed as flat elliptical holes.

Further, the long axis direction of the water spray holes is parallel to the front surface of the silicon wafer.

Furthermore, the number of the water inlet pipelines is two, the water inlet pipelines are respectively arranged at the outer sides of the two side plates, and each water inlet pipeline is communicated with the two slicing sprayers at the corresponding side.

Furthermore, each water inlet pipeline comprises a main pipeline and two branch pipelines, a pressure valve is installed at one end of the main pipeline to be connected with a water pump, the other end of the main pipeline is connected with one end of each branch pipeline, and the other ends of the two branch pipelines are respectively connected with the two slicing nozzles.

Further, the installation angle of the slicing spray head is adjustably connected to the bottom end of the branch pipeline.

The above technical scheme of the utility model one of following beneficial effect has at least:

1. according to the utility model discloses a silicon chip burst device is through setting up the burst shower nozzle in four bights departments of carrier to strike four bights departments of silicon chip, thereby make the silicon chip burst obtain comparatively even burst impact force, the deformation volume of silicon chip is less, and then can burst smoothly, and the silicon chip burst breakage rate is low.

2. The utility model discloses a silicon chip burst device simple structure, reliable and stable, easy to carry out.

Drawings

Fig. 1 is a schematic structural diagram of a silicon wafer slicing apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view of the area A in FIG. 1;

fig. 3 is another schematic structural diagram of a silicon wafer slicing apparatus according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a slicing nozzle of a silicon wafer slicing device according to an embodiment of the present invention.

Reference numerals are as follows: 100. a carrier; 110. a chassis; 120. a side plate; 130. a vertical rod; 140. a connecting member;

200. slicing spray heads; 210. a first chamfer; 220. a water inlet channel; 230. a water spray hole;

300. a water inlet pipeline; 310. a main pipeline; 320. distributing pipelines; 330. a pressure valve;

400. a silicon wafer; 410. and (7) second chamfering.

Detailed Description

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention will be combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which the invention belongs. The use of "first," "second," and similar terms in the description herein do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships are changed accordingly.

The following first describes a silicon wafer separation device according to an embodiment of the present invention with reference to the drawings.

According to the utility model discloses silicon chip burst device, include: carrier 100, sliced shower head 200 and water inlet pipeline 300.

The carrier 100 carries a plurality of stacked silicon chips 400, and the carrier 100 is provided with at least four first corners, wherein the four first corners correspond to four second corners of the silicon chips 400 one by one.

The plurality of the piece-separating spray heads 200 with the same number as the first corners are respectively arranged facing the first corners, the piece-separating spray heads 200 are provided with water spray holes 230, and the water spray holes 230 face the first corners; and

and the water inlet pipeline 300 is communicated with the slicing sprayer 200.

As an example, as shown in fig. 1 and 2, the silicon wafer slicing device of the present invention is configured to place a plurality of sliced stacked silicon wafers 400 on a carrier 100, and provide slicing shower nozzles 200 at four first corners of the bottom of the carrier 100, supply water to the slicing shower nozzles 200 through a water inlet pipeline 300, and perform impact cleaning on the second corners of the silicon wafers 400 to separate the silicon wafers, and provide a second chamfer 410 at the second corners of the silicon wafers 400, so that the water spraying direction of the slicing shower nozzles 200 can be aligned to the second chamfer 410.

In addition, the water spraying direction of the slicing nozzle 200 is aligned with the second chamfers 410 and along the diagonal direction, and each second chamfer 410 is perpendicular to the corresponding diagonal direction, so that accurate force application can be realized, and the slicing cleaning efficiency of the silicon wafer 400 can be improved.

The utility model discloses a silicon chip burst device carries out water spray impact burst through four corners on the silicon chip 400 layer of setting on carrier 100 for silicon chip 400 atress is even, and the burst is efficient, and the breakage rate is low, and is practical high-efficient.

Further, the carrier 100 includes: a chassis 110, a pair of side plates 120, and a vertical post 130.

Wherein the bottom plate 110 is used for placing the stacked silicon chips 400, the bottom plate 110 is provided with four corners, and the corners are used as first corners.

A pair of side plates 120 are vertically fixed at both sides of the base plate 110, respectively;

the vertical rod 130 is vertically fixed at the rear side of the chassis 110;

wherein, four corners of the bottom plate 110 are exposed from the side surfaces of the side plates 120 and the side surfaces of the vertical bars 130.

As an example, as shown in fig. 3, the carrier 100 is composed of a bottom plate 110, a pair of side plates 120 and vertical rods 130, the pair of side plates 120 are vertically fixed on two sides of the bottom plate 110, the vertical rods 130 are fixed on the rear side of the bottom plate 110, the silicon wafer 400 can be placed on the bottom plate 110, the side plates 120 and the vertical rods 130 can limit the silicon wafer 400, so that the cut silicon wafer 400 to be sliced can be stably and reliably placed, and the four corners of the bottom plate 110 are exposed from the side surfaces of the side plates 120 and the vertical rods 130, so that when the silicon wafer 400 is placed, the second chamfer 410 of the silicon wafer 400 can be exposed, and the slicing can be conveniently cleaned by impact.

Further, a connecting member 140 is fixed to the top end of the vertical bar 130 and the top surface of the side plate 120.

As an example, as shown in fig. 3, a U-shaped connecting member 140 is fixed to the top surfaces of the vertical bar 130 and the side plate 120, so as to improve the overall stability of the carrier 100. Further, the vertical rod 130 may include a plurality of spaced apart (2 shown in fig. 3), for example, to further improve the stability of the carrier 100 as a whole.

Further, burst shower nozzle 200 sets up in the corner of chassis 110, and burst shower nozzle 200 is the block structure, and inhalant canal 220 has been seted up from last to down to the inside of burst shower nozzle 200, and inhalant canal 220's top intercommunication inlet line 300, hole for water spraying 230 intercommunication inhalant canal 220.

That is, the wafer-dividing shower head 200 is disposed at a corner of the base plate 110 to spray water to the silicon wafer 400 placed on the base plate 110 for dividing the silicon wafer.

Further, a first chamfer 210 is arranged in the vertical direction along the vertical edge of one side of the slicing nozzle 200 facing the corner of the base plate 110, and the water spray hole 230 is arranged on the surface of the first chamfer 210.

For example, as shown in fig. 4, a water inlet passage 220 is opened in the piece-slicing nozzle 200 from top to bottom, the water inlet passage 220 penetrates through the top surface of the piece-slicing nozzle 200 from top to bottom, the bottom end of the water inlet passage 220 is closed, a first chamfer 210 is arranged on the vertical edge of one side of the piece-slicing nozzle 200 close to the corner of the base plate 110 in the vertical direction, a water spray hole 230 is opened on the surface of the first chamfer 210, and the water spray hole 230 is communicated with the water inlet passage 220 so as to spray water to the outside.

Further, the water spray holes 230 are flat elliptical holes. This makes it possible to distribute the water pressure more uniformly in the longitudinal direction of the water discharge hole.

Further, the long axis direction of the water spraying holes 230 is parallel to the front surface of the silicon wafer 400.

Therefore, the shape of the water spray holes 230 with the flat elliptical holes is fitted with the impact surface of the second chamfer 410 of the stacked silicon wafers 400, so that the slicing efficiency is greatly improved, and the silicon wafers are not easy to damage.

Further, the number of the inlet water 300 is two, and the inlet water 300 is respectively arranged at the outer sides of the two side plates 120, and each inlet pipe 300 is communicated with the two split nozzles at the corresponding side.

Thus, the pair of water inlet pipes 300 respectively supply water to the two slice nozzles 200 on the corresponding side.

Further, each water inlet pipeline 300 comprises a main pipeline 310 and two branch pipelines 320, one end of the main pipeline 310 is provided with a pressure valve 330 to connect with a water pump, the other end of the main pipeline 310 is connected with one ends of the two branch pipelines 320, and the other ends of the two branch pipelines 320 are respectively connected with the two piece-divided spray heads 200.

That is to say, the water inlet pipes 300 of the two slicing sprinklers 200 on the corresponding side supply water through the main pipe 310, and then the main pipe 310 is connected with the water inlet channels 220 of the two slicing sprinklers 200 on the corresponding side respectively, which are connected with the two sub pipes 320 respectively, so as to form an integral water inlet route, and the water inlet end of the main pipe 310 is further connected with the pressure valve 330 to adjust the water pressure of the inlet water, and further adjust the water pressure sprayed by the slicing sprinklers 200, thereby adapting to the stress requirements of the silicon slices.

Further, the mounting angle of the slicing nozzle 200 is adjustably connected to the bottom end of the branch pipe 320.

Therefore, the mounting angle of the slicing sprayer 200 can be adjusted, and the slicing sprayer can meet the slicing requirements of the silicon wafer 400 under different working conditions. For example, according to the position of the sub-pipe 320, the angle of the slicing nozzle 200 is adjusted at the bottom end of the sub-pipe 320, so that the water spraying direction of the slicing nozzle 200 is aligned with the diagonal line of the silicon wafer, and the angle of the slicing nozzle 200 is adapted to the slicing working condition.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and embellishments can be made without departing from the principle of the present invention, and these improvements and embellishments should also be regarded as the protection scope of the present invention.

Claims

1. A silicon wafer separating device is characterized by comprising:

the carrier is provided with at least four first corner parts, wherein the four first corner parts correspond to four second corner parts of the silicon wafer one by one;

and the water inlet pipeline is communicated with the slicing spray head.

2. The wafer slicing apparatus of claim 1, wherein the carrier comprises:

the vertical rod is vertically fixed on the rear side of the chassis;

3. The silicon wafer slicing device as claimed in claim 2, wherein a connecting member is fixed to the top ends of the vertical rods and the top surfaces of the side plates.

4. The silicon wafer slicing device according to claim 2, wherein the slicing shower head is arranged at a corner of the base plate, the slicing shower head is of a block structure, a water inlet channel is formed in the slicing shower head from top to bottom, the top of the water inlet channel is communicated with the water inlet pipeline, and the water spray holes are communicated with the water inlet channel.

5. The silicon wafer slicing apparatus as claimed in claim 4, wherein a first chamfer is provided in a vertical direction along a vertical edge of a side of the slicing nozzle facing a corner of the base plate, and the water spraying hole is provided on a surface of the first chamfer.

6. The silicon wafer slicing apparatus according to claim 5, wherein the water spray holes are formed as flat elliptical holes.

7. The silicon wafer slicing apparatus according to claim 6, wherein the long axis direction of the water spraying holes is parallel to the front surface of the silicon wafer.

8. The silicon wafer slicing device according to claim 2, wherein the number of the water inlet pipes is two, the two water inlet pipes are respectively arranged at the outer sides of the two side plates, and each water inlet pipe is communicated with the two slicing nozzles at the corresponding side.

9. The silicon wafer slicing device according to claim 8, wherein each of the water inlet pipes comprises a main pipe and two branch pipes, one end of the main pipe is provided with a pressure valve for connecting with a water pump, the other end of the main pipe is connected with one end of the two branch pipes, and the other ends of the two branch pipes are respectively connected with the two slicing nozzles.

10. The silicon wafer slicing apparatus according to claim 9, wherein the slicing nozzle is adjustably connected to a bottom end of the branch pipe.