CN213184329U - Wet piece burst mechanism of solar energy silicon chip - Google Patents

Wet piece burst mechanism of solar energy silicon chip Download PDF

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Publication number
CN213184329U
CN213184329U CN202022194812.8U CN202022194812U CN213184329U CN 213184329 U CN213184329 U CN 213184329U CN 202022194812 U CN202022194812 U CN 202022194812U CN 213184329 U CN213184329 U CN 213184329U
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China
Prior art keywords
burst
baffle
shower nozzle
hole
silicon chip
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Active
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CN202022194812.8U
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Chinese (zh)
Inventor
王宝军
郗世亮
王贵军
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Tianjin Yuanqisheng Technology Development Co ltd
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Tianjin Yuanqisheng Technology Development Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A20/00Water conservation; Efficient water supply; Efficient water use
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model belongs to the technical field of solar energy silicon chip burst, especially, relate to a wet piece burst mechanism of solar energy silicon chip, hold in the palm, left burst shower nozzle, right burst shower nozzle, left burst inlet tube, right burst inlet tube, water pressure regulating valve, water pump inlet tube and water pump including the material, the material holds in the palm including base, left baffle, right baffle and backplate, base left and right sides symmetry is provided with left baffle, right baffle, the base rear side is provided with the backplate, the symmetry is opened there is the square through-hole on left side baffle and the right baffle. The utility model provides a wet piece burst mechanism of solar energy silicon chip, this wet piece burst mechanism can reduce even piece rate and breakage rate of silicon chip burst in-process, can reduce workman's working strength, can also improve silicon chip separation effect and production efficiency.

Description

Wet piece burst mechanism of solar energy silicon chip
Technical Field
The utility model belongs to the technical field of solar energy silicon chip burst, especially, relate to a wet piece burst mechanism of solar energy silicon chip.
Background
At present, in the field of solar photovoltaic or semiconductors, a rod-shaped raw material needs to be cut into a sheet-shaped raw material with a certain thickness, silicon chip cutting fluid is adhered to the sheet-shaped raw material, surface tension exists between the silicon chips, and meanwhile, the silicon chips are thin and crisp and can be damaged due to the fact that the silicon chips bear a large external force. The existing equipment realizes the separation of solar silicon wafers in water, adsorbs the solar silicon wafers and transmits the solar silicon wafers onto a conveyor belt, but the existing equipment generally has the defects that the separation effect of the solar silicon wafers in water is poor, two adjacent solar silicon wafers cannot be completely separated, so that the connected solar silicon wafers are conveyed to a next-stage conveying mechanism, and even the silicon wafers are damaged.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at solves among the prior art solar wafer and can produce the problem of lamination and piece at the burst in-process, provides a wet piece burst mechanism of solar wafer, and this wet piece burst mechanism can reduce even piece rate and breakage rate of silicon chip burst in-process, can reduce workman's working strength, can also improve silicon chip separation effect and production efficiency.
The utility model provides a technical problem adopt following technical scheme to realize: the utility model provides a wet piece burst mechanism of solar silicon chip, includes material support, left burst shower nozzle, right burst shower nozzle, left burst inlet tube, right burst inlet tube, water pressure regulating valve, water pump inlet tube and water pump, the material holds in the palm and includes base, left baffle, right baffle and backplate, base left and right sides symmetry is provided with left baffle, right baffle, the base rear side is provided with the backplate, the symmetry is opened on left side baffle and the right baffle has the square through-hole, the square through-hole outside is provided with left burst shower nozzle on the left side baffle, left side burst shower nozzle advances water piping connection water pressure regulating valve left end through left burst, the square through-hole outside is provided with right burst shower nozzle on the right baffle, right side burst shower nozzle advances water piping connection water pressure regulating valve right-hand member through right burst, water pressure regulating valve rear end advances water piping connection water pump through the water pump.
Further, clamp buckles are symmetrically arranged on the left baffle and the right baffle.
Further, the left baffle and the right baffle are symmetrically provided with clamp buckles through screws, the upper part of the outer side of the left baffle is fixedly connected with the clamp buckles through four screws, and the upper part of the outer side of the right baffle is fixedly connected with the clamp buckles through four screws.
Furthermore, the rear baffle plate is provided with a rectangular hole, and bosses are symmetrically arranged at the left end and the right end of the front side of the base.
Furthermore, any type of hole in round hole, square hole, rectangle hole is opened on left burst shower nozzle and the right burst shower nozzle.
The utility model has the advantages that:
the left slicing sprayer and the right slicing sprayer are symmetrically arranged on the left side and the right side of the stacked silicon wafer support of the wet wafer slicing mechanism, the left slicing sprayer and the right slicing sprayer symmetrically and stably spray water flow from the two sides of the stacked silicon wafers to enable the silicon wafers to be quickly separated, the water pressure sprayed by the left slicing sprayer and the right slicing sprayer can be adjusted through the water pressure adjusting valve, the water flow is sprayed to gaps between the silicon wafers from the two sides of the stacked silicon wafers with the same pressure, the silicon wafers are stably separated, the wafer-by-wafer separation is not damaged, the silicon wafer separation effect and the production efficiency are improved, the wafer connection rate and the damage rate in the silicon wafer slicing process are reduced, and the working strength of worker slicing is also reduced.
Drawings
Fig. 1 is a schematic structural diagram of the solar silicon wafer wet wafer separating mechanism of the present invention.
1. Material support 2, left separating spray head 3 and right separating spray head
4. A left burst inlet tube 5, a right burst inlet tube 6 and a water pressure regulating valve
7. Water inlet pipe 8 of water pump, water pump 9 and base
10. Left baffle 11, right baffle 12, backplate
13. Square through hole 14, clamp fastener 15, rectangular hole
16. Screw 17, boss 18 and silicon chip
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in figure 1, the utility model provides a solar silicon wafer 18 wet wafer slicing mechanism, which comprises a material support 1, a left slicing sprayer 2, a right slicing sprayer 3, a left slicing water inlet pipe 4, a right slicing water inlet pipe 5, a water pressure regulating valve 6, a water pump water inlet pipe 7 and a water pump 8, wherein the material support 1 comprises a base 9, a left baffle 10, a right baffle 11 and a rear baffle 12, the left and right sides of the base 9 are symmetrically provided with the left baffle 10 and the right baffle 11, the rear baffle 12 is arranged at the rear side of the base 9, square through holes 13 are symmetrically formed on the left baffle 10 and the right baffle 11, a left slicing sprayer 2 is arranged at the outer side of the square through hole 13 on the left baffle 10, the left slicing sprayer 2 is connected with the left end of the water pressure regulating valve 6 through the left slicing sprayer 4, the right slicing sprayer 3 is arranged at the outer side of the square through hole 13 on the right baffle 11, the right slicing sprayer, the rear end of the water pressure regulating valve 6 is connected with a water pump 8 through a water inlet pipe 7 of the water pump.
The left baffle 10 and the right baffle 11 are symmetrically provided with clamp buckles 14.
The left baffle 10 and the right baffle 11 are symmetrically provided with clamp buckles 14 through screws 16, the upper part of the outer side of the left baffle 10 is fixedly connected with the clamp buckles 14 through four screws 16, and the upper part of the outer side of the right baffle 11 is fixedly connected with the clamp buckles 14 through four screws 16.
The rear baffle plate 12 is provided with a rectangular hole 15, and bosses 17 are symmetrically arranged at the left end and the right end of the front side of the base 9.
Any type of hole of a round hole, a square hole and a rectangular hole 15 is formed in the left fragment spray head 2 and the right fragment spray head 3.
Examples
As shown in fig. 1, hold silicon chip 18 according to certain inclination (being less than 45 degrees) in holding in the palm 1 with the material, the left side and the right side of holding in the palm 1 of material are according to certain interval and angle symmetrical arrangement left burst shower nozzle 2, right burst shower nozzle 3, the one end of left side burst shower nozzle 2 and right burst shower nozzle 3 respectively with left burst inlet tube 4, right burst inlet tube 5 is connected, left burst inlet tube 4 and right burst inlet tube 5 are connected with the both ends of controlling of water pressure regulating valve 6 respectively, the rear end of water pressure regulating valve 6 is connected with the one end of water pump inlet tube 7, the other end of water pump inlet tube 7 is connected with water pump 8, this wet piece divides the piece mechanism to connect and carries out the burst operation after finishing.
During the slicing operation, at first start water pump 8, the water that water pump 8 output is carried to water pressure regulating valve 6 reposition of redundant personnel via water pump inlet tube 7, water pressure regulating valve 6 left end rivers are carried to left slicing shower nozzle 2 and are passed through the round hole of seting up on the left slicing shower nozzle 2, square hole or rectangular hole are sprayed and are gone out, water pressure regulating valve 6 right-hand member rivers are carried to right slicing shower nozzle 3 and are sprayed and go out through the round hole of seting up on the right slicing shower nozzle 3 via right slicing inlet tube 5, square hole or rectangular hole, the pressure of the rivers that erupt on left slicing shower nozzle 2 and the right slicing shower nozzle 3 can carry out the height through water pressure regulating valve 6 and adjust, make the same pressure rivers of left and right sides spout in the gap between range upon range of silicon chip 18 and silicon chip 18, thereby steadily separate silicon chip 18 and silicon chip 18.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (5)

1. The utility model provides a wet piece burst mechanism of solar energy silicon chip which characterized in that: including material support, left burst shower nozzle, right burst shower nozzle, left burst inlet tube, right burst inlet tube, water pressure regulating valve, water pump inlet tube and water pump, the material holds in the palm including base, left baffle, right baffle and backplate, base left and right sides symmetry is provided with left baffle, right baffle, the base rear side is provided with the backplate, the symmetry is opened on left side baffle and the right baffle has the square through-hole, the square through-hole outside is provided with left burst shower nozzle on the left side baffle, left side burst shower nozzle advances water piping connection water pressure regulating valve left end through left burst, the square through-hole outside is provided with right burst shower nozzle on the right baffle, right side burst shower nozzle advances water piping connection water pressure regulating valve right-hand member through right burst, water pressure regulating valve rear end advances water piping connection water pump through the water pump.
2. The wet solar silicon wafer slicing mechanism of claim 1, wherein: and clamp buckles are symmetrically arranged on the left baffle and the right baffle.
3. The wet solar silicon wafer slicing mechanism of claim 2, wherein: the clamp buckle is symmetrically arranged on the left baffle and the right baffle through screws, the upper part of the outer side of the left baffle is fixedly connected with the clamp buckle through four screws, and the upper part of the outer side of the right baffle is fixedly connected with the clamp buckle through four screws.
4. The wet solar silicon wafer slicing mechanism of claim 1, wherein: the rear baffle is provided with a rectangular hole, and bosses are symmetrically arranged at the left end and the right end of the front side of the base.
5. The wet solar silicon wafer slicing mechanism of claim 1, wherein: any type of hole in round hole, square hole, the rectangle hole is opened on left burst shower nozzle and the right burst shower nozzle.
CN202022194812.8U 2020-09-29 2020-09-29 Wet piece burst mechanism of solar energy silicon chip Active CN213184329U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022194812.8U CN213184329U (en) 2020-09-29 2020-09-29 Wet piece burst mechanism of solar energy silicon chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022194812.8U CN213184329U (en) 2020-09-29 2020-09-29 Wet piece burst mechanism of solar energy silicon chip

Publications (1)

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CN213184329U true CN213184329U (en) 2021-05-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023274078A1 (en) * 2021-07-01 2023-01-05 杭州中为光电技术有限公司 Distribution mechanism and degluing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023274078A1 (en) * 2021-07-01 2023-01-05 杭州中为光电技术有限公司 Distribution mechanism and degluing device

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