CN216639699U

CN216639699U - Electroplating solution liquid flow direction control device

Info

Publication number: CN216639699U
Application number: CN202123116175.3U
Authority: CN
Inventors: 谷德鑫
Original assignee: Shenyang Chaoyi Microelectronic Equipment Co ltd
Current assignee: Shenyang Chaoyi Microelectronic Equipment Co ltd
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-05-31
Anticipated expiration: 2031-12-13

Abstract

The utility model discloses a device for controlling the flow direction of electroplating solution liquid flow, and relates to the technical field of single-chip wet electroplating treatment. The control device main part 1 is circular, and main part 1 is inside to set up hollow vertical liquid stream part, main part 1 lateral wall one side sets up a plurality of horizontal liquid stream parts, and the opposite side evenly sets up a plurality of liquid stream export 9. The arrangement of the vertical liquid flow part controls the electroplating solution to be uniformly distributed on the surface of the wafer from the vertical liquid outlets, and the electroplating solution is more uniformly distributed on the surface of the wafer due to the same pressure applied to each vertical liquid outlet; the horizontal liquid flow part is arranged to control the electroplating solution to flow from the horizontal liquid outlet to the liquid flow outlet along the horizontal direction; the arrangement of the vertical liquid flow part and the horizontal liquid flow part can change the liquid flow direction at the wafer through the flow control of the two liquid inlets.

Description

Electroplating solution liquid flow direction control device

Technical Field

The utility model relates to the technical field of single-piece wet electroplating treatment, in particular to a device for controlling the flow direction of electroplating solution flow.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the starting material is silicon, and high-purity polycrystalline silicon is dissolved, doped into a silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

In the process of manufacturing semiconductor chips, electroplating is a common method for forming a film on a wafer. In particular, in the advanced packaging technology, features such as copper pillars and solder joints are usually formed on a wafer by electroplating, which has the advantages of simple process, low cost, etc.

In the existing electroplating process, the problems of uneven distribution of the electroplating solution and the like are easy to occur in the step of electroplating, and the control of the flow direction of the electroplating solution is not good.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, namely the problems of the background art, the utility model provides a plating solution flow direction control device, which comprises the following specific technical scheme:

a control device for the liquid flow direction of electroplating liquid is characterized in that a main body 1 of the control device is circular, a hollow vertical liquid flow part is arranged in the main body 1, a plurality of horizontal liquid flow parts are arranged on one side of the side wall of the main body 1, and a plurality of liquid flow outlets 9 are uniformly arranged on the other side of the side wall of the main body 1.

Perpendicular liquid flow part includes perpendicular inlet 2, hollow perpendicular feed liquor cavity 3 and goes out liquid baffle 4 perpendicularly, perpendicular inlet 2 sets up in the controlling means bottom, communicates perpendicular feed liquor cavity 3 and outside, 3 top control device middle parts of perpendicular feed liquor cavity set up perpendicular liquid baffle 4, it covers perpendicular feed liquor cavity 3 completely to go out liquid baffle 4 perpendicularly, go out the perpendicular liquid outlet 5 of a plurality of evenly distributed on the liquid baffle 4 perpendicularly.

The vertical liquid inlet 2 is connected to an electroplating liquid storage device outwards through a pipeline.

Horizontal liquid flow part includes horizontal inlet 6, horizontal feed liquor cavity 7 and horizontal liquid outlet 8, horizontal inlet 6 sets up controlling means bottom surface edge, horizontal feed liquor cavity 7 sets up inside the controlling means lateral wall, 7 tops of horizontal feed liquor cavity set up horizontally horizontal liquid outlet 8.

The edge of a semicircle at one side of the control device is tightly provided with a plurality of horizontal liquid flow parts, the semicircle at the other side is provided with a plurality of liquid flow outlets 9, and each liquid flow outlet 9 and the horizontal liquid flow part are symmetrically arranged.

The horizontal liquid inlet 6 is connected to an electroplating liquid storage device through a pipeline outwards.

The beneficial technical effects of the utility model are as follows: the arrangement of the vertical liquid flow part controls the electroplating solution to be uniformly distributed on the surface of the wafer from the vertical liquid outlets, and the electroplating solution is more uniformly distributed on the surface of the wafer due to the same pressure applied to each vertical liquid outlet; the horizontal liquid flow part is arranged to control the electroplating solution to flow from the horizontal liquid outlet to the liquid flow outlet along the horizontal direction; the arrangement of the vertical liquid flow part and the horizontal liquid flow part can change the liquid flow direction at the wafer through the flow control of the two liquid inlets.

Drawings

FIG. 1 is a front view of one embodiment of the present invention;

FIG. 2 is a schematic perspective view of an embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 4 is a cross-sectional view taken along the plane B-B in fig. 1.

Reference numeral 1, a main body; 2. a vertical liquid inlet; 3. a vertical liquid inlet cavity; 4. a vertical liquid outlet clapboard; 5. a vertical liquid outlet; 6. a horizontal liquid inlet; 7. a horizontal liquid inlet cavity; 8. a horizontal liquid outlet; and 9, a liquid flow outlet.

Detailed Description

Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.

As shown in FIGS. 1 to 4, a plating solution flow direction control device, wherein a main body 1 of the control device is circular, a hollow vertical liquid flow part is arranged in the main body 1, a plurality of horizontal liquid flow parts are arranged on one side of the side wall of the main body, and a plurality of liquid flow outlets 9 are uniformly arranged on the other side of the side wall of the main body.

When the electroplating liquid is used, one path of electroplating liquid enters the vertical liquid flow cavity from the vertical liquid inlet through the pipeline and is fully distributed in the whole cavity to reach the consistent pressure everywhere, and the electroplating liquid flows out upwards from the vertical liquid outlet on the vertical liquid outlet partition plate under the driving of the pressure to reach the surface of the wafer; meanwhile, the other path of electroplating solution enters the horizontal liquid inlet cavity from the horizontal liquid inlet through the pipeline, flows out of the horizontal liquid outlet, flows along the surface of the wafer and flows out of the control device from the liquid outlet. At the moment, the direction of the fluid on the surface of the wafer is determined by the superposition of the horizontal flow direction and the vertical flow direction, each component can be controlled by the flow of the liquid inlet, and the flow direction of the wafer can be changed by adjusting the equal flow of the two liquid inlets.

While the utility model has been described with reference to a preferred embodiment, various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model, and particularly, features shown in the various embodiments may be combined in any suitable manner without departing from the scope of the utility model. It is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

In the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings, which are for convenience of description only, and do not indicate or imply that the devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The terms "comprises," "comprising," or any other similar term are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus.

So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the utility model, and the technical scheme after the changes or substitutions can fall into the protection scope of the utility model.

Claims

1. A plating solution flow direction control device, characterized in that: the control device is characterized in that the main body (1) of the control device is circular, a hollow vertical liquid flow part is arranged in the main body (1), a plurality of horizontal liquid flow parts are arranged on one side of the side wall of the main body, and a plurality of liquid flow outlets (9) are uniformly arranged on the other side of the side wall of the main body.

2. The plating liquid flow direction control device as claimed in claim 1, wherein: perpendicular liquid flow part includes perpendicular inlet (2), hollow perpendicular feed liquor cavity (3) and goes out liquid baffle (4) perpendicularly, perpendicular inlet (2) set up in the controlling means bottom, communicates perpendicular feed liquor cavity (3) and outside, perpendicular feed liquor cavity (3) top controlling means middle part sets up perpendicular liquid baffle (4), go out liquid baffle (4) perpendicularly and cover perpendicular feed liquor cavity (3) completely, go out the perpendicular liquid baffle (4) and go up evenly distributed a plurality of perpendicular liquid outlet (5) perpendicularly.

3. The plating liquid flow direction control device as claimed in claim 2, wherein: the vertical liquid inlet (2) is connected to an electroplating liquid storage device outwards through a pipeline.

4. The plating liquid flow direction control device as claimed in claim 1, wherein: horizontal liquid flow part includes horizontal inlet (6), horizontal feed liquor cavity (7) and horizontal liquid outlet (8), horizontal inlet (6) set up controlling means bottom surface edge, horizontal feed liquor cavity (7) set up inside the controlling means lateral wall, horizontal feed liquor cavity (7) top sets up horizontally horizontal liquid outlet (8).

5. The plating liquid flow direction control device as claimed in claim 4, wherein: the edge of a semicircle at one side of the control device is tightly provided with a plurality of horizontal liquid flow parts, the semicircle at the other side is provided with a plurality of liquid flow outlets (9), and each liquid flow outlet (9) and the horizontal liquid flow part are symmetrically arranged.

6. The plating liquid flow direction control device as claimed in claim 4, wherein: the horizontal liquid inlet (6) is connected to an electroplating liquid storage device outwards through a pipeline.