CN219190806U - Crystal bar cutting cooling device - Google Patents
Crystal bar cutting cooling device Download PDFInfo
- Publication number
- CN219190806U CN219190806U CN202223460640.XU CN202223460640U CN219190806U CN 219190806 U CN219190806 U CN 219190806U CN 202223460640 U CN202223460640 U CN 202223460640U CN 219190806 U CN219190806 U CN 219190806U
- Authority
- CN
- China
- Prior art keywords
- pipe
- slurry pipe
- slurry
- main
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model relates to the technical field of slicing machines, in particular to a crystal bar cutting and cooling device. The crystal bar cutting and cooling device comprises two groups of main slurry pipe mechanisms which are oppositely arranged, wherein the main slurry pipe mechanisms can be arranged on a support to spray diamond wires of a cutting roller on the support, and the two groups of auxiliary slurry pipe mechanisms which are oppositely arranged can be arranged on a moving mechanism to spray silicon bars on the moving mechanism. Due to the arrangement of the main pulp pipe mechanism and the auxiliary pulp pipe mechanism, the main pulp pipe mechanism can spray the diamond wire of the cutting roller on the support to take away part of heat. The auxiliary slurry pipe mechanism can spray the silicon rod on the moving mechanism, and the auxiliary slurry pipe can spray the whole cutting area as the auxiliary slurry pipe moves up and down along with the silicon rod on the moving mechanism. When the diamond wire cuts the silicon rod, the cutting liquid sprayed by the auxiliary slurry pipe mechanism further reduces the temperature of the silicon rod and the diamond wire, so that the situation that the cutting operation cannot be performed due to breakage of the superfine diamond wire caused by overheating is prevented.
Description
Technical Field
The utility model relates to the technical field of slicing machines, in particular to a crystal bar cutting and cooling device.
Background
With the development of photovoltaic technology, solar energy is widely popularized as a green, environment-friendly and renewable energy source. Monocrystalline silicon is the core material of solar photovoltaic mechanisms, and therefore, the market is increasingly demanding monocrystalline silicon or silicon wafers.
In the prior art, in order to prepare silicon wafers with larger sizes and thinner thicknesses and reduce silicon loss in the process of cutting the silicon wafers, cutting lines for cutting the silicon wafers are thinner and thinner. The original cooling device can only spray and cool the diamond wire, the sprayed cutting fluid can only take away a small amount of heat on the diamond wire, the device cannot adapt to the superfine diamond wire, the temperature is higher during cutting, the superfine diamond wire generates a fracture phenomenon, and the ultrathin silicon wafer is damaged, so that the yield of the silicon wafer is reduced.
Disclosure of Invention
First, the technical problem to be solved
In view of the above-mentioned drawbacks and shortcomings of the prior art, the present utility model provides a cooling device for cutting a crystal bar, which solves the technical problems of high breakage rate of an ultrafine diamond wire and reduced yield of a silicon wafer.
(II) technical scheme
In order to achieve the above purpose, the main technical scheme adopted by the utility model comprises the following steps:
the embodiment of the utility model provides a crystal bar cutting and cooling device, which comprises two groups of main slurry pipe mechanisms which are oppositely arranged, wherein the main slurry pipe mechanisms can be arranged on a support to spray diamond wires of a cutting roller on the support; two sets of vice thick liquid pipe mechanisms of relative setting, vice thick liquid pipe mechanism can set up on moving mechanism in order to spray the silicon rod on the moving mechanism.
Preferably, the main pulp pipe mechanism comprises a first mounting frame and a main pulp spraying assembly arranged on the first mounting frame; the main slurry spraying assembly comprises a first slurry pipe and a first spraying channel unit; the first spraying channel unit is communicated with the first slurry pipe, and a liquid outlet is arranged on the first spraying channel unit so as to be aligned with the diamond wire.
Preferably, the first shower pass unit includes a first connection plate and a second connection plate; the first connecting plate, the second connecting plate and the first mounting frame enclose to form a spraying channel, a liquid inlet of the spraying channel is communicated with the first slurry pipe, and a liquid outlet of the spraying channel is aligned with the diamond wire.
Preferably, a plurality of through holes are formed in the first slurry pipe, the through holes are distributed at equal intervals along the axis direction of the first slurry pipe, and the through holes are communicated with the first spraying channel unit.
Preferably, the main pulp spray assembly further comprises a splitter plate, and the splitter plate is arranged in the first pulp pipe along the axial direction of the first pulp pipe; the splitter plate is provided with a plurality of splitter holes along the axial direction.
Preferably, the main slurry spray assembly further comprises a shielding plate; the second connecting plate comprises an inclined part and a vertical part which are connected; the shielding plate is connected with the vertical part of the second connecting plate and slides along the vertical direction of the vertical part to adjust the liquid outlet size of the liquid outlet of the spraying channel.
Preferably, the main pulp pipe mechanism further comprises a lifting spray assembly arranged on the first mounting frame, and the lifting spray assembly is positioned above the main pulp spray assembly; the lifting spray assembly comprises a second slurry pipe and a plurality of nozzles; the plurality of nozzles are distributed at equal intervals along the axial direction of the second slurry pipe, and the nozzles are communicated with the second slurry pipe.
Preferably, the lifting spray assembly further comprises a booster pump; the pressurizing pump is communicated with the second slurry pipe to pressurize the liquid in the second slurry pipe.
Preferably, the main pulp pipe mechanism further comprises a first water inlet pipe and a second water inlet pipe; the first water inlet pipe is communicated with the first slurry pipe, and the second water inlet pipe is communicated with the second slurry pipe.
Preferably, the auxiliary slurry pipe mechanism comprises a third slurry pipe, a second spraying channel unit and a second mounting frame connected with the moving mechanism; the third thick liquid pipe set up in on the second mounting bracket, the second sprays passageway unit and third thick liquid pipe intercommunication, and is equipped with the spraying groove on the second and sprays passageway unit in order to aim at the silicon rod.
(III) beneficial effects
The beneficial effects of the utility model are as follows:
according to the crystal bar cutting and cooling device, as the main slurry pipe mechanism and the auxiliary slurry pipe mechanism are arranged, the main slurry pipe mechanism is arranged on the support and can spray diamond wires of the cutting roller on the support to take away part of heat. The auxiliary slurry pipe mechanism is arranged on the moving mechanism and can spray the silicon rod on the moving mechanism, and the auxiliary slurry pipe can spray the whole cutting area as the auxiliary slurry pipe moves up and down along with the silicon rod on the moving mechanism. When the diamond wire cuts the silicon rod, the cutting liquid sprayed by the auxiliary slurry pipe mechanism further reduces the temperature of the silicon rod and the diamond wire, so that the situation that the cutting operation cannot be performed due to breakage of the superfine diamond wire caused by overheating is prevented.
Drawings
FIG. 1 is a schematic view of a crystal bar cutting cooling device in the position of a square cutting machine;
FIG. 2 is a schematic structural view of a main slurry pipe mechanism;
FIG. 3 is a schematic view of a primary slurry spray assembly from a perspective;
fig. 4 is a schematic structural view of another view of the main slurry spray assembly.
[ reference numerals description ]
1: a main slurry pipe mechanism; 11: a first mounting frame; 12: a first slurry pipe; 13: a first spray channel unit; 131: a first connection plate; 132: a second connecting plate; 1321: an inclined portion; 1322: a vertical portion; 14: a shielding plate; 15: a second slurry pipe; 16: a nozzle; 17: a first water inlet pipe; 18: a second water inlet pipe; 19: a diverter plate;
2: an auxiliary slurry pipe mechanism;
a: a support;
b: a moving mechanism;
c: a silicon rod;
d: and (5) a diamond wire.
Detailed Description
In order that the above-described aspects may be better understood, exemplary embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
As shown in fig. 1, the embodiment provides a crystal bar cutting and cooling device installed on a slicing machine, wherein the slicing machine comprises a support a and a moving mechanism b, a cutting roller is arranged on the support a, a plurality of diamond wires d are distributed on the cutting roller at equal intervals, a silicon bar c is arranged on the moving mechanism b, and the moving mechanism b drives the silicon bar c to move up and down to perform relative movement with the diamond wires d, so that the rotating diamond wires d cut the silicon bar c.
The crystal bar cutting and cooling device comprises two groups of main slurry pipe mechanisms 1 and two groups of auxiliary slurry pipe mechanisms 2 which are oppositely arranged. The main pulp pipe mechanism 1 can be arranged on the support a, the main pulp pipe mechanism 1 can spray the diamond wire d on the cutting roller to cool, the auxiliary pulp pipe mechanism 2 can be arranged on the moving mechanism b to spray the silicon rod c on the moving mechanism b, and the moving mechanism b can drive the auxiliary pulp pipe mechanism 2 and the silicon rod c to move up and down at the same time.
According to the crystal bar cutting cooling device provided by the embodiment, due to the fact that the main slurry pipe mechanism 1 and the auxiliary slurry pipe mechanism 2 are arranged, the main slurry pipe mechanism 1 can spray the diamond wire d of the cutting roller on the support a to take away part of heat. The auxiliary slurry pipe mechanism 2 can spray the silicon rod c on the moving mechanism b, and the auxiliary slurry pipe can spray the whole cutting area as the auxiliary slurry pipe moves up and down along with the silicon rod c on the moving mechanism b. When the diamond wire d cuts the silicon rod c, the cutting liquid sprayed by the auxiliary slurry pipe mechanism 2 further reduces the temperature of the silicon rod c and the diamond wire d, so that the situation that the cutting operation cannot be performed due to breakage of the superfine diamond wire d caused by overheating is prevented.
As shown in fig. 2, the main pulp pipe mechanism 1 includes a first mounting frame 11, a main pulp spray assembly, a lifting spray assembly, a first water inlet pipe 17 and a second water inlet pipe 18, the main pulp spray assembly and the lifting spray assembly are both disposed on the first mounting frame 11, and the lifting spray assembly is disposed above the main pulp spray assembly. The main pulp spraying assembly comprises a first pulp pipe 12 and a first spraying channel unit 13, wherein a first water inlet pipe 17 is communicated with the first pulp pipe 12 to provide cutting fluid for the main pulp spraying assembly, the first spraying channel unit 13 is communicated with the first pulp pipe 12, and a liquid outlet is formed in the first spraying channel unit 13 to be aligned with a diamond line d for spraying.
As shown in fig. 3, the first spraying channel unit 13 includes a first connecting plate 131 and a second connecting plate 132, the first connecting plate 131, the second connecting plate 132 and the first mounting frame 11 enclose to form a spraying channel, a liquid inlet of the spraying channel is communicated with the first slurry pipe 12, and a liquid outlet of the spraying channel is aligned with the diamond line d. In order to make the liquid outlet evenly go out, a plurality of through-holes have been seted up on the first thick liquid pipe 12, and a plurality of through-holes are arranged equidistant along the axis direction of first thick liquid pipe 12, and the through-hole communicates with first spraying passageway unit 13.
As shown in fig. 3 to 4, in order to make the cutting fluid in the first slurry pipe 12 uniformly enter the plurality of through holes, the main slurry spray assembly further includes a flow dividing plate 19, the flow dividing plate 19 is disposed inside the first slurry pipe 12 along the axial direction of the first slurry pipe 12, and the flow dividing plate 19 is provided with a plurality of flow dividing holes along the axial direction thereof.
As shown in fig. 4, in order to adjust the liquid outlet amount of the liquid outlet of the spraying channel, the main slurry spraying assembly further includes a shielding plate 14, and for matching with the shielding plate 14, the second connecting plate 132 includes a tilting portion 1321 and a vertical portion 1322 connected, and the shielding plate 14 is connected with the vertical portion 1322 of the second connecting plate 132 and slides along the vertical direction of the vertical portion 1322 to adjust the liquid outlet amount of the liquid outlet of the spraying channel.
The material lifting spray assembly comprises a second slurry pipe 15, a plurality of nozzles 16 and a pressure pump, wherein the second water inlet pipe 18 is communicated with the second slurry pipe 15 to supply pure water to the material lifting spray assembly, and the pressure pump is communicated with the second slurry pipe 15 to pressurize the pure water in the second slurry pipe 15 to form water mist. The plurality of nozzles 16 are arranged at equal intervals in the axial direction of the second slurry pipe 15, and the nozzles 16 communicate with the second slurry pipe 15 to align the silicon rods c.
When the diamond wire d cuts the silicon rod c to form a plurality of silicon wafers, pressurized water mist sprayed by the lifting spray assembly is aligned to the silicon wafers, so that on one hand, most of heat generated after the silicon rod c is cut can be taken away, the cooling effect is achieved, the temperature of the silicon wafers is reduced, and on the other hand, the adsorption force generated between two cut adjacent ultrathin silicon wafers can be flushed away by using higher water pressure, the lifting of the silicon wafers is facilitated, and damage to the ultrathin silicon wafers due to adhesion of the silicon wafers is avoided.
In this embodiment, the auxiliary slurry pipe mechanism 2 includes a third slurry pipe, a second spray channel unit and a second mounting frame, the second mounting frame is connected with the moving mechanism b, the third slurry pipe is arranged on the first mounting frame 11, the second spray channel unit is communicated with the third slurry pipe, and a spray groove is arranged on the second spray channel unit to align with the silicon rod c. It should be noted that the structure of the second spray path unit is the same as that of the first spray path unit 13, and will not be described here again.
In the description of the present utility model, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; may be a communication between two elements or an interaction between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature, which may be in direct contact with the first and second features, or in indirect contact with the first and second features via an intervening medium. Moreover, a first feature "above," "over" and "on" a second feature may be a first feature directly above or obliquely above the second feature, or simply indicate that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is level lower than the second feature.
In the description of the present specification, the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., refer to particular features, structures, materials, or characteristics described in connection with the embodiment or example as being included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that alterations, modifications, substitutions and variations may be made in the above embodiments by those skilled in the art within the scope of the utility model.
Claims (10)
1. The utility model provides a crystal bar cutting cooling device which characterized in that includes:
two sets of main pulp pipe mechanisms which are oppositely arranged, wherein the main pulp pipe mechanisms can be arranged on a support to spray diamond wires of a cutting roller on the support;
and the two groups of auxiliary slurry pipe mechanisms are oppositely arranged, and the auxiliary slurry pipe mechanisms can be arranged on the moving mechanism to spray the silicon rods on the moving mechanism.
2. The ingot cutting cooling unit of claim 1,
the main slurry pipe mechanism comprises a first mounting frame and a main slurry spraying assembly arranged on the first mounting frame;
the main slurry spraying assembly comprises a first slurry pipe and a first spraying channel unit;
the first spraying channel unit is communicated with the first slurry pipe, and a liquid outlet is formed in the first spraying channel unit so as to be aligned with the diamond wire.
3. The ingot cutting cooling unit of claim 2,
the first spraying channel unit comprises a first connecting plate and a second connecting plate;
the first connecting plate, the second connecting plate and the first mounting frame enclose to form a spraying channel, a liquid inlet of the spraying channel is communicated with the first slurry pipe, and a liquid outlet of the spraying channel is aligned with the diamond wire.
4. The ingot cutting cooling unit of claim 2,
the first slurry pipe is provided with a plurality of through holes, the through holes are distributed at equal intervals along the axis direction of the first slurry pipe, and the through holes are communicated with the first spraying channel unit.
5. The ingot cutting cooling unit of claim 2,
the main pulp spray assembly further comprises a flow dividing plate, and the flow dividing plate is arranged in the first pulp pipe along the axial direction of the first pulp pipe;
the splitter plate is provided with a plurality of splitter holes along the axial direction of the splitter plate.
6. The ingot cutting cooling unit of claim 3 wherein,
the main slurry spraying assembly further comprises a shielding plate;
the second connecting plate comprises an inclined part and a vertical part which are connected;
the shielding plate is connected with the vertical part of the second connecting plate and slides along the vertical direction of the vertical part so as to adjust the liquid outlet size of the liquid outlet of the spraying channel.
7. The ingot cutting cooling unit of claim 2,
the main pulp pipe mechanism further comprises a lifting spray assembly arranged on the first mounting frame, and the lifting spray assembly is positioned above the main pulp spray assembly;
the lifting spray assembly comprises a second slurry pipe and a plurality of nozzles;
the nozzles are distributed at equal intervals along the axial direction of the second slurry pipe, and the nozzles are communicated with the second slurry pipe.
8. The ingot cutting cooling unit of claim 7,
the lifting spray assembly further comprises a pressurizing pump;
the booster pump is in communication with the second slurry pipe to pressurize the liquid in the second slurry pipe.
9. The ingot cutting cooling unit of claim 7,
the main pulp pipe mechanism further comprises a first water inlet pipe and a second water inlet pipe;
the first water inlet pipe is communicated with the first slurry pipe, and the second water inlet pipe is communicated with the second slurry pipe.
10. The ingot cutting cooling unit of claim 1,
the auxiliary slurry pipe mechanism comprises a third slurry pipe, a second spraying channel unit and a second mounting frame connected with the moving mechanism;
the third slurry pipe is arranged on the second mounting frame, the second spraying channel unit is communicated with the third slurry pipe, and the second spraying channel unit is provided with a spraying groove to align with the silicon rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223460640.XU CN219190806U (en) | 2022-12-23 | 2022-12-23 | Crystal bar cutting cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223460640.XU CN219190806U (en) | 2022-12-23 | 2022-12-23 | Crystal bar cutting cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219190806U true CN219190806U (en) | 2023-06-16 |
Family
ID=86706159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223460640.XU Active CN219190806U (en) | 2022-12-23 | 2022-12-23 | Crystal bar cutting cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219190806U (en) |
-
2022
- 2022-12-23 CN CN202223460640.XU patent/CN219190806U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105151385A (en) | Chain transmission type automatic film sticking machine and film sticking process thereof | |
| CN219190806U (en) | Crystal bar cutting cooling device | |
| CN218286232U (en) | Swing spraying mechanism, cutting fluid system and wire cutting machine | |
| CN219256074U (en) | Cutting machine head assembly and cutting device | |
| CN216098077U (en) | Auxiliary device for curling of air pipe opening | |
| CN102085641B (en) | Anti-wire jumper sand-blasting device for multi-wire cutter | |
| CN210389718U (en) | Solar silicon wafer slicing machine for cutting silicon wafers in spraying mode | |
| CN214491143U (en) | Silicon crystal is spray rinsing system for cutting device | |
| CN209440561U (en) | The automatic cycle spray equipment of multi-wire cutting machine for silicon wafer | |
| CN215844912U (en) | Wire drawing device for preparing high-reliability cable core | |
| CN210309034U (en) | Film blowing machine with water cooling device | |
| CN114664640A (en) | Cleaning method for reducing sticking rate of ultrathin silicon wafer | |
| CN113172782A (en) | Single-chip microcomputer wafer slicing device | |
| CN210616985U (en) | Automatic circulating spraying silicon wafer cutting machine | |
| CN220614542U (en) | Cutting device and cutting equipment | |
| CN217755872U (en) | Silicon wafer separating device | |
| CN217476314U (en) | Silicon rod single line double knives coping saw cutting machine | |
| CN217249849U (en) | Water spraying mechanism for slicing machine | |
| CN204935938U (en) | 25 monocrystalline excavation machines | |
| CN218985008U (en) | Anti-sticking knife device for cutting traditional Chinese medicine decoction pieces | |
| CN218902847U (en) | Off-line spraying and cleaning device of wire cutting machine | |
| CN216707972U (en) | Device for improving efficiency of cutting fluid in semiconductor diamond wire cutting process | |
| CN203739039U (en) | Spraying device for multi-wire squaring machine | |
| CN209793957U (en) | Novel protection film coating cutting device | |
| CN217372944U (en) | Multi-wire saw mortar nozzle flow control device and multi-wire saw |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |