CN217742130U

CN217742130U - Novel heat dissipation structure for communication electronic product

Info

Publication number: CN217742130U
Application number: CN202221733902.2U
Authority: CN
Inventors: 孟令波; 凌杰
Original assignee: Shenzhen Xingtongming Electronic Technology Co ltd
Current assignee: Shenzhen Xingtongming Electronic Technology Co ltd
Priority date: 2022-07-06
Filing date: 2022-07-06
Publication date: 2022-11-04
Anticipated expiration: 2032-07-06

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a novel heat dissipation structure for communication electronic products, wherein a containing space is arranged inside a shell, a main control board is arranged in the containing space, heat conductors are respectively arranged on two side surface shielding covers of the main control board, one side surface of each heat conductor is tightly attached to the main control board, and the other side surface of each heat conductor is tightly attached to the shell; a plurality of heat dissipation holes are formed in the shell, and the positions of the heat dissipation holes correspond to the positions of the heat conductors; the heat conductor comprises a filling body, and graphene sheets are coated on the outer side of the filling body. Compared with the prior art, the utility model discloses a novel heat radiation structure for communication electronics product adopts the cotton heat transfer structure of graphite alkene piece cladding EVA bubble, simple process, and weight reduction, cost reduction, heat dispersion obtains improving, can effectively solve the machine mainboard problem of generating heat.

Description

Novel heat dissipation structure for communication electronic product

[ technical field ] A method for producing a semiconductor device

The utility model relates to a heat dissipation technical field, in particular to a novel heat radiation structure for communication electronic product.

[ background of the invention ]

In the monitoring communication electronic product in the prior art, the main control chip has high power consumption and large current due to high-speed data flow when the camera data is read and written into the T card, the mainboard generates heat seriously, a CPU (central processing unit) is caused by high-temperature frequency reduction or even dead halt, the conventional heat conduction mode of a heat conduction film or a copper pipe has high cost and complex process, and the installation and use are influenced by the weight increase of equipment.

[ Utility model ] A method for manufacturing a semiconductor device

In order to overcome the above problems, the utility model provides a can effectively solve the above-mentioned problem a novel heat radiation structure for communication electronic product.

The utility model provides a technical scheme who above-mentioned technical problem provided is: the novel heat dissipation structure for the communication electronic product comprises a shell, wherein an accommodating space is formed in the shell, a main control board is arranged in the accommodating space, heat conductors are respectively arranged on shielding covers on two side surfaces of the main control board, one side surface of each heat conductor is tightly attached to the main control board, and the other side surface of each heat conductor is tightly attached to the shell; the shell is provided with a plurality of heat dissipation holes, and the positions of the heat dissipation holes correspond to the positions of the heat conductors; the heat conductor comprises a filling body, and the outer side of the filling body is coated with graphene sheets.

Preferably, the graphene sheets have a thickness of 0.07mm.

Preferably, the filling body is made of EVA foam and is in a cuboid shape, and graphene sheets are arranged on at least four surfaces of the cuboid-shaped filling body.

Preferably, a single-sided back heat-conducting double-sided adhesive tape is arranged on one side, close to the main control board, of the heat conductor, and the single-sided back heat-conducting double-sided adhesive tape is adhered to the shielding cover on the outer side of the main control board.

Preferably, the plurality of heat dissipation holes are distributed on the shell in a matrix manner, and the heat conductor is covered at the position of the heat dissipation holes.

Preferably, the shell is provided with a smoke sensor vent, a smoke sensor is arranged on the inner side of the smoke sensor vent, and the smoke sensor is connected to the main control board.

Preferably, the main control board is connected with a camera, a power supply USB interface and a T-FLASH slot, and the camera, the power supply USB interface and the T-FLASH slot are exposed out of the shell.

Preferably, a first WIFI antenna and a second WIFI antenna are attached to the inner side of the shell and connected to the main control board.

Preferably, an aluminum alloy bracket is fixed on the top of the shell.

Preferably, the housing is made of plastic.

Compared with the prior art, the utility model discloses a novel heat radiation structure for communication electronics product adopts the cotton heat transfer structure of graphite alkene piece cladding EVA bubble, compares with the heat conduction silica gel of same volume, simple process, weight reduction, cost reduction, heat dispersion obtains improving, can effectively solve the machine mainboard problem of generating heat.

[ description of the drawings ]

Fig. 1 is an overall view of the novel heat dissipation structure for communication electronic products of the present invention;

fig. 2 is an internal structural view of the novel heat dissipation structure for communication electronic products of the present invention;

fig. 3 is a plan view of a heat conductor of the novel heat dissipation structure for communication electronic products of the present invention;

fig. 4 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A of fig. 3.

[ detailed description ] A

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

It should be noted that in embodiments of the present invention, all directional indications (such as up, down, left, right, front, back \8230;) are limited to relative positions on a given view, not absolute positions.

Furthermore, descriptions in the present application as to "first," "second," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

Referring to fig. 1 to 4, the novel heat dissipation structure for communication electronic products of the present invention includes a housing 10, an accommodating space is provided inside the housing 10, a main control board 50 is provided in the accommodating space, heat conductors 30 are respectively provided on two side surface shields of the main control board 50, the main control board 50 is tightly attached to one side surface of the heat conductor 30, and the housing 10 is tightly attached to the other side surface of the heat conductor 30.

The housing 10 is provided with a plurality of heat dissipation holes 11, the positions of the heat dissipation holes 11 correspond to the positions of the heat conductor 30, and the heat conductor 30 transfers heat generated by the main control board 50 to one side of the heat dissipation holes 11, and the heat is dissipated by the heat dissipation holes 11.

The thermal conductor 30 includes a filler 32, the graphene sheet 31 is coated on the outer side of the filler 32, and the graphene sheet 31 can quickly transfer heat generated by the main control board 50 to one side of the heat dissipation hole 11, and the heat is dissipated by discharging the heat dissipation hole 11. The graphene sheet 31 has a thickness of 0.07mm.

The filling body 32 is made of EVA foam and is in a cuboid shape, at least four faces of the cuboid-shaped filling body 32 are provided with graphene sheets 31, namely one face close to the main control board 50, one face close to the heat dissipation holes 11, and an upper face and a lower face which are connected with the two faces. The adjacent graphene sheets 31 need to be in contact with each other or integrally formed to function as a heat conduction.

A single-sided back heat-conducting double-sided adhesive tape 60 is arranged on one side of the heat conductor 30 close to the main control board 50, and the single-sided back heat-conducting double-sided adhesive tape 60 is adhered to a shielding cover on the outer side of the main control board 50 and used for fixing the position of the heat conductor 30.

The heat conductor 30 is disposed in an area of the main control board 50 with a large amount of heat, so as to facilitate heat dissipation at key positions and improve heat dissipation effect.

A plurality of louvres 11 are the matrix and distribute on shell 10, and the position of louvre 11 covers heat conductor 30, does benefit to as far as possible heat extraction, improves the radiating effect.

The shell 10 is further provided with a smoke sensor air hole 12, a smoke sensor is arranged on the inner side of the smoke sensor air hole 12, and the smoke sensor is connected to the main control board 50.

The main control board 50 is further connected with a camera 51, a power supply USB interface 52 and a T-FLASH slot 53, and the camera 51 is a 500w pixel camera for monitoring. The camera 51, the power supply USB interface 52 and the T-FLASH slot 53 are exposed out of the shell 10.

A first WIFI antenna 54 and a second WIFI antenna 55 are attached to the inner side of the housing 10, and the first WIFI antenna 54 and the second WIFI antenna 55 are connected to the main control board 50 and used for wireless connection.

An aluminum alloy bracket 20 is fixed on the top of the housing 10 for installation. The housing 10 is made of plastic.

Compared with the prior art, the utility model discloses a novel heat radiation structure for communication electronic product adopts the cotton heat transfer structure of graphite alkene piece 31 cladding EVA bubble, compares with the heat conduction silica gel of same volume, and simple process, weight reduction is about 80g, and cost reduction 60%, mainboard same position temperature will reduce 14 ~ 16 ℃, can effectively solve the machine mainboard problem of generating heat.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and any modifications, equivalent replacements, and improvements made within the spirit of the present invention should be included in the scope of the present invention.

Claims

1. The novel heat dissipation structure for the communication electronic product is characterized by comprising a shell, wherein an accommodating space is arranged in the shell, a main control board is arranged in the accommodating space, heat conductors are respectively arranged on shielding covers on two side surfaces of the main control board, one side surface of each heat conductor is tightly attached to the main control board, and the other side surface of each heat conductor is tightly attached to the shell;

the shell is provided with a plurality of heat dissipation holes, and the positions of the heat dissipation holes correspond to the positions of the heat conductors;

the heat conductor comprises a filling body, and the outer side of the filling body is coated with graphene sheets.

2. The novel heat dissipation structure for communication electronic products as claimed in claim 1, wherein the graphene sheet has a thickness of 0.07mm.

3. The novel heat dissipation structure for communication electronic products as claimed in claim 1, wherein the filling body is made of EVA foam, and is rectangular, and at least four surfaces of the rectangular filling body are provided with graphene sheets.

4. The new heat dissipation structure for communication electronic products as claimed in claim 1, wherein a single-sided back-to-back thermal-conductive double-sided tape is disposed on a side of the heat conductor close to the main control board, and the single-sided back-to-back thermal-conductive double-sided tape is attached to the shielding cover outside the main control board.

5. The novel heat dissipation structure of claim 1, wherein the heat dissipation holes are distributed in a matrix on the housing, and the positions of the heat dissipation holes cover the heat conductor.

6. The novel heat dissipation structure for communication electronic products as claimed in claim 1, wherein the housing is formed with a smoke sensor vent, and a smoke sensor is disposed inside the smoke sensor vent and connected to the main control board.

7. The novel heat dissipation structure for communication electronic products as claimed in claim 1, wherein a camera, a power supply USB interface and a T-FLASH slot are connected to the main control board, and the camera, the power supply USB interface and the T-FLASH slot are exposed from the housing.

8. The novel heat dissipation structure for communication electronic products of claim 1, wherein a first WIFI antenna and a second WIFI antenna are attached to the inner side of the housing, and the first WIFI antenna and the second WIFI antenna are connected to the main control board.

9. The new heat dissipation structure for communication electronic products as claimed in claim 1, wherein an aluminum alloy bracket is fixed on the top of the housing.

10. The new heat dissipation structure for communication electronic products as claimed in claim 1, wherein the housing is made of plastic.