CN217739834U - Case structure based on radiating fin type cover plate - Google Patents
Case structure based on radiating fin type cover plate Download PDFInfo
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- CN217739834U CN217739834U CN202220988736.4U CN202220988736U CN217739834U CN 217739834 U CN217739834 U CN 217739834U CN 202220988736 U CN202220988736 U CN 202220988736U CN 217739834 U CN217739834 U CN 217739834U
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Abstract
The utility model provides a quick-witted case structure based on fin formula apron, including fin formula apron, heat dissipation conducting block, heat conduction gasket, CPU, mainboard PCB and drain pan, fin formula apron detachable connects the upside at the drain pan, and the quick-witted case casing is constituteed to fin formula apron and drain pan. In the technical scheme, the top radiating fin type cover plate and the radiating conduction block are made of AL6063-T5 materials, the good heat conduction performance of aluminum is utilized to transfer part of heat generated by a CPU to the radiating conduction block through the heat conduction gasket for discharging, and part of heat is transferred to the radiating fin type cover plate through the radiating conduction block for discharging; the top radiating fin type cover plate and the radiating conducting block adopt the structural form of radiating fins, the radiating area is increased, the radiating requirement of a CPU is met, and the normal work of equipment is ensured.
Description
Technical Field
The utility model relates to a quick-witted case structural design technical field, concretely relates to quick-witted case structure based on fin formula apron.
Background
At present, similar cases mainly serve a mainboard, and are a structural form convenient for fixing and using the mainboard. Because the mainboard has a CPU with high power consumption, the case needs to consider the requirement of internal heat dissipation in the structural design, and simultaneously also considers the requirement of the use environment of the case, thereby reducing the volume of the case as much as possible.
The traditional case mainly adopts two structural forms:
(1) The whole SGCC material of selecting for use of outside casing, spare part adopt sheet metal working's mode. When heat dissipation is considered, a fan is arranged in the reserved space inside the heat dissipation device to perform forced air cooling. The fan has the advantages of simple processing mode, strong timeliness and convenience in installation, but the disadvantage is that the external size of the whole case is increased for reserving the fan space, certain noise is generated during the operation of the fan, and the experience feeling is slightly worse for a user.
(2) Another kind of structural style with the utility model discloses the difference is that the bottom casing also chooses for use AL6063-T5 material, and spare part adopts the mode of machining, and its advantage is that the good heat conductivility who has utilized aluminium adopts the radiating problem of CPU of natural forced air cooling's mode solution, has also reduced the whole size of quick-witted case simultaneously, but because the change of material and processing mode, has increased the degree of difficulty of the whole equipment of quick-witted case.
Disclosure of Invention
The utility model provides a case structure based on a radiating fin type cover plate, which solves the problems of heat dissipation and volume of the case, wherein the top radiating fin type cover plate and the radiating conduction block have good heat conductivity, part of heat generated by the CPU is transmitted to the radiating conduction block through the heat conduction gasket and is discharged, and part of heat is transmitted to the radiating fin type cover plate through the radiating conduction block and is discharged; the top radiating fin type cover plate and the radiating conducting block adopt the structural form of radiating fins, so that the radiating area is increased, the radiating requirement of a CPU is met, the normal work of equipment is ensured, the radiating requirement is met, the use of a fan is reduced, the size of a case is reduced, and the noise caused in the use process of the fan is avoided.
The utility model provides a case structure based on a radiating fin type cover plate, which comprises a radiating fin type cover plate, a radiating heat conduction block, a heat conduction gasket, a CPU, a mainboard PCB and a bottom case arranged outside the radiating heat conduction block, the heat conduction gasket, the CPU and the mainboard PCB, wherein the radiating fin type cover plate is detachably connected to the upper side of the bottom case;
the radiating fin type cover plate comprises a base plate and radiating teeth connected above the base plate, the number of the radiating teeth is at least two, and the base plate and the radiating teeth are of an integrated structure.
The utility model discloses a chassis structure based on a radiating fin type cover plate, as the preferred mode, the bottom shell is a hexahedron structure with an upper opening, the radiating conduction block is arranged in the opening, and the length and the width of the bottom shell are the same as those of the radiating fin type cover plate;
the radiating fin type cover plate is connected with the bottom shell through a fastening piece, and the main board PCB is connected with the bottom shell through a fastening piece.
A machine case structure based on fin formula apron, as preferred mode, the heat dissipation conduction piece sets up two at least heat dissipation through-holes.
A machine case structure based on fin formula apron, as preferred mode, fin formula apron and heat dissipation conduction piece pass through the glue welding and connect.
A machine case structure based on fin formula apron, as preferred mode, the material of fin formula apron and heat dissipation conducting block is AL 6063-T5.
A machine case structure based on fin formula apron, as preferred mode, heat conduction gasket bonds in CPU's top, the bottom of heat dissipation conduction piece, heat conduction gasket is sheet structure.
A quick-witted case structure based on fin formula apron, as preferred mode, thermal conductivity of heat conduction gasket is 2 ~ 6m K.
A machine case structure based on fin formula apron, as preferred mode, heat-conducting gasket's softness is 30 ~ 40.
A machine case structure based on fin formula apron, as preferred mode, CPU and mainboard PCB connect through the welding.
A machine case structure based on fin formula apron, as preferred mode, the material of drain pan is SGCC, the drain pan uses panel beating processing.
A chassis structure based on a radiating fin type cover plate comprises the radiating fin type cover plate, a radiating heat conduction block, a heat conduction gasket, a CPU, a mainboard PCB and a bottom shell; the heat dissipation conducting block, the heat conduction gasket, the CPU and the mainboard PCB are positioned in a shell formed by the heat dissipation sheet type cover plate and the bottom shell; the heat dissipation conduction block is positioned at the bottom inside the heat dissipation sheet type cover plate; the main board PCB is positioned on the upper side of the inner part of the bottom shell; the CPU is positioned on the upper side inside the mainboard PCB; the heat conducting gasket is positioned at the bottom of the heat dissipation conducting block and on the upper side of the CPU.
The radiating fin type cover plate is fixedly connected with the bottom shell through a fastener, and the main board PCB is fixedly connected with the bottom shell through a fastener; the radiating fin type cover plate is fixedly connected with the radiating conducting block through glue welding; the CPU and the mainboard PCB are fixed by welding; the heat conducting gasket is fixed on the top of the CPU in a sticking way; the radiating fin type cover plate and the radiating conduction block are made of AL6063-T5 materials, and the bottom shell is made of SGCC materials.
The structural parameters of the radiating fin type cover plate comprise the thickness of the substrate, the thickness of the radiating teeth, the height of the radiating teeth and the tooth spacing, and can be determined according to the heat power consumption of the CPU.
In the technical scheme, the top radiating fin type cover plate and the radiating conducting block are made of AL6063-T5 materials, the good heat conduction performance of aluminum is utilized to transfer part of heat generated by a CPU to the radiating conducting block through the heat conducting gasket to be discharged, and the other part of heat is transferred to the radiating fin type cover plate through the radiating conducting block to be discharged. The top radiating fin type cover plate and the radiating conducting block both adopt a radiating fin type structural form, so that the radiating area is increased, the radiating requirement of a CPU (central processing unit) is met, and the normal work of equipment is ensured. Because the structure can meet the heat dissipation requirement, the use of the fan is reduced, the size of the case is reduced, and meanwhile, the noise caused in the use process of the fan is avoided.
Compared with the prior art, the utility model discloses remain the panel beating mode of processing of drain pan, reduced the complexity of processing, simplified the equipment of later stage spare part.
The utility model discloses compare with the existing equipment structure, have following advantage:
(1) The bottom shell adopts the processing mode of panel beating, has reduced the complexity of processing when satisfying mainboard installation user demand, has simplified the equipment of later stage spare part.
(2) By adopting the design of the radiating fin type cover plate, AL6063-T5 material is selected, the good heat conducting property of aluminum is utilized, the radiating area outside the shell is increased, the radiating requirement of a CPU is met, and the normal work of the equipment is ensured.
(3) The space for installing the fan is eliminated inside, the integral size of the case is reduced, and noise caused by the use of the fan is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a chassis based on a heat sink type cover plate.
Reference numerals:
1. a heat sink cover plate; 2. a heat-dissipating conductive block; 3. a thermally conductive gasket; 4. a CPU4; 5. a main board PCB; 6. a bottom shell.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
As shown in fig. 1, a chassis structure based on a heat-dissipating fin type cover plate comprises a heat-dissipating fin type cover plate 1, a heat-dissipating conduction block 2, a heat-conducting gasket 3, a CPU4, a motherboard PCB5 and a bottom case 6 arranged outside the heat-dissipating conduction block 2, the heat-conducting gasket 3, the CPU4 and the motherboard PCB5, wherein the heat-dissipating conduction block 2, the heat-conducting gasket 3, the CPU4 and the bottom case 6 are sequentially arranged on the lower side of the heat-dissipating fin type cover plate 1, the heat-dissipating fin type cover plate 1 and the bottom case 6 form a chassis housing, and the motherboard PCB5 is arranged on the upper side of the bottom in the bottom case 6;
the radiating fin type cover plate 1 comprises a substrate and at least two radiating teeth connected above the substrate, and the substrate and the radiating teeth are of an integrated structure;
the bottom shell 6 is of a hexahedral structure with an upper opening, the heat dissipation conduction block 2 is arranged in the opening, and the length and the width of the bottom shell 6 are the same as those of the radiating fin type cover plate 1;
the radiating fin type cover plate 1 is connected with the bottom shell 6 through a fastening piece, and the main board PCB5 is connected with the bottom shell 6 through a fastening piece;
the heat dissipation and conduction block 2 is provided with at least two heat dissipation through holes;
the radiating fin type cover plate 1 is connected with the radiating conduction block 2 through glue welding;
the materials of the radiating fin type cover plate 1 and the radiating conduction block 2 are AL 6063-T5;
the heat conducting gasket 3 is adhered to the top of the CPU4 and the bottom of the heat dissipation conducting block 2, and the heat conducting gasket 3 is of a sheet structure;
the heat conductivity coefficient of the heat-conducting gasket 3 is 2-6 m.K;
the softness of the heat-conducting gasket 3 is 30-40;
the CPU4 is connected with the main board PCB5 through welding;
the material of drain pan 6 is SGCC, and drain pan 6 uses the sheet metal working.
Example 2
As shown in fig. 1, a chassis structure based on a heat-sink type cover plate includes a heat-sink type cover plate 1, a heat-sink conducting block 2, a heat-conducting pad 3, a CPU4, a motherboard PCB5, and a bottom case 6; the heat dissipation and conduction block 2, the heat conduction gasket 3, the CPU4 and the mainboard PCB5 are positioned in a shell formed by the heat dissipation sheet type cover plate 1 and the bottom shell 6; the heat dissipation conducting block 2 is positioned at the bottom inside the radiating fin type cover plate 1; the main board PCB5 is positioned on the upper side of the inner part of the bottom shell 6; the CPU4 is positioned at the upper side inside the mainboard PCB 5; the heat conducting gasket 3 is positioned at the bottom of the heat radiating conducting block 2 and at the upper side of the CPU4;
the radiating fin type cover plate 1 comprises a substrate and at least two radiating teeth connected above the substrate, and the substrate and the radiating teeth are of an integrated structure; the structural parameters of the radiating fin type cover plate comprise the thickness of the substrate, the thickness of the radiating teeth, the height of the radiating teeth and the tooth spacing, and can be determined according to the heat power consumption of the CPU;
the radiating fin type cover plate 1 is fixedly connected with the bottom shell 6 through a fastener; the main board PCB5 and the bottom shell 6 are fixedly connected through a fastener; the radiating fin type cover plate 1 and the radiating heat conduction block 2 are fixedly connected through glue welding; the CPU4 and the main board PCB5 are fixed by welding; the heat conducting pad 3 is fixed on the top of the CPU4 by means of adhesion.
The heat dissipation method of the embodiment 1-2 is as follows:
the top radiating fin type cover plate 1 and the radiating conducting block 2 are made of AL6063-T5 materials, the good heat conduction performance of aluminum is utilized to transfer part of heat generated by a CPU4 to the radiating conducting block 2 through the heat conducting gasket 3 to be discharged, and the other part of heat is transferred to the radiating fin type cover plate 1 through the radiating conducting block 2 to be discharged. The top radiating fin type cover plate 1 and the radiating conducting block 2 are both in a radiating fin type structure form, so that the radiating area is increased.
The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a quick-witted case structure based on fin formula apron which characterized in that: the heat dissipation device comprises a heat dissipation sheet type cover plate (1), a heat dissipation conduction block (2), a heat conduction gasket (3), a CPU (4), a mainboard PCB (5) and a bottom shell (6) arranged on the outer sides of the heat dissipation conduction block (2), the heat conduction gasket (3), the CPU (4) and the mainboard PCB (5), wherein the heat dissipation sheet type cover plate (1) is detachably connected to the upper side of the bottom shell (6), the heat dissipation sheet type cover plate (1) and the bottom shell (6) form a machine box shell body, and the mainboard PCB (5) is arranged on the upper side of the bottom in the bottom shell (6);
the radiating fin type cover plate (1) comprises a substrate and at least two radiating teeth connected above the substrate, and the substrate and the radiating teeth are of an integrated structure;
the heat dissipation and conduction block (2) is provided with at least two heat dissipation through holes;
the heat conduction gasket (3) is bonded to the top of the CPU (4) and the bottom of the heat dissipation conduction block (2), and the heat conduction gasket (3) is of a sheet structure;
the bottom shell (6) is of a hexahedral structure with an upper opening, the heat dissipation conduction block (2) is arranged in the opening, and the length and the width of the bottom shell (6) are the same as those of the radiating fin type cover plate (1);
the radiating fin type cover plate (1) is connected with the bottom shell (6) through a fastener, and the main board PCB (5) is connected with the bottom shell (6) through a fastener.
2. The case structure based on the finned cover plate of claim 1, wherein: the radiating fin type cover plate (1) is connected with the radiating heat conduction block (2) through glue welding.
3. The case structure based on the finned cover plate of claim 1, wherein: the radiating fin type cover plate (1) and the radiating heat conduction block (2) are made of AL 6063-T5.
4. The case structure based on the finned cover plate of claim 1, wherein: the heat conductivity coefficient of the heat conduction gasket (3) is 2-6 m.K.
5. The case structure based on the finned cover plate of claim 1, wherein: the softness of the heat-conducting gasket (3) is 30-40.
6. The case structure based on the finned cover plate of claim 1, wherein: the CPU (4) and the main board PCB (5) are connected through welding.
7. The case structure based on the finned cover plate of claim 1, wherein: the material of drain pan (6) is SGCC, drain pan (6) uses the panel beating processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220988736.4U CN217739834U (en) | 2022-04-27 | 2022-04-27 | Case structure based on radiating fin type cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220988736.4U CN217739834U (en) | 2022-04-27 | 2022-04-27 | Case structure based on radiating fin type cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217739834U true CN217739834U (en) | 2022-11-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220988736.4U Active CN217739834U (en) | 2022-04-27 | 2022-04-27 | Case structure based on radiating fin type cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217739834U (en) |
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2022
- 2022-04-27 CN CN202220988736.4U patent/CN217739834U/en active Active
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