CN214898421U

CN214898421U - Electronic chip radiator

Info

Publication number: CN214898421U
Application number: CN202121333821.9U
Authority: CN
Inventors: 王国军; 王超; 唐刚
Original assignee: Zhejiang Xipu Detection Technology Co ltd
Current assignee: Zhejiang Xipu Detection Technology Co ltd
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2021-11-26
Anticipated expiration: 2031-06-16

Abstract

The utility model discloses an electronic chip radiator, which comprises a shell, wherein a hollow part is arranged in the shell, an electronic chip is arranged at the hollow part, two through holes are arranged at the inner top of the shell, a flange is arranged at the edge of the through hole at the top of the shell, a placing groove is arranged at the position between the two through holes at the top of the shell, a metal plate is arranged in the placing groove, a plurality of radiating fins are arranged at the bottom of the metal plate, the radiating fins extend downwards to the hollow part, a cooling device is fixed at the top of the shell by screws, the device can effectively reduce the temperature in the shell by double heat collection of a wind collecting cover and a heat exchange fin and cools the heat in the cooling device, so that the electronic chip can better work, the structure is simple, the operation is convenient.

Description

Electronic chip radiator

Technical Field

The utility model relates to an electronic chip radiator.

Background

Chips, also known as microcircuits (microcircuits), microchips (microchips), and Integrated Circuits (ICs). Refers to a silicon chip containing integrated circuits, which is small in size and is often part of a computer or other electronic device.

However, the electronic chip generates a large amount of heat during operation, and if the heat cannot be dissipated in time, the working performance and efficiency of the electronic chip are affected, and the chip is burned down in severe cases, so that the cost is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that an electron chip radiator is provided.

The utility model discloses a realize through following technical scheme:

an electronic chip radiator comprises a shell, wherein a hollow part is arranged in the shell, an electronic chip is arranged at the hollow part, two through holes are formed in the inner top of the shell, a flange is arranged at the edge of the through hole at the top of the shell, a placing groove is formed in the position, between the two through holes, at the top of the shell, a metal plate is arranged in the placing groove, a plurality of radiating fins are arranged at the bottom of the metal plate, the radiating fins extend downwards to the hollow part, and a cooling device is fixed to the top of the shell through screws.

Preferably, the cooling device comprises a water storage tank, a metal pipe is arranged in the water storage tank, two ends of the metal pipe are communicated to the bottom of the water storage tank, a concave part is arranged at the joint of the two ends of the metal pipe at the bottom of the water storage tank, the concave part is matched with the flange, a water inlet hole is arranged at a position, close to the top, of one side of the inner wall of the water storage tank, a water outlet hole is arranged at a position, close to the bottom, of one side of the inner wall of the water storage tank, sealing covers are arranged at the positions of the water inlet hole and the water outlet hole, and a condenser pipe is arranged in the water storage tank.

Preferably, a temperature display communicated with the inside of the water storage tank is arranged on the front end surface of the water storage tank.

Preferably, a rotary switch for controlling the temperature of the condensation pipe is arranged on the front end surface of the water storage tank.

Preferably, the metal plate, the fins and the metal tube are all made of copper.

Preferably, the section of the metal pipe located in the water storage tank is arranged in a surrounding mode.

Preferably, an insulating layer is arranged on the outer wall of the water storage tank.

Preferably, the inner wall of the shell is provided with air collecting covers at the two through holes.

Preferably, a fan is disposed below the wind collecting cover located at one side inside the housing.

The utility model has the advantages that: compared with the prior art, the device collects heat through the air collecting cover and the heat exchange fins, cools the heat through the cooling device, can effectively reduce the temperature in the shell, enables the electronic chip to work better, and is simple in structure and convenient to operate.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a front view of the present invention;

fig. 3 is an enlarged view of the present invention from a.

Detailed Description

All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.

Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.

In the description of the present invention, it is to be understood that the terms "one end", "the other end", "the outside", "upper", "inside", "horizontal", "coaxial", "central", "end", "length", "outer end", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, in the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise explicitly specified or limited, the terms "set", "coupled", "connected", "penetrating", "plugging", and the like are to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

An electronic chip heat sink as shown in fig. 1, 2 and 3 comprises a housing 1, a hollow portion 101 disposed inside the housing 1, an electronic chip 2 disposed in the hollow portion 101, two through holes 102 disposed on the top of the housing 1, a flange 103 disposed on the top of the housing 1 and located at the edge of the through holes 102, a placement groove 104 disposed on the top of the housing 1 and located between the two through holes 102, a metal plate 105 disposed in the placement groove 104, a plurality of fins 106 disposed on the bottom of the metal plate 105, the fins 106 extending downward to the hollow portion 101, and a cooling device 3 screwed on the top of the housing 1.

In the present invention, the cooling device 3 comprises a water storage tank 301, a metal pipe 302 is disposed in the water storage tank 301, two ends of the metal pipe 302 are all connected to the bottom of the water storage tank 301, the bottom of the water storage tank 301 is located at the joint of two ends of the metal pipe 302, the concave portion 303 is engaged with the flange 103, one side of the inner wall of the water storage tank 301 is close to the top position and is provided with an inlet hole 304, one side of the inner wall of the water storage tank 301 is close to the bottom position and is provided with an outlet hole 305, the inlet hole 304 and the outlet hole 305 are both provided with a sealing cover 306, and a condenser pipe 307 is disposed inside the water storage tank 301.

The utility model discloses in the embodiment of a preferred the preceding terminal surface of storage water tank 301 is provided with the intercommunication the inside temperature monitor 308 of storage water tank 301 is convenient for observe inside temperature.

The utility model discloses in the embodiment of a preferred the preceding terminal surface of storage water tank 301 is provided with rotary switch 309 of control condenser pipe 307 temperature, and the workman's operation of being convenient for adjusts according to the demand by oneself.

In a preferred embodiment of the present invention, the metal plate 105, the heat sink 106 and the metal tube 302 are made of copper, and the copper has good thermal conductivity.

In the preferred embodiment of the present invention, the metal pipe 302 is located in the water storage tank 301, so that the surrounding arrangement can increase the contact area and reduce the temperature better.

In one preferred embodiment of the present invention, the outer wall of the water storage tank 301 is provided with a heat insulating layer 310, which reduces the energy loss in the water storage tank.

In a preferred embodiment of the present invention, the inner wall of the housing 1 is located two through holes 102 are provided with a wind collecting cover 107, which is convenient for collecting heat and has guiding function.

In a preferred embodiment of the present invention, a fan 108 is disposed below the wind collecting cover 107 located at one side inside the housing 1 to promote air circulation.

Working principle; the electronic chip work produces and is that the heat flows into in the metal tube through the air-collecting cover, makes its cooling, enters into the metal tube in the hot-air can become cold air, according to the hot-air rise, the principle that cold air descends, in the metal tube cold air also can flow into the casing, also accessible fan's drive makes its circulation flow, can transmit the metal sheet after the heat absorption of heat fin, the bottom of metal sheet laminating storage water tank also can reach the purpose of cooling.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. An electronic chip heat sink, comprising: the cooling device comprises a shell, wherein a hollow part is arranged in the shell, an electronic chip is arranged at the hollow part, two through holes are formed in the inner top of the shell, a flange is arranged at the edge of the through hole at the top of the shell, a placing groove is formed in the position, between the two through holes, at the top of the shell, a metal plate is arranged in the placing groove, a plurality of cooling fins are arranged at the bottom of the metal plate, the cooling fins extend downwards to the hollow part, and a cooling device is fixed to the top of the shell through screws.

2. The electronic chip heat sink of claim 1, wherein: the cooling device comprises a water storage tank, a metal pipe is arranged in the water storage tank, two ends of the metal pipe are communicated to the bottom of the water storage tank, a concave part is arranged at the position, located at the joint of the two ends of the metal pipe, of the bottom of the water storage tank, the concave part is matched with the flange, a water inlet hole is formed in one side of the inner wall of the water storage tank, close to the top of the inner wall of the water storage tank, a water outlet hole is formed in one side of the inner wall of the water storage tank, close to the bottom of the inner wall of the water storage tank, sealing covers are arranged at the water inlet hole and the water outlet hole, and a condensation pipe is arranged in the water storage tank.

3. An electronic chip heat sink according to claim 2, wherein: the front end face of the water storage tank is provided with a temperature display communicated with the inside of the water storage tank.

4. An electronic chip heat sink according to claim 2, wherein: and a rotary switch for controlling the temperature of the condenser pipe is arranged on the front end surface of the water storage tank.

5. An electronic chip heat sink according to claim 2, wherein: the metal plate, the radiating fins and the metal pipe are all made of copper.

6. An electronic chip heat sink according to claim 2, wherein: the section of the metal pipe located in the water storage tank is arranged in a surrounding mode.

7. An electronic chip heat sink according to claim 2, wherein: and the outer wall of the water storage tank is provided with a heat insulation layer.

8. The electronic chip heat sink of claim 1, wherein: and air collecting covers are arranged on the inner wall of the shell at the two through holes.

9. The electronic chip heat sink of claim 8, wherein: and a fan is arranged below the air collecting cover positioned at one side in the shell.