CN217721600U - HDI high density lamination circuit board of blind hole counterpoint technique - Google Patents

Abstract

The utility model discloses a HDI high density lamination circuit board of blind hole counterpoint technique belongs to HDI circuit board technical field, has aimed at the relatively poor problem of heat dispersion and anti-seismic performance effect between the lamination of high density multilayer circuit board, including two core boards that are laminating setting from top to bottom, the top surface of the core board that is located above is provided with the power ply, the top surface of power ply is provided with the circuit ply, the bottom surface of the core board that is located the bottom is provided with the ground plate, the bottom surface of the ground plate is provided with the heat-conducting plate; the utility model discloses a location installation between locating lever and the locating hole to both can strengthen the heat-conduction effect to the heat-conducting plate bottom surface through elasticity buffering strip, can form the support buffering to high density build-up circuit board again, thereby improve heat dispersion and the buffering protective effect to high density build-up circuit board, thereby improve the performance to high density build-up circuit board greatly.

Description

HDI high density lamination circuit board of blind hole counterpoint technique

Technical Field

The utility model belongs to the technical field of the HDI circuit board, concretely relates to HDI high density lamination circuit board of blind hole counterpoint technique.

Background

With the development of electronic products, HDI boards have been developed gradually on the basis of PCBs, and HDI boards are formed by using conventional double-sided boards as core boards and by continuous stacking layers, so that thin, multi-layer, and stable high-density interconnection printed circuit boards, i.e., high-density multi-layer circuit boards, which cannot be realized by conventional multi-layer board technologies, are manufactured.

For traditional circuit board, HDI circuit board can realize the electric interconnection between layer to layer for high density multilayer circuit board, adopts a large amount of little buried holes in the board, can realize the high intensive interconnection of circuit, but it can have following not enoughly under the in-service use condition:

(1) as the number of circuit layers of the high-density multilayer circuit board is increased, the heat dissipation between layers is greatly reduced, and the service performance of the high-density multilayer circuit board is affected;

(2) with the thinner lines of the high-density multilayer circuit board circuit, the lines are easy to be damaged in the process of oscillation, so that the service performance of the high-density multilayer circuit board is reduced.

Therefore, a HDI high-density build-up circuit board with a blind hole alignment technology is needed to solve the problem that the heat dissipation performance and the anti-seismic performance effect between the build-up layers of the high-density multilayer circuit board in the prior art are poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a HDI high density lamination circuit board of blind hole counterpoint technique to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a HDI high density lamination circuit board of blind hole counterpoint technique, includes two cores that are laminating setting from top to bottom, is located the top surface of core is provided with the power plywood, the top surface of power plywood is provided with the circuit plywood, is located the bottom surface of core is provided with the ground plate, the bottom surface of ground plate is provided with the heat-conducting plate, the ground plate, two the core the power plywood and the lateral wall of circuit plywood all is provided with four lugs that are symmetric distribution, is located same vertical planar a plurality of the locating hole has been seted up between the lug, the outer peripheral face of core is provided with the protection frame, the inner wall of protection frame is provided with the positioning mechanism with locating hole matched with, ground plate, two the core and be provided with first order blind hole between the power plywood, the heat-conducting plate, ground plate, two the core the power plywood and be provided with second order hole, second order mistake hole and through-hole that distribute in proper order between the circuit plywood.

It needs to explain further that positioning mechanism includes four position sleeves that are the symmetric distribution, four the position sleeve all with the bottom lateral wall of protective frame is fixed, every the top surface of position sleeve all slides and runs through there is the locating lever, lies in two with one side be fixed with the mounting panel between the position sleeve, two the top surface of mounting panel is fixed with a plurality of springiness cushioning strips that are evenly distributed, and is a plurality of the bottom surface laminating of springiness cushioning strip is provided with a plurality of bracing pieces that are evenly distributed, lies in two with one end be fixed with the backup pad between the position sleeve, the both ends of bracing piece respectively with two the top surface of backup pad is fixed.

In the scheme, the elastic buffer strip comprises a horizontal section and an elliptical section which are distributed in a crossed manner, the elliptical section of the elastic buffer strip is in contact with the bottom surface of the heat conducting plate, and the horizontal section of the elastic buffer strip positioned at the outermost end is fixed with the top surface of the mounting plate.

It is worth further saying that the support rod is located on the bottom surface of the elliptical section of the elastic buffering strip, and the contact surface of the support rod and the elastic buffering strip is an arc surface which is matched with each other.

As a preferred embodiment, rubber damping blocks are arranged on two sides of the supporting rod, the rubber damping blocks are fixed to the inner wall of the end face of the protection frame, and the end faces of the rubber damping blocks are attached to the end faces of the heat conducting plate, the ground plate, the two core plates, the power layer plate and the circuit layer plate.

As a preferred embodiment, the side walls of two sides of the protection frame are provided with rubber damping plates, the rubber damping plates are attached to the ground plate, the core plate and the power supply layer plate, and chamfers are formed on the top surfaces, close to the core plate, of the rubber damping blocks and the top surfaces, close to the core plate, of the rubber damping plates.

Compared with the prior art, the utility model provides a pair of HDI high density lamination circuit board of blind hole counterpoint technique includes following beneficial effect at least:

(1) The positioning holes of the lugs are used for positioning, so that the heat conduction plate, the grounding plate, the two core plates, the power supply layer plate and the circuit layer plate are manufactured in a stacking layer mode to form a three-order six-layer high-density laminated circuit board, and a first-order blind hole, a second-order stacked hole, a second-order staggered hole and a through hole are formed through the preset micro-buried holes, so that the use performance of the high-density laminated circuit board is improved.

(2) Through the positioning installation between locating lever and the locating hole to through the heat conduction effect of elasticity buffering strip both can reinforcing to the heat-conducting plate bottom surface, can form the support buffering to high density lamination circuit board again, thereby improve the heat dispersion and the buffering protective effect to high density lamination circuit board, thereby improve the performance to high density lamination circuit board greatly.

(3) The arrangement of the rubber damping block can limit the supporting rod to a certain degree and also can buffer and protect the high-density laminated circuit board manufactured in a laminated level, so that the shock absorption and protection effect of the high-density laminated circuit board is improved; the rubber damping plate can improve the stability of the installation of the high-density laminated circuit board in the protective frame, can also perform damping protection on the high-density laminated circuit board, and further improves the damping protection effect of the high-density laminated circuit board by matching the action of the rubber damping block.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the protection frame of the present invention;

FIG. 3 is a schematic view of a partial structure of the positioning mechanism of the present invention;

fig. 4 is the local structure diagram of the first-order blind hole, the second-order overlapped hole, the second-order staggered hole and the through hole of the present invention.

In the figure: 1. a core board; 2. a power supply laminate; 3. a circuit layer board; 4. a ground plate; 5. a heat conducting plate; 6. a lug; 7. positioning holes; 8. a protective frame; 9. a positioning mechanism; 91. a positioning sleeve; 92. positioning a rod; 93. mounting a plate; 94. an elastic buffer strip; 941. a horizontal segment; 942. an elliptical section; 95. a support bar; 96. a support plate; 10. a first-order blind hole; 11. second-order hole stacking; 12. a second staggered hole; 13. a through hole; 14. a rubber damping block; 15. a rubber damping plate.

Detailed Description

The present invention will be further described with reference to the following examples.

In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the following will combine the drawings of the embodiments of the present invention to clearly and completely describe the technical solution of the embodiments of the present invention, and obviously, the described embodiments are a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative labor are within the scope of the protection of the present invention based on the described embodiments of the present invention.

The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention. The condition in the embodiment can be further adjusted according to concrete condition the utility model discloses a it is right under the design prerequisite the utility model discloses a simple improvement of method all belongs to the utility model discloses the scope of claiming.

Please refer to fig. 1-4, the utility model provides a HDI high density lamination circuit board of blind hole counterpoint technique, core 1 including two and being laminating the setting from top to bottom, the top surface of core 1 that is located the top is provided with power ply 2, the top surface of power ply 2 is provided with circuit ply 3, the bottom surface of core 1 that is located the bottom is provided with ground plate 4, the bottom surface of ground plate 4 is provided with heat-conducting plate 5, ground plate 4, two core 1, the lateral wall of power ply 2 and circuit ply 3 all is provided with four lugs 6 that are the symmetric distribution, locating hole 7 has been seted up between a plurality of lugs 6 that are located same vertical plane, the outer peripheral face of core 1 is provided with protection frame 8, the inner wall of protection frame 8 is provided with positioning mechanism 9 with locating hole 7 matched with, ground plate 4, be provided with first order lamination blind hole 10 between two core 1 and the power ply 2 and the circuit ply 2, heat-conducting plate 5, ground plate 4, two core 1, be provided with second order lamination blind hole 11 that are distributed in proper order between power ply 2 and the circuit ply 3, second order lamination blind hole 12 and through the action of the built-up through-level locating hole 12, thereby make the second order high density lamination circuit board carry out the laminated board of second order through the laminated hole of lamination.

Further as shown in fig. 3 and 4, it is worth specifically explaining that the positioning mechanism 9 includes four positioning sleeves 91 that are symmetrically distributed, the four positioning sleeves 91 are all fixed with the bottom side wall of the protection frame 8, the top surface of each positioning sleeve 91 is all slidably penetrated with a positioning rod 92, a mounting plate 93 is fixed between the two positioning sleeves 91 located on the same side, a plurality of elastic buffer strips 94 that are uniformly distributed are fixed on the top surfaces of the two mounting plates 93, a plurality of support rods 95 that are uniformly distributed are provided on the bottom surface of the elastic buffer strips 94, a support plate 96 is fixed between the two positioning sleeves 91 located on the same end, and both ends of the support rod 95 are fixed with the top surfaces of the two support plates 96 respectively.

The scheme has the following working processes: the two core plates 1 form a substrate of the HDI high-density laminated circuit board, the heat conduction plate 5, the grounding plate 4, the two core plates 1, the power supply layer plate 2 and the circuit layer plate 3 are manufactured in a superposition layer mode under the action of the lugs 6, and a first-order blind hole 10, a second-order superposed hole 11, a second-order staggered hole 12 and a through hole 13 are formed through superposition manufacturing of micro-buried holes among the heat conduction plate 5, the grounding plate 4, the two core plates 1, the power supply layer plate 2 and the circuit layer plate 3, so that a third-order six-layer high-density laminated circuit board is formed, and blind hole alignment treatment of the three-order six-layer high-density laminated circuit board is realized; after the high-density laminated circuit board is manufactured at the laminated level, the positioning holes 7 between the lugs 6 and the positioning rods 92 of the protection frame 8 are inserted and installed, preliminary positioning and installation are conducted on the high-density laminated circuit board, until the bottom surface of the heat conduction plate 5 is in contact with the elastic buffer strips 94, the heat conduction effect on the bottom surface of the heat conduction plate 5 can be enhanced through the elastic buffer strips 94, supporting and buffering of the high-density laminated circuit board can be formed, and therefore the heat dissipation performance and the buffering protection effect of the high-density laminated circuit board are improved.

According to the working process, the following steps are known: the positioning is carried out through the positioning holes 7 of the lugs 6, so that the heat conduction plate 5, the grounding plate 4, the two core plates 1, the power supply layer plate 2 and the circuit layer plate 3 are manufactured in a stacking layer mode to form a three-step six-layer high-density laminated circuit board, and a first-step blind hole 10, a second-step laminated hole 11, a second-step staggered hole 12 and a through hole 13 are formed through a preset micro-buried hole, so that the use performance of the high-density laminated circuit board is improved; through the positioning and installation between the positioning rod 92 and the positioning hole 7, the elastic buffer strip 94 can not only enhance the heat conduction effect on the bottom surface of the heat conducting plate 5, but also form the supporting buffer on the high-density laminated circuit board, thereby improving the heat dissipation performance and the buffer protection effect on the high-density laminated circuit board, and greatly improving the service performance of the high-density laminated circuit board.

As further shown in fig. 4, it is worth specifically describing that the elastic buffer strip 94 includes a horizontal section 941 and an elliptical section 942 that are distributed in a cross manner, the elliptical section 942 of the elastic buffer strip 94 contacts with the bottom surface of the heat conducting plate 5, the horizontal section 941 of the elastic buffer strip 94 located at the outermost end is fixed to the top surface of the mounting plate 93, and the elastic buffer strip 94 is disposed between the elliptical section 942 and the horizontal section 941 to improve the heat exchange effect between the elastic buffer strip and the external environment, so that the heat conducting plate 5 conducts part of heat to the horizontal section 941 through the elliptical section 942, thereby improving the contact area between the elastic buffer strip and the external environment to a certain extent, greatly improving the heat dissipation effect, and further improving the heat conduction and dissipation performance of the high-density laminated circuit board.

As further shown in fig. 3 and fig. 4, it should be specifically noted that the supporting rod 95 is located at the bottom of the elliptical section 942 of the elastic buffer strip 94, and the contact surface between the supporting rod 95 and the elastic buffer strip 94 is a matched arc surface, wherein the supporting rod 95 makes full contact with and supports the elliptical section 942 of the elastic buffer strip 94, so as to further support the elliptical section 942 of the elastic buffer strip 94.

Further as shown in fig. 1, fig. 2 and fig. 3, it is worth specifically explaining that rubber damping blocks 14 are arranged on both sides of the supporting rod 95, the rubber damping blocks 14 are fixed to the inner wall of the end face of the protective frame 8, and the end faces of the rubber damping blocks 14 are attached to the end faces of the heat conducting plate 5, the ground plate 4, the two core plates 1, the power layer plate 2 and the circuit layer plate 3, wherein the rubber damping blocks 14 can limit the supporting rod 95 to a certain extent and can also buffer and protect a high-density laminated circuit board manufactured in a laminated layer, so as to improve the shock absorption and protection effect of the high-density laminated circuit board.

Further as shown in fig. 1, fig. 2 and fig. 3, it is worth specifically explaining that the side walls of the two sides of the protection frame 8 are respectively provided with a rubber damping plate 15, the rubber damping plates 15 are attached to the ground plate 4, the two core plates 1 and the power layer plate 2, and chamfers are respectively arranged on the top surfaces of the rubber damping blocks 14 and the rubber damping plates 15 close to the core plates 1, wherein the rubber damping plates 15 can improve the stability of the installation of the high-density laminated circuit board in the protection frame 8 and can also perform shock absorption protection on the high-density laminated circuit board, and the shock absorption protection effect of the high-density laminated circuit board is further improved by matching with the action of the rubber damping blocks 14.

To sum up: through the location installation between locating lever 92 and locating hole 7 to both can strengthen the heat-conduction effect to the heat-conducting plate 5 bottom surface through elastic buffer strip 94, can form the support buffering to high density lamination circuit board again, thereby improve heat dispersion and the buffering protective effect to high density lamination circuit board, thereby improve the performance to high density lamination circuit board greatly, and through the setting of rubber damping piece 14 and rubber damping board 15, both can improve the location installation stability to high density lamination circuit board, can improve the shock attenuation protective effect to it again greatly.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art, and the use of the term "including" or "comprising" in the present application shall mean that the element or item preceding the term covers the element or item listed after the term and its equivalents, but does not exclude other elements or items, and the term "connected" or "connected" is not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect, "upper", "lower", "left", "right", etc. merely indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may be changed accordingly.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a HDI high density lamination circuit board of blind hole counterpoint technique, includes two core boards (1) that are laminating setting from top to bottom, its characterized in that, be located the top surface of core board (1) is provided with power plywood (2), the top surface of power plywood (2) is provided with circuit plywood (3), is located the bottom surface of core board (1) is provided with ground plate (4), the bottom surface of ground plate (4) is provided with heat-conducting plate (5), heat-conducting plate (5) ground plate (4), two core board (1) power plywood (2) and the lateral wall of circuit plywood (3) all is provided with four lugs (6) that are symmetric distribution, is located a plurality of same vertical plane locating hole (7) have been seted up between lug (6), the outer peripheral face of core board (1) is provided with protection frame (8), the inner wall of protection frame (8) be provided with locating hole (7) matched with positioning mechanism (9), ground plate (4), two core board (1) and power plywood (2) between be provided with second order blind hole (11) in proper order the distribution of ground plate (3) are the heat-conducting plate (10), ground plate (5), two), A second staggered hole (12) and a through hole (13).

2. The HDI high-density build-up circuit board adopting the blind hole aligning technology according to claim 1, characterized in that: positioning mechanism (9) including four position sleeve (91) that are the symmetric distribution, four position sleeve (91) all with the bottom lateral wall of protective frame (8) is fixed, every the top surface of position sleeve (91) all slides and runs through there is locating lever (92), lies in two with one side be fixed with mounting panel (93), two between position sleeve (91) the top surface of mounting panel (93) is fixed with a plurality of springiness cushioning strip (94) that are evenly distributed, and is a plurality of the laminating of the bottom surface of springiness cushioning strip (94) is provided with a plurality of bracing pieces (95) that are evenly distributed, lies in two of same end be fixed with backup pad (96) between position sleeve (91), the both ends of bracing piece (95) respectively with two the top surface of backup pad (96) is fixed.

3. The HDI high-density build-up circuit board adopting the blind hole aligning technology according to claim 2, characterized in that: the elastic buffer strip (94) comprises a horizontal section (941) and an elliptical section (942) which are distributed in a crossed manner, the elliptical section (942) of the elastic buffer strip (94) is in contact with the bottom surface of the heat conducting plate (5), and the horizontal section (941) of the elastic buffer strip (94) at the outermost end is fixed to the top surface of the mounting plate (93).

4. The HDI high-density build-up circuit board of claim 3, wherein: the supporting rod (95) is positioned on the bottom surface of the elliptical section (942) of the elastic buffer strip (94), and the contact surface of the supporting rod (95) and the elastic buffer strip (94) is an arc surface which is matched with each other.

5. The HDI high-density build-up circuit board of claim 4, wherein: the both sides of bracing piece (95) all are provided with rubber damping piece (14), rubber damping piece (14) with the terminal surface inner wall of protection frame (8) is fixed, the terminal surface of rubber damping piece (14) with heat-conducting plate (5) ground plate (4), two core (1) power plywood (2) and the terminal surface laminating of circuit plywood (3) sets up.

6. The HDI high-density build-up circuit board adopting the blind hole aligning technology according to claim 5, characterized in that: the both sides lateral wall of protection frame (8) all is provided with rubber damping plate (15), rubber damping plate (15) with ground plate (4), two core (1) and the side laminating of power plywood (2) sets up, rubber damping piece (14) with the chamfer has all been seted up to the top surface that rubber damping plate (15) are close to core (1).

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