CN220381554U - High radiating efficiency machine case - Google Patents
High radiating efficiency machine case Download PDFInfo
- Publication number
- CN220381554U CN220381554U CN202322263479.5U CN202322263479U CN220381554U CN 220381554 U CN220381554 U CN 220381554U CN 202322263479 U CN202322263479 U CN 202322263479U CN 220381554 U CN220381554 U CN 220381554U
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- China
- Prior art keywords
- heat dissipation
- module
- mounting plate
- module mounting
- middle frame
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- 230000017525 heat dissipation Effects 0.000 claims description 51
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The utility model belongs to the technical field of structural members of electronic equipment, and particularly relates to a high-heat-dissipation-efficiency chassis which comprises a middle frame, a module mounting plate, a left cover plate and a right cover plate.
Description
Technical Field
The utility model belongs to the technical field of structural parts of electronic equipment, and particularly relates to a chassis with high heat dissipation efficiency.
Background
The structural requirement of some model 2MCU avionics equipment can satisfy the heat dissipation demand that exceeds 2MCU electronic equipment natural heat dissipation ability upper limit when satisfying lightweight, miniaturization, and current avionics equipment can not satisfy the structural layout of this requirement.
Disclosure of Invention
In view of this, the present utility model provides a chassis with high heat dissipation efficiency, which can meet the requirements of miniaturization, light weight, high density assembly, high heat dissipation capability, operability, maintainability, environmental adaptability, etc. of the equipment by optimizing the layout and structural form of each module inside the chassis.
In order to achieve the technical purpose, the utility model adopts the following specific technical scheme:
a high heat dissipation efficiency chassis for mounting modules of an avionics device, the chassis comprising:
the middle frame is a frame-shaped structure with two open ends;
the module mounting plate is arranged in the middle frame, is arranged in parallel with openings at two ends of the middle frame and is arranged in a heat conduction way with the middle frame;
the left cover plate is used for buckling one opening of the middle frame, one surface close to the module mounting plate is provided with a plurality of heat conduction convex blocks, and one surface far away from the module mounting plate is provided with radiating fins;
the right cover plate is used for buckling the other opening of the middle frame, one surface close to the module mounting plate is provided with a plurality of heat conduction convex blocks, and the surface far away from the module mounting plate is provided with heat dissipation fins;
wherein: plate-shaped data modules, power modules and display modules are arranged on two sides of the module mounting plate; the heating devices on the data module, the power module and the display module, which are close to one end of the module mounting plate, are arranged in a heat conduction manner with the module mounting plate;
among the heating devices of data module, power module and display module, be close to the heat dissipation device laminating of left side apron the heat dissipation lug on the left side apron, be close to the heat dissipation device laminating of right side apron the heat dissipation lug on the right side apron.
Further, a plurality of heat dissipation convex blocks are arranged on the module mounting plate; among the heating devices of the data module, the power module and the display module, the heat dissipation device close to the module mounting plate is attached to the heat dissipation protruding block on the module mounting plate.
Further, the middle frame and the module mounting plate are of an integrated structure.
Further, the thickness of the plate of the middle frame is 1.3-1.7mm.
Further, the thickness of the plate of the module mounting plate is 3-3.5 mm.
Further, the long edges of the middle frame are uniformly provided with groove structures.
Further, the height of the radiating fins is 10-13 mm, the width of the radiating fins is 1.3-1.7mm, and the distance between the radiating fins is 11-12mm.
By adopting the technical scheme, the utility model has the following beneficial effects:
1. according to the utility model, the middle frame and the left and right cover plates are used for radiating simultaneously, so that an effective radiating path is fully utilized, the radiating performance of the electronic equipment structure is improved, and the equipment with 90W power consumption can normally work under the natural radiating condition.
2. The utility model can realize multi-module compact layout on the premise of meeting the requirements of light weight and simple structure.
3. The utility model is convenient to assemble and disassemble and has good maintainability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
Fig. 1 is a schematic structural diagram of a chassis with high heat dissipation efficiency according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram illustrating a distribution mode of each module in a chassis with high heat dissipation efficiency according to an embodiment of the present utility model;
wherein: 1. a left cover plate; 2. a storage module; 3. a CPU; 4. a data processing module; 5. a middle frame; 6. a handle; 7. a power module; 8. a display module; 9. a right cover plate; 10. debugging port cover plate.
Detailed Description
Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present disclosure will become readily apparent to those skilled in the art from the following disclosure, which describes embodiments of the present disclosure by way of specific examples. It will be apparent that the described embodiments are merely some, but not all embodiments of the present disclosure. The disclosure may be embodied or practiced in other different specific embodiments, and details within the subject specification may be modified or changed from various points of view and applications without departing from the spirit of the disclosure. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure are intended to be within the scope of this disclosure.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the disclosure by way of illustration, and only the components related to the disclosure are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
In one embodiment of the present utility model, a high heat dissipation efficiency chassis is provided for mounting modules of an avionics device, as shown in fig. 1, the chassis comprising:
the middle frame 5 is a frame-shaped structure with two open ends;
the module mounting plate is arranged in the middle frame 5, is arranged in parallel with openings at two ends of the middle frame 5 and is arranged in a heat conduction way with the middle frame 5;
a left cover plate 1 for buckling an opening of the middle frame 5, wherein a plurality of heat conduction convex blocks are arranged on one surface close to the module mounting plate, and radiating fins are arranged on one surface far away from the module mounting plate;
the right cover plate 9 is used for buckling the other opening of the middle frame 5, one surface close to the module mounting plate is provided with a plurality of heat conduction convex blocks, and the surface far away from the module mounting plate is provided with heat dissipation fins;
wherein: plate-shaped data modules, power modules 7 and display modules 8 are arranged on two sides of the module mounting plate; the heating devices on one end, close to the module mounting plate, of the data module, the power module 7 and the display module 8 are arranged in a heat conduction manner with the module mounting plate;
among the heating devices of the data module, the power module 7 and the display module 8, the heat dissipation device close to the left cover plate 1 is attached to the heat dissipation convex block on the left cover plate 1, and the heat dissipation device close to the right cover plate 9 is attached to the heat dissipation convex block on the right cover plate 9.
In this embodiment, the module mounting board is provided with a plurality of heat dissipation bumps; among the heating devices of the data module, the power module 7 and the display module 8, the heat dissipation device close to the module mounting plate is attached to the heat dissipation protruding block on the module mounting plate.
In this embodiment, the middle frame 5 and the module mounting board are integrally formed.
In this embodiment, the thickness of the plate of the middle frame 5 is 1.3-1.7mm.
In this embodiment, the thickness of the plate of the module mounting plate is 3-3.5 mm.
In this embodiment, the long sides of the middle frame 5 are uniformly provided with groove structures.
In this embodiment, the height of the heat dissipation fins is 10-13 mm, the width of the heat dissipation fins is 1.3-1.7mm, and the spacing between the heat dissipation fins is 11-12mm.
In this embodiment, the main heat dissipation devices of each module dissipate heat through the middle frame 5, the left cover plate 1 and the right cover plate 9 at the same time, so that an effective heat dissipation path in the electronic equipment structure is fully utilized, and the heat dissipation capability of the equipment can be greatly improved.
The bottom of the chassis middle frame 5 is uniformly provided with groove structures along the long side direction, so that the effect of weight reduction is achieved while the structural rigidity is improved; the front debugging port cover plate 10 is designed as a hinge, so that the debugging port is convenient to use, parts are not lost, and the beautiful industrial design requirement is met; corresponding finger buckles are reserved at screw holes on two sides of the upper part, and limit guidance is provided for mounting and dismounting the left cover plate 9 and the right cover plate 9.
The left cover plate 1 and the right cover plate 9 are respectively provided with a radiating fin and an embedded handle 6, which respectively have the functions of improving the radiating capacity and pulling out, and have good maintainability.
Through the measures, on the basis of ensuring light weight and miniaturization, the heat dissipation capacity of the equipment is greatly improved by adjusting the internal structure of the equipment, and the normal and stable operation of the product under high power consumption is ensured.
The chassis of the embodiment is used for improving the heat dissipation efficiency structure of each module of the 2MCU avionics equipment, as shown in fig. 2, the electronic equipment is integrally composed of a middle frame 5, a left cover plate 1, a right cover plate 9, a handle 6, a debugging port cover plate 10, a data processing module 4, a storage module 2, a power module 7, a display module 8 and a CPU3 module;
the middle frame 5 adopts a milling integrated structure, and the middle plate thickness of the middle frame is 3-3.5 mm, so that heat dissipation of key high-heat-generating devices in the data module, the power module and the display module is facilitated, and the thickness of other parts is 1.5mm.
The bottom of the middle frame 5 is uniformly provided with groove structures along the long side direction, the weight reduction effect is achieved while the structural rigidity is improved, the groove width is 47.6mm, the groove depth is 7mm, and the groove spacing is 1.5mm.
The middle frame 5 is provided with a pillar up and down to provide positioning function for the data processing module, the power module and the display module.
The front of the middle frame 5 is provided with a handle 6, a debugging port cover plate 10 and a front lock, the rear is provided with a connector, the left side is provided with a left cover plate, and the right side is provided with a right cover plate.
The debugging port cover plate 10 is designed as a hinge, so that the debugging port is convenient to use, parts are not lost, and meanwhile, the beautiful industrial design requirements are met.
Screw hole spacing at the joint of the middle frame 5 and the cover plates at the left side and the right side is 46-55 mm.
Corresponding finger buckles are reserved at screw holes on two sides of the upper part of the middle frame 5, and limit guidance is provided for mounting and dismounting the left cover plate and the right cover plate.
The left cover plate 1 and the right cover plate 9 are respectively provided with an embedded handle, which can play a role in pulling and has good maintainability.
The left cover plate 1 and the right cover plate 9 are respectively provided with a heat dissipation boss, and the large-power-consumption heat devices of the modules on the left side and the right side dissipate heat through the cover plates.
The left cover plate 1 and the right cover plate 9 are provided with radiating fins, the height is 10-13 mm, the width is 1.5mm, and the distance between the radiating fins is 11.5mm, so that the high radiating performance is achieved.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the disclosure are intended to be covered by the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (7)
1. A high thermal efficiency chassis for mounting modules of an avionics device, the chassis comprising:
the middle frame is a frame-shaped structure with two open ends;
the module mounting plate is arranged in the middle frame, is arranged in parallel with openings at two ends of the middle frame and is arranged in a heat conduction way with the middle frame;
the left cover plate is used for buckling one opening of the middle frame, one surface close to the module mounting plate is provided with a plurality of heat conduction convex blocks, and one surface far away from the module mounting plate is provided with radiating fins;
the right cover plate is used for buckling the other opening of the middle frame, one surface close to the module mounting plate is provided with a plurality of heat conduction convex blocks, and the surface far away from the module mounting plate is provided with heat dissipation fins;
wherein: plate-shaped data modules, power modules and display modules are arranged on two sides of the module mounting plate; the heating devices on the data module, the power module and the display module, which are close to one end of the module mounting plate, are arranged in a heat conduction manner with the module mounting plate;
among the heating devices of data module, power module and display module, be close to the heat dissipation device laminating of left side apron the heat dissipation lug on the left side apron, be close to the heat dissipation device laminating of right side apron the heat dissipation lug on the right side apron.
2. The high heat dissipation efficiency chassis of claim 1, wherein the module mounting board is provided with a plurality of heat dissipation bumps; among the heating devices of the data module, the power module and the display module, the heat dissipation device close to the module mounting plate is attached to the heat dissipation protruding block on the module mounting plate.
3. The high heat dissipation efficiency chassis of claim 2, wherein the center frame is of unitary construction with the module mounting plate.
4. A high heat dissipation efficiency chassis according to claim 3, wherein the thickness of the plate of the middle frame is 1.3-1.7mm.
5. The high heat dissipation efficiency chassis of claim 4, wherein the module mounting plate has a plate thickness of 3-3.5 mm.
6. The high heat dissipation efficiency chassis of claim 5, wherein the long sides of the middle frame are uniformly arranged with groove structures.
7. The high heat dissipation efficiency chassis of claim 6, wherein the heat dissipation fins have a height of 10-13 mm, a width of 1.3-1.7mm, and a spacing between the heat dissipation fins of 11-12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322263479.5U CN220381554U (en) | 2023-08-22 | 2023-08-22 | High radiating efficiency machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322263479.5U CN220381554U (en) | 2023-08-22 | 2023-08-22 | High radiating efficiency machine case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220381554U true CN220381554U (en) | 2024-01-23 |
Family
ID=89572479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322263479.5U Active CN220381554U (en) | 2023-08-22 | 2023-08-22 | High radiating efficiency machine case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220381554U (en) |
-
2023
- 2023-08-22 CN CN202322263479.5U patent/CN220381554U/en active Active
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| GR01 | Patent grant | ||
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