CN217719516U - Cold and hot integrated device - Google Patents
Cold and hot integrated device Download PDFInfo
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- CN217719516U CN217719516U CN202221515501.XU CN202221515501U CN217719516U CN 217719516 U CN217719516 U CN 217719516U CN 202221515501 U CN202221515501 U CN 202221515501U CN 217719516 U CN217719516 U CN 217719516U
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- 230000007246 mechanism Effects 0.000 claims abstract description 117
- 230000007723 transport mechanism Effects 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims description 62
- 238000001816 cooling Methods 0.000 claims description 16
- 230000003028 elevating effect Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000010354 integration Effects 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 3
- 238000010622 cold drawing Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 238000000605 extraction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 201000009240 nasopharyngitis Diseases 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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Abstract
The application relates to the technical field of semiconductor manufacturing, and provides a cold and hot integrated device, which comprises: a hot plate; the first bearing lifting mechanism is arranged below the hot plate and can extend and protrude out of the upper surface of the hot plate; the cold plate is arranged at an interval with the hot plate; the second bearing lifting mechanism is arranged below the cold plate and can extend to protrude out of the upper surface of the cold plate; and the conveying mechanism is arranged in parallel with the connecting line of the hot plate and the cold plate and is used for conveying the wafer between the hot plate and the cold plate. The application provides a cold and hot integrated device, owing to set up transport mechanism between hot plate and cold drawing, its transport mechanism can in time convey the wafer that toasts the completion to cool off on the cold drawing, has avoided the problem of overbaking completely, has ensured the quality of product. The wafer is transmitted between the hot plate and the cold plate through the internal transmission mechanism, an external main arm is not needed to transmit the wafer, the operation is simpler, and the productivity of the equipment is improved.
Description
Technical Field
The application relates to the technical field of semiconductor manufacturing, in particular to a cold and hot integrated device.
Background
In the semiconductor chip manufacturing process, wafers are the most important material, and more than 90% of the electronic devices on the market are manufactured on the basis of wafers. Wafer processing need be through toasting and cooling, but current baking equipment is after toasting the completion to the wafer, must wait for outside arm idle after, just can take out the wafer that toasts the completion and put on the cold drawing and cool off, the negative glue is higher to the sensitivity of temperature, the time of waiting is longer can cause the overbaking scheduling problem to some processes are then must cool off the very first time after toasting the completion, and when outside arm downtime, the latency is then longer.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a cold and hot integrated device to solve the technical problem that the wafer can not be cooled in time after being baked in the prior art.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
the application provides a cold and hot integrated device, includes:
a hot plate;
the first bearing lifting mechanism is arranged below the hot plate and can extend and protrude out of the upper surface of the hot plate;
a cold plate spaced from the hot plate;
the second bearing lifting mechanism is arranged below the cold plate and can extend and protrude out of the upper surface of the cold plate;
the conveying mechanism is arranged in parallel with a connecting line of the hot plate and the cold plate, and the conveying mechanism is used for conveying wafers between the hot plate and the cold plate.
According to the above cold and heat integration apparatus, the transfer mechanism includes:
an electric cylinder;
the guide rod is connected with the electric cylinder, a sliding block is arranged on the guide rod, and the sliding block is connected with the guide rod in a sliding manner;
one end of the inner mechanical arm is connected with the sliding block, the other end of the inner mechanical arm is used for bearing the wafer, and the inner mechanical arm moves under the driving of the electric cylinder.
According to the cooling and heating integrated device, the internal robot arm comprises:
the connecting arm is connected with the sliding block;
the first bearing arm is perpendicular to the connecting arm and is connected with the connecting arm;
the second bearing arm is arranged at the end part of the first bearing arm and is vertical to the first bearing arm, and one end of the second bearing arm is connected with the end part of the first bearing arm;
the third bearing arm is arranged in parallel with the first bearing arm, and the other end of the second bearing arm is connected with the end part of the third bearing arm;
the first, second and third carrier arms form a Contraband font, and the opening of the Contraband font faces the hot plate.
According to the above cold and hot integrated device, the first load lifting mechanism comprises:
a first cylinder;
the first lifting support is arranged at the top of the first air cylinder and is connected with the first air cylinder;
the first lifting thimble is arranged at the top of the first lifting support and is connected with the first lifting support;
the hot plate is provided with a first lifting through hole, and the first lifting ejector pin extends out of the upper surface of the hot plate through the first lifting through hole.
According to the above cold and hot integrated device, the second load lifting mechanism comprises:
a second cylinder;
the second lifting support is arranged at the top of the second cylinder and is connected with the second cylinder;
the second lifting thimble is arranged at the top of the second lifting support and is connected with the second lifting support;
and a second lifting through hole is formed in the cold plate, and the second lifting thimble extends out of the upper surface of the cold plate through the second lifting through hole.
According to the cold and hot integrated device, the side covers are further arranged on the periphery of the hot plate, the lifting mechanism is arranged below the side covers, and the lifting mechanism drives the side covers to lift.
According to the above cold and hot integrated device, the elevating mechanism includes:
a third cylinder;
the support frame, the support frame is located the top of third cylinder and with the third cylinder is connected, just keeping away from of support frame one side of third cylinder is equipped with the draw-in groove, the bottom edge card of side cap is located in the draw-in groove and with the draw-in groove joint.
According to the cold and hot integrated device, a top cover is further arranged right above the hot plate, and an air suction hole is formed in the top cover.
According to the cold and heat integration device, a heat insulation plate is arranged between the hot plate and the cold plate.
According to the cold and hot integrated device, the cold and hot integrated device further comprises a shell, and the hot plate, the first bearing lifting mechanism, the cold plate, the second bearing lifting mechanism and the conveying mechanism are all arranged in the shell;
a first wafer inlet and outlet are formed in the side wall of the shell and correspond to the hot plate in position;
and a second wafer inlet and outlet is formed in the side wall of the shell and corresponds to the cold plate.
The application provides a cold and hot integrated device's beneficial effect lies in at least:
(1) The application provides a cold and hot integrated device owing to set up transport mechanism between hot plate and cold drawing, its transport mechanism can in time convey the wafer that toasts the completion to cool off on the cold drawing, has avoided the problem of overbaking completely, has ensured the quality of product.
(2) The application provides a cold and hot integrated device, through inside transport mechanism transmission wafer between hot plate and cold plate, no longer need outside main arm to convey the wafer, operate simpler, still improved the productivity of equipment.
(3) Although the hot plate, the first bearing lifting mechanism, the cold plate, the second bearing lifting mechanism and the conveying mechanism are integrated into one device, the functions of all the parts are independent, and therefore when the conveying mechanism is damaged or one of the cold plates or the hot plates is damaged, the rest cold plates or the hot plates can be used as common cold plates or hot plates.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of a cooling and heating integrated device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a cold and heat integrated device according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a cold and heat integration device according to an embodiment of the present application;
fig. 4-12 are schematic diagrams illustrating a process of transferring a wafer by a thermal integrated device according to an embodiment of the present application;
fig. 13 is a schematic structural diagram of a first load-bearing lifting mechanism according to an embodiment of the present disclosure;
fig. 14 is a schematic structural diagram of a second load-bearing lifting mechanism according to an embodiment of the present application;
fig. 15 is a schematic view of a connection structure between a lifting mechanism and a side plate according to an embodiment of the present application;
fig. 16 is a schematic structural diagram of a lifting mechanism according to an embodiment of the present application;
fig. 17 is a schematic structural diagram of a housing according to an embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
100. a cold and hot integrated device; 101. a housing; 1011. a first wafer inlet/outlet; 1012. a second wafer inlet and outlet; 110. a hot plate; 111. a first lifting through hole; 120. a first load-bearing lifting mechanism; 121. a first cylinder; 122. a first lifting support; 123. a first lifting thimble; 130. a cold plate; 131. a second lifting through hole; 140. a second load-bearing lifting mechanism; 141. a second cylinder; 142. a second lifting support; 143. a second lifting thimble; 150. a transport mechanism; 151. an electric cylinder; 152. a guide bar; 153. an internal mechanical arm; 1531. a connecting arm; 15311. a screw; 1532. a first carrying arm; 1533. a second carrying arm; 1534. a third carrying arm; 160. a side cover; 170. a lifting mechanism; 171. a third cylinder; 172. a support frame; 1721. a card slot; 180. a top cover; 181. an air exhaust hole; 190. a heat insulation plate; 200. a wafer; 300. an external master arm.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, the present embodiment provides a cooling and heating integrated device 100, including: a hot plate 110; a first carrying elevating mechanism 120, the first carrying elevating mechanism 120 being disposed below the hot plate 110 and being extendable to protrude from an upper surface of the hot plate 110; a cold plate 130, the cold plate 130 being spaced apart from the hot plate 110; a second carrying elevating mechanism 140, wherein the second carrying elevating mechanism 140 is disposed below the cold plate 130 and can extend to protrude out of the upper surface of the cold plate 130; a transfer mechanism 150, the transfer mechanism 150 being disposed parallel to a line connecting the hot plate 110 and the cold plate 130, the transfer mechanism 150 being configured to transfer the wafer 200 between the hot plate 110 and the cold plate 130.
The working principle and the working process of the cooling and heating integrated device 100 provided by the embodiment are as follows:
the first carrier lift mechanism 120 is controlled to move up and extend out of the upper surface of the hot plate 110, the external robot 300 is controlled to transfer the wafer 200 onto the first carrier lift mechanism 120, and then the first carrier lift mechanism 120 is controlled to move down, so that the wafer 200 is placed on the hot plate 110 and baking is started (see fig. 4 and 5).
After the baking is completed, the first load-bearing lifting mechanism 120 is controlled to ascend and lift the baked wafer 200.
After the transfer mechanism 150 is controlled to move to the hot plate 110, the first load-bearing lifting mechanism 120 is controlled to descend so as to place the wafer 200 on the transfer mechanism 150, the transfer mechanism 150 transfers the baked wafer 200 to the cold plate 130, and the next wafer 200 enters the hot plate 110 (see fig. 6 to 9).
The second load lift mechanism 140 is controlled to ascend and extend out of the upper surface of the cold plate 130 so as to lift the baked wafer 200 transferred by the transfer mechanism 150, and the transfer mechanism 150 moves to the initial position.
The second load lift mechanism 140 is controlled to descend to place the baked wafer 200 on the cold plate 130, and cooling is started (see fig. 10).
After the cooling is completed, the second load-bearing lift mechanism 140 is controlled to ascend to lift the cooled wafer 200, and the external master 300 is controlled to take out the cooled wafer 200 (see fig. 11 and 12).
The second carrier lift mechanism 140 is controlled to descend to wait for the next wafer 200 to enter.
The cold and heat integration device 100 provided by the embodiment has at least the following beneficial effects:
(1) In the cooling and heating integrated device 100 provided by this embodiment, since the transfer mechanism 150 is disposed between the hot plate 110 and the cold plate 130, the transfer mechanism 150 can transfer the baked wafer 200 to the cold plate 130 in time for cooling, thereby completely avoiding the problem of over-baking and ensuring the product quality.
(2) The integrated cooling and heating device 100 of the embodiment transfers the wafer 200 between the hot plate 110 and the cold plate 130 through the internal transfer mechanism 150, thereby eliminating the need for an external robot 300 to transfer the wafer 200, simplifying the operation and improving the throughput of the equipment.
(3) Although the hot plate 110, the first carrying elevating mechanism 120, the cold plate 130, the second carrying elevating mechanism 140 and the transporting mechanism 150 are integrated into one device, the functions of the components are independent, so that when the transporting mechanism 150 is damaged or one of the cold plate 130 or the hot plate 110 is damaged, the remaining cold plate 130 or the hot plate 110 can be used as a common cold plate 130 or hot plate 110.
In one embodiment, referring to fig. 1, the transfer mechanism 150 includes: an electric cylinder 151; the guide rod 152 is connected with the electric cylinder 151, a sliding block (not shown in the figure, the same applies below) is arranged on the guide rod 152, and the sliding block is connected with the guide rod 152 in a sliding manner; and an inner robot 153, one end of the inner robot 153 being connected to the slider, the other end of the inner robot 153 being configured to support the wafer 200, and the inner robot 153 being driven by the electric cylinder 151 to move. The cylinder 151 drives the slider on the guide 152 to slide along the guide 152, and the slider drives the inner robot 153 to slide on the guide 152, thereby transferring the wafer 200 between the hot plate 110 and the cold plate 130 by the inner robot 153. And the transmission mechanism 150 has a simple structure and operates stably.
In one embodiment, with continued reference to fig. 1, the inner robot arm 153 includes: a connecting arm 1531, the connecting arm 1531 being connected to the slider; a first carrying arm 1532, the first carrying arm 1532 is disposed perpendicular to the connecting arm 1531 and connected to the connecting arm 1531; a second carrying arm 1533, wherein the second carrying arm 1533 is disposed at an end of the first carrying arm 1532 and perpendicular to the first carrying arm 1532, and one end of the second carrying arm 1533 is connected to an end of the first carrying arm 1532; a third carrying arm 1534, wherein the third carrying arm 1534 is disposed parallel to the first carrying arm 1532, and the other end of the second carrying arm 1533 is connected to the end of the third carrying arm 1534; the first carrier arm 1532, the second carrier arm 1533, and the third carrier arm 1534 form a Contraband font, with Contraband font opening toward the thermal plate 110.
In the initial state, the internal robot arm 153 is disposed at one end of the cold plate 130, and the first, second and third carrying arms 1532, 1533 and 1534 of the internal robot arm 153 are configured to have a shape Contraband, and the opening of the shape Contraband faces the hot plate 110. When the inner robot 153 moves to the second carrying and lifting mechanism 140 and the first carrying and lifting mechanism 120, it is able to avoid interference with the second carrying and lifting mechanism 140 and the first carrying and lifting mechanism 120, so as to lift the wafer 200 conveniently, and the first carrying arm 1532, the second carrying arm 1533 and the third carrying arm 1534 form a Contraband font as a stable and simple supporting structure for lifting the wafer 200.
Optionally, the connecting arm 1531 is connected to the slider via a screw 15311. Not only can the connecting arm 1531 be stably connected to the slider by the screw 15311, but also the connecting arm can be easily disassembled.
Optionally, the connecting arm 1531 is fixedly connected to the middle portion of the first carrying arm 1532, so that the structure is more stable and firm. Optionally, the connecting arm 1531 is integral with the first carrier arm 1532.
Optionally, the second connecting arm 1531 is fixedly connected to the first connecting arm 1531, so that the structure is more stable and firm. Optionally, the second connecting arm 1531 is integral with the first connecting arm 1531.
Optionally, the third connecting arm 1531 is fixedly connected to the second connecting arm 1531, so that the structure is more stable and firm. Optionally, the third connecting arm 1531 and the second connecting arm 1531 are of a unitary construction.
In one embodiment, referring to fig. 2, 3 and 13, the first bearing and lifting mechanism 120 includes: a first cylinder 121; the first lifting bracket 122 is arranged at the top of the first cylinder 121, and the first lifting bracket 122 is connected with the first cylinder 121; the first lifting thimble 123 is arranged at the top of the first lifting support 122 and connected with the first lifting support 122; the hot plate 110 is provided with a first lifting through hole 111, and the first lifting thimble 123 extends out of the upper surface of the hot plate 110 through the first lifting through hole 111. Optionally, a first detector (not shown, the same applies below) is disposed on the first cylinder 121 for detecting the position of the operation process. The first bearing lifting mechanism 120 is simple in structure, stable in structure and stable in lifting operation.
When the first carrying lifting mechanism 120 is controlled to ascend, the specific working process of the first carrying lifting mechanism 120 is as follows: the first cylinder 121 is controlled to work, the first lifting support 122 is driven to move upwards through the action of the first cylinder 121, the first lifting support 122 drives the first lifting thimble 123 to move upwards, and the first lifting thimble 123 penetrates through the first lifting through hole 111 on the hot plate 110, so that the wafer 200 can be lifted.
When the first bearing lifting mechanism 120 is controlled to descend, the specific working process of the first bearing lifting mechanism 120 is as follows: the first cylinder 121 is controlled to work, the first lifting support 122 moves downwards under the action of the first cylinder 121, and the first lifting support 122 moves downwards to drive the first lifting thimble 123 to move downwards until the first lifting thimble 123 descends below the hot plate 110, so that the wafer 200 is placed on the hot plate 110.
Optionally, the first lifting support 122 includes at least three first support rods, each of the first support rods is provided with a first lifting thimble 123, and the hot plate 110 is provided with at least three first lifting through holes 111.
Optionally, the first lifting support 122 includes three first support rods, each of the first support rods is provided with a first lifting thimble 123, and the hot plate 110 is provided with three first lifting through holes 111. The first lifting support 122 is configured to include three first supporting rods, correspondingly, the number of the first lifting pins 123 is also three, and the connecting lines of the three first lifting pins 123 form a regular triangle, which can play a role in stably supporting the wafer 200 and save materials.
It should be understood that the number of the first lifting brackets 122 including the first supporting rods, the number of the first lifting pins 123, and the arrangement manner are not limited to the above, and other situations may also be possible, and are not limited herein.
In one embodiment, referring to fig. 2, 3 and 14, the second bearing and lifting mechanism 140 includes: the second cylinder 141; the second lifting bracket 142 is arranged at the top of the second air cylinder 141 and connected with the second air cylinder 141; the second lifting thimble 143 is disposed at the top of the second lifting support 142 and connected to the second lifting support 142; the cold plate 130 is provided with a second lifting through hole 131, and the second lifting thimble 143 extends out of the upper surface of the cold plate 130 through the second lifting through hole 131. Optionally, a second detector (not shown, the same applies below) is disposed on the second cylinder 141 for detecting the position of the operation process. The second bearing lifting mechanism 140 is simple in structure, stable in structure and stable in lifting operation.
When the second carrying lifting mechanism 140 is controlled to lift, the specific working process of the second carrying lifting mechanism 140 is as follows: the second cylinder 141 is controlled to work, the second lifting support 142 is driven to move upwards through the action of the second cylinder 141, the second lifting support 142 drives the second lifting thimble 143 to move upwards, and the second lifting thimble 143 penetrates through the second lifting through hole 131 of the cold plate 130, so that the wafer 200 can be jacked up.
When the second bearing lifting mechanism 140 is controlled to descend, the specific working process of the second bearing lifting mechanism 140 is as follows: the second cylinder 141 is controlled to work, the second lifting support 142 moves downwards under the action of the second cylinder 141, and the second lifting support 142 moves downwards to drive the second lifting thimble 143 to move downwards until the second lifting thimble 143 descends below the cold plate 130, so that the wafer 200 is placed on the cold plate 130.
Optionally, the second lifting support 142 includes at least three second support rods, each of the second support rods is provided with a second lifting thimble 143, and the hot plate 110 is provided with at least three second lifting through holes 131.
Optionally, the second lifting support 142 includes three second support rods, each of the second support rods is provided with a second lifting thimble 143, and the hot plate 110 is provided with three second lifting through holes 131. The second lifting support 142 is configured to include three second support rods, correspondingly, three second lifting pins 143 are provided, and the connecting lines of the three second lifting pins 143 form a regular triangle, which can play a role in stably supporting the wafer 200 and save materials.
It should be understood that the number of the second supporting rods included in the second lifting bracket 142, the number of the second lifting pins 143, and the arrangement of the second lifting pins are not limited to the above, and other situations may also be adopted, which are not limited herein.
In one embodiment, referring to fig. 2 and 3, a side cover 160 is further disposed around the hot plate 110, a lifting mechanism 170 is disposed below the side cover 160, and the lifting mechanism 170 drives the side cover 160 to lift. Arranging side covers 160 around the hot plate 110 to enclose the hot plate 110; and a lifting mechanism 170 is provided below the side cover 160, and the lifting mechanism 170 is used for controlling the lifting of the side cover 160. When the wafer 200 is placed on the hot plate 110 and needs to be baked, the lifting mechanism 170 is controlled to drive the side cover 160 to be lifted up so as to surround the hot plate 110, so that the baking of the wafer 200 can be started. After the baking is completed, the lifting mechanism 170 is controlled to drive the side cover 160 to descend, and the first load lifting mechanism 120 ascends to jack up the baked wafer 200, so that the inner robot 153 can transfer the baked wafer 200 conveniently.
In one embodiment, referring to fig. 15 and 16, the lifting mechanism 170 includes: a third cylinder 171; the supporting frame 172 is arranged above the third cylinder 171 and connected with the third cylinder 171, the supporting frame 172 is far away from one side of the third cylinder 171 and provided with a clamping groove 1721, and the bottom edge of the side cover 160 is clamped in the clamping groove 1721 and clamped with the clamping groove 1721. Optionally, a third detector (not shown, the same applies below) is disposed on the third cylinder 171 for detecting the position of the operation process. The lifting mechanism 170 is simple in structure and stable in structure, and the side cover 160 is driven to stably lift and run.
When the lifting mechanism 170 needs to be controlled to drive the side cover 160 to lift, the specific operation process of the lifting mechanism 170 is as follows: the third cylinder 171 is controlled to work, the support frame 172 is driven to move upwards through the action of the third cylinder 171, and the support frame 172 drives the side cover 160 to move upwards, so that the side cover 160 is driven to lift.
When the lifting mechanism 170 needs to be controlled to drive the side cover 160 to descend, the specific working process of the lifting mechanism 170 is as follows: the third cylinder 171 is controlled to work, the supporting frame 172 moves downwards under the action of the third cylinder 171, and the supporting frame 172 drives the side cover 160 to move downwards, so that the side cover 160 is driven to descend.
In one embodiment, referring to fig. 2 and 3, a top cover 180 is further disposed directly above the heat plate 110, and the top cover 180 is provided with a suction hole 181. The cooperation of the top cover 180, the side cover 160 and the hot plate 110 forms a sealed space, ensuring the internal temperature and cleanliness of the sealed space; the extraction hole 181 is used for externally connecting an extraction pipe to realize air extraction.
In one embodiment, referring to FIGS. 2 and 3, an insulating plate 190 is disposed between the hot plate 110 and the cold plate 130. The thermal shield 190 is provided to block temperature convection between the hot plate 190 and the cold plate 130.
In one embodiment, referring to fig. 17, the integrated cooling and heating device 100 further includes a housing 101, and the hot plate 110, the first carrying lifting mechanism 120, the cold plate 130, the second carrying lifting mechanism 140 and the transporting mechanism 150 are disposed in the housing 101. The integration of the hot plate 110, the first load bearing elevator mechanism 120, the cold plate 130, the second load bearing elevator mechanism 140, and the transport mechanism 150 within the enclosure 101 is achieved. The side wall of the housing 101 is provided with a first wafer inlet 1011, the first wafer inlet 1011 corresponds to the hot plate 110, and the arrangement of the first wafer inlet 1011 facilitates the wafer 200 to be placed in or taken out of the hot plate 110. The side wall of the housing 101 is provided with a second wafer inlet and outlet 1012, the second wafer inlet and outlet 1012 corresponds to the cold plate 130, and the second wafer inlet and outlet 1012 is arranged to facilitate placing or taking out the wafer 200 at the cold plate 130.
In summary, the present embodiment provides a cooling and heating integrated device 100, including: a hot plate 110; a first carrying elevating mechanism 120, the first carrying elevating mechanism 120 being disposed below the hot plate 110 and being extendable to protrude from an upper surface of the hot plate 110; a cold plate 130, the cold plate 130 being spaced apart from the hot plate 110; a second carrying elevating mechanism 140, wherein the second carrying elevating mechanism 140 is disposed below the cold plate 130 and can extend to protrude out of the upper surface of the cold plate 130; a transfer mechanism 150, the transfer mechanism 150 being disposed parallel to a line connecting the hot plate 110 and the cold plate 130, the transfer mechanism 150 being configured to transfer the wafer 200 between the hot plate 110 and the cold plate 130. (1) In the cooling and heating integrated device 100 provided by this embodiment, since the transfer mechanism 150 is disposed between the hot plate 110 and the cold plate 130, the transfer mechanism 150 can transfer the baked wafer 200 to the cold plate 130 in time for cooling, thereby completely avoiding the problem of over-baking and ensuring the product quality. (2) The integrated cooling and heating device 100 of the embodiment transfers the wafer 200 between the hot plate 110 and the cold plate 130 through the internal transfer mechanism 150, thereby eliminating the need for an external robot 300 to transfer the wafer 200, simplifying the operation and improving the throughput of the equipment. (3) Although the hot plate 110, the first carrying elevating mechanism 120, the cold plate 130, the second carrying elevating mechanism 140 and the transporting mechanism 150 are integrated into one device, the functions of the components are independent, so that when the transporting mechanism 150 is damaged or one of the cold plate 130 or the hot plate 110 is damaged, the remaining cold plate 130 or the hot plate 110 can be used as a general cold plate 130 or a general hot plate 110.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A cold-heat integrated device, comprising:
a hot plate;
the first bearing lifting mechanism is arranged below the hot plate and can extend and protrude out of the upper surface of the hot plate;
a cold plate spaced apart from the hot plate;
the second bearing lifting mechanism is arranged below the cold plate and can extend to protrude out of the upper surface of the cold plate;
the conveying mechanism is arranged in parallel with a connecting line of the hot plate and the cold plate, and the conveying mechanism is used for conveying wafers between the hot plate and the cold plate.
2. The integrated cold and heat apparatus according to claim 1, wherein the transfer mechanism comprises:
an electric cylinder;
the guide rod is connected with the electric cylinder, a sliding block is arranged on the guide rod, and the sliding block is connected with the guide rod in a sliding manner;
one end of the inner mechanical arm is connected with the sliding block, the other end of the inner mechanical arm is used for bearing the wafer, and the inner mechanical arm moves under the driving of the electric cylinder.
3. A cold and heat integration apparatus according to claim 2, wherein the internal robot arm comprises:
the connecting arm is connected with the sliding block;
the first bearing arm is perpendicular to the connecting arm and is connected with the connecting arm;
the second bearing arm is arranged at the end part of the first bearing arm and is vertical to the first bearing arm, and one end of the second bearing arm is connected with the end part of the first bearing arm;
the third bearing arm is arranged in parallel with the first bearing arm, and the other end of the second bearing arm is connected with the end part of the third bearing arm;
the first, second and third carrier arms form a Contraband font, and the opening of the Contraband font faces the hot plate.
4. The integrated cold and heat exchanger according to claim 1, wherein the first load lifting mechanism comprises:
a first cylinder;
the first lifting support is arranged at the top of the first air cylinder and is connected with the first air cylinder;
the first lifting thimble is arranged at the top of the first lifting support and is connected with the first lifting support;
the hot plate is provided with a first lifting through hole, and the first lifting ejector pin extends out of the upper surface of the hot plate through the first lifting through hole.
5. The integrated cold and heat exchanger according to claim 1, wherein the second load lifting mechanism comprises:
a second cylinder;
the second lifting support is arranged at the top of the second cylinder and is connected with the second cylinder;
the second lifting thimble is arranged at the top of the second lifting support and connected with the second lifting support;
and a second lifting through hole is formed in the cold plate, and the second lifting thimble extends out of the upper surface of the cold plate through the second lifting through hole.
6. The cooling and heating integrated device according to claim 1, wherein a side cover is further disposed around the hot plate, and a lifting mechanism is disposed below the side cover and drives the side cover to lift.
7. A cold and heat integration device according to claim 6, wherein the elevating mechanism comprises:
a third cylinder;
the support frame, the support frame is located the top of third cylinder and with the third cylinder is connected, just keeping away from of support frame one side of third cylinder is equipped with the draw-in groove, the bottom edge card of side cap is located in the draw-in groove and with the draw-in groove joint.
8. A cold and heat integration device according to claim 6, wherein a top cover is further provided directly above the hot plate, and the top cover is provided with a suction hole.
9. The heat and cold integration device of claim 1, wherein a thermal insulation plate is disposed between the hot plate and the cold plate.
10. A cold-heat integration device according to any one of claims 1 to 9, further comprising a housing, wherein the hot plate, the first load lifting mechanism, the cold plate, the second load lifting mechanism and the transport mechanism are provided in the housing;
a first wafer inlet and outlet is formed in the side wall of the shell and corresponds to the hot plate in position;
and a second wafer inlet and outlet is formed in the side wall of the shell and corresponds to the cold plate.
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CN202221515501.XU CN217719516U (en) | 2022-06-17 | 2022-06-17 | Cold and hot integrated device |
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CN202221515501.XU CN217719516U (en) | 2022-06-17 | 2022-06-17 | Cold and hot integrated device |
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