CN217691202U - Online equipment for Mini RGB die bonding - Google Patents

Abstract

The utility model discloses an online equipment for Mini RGB solid crystal, it includes the frame and the pushing away material subassembly, the feed subassembly, receive the material subassembly, move and carry subassembly and a plurality of solid brilliant units that are connected with the frame, the pushing away material subassembly with receive the material subassembly and locate the both ends of frame respectively, pushing away the material subassembly and set up with the feed subassembly is adjacent, a plurality of solid brilliant units set up between feed subassembly and receive the material subassembly, and a plurality of solid brilliant units arrange in proper order along the direction that the feed subassembly points to receive the material subassembly, it carries the subassembly to all be provided with between two arbitrary adjacent solid brilliant units; move and carry subassembly including mount pad, first transfer rail and second transfer rail, second transfer rail can be close to or keep away from first transfer rail. In the utility model, the feeding and crystal searching of the crystal rings of different chips are carried out by adopting different stations, thus improving the operation efficiency of the equipment; the equipment optimizes the layout of the whole machine, so that the equipment occupies a smaller area, has high automation degree, wide product compatibility range and increased production efficiency.

Description

Online equipment for Mini RGB die bonding

Technical Field

The utility model relates to an automation equipment technical field especially relates to an online equipment that is used for Mini RGB solid brilliant.

Background

With the fact that the chip size of the Mini LED is smaller and smaller, the die bonding precision of the traditional die bonding equipment can only meet the die bonding requirement of the traditional LED (large-size) chip, and for the Mini LED die bonding with small chip size and small die bonding distance, the die bonding precision (including XY position and angle deviation) of the equipment and the equipment productivity have higher requirements. In addition, the driven die bonding equipment can only bond one of the RGB optical chips, at least three pieces of equipment are required to complete GRB die bonding, or chips of other colors can be bonded again after a die ring replacement station is required, so that the die bonding process becomes complicated or the die ring station becomes complicated and bulky, which affects die bonding efficiency.

Therefore, there is a need to provide a new on-line apparatus for Mini RGB die bonding to solve the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing an online equipment that is used for Mini RGB solid brilliant aims at solving the problem of fixed inefficiency.

In order to achieve the above object, the present invention provides an online apparatus for Mini RGB die bonding, which comprises a frame, and a material pushing assembly, a material feeding assembly, a material receiving assembly, a transferring assembly and a plurality of die bonding units connected to the frame, wherein the material pushing assembly and the material receiving assembly are respectively disposed at two ends of the frame, the material pushing assembly is disposed adjacent to the material feeding assembly, the plurality of die bonding units are disposed between the material feeding assembly and the material receiving assembly, the plurality of die bonding units are sequentially disposed along a direction of the material feeding assembly pointing to the material receiving assembly, and the transferring assembly is disposed between any two adjacent die bonding units;

move and carry subassembly includes mount pad, first transfer orbit and second transfer orbit, the bottom of mount pad with the frame is connected, first transfer orbit is fixed in the top of mount pad, second transfer orbit with first transfer orbit sets up relatively, second transfer orbit with mount pad sliding connection, second transfer orbit can be close to or keep away from first transfer orbit, second transfer orbit with first transfer orbit cooperation is in order to remove the work piece of treating processing.

Optionally, a sliding groove is formed in the top of the mounting seat, a sliding portion is arranged at the bottom of the second conveying rail, and the sliding portion is slidably arranged in the sliding groove; and the first conveying rail and the second conveying rail are both provided with belt conveying mechanisms, and the two belt conveying mechanisms are matched to support and move the workpiece to be processed.

Optionally, the die bonder unit comprises a moving platform, a chip searching platform, a core pushing mechanism and a die bonder mechanism, wherein the moving platform is used for being in butt joint with the transfer assembly to receive the workpiece to be machined, the chip searching platform is used for pulling a chip to a working position, the core pushing mechanism is arranged on the lower side of the chip searching platform and used for pushing up the chip to enable the chip to be separated from a blue film, the die bonder mechanism is erected on the moving platform and the upper side of the chip searching platform and used for carrying the chip pushed up by the core pushing mechanism to the workpiece to be machined on the moving platform.

Optionally, the moving platform includes a bottom plate, a first sliding plate, a platform, a first linear driving element and a second linear driving element, the first sliding plate is slidably disposed on the bottom plate along a first direction, and the first linear driving element is disposed on the bottom plate and is configured to drive the first sliding plate; the platform along the second direction slide set up in on the first slide, second straight line driving piece set up in just be used for the drive on the first slide the platform, set up on the platform and pull the subassembly, pull the subassembly and be used for with move the butt joint of carrying the subassembly.

Optionally, the chip searching platform includes a base, a second sliding plate, a wafer ring platform, a fixture, a third linear driving member, a fourth linear driving member, and a first rotary driving member, the second sliding plate is slidably disposed on the base along a first direction, and the third linear driving member is disposed on the base and is configured to drive the second sliding plate; the crystal ring platform is arranged on the second sliding plate in a sliding mode along a second direction, and the fourth linear driving piece is arranged on the second sliding plate and used for driving the crystal ring platform; the fixture is rotationally connected with the crystal ring platform, and the first rotary driving part is used for driving the fixture.

Optionally, the ejection core mechanism includes mounting panel, first slip table, second slip table, first driving piece, second driving piece and third driving piece, first slip table along first direction slip set up in on the mounting panel, the second slip table along second direction slip set up in on the first slip table, first driving piece with the second driving piece branch is located the both sides of mounting panel, first driving piece passes through the cam mechanism drive first slip table, the second driving piece passes through the cam mechanism drive the second slip table, the third driving piece set up in on the second slip table, the third driving piece is used for jacking up the chip.

Optionally, the die bonder comprises a mounting rack, a swing arm, a rotary driving piece and a vertical driving piece, wherein the swing arm, the rotary driving piece and the vertical driving piece are arranged on the mounting rack, a suction nozzle used for sucking a chip is arranged on the swing arm, the rotary driving piece is used for driving the swing arm to rotate, and the vertical driving piece is used for driving the rotary driving piece and the swing arm to move along the vertical direction.

Optionally, the feeding assembly comprises a base, a discharging box, a first screw rod driving assembly and a first sliding plate, the first screw rod driving assembly and the first sliding plate are arranged on the base, the discharging box is connected with the first sliding plate in a sliding mode, and the first screw rod driving assembly is used for driving the discharging box to move.

Optionally, the material pushing assembly comprises a pneumatic system and an adjusting plate, the material pushing assembly is used for pushing the workpiece to be processed in the material discharging box to the moving platform, and the adjusting plate is used for adjusting the pushing depth of the pneumatic system.

Optionally, the material receiving assembly comprises a support, a supporting plate, a material box, a second lead screw driving assembly and a second sliding plate, the second lead screw driving assembly and the second sliding plate are arranged on the support, the material box is connected with the second sliding plate in a sliding mode, the second lead screw driving assembly is used for driving the material box to move, the material box is arranged on the supporting plate, and a belt conveying system is further arranged on the supporting plate.

In the technical scheme of the utility model, the workpiece to be processed is a substrate, and the material pushing component and the material feeding component are arranged on the left side of the frame and are used for feeding equipment or butting upstream equipment of a product; the receiving assembly is arranged at the right end of the rack and used for receiving the substrate or butting with downstream equipment, and the middle part of the rack is provided with a plurality of die bonding units and a plurality of transferring assemblies; the machine frame is internally provided with a pushing assembly, a feeding assembly, a receiving assembly, a transferring assembly and a control unit of a die bonding unit, the pushing assembly and the feeding assembly are used for automatically feeding a substrate to the equipment, the substrate is introduced into the die bonding unit, the transferring assembly is introduced into the next working die bonding unit after the die bonding unit at one station works, and similarly, the substrate is introduced into the receiving assembly after the three die bonding units work, so that the die bonding requirements of RGB chips are met, and meanwhile, the die ring feeding and die finding of different chips are carried out by adopting different stations, so that the operation efficiency of the equipment can be improved; the equipment optimizes the layout of the whole machine, so that the equipment occupies a smaller area, has high automation degree, wide product compatibility range and increased production efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an in-line apparatus for Mini RGB die bonding according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a pushing assembly according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of a feeding assembly according to an embodiment of the present invention;

FIG. 4 is a schematic structural view of a material receiving assembly in an embodiment of the present invention;

fig. 5 is a schematic structural view of a transfer assembly according to an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a die bonding unit according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a mobile platform according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a chip search platform according to an embodiment of the present invention;

fig. 9 is a schematic structural view of a core ejecting mechanism in an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a die bonding mechanism according to an embodiment of the present invention.

The reference numbers illustrate:

the realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In addition, the technical solutions of the embodiments of the present invention can be combined with each other, but it is necessary to use a person skilled in the art to realize the basis, and when the technical solutions are combined and contradictory to each other or cannot be realized, the combination of the technical solutions should not exist, and is not within the protection scope of the present invention.

As shown in fig. 1 to 10, in an embodiment of the present invention, the online apparatus for Mini RGB die bonding includes a frame 1, a material pushing assembly 2 connected to the frame 1, a material feeding assembly 3, a material receiving assembly 4, a die transferring assembly 5 and a plurality of die bonding units 6, wherein the material pushing assembly 2 and the material receiving assembly 4 are respectively disposed at two ends of the frame 1, the material pushing assembly 2 and the material feeding assembly 3 are disposed adjacent to each other, the plurality of die bonding units 6 are disposed between the material feeding assembly 3 and the material receiving assembly 4, and the plurality of die bonding units 6 are sequentially disposed along a direction from the material feeding assembly 3 to the material receiving assembly 4, and the die transferring assembly 5 is disposed between any two adjacent die bonding units; the transferring assembly 5 comprises an installation seat 51, a first conveying rail 52 and a second conveying rail 53, the bottom of the installation seat 51 is connected with the rack 1, the first conveying rail 52 is fixed at the top of the installation seat 51, the second conveying rail 53 is arranged opposite to the first conveying rail 52, the second conveying rail 53 is connected with the installation seat 51 in a sliding mode, the second conveying rail 53 can be close to or far away from the first conveying rail 52, and the second conveying rail 53 is matched with the first conveying rail 52 to move a workpiece to be processed.

In the embodiment, the workpiece to be processed is a substrate, and the pushing assembly 2 and the feeding assembly 3 are arranged on the left side of the rack 1 and used for feeding equipment or butting upstream equipment of a product; the receiving assembly 4 is arranged at the right end of the rack 1 and is used for receiving substrates or butting downstream equipment, and the middle part of the rack 1 is provided with a plurality of die bonding units 6 and a plurality of transfer assemblies 5; the machine frame 1 is internally provided with a pushing assembly 2, a feeding assembly 3, a receiving assembly 4, a transferring assembly 5 and a control unit of a die bonding unit 6, the pushing assembly 2 and the feeding assembly 3 are used for automatically providing substrate feeding for equipment, a substrate is introduced into the die bonding unit 6, the transferring assembly 5 is introduced into the next working die bonding unit 6 after the die bonding unit 6 at one station is worked, and similarly, the substrate is introduced into the receiving assembly 4 after the 3 groups of die bonding units 6 are worked, so that the die bonding requirements of RGB chips are met, and meanwhile, the die ring feeding and die finding of different chips are carried out by adopting different stations, so that the operation efficiency of the equipment can be improved; the equipment optimizes the layout of the whole machine, so that the equipment occupies a smaller area, has high automation degree, wide product compatibility range and increased production efficiency.

Referring to fig. 5, a sliding groove 511 is formed in the top of the mounting seat 51, and a sliding portion is arranged at the bottom of the second conveying rail 53 and is slidably disposed in the sliding groove 511; the first conveying track 52 and the second conveying track 53 are both provided with a belt conveying mechanism 541, and the two belt conveying mechanisms 541 are matched to support and move the workpiece to be processed. The base 621 is provided with a chute 511 board through an adapter, the first transmission track 52 is arranged at the right side of the chute 511 board, and a driving piece for driving the belt transmission is arranged at the rear end of the track; the second conveying rail 53 is installed at the left side of the sliding slot 511, and the rail width (the distance between the first conveying rail 52 and the second conveying rail 53) can be adjusted in the sliding slot 511 according to the size of the product, so that the product with different sizes can be compatible.

Specifically, please refer to fig. 6 in combination, the die bonding unit 6 includes a moving platform 61, a chip searching platform 62, a core pushing mechanism 63 and a die bonding mechanism 64, the moving platform 61 is used for being abutted to the transfer component 5 to receive the substrate, the chip searching platform 62 is used for pulling the chip to a working position, the core pushing mechanism 63 is disposed at a lower side of the chip searching platform 62, the core pushing mechanism 63 is used for pushing up the chip to separate the chip from the blue film, the die bonding mechanism 64 is erected at upper sides of the moving platform 61 and the chip searching platform 62, and the die bonding mechanism 64 is used for transporting the chip pushed up by the core pushing mechanism 63 to the substrate on the moving platform 61. The moving platform 61 is used for drawing the substrate to a specified position (including a loading position for connecting the substrate, a die bonding position and a blanking position for connecting and leading out the substrate), the chip searching platform 62 is used for drawing the chip to a specified working position (including a loading position for connecting the blue film of the die ring, a core ejecting position and a blanking position for connecting the blue film of the die ring), the core ejecting mechanism 63 ejects the core upwards to be separated from the blue film state, the die bonding mechanism 64 picks up the chip from the core ejecting mechanism 63 and places the chip on the substrate moving platform 61 at the specified working position, and the substrate moving platform 61, the chip searching platform 62, the core ejecting mechanism 63 and the die bonding mechanism 64 in the die bonding unit 6 cooperate together to complete unit die bonding operation.

In an embodiment, referring to fig. 7 in combination, the movable platform 61 includes a bottom plate 611, a first sliding plate 612, a platform 613, a first linear driving element 614 and a second linear driving element 615, the first sliding plate 612 is slidably disposed on the bottom plate 611 along a first direction, the first linear driving element 614 is disposed on the bottom plate 611 and is used for driving the first sliding plate 612; the platform 613 is slidably disposed on the first sliding plate 612 along the second direction, the second linear driving element 615 is disposed on the first sliding plate 612 and used for driving the platform 613, and the platform 613 is disposed with a traction assembly, which is used for being abutted to the transfer assembly 5. A transverse sliding rail, a first linear driving element 614 and a first sliding plate 612 which drive transverse movement are arranged on the bottom plate 611; the first sliding plate 612 is provided with a longitudinal slide rail, a second linear driving element 615 for driving the longitudinal movement, and a longitudinal sliding plate. The platform 613 is arranged on a longitudinal slide and the platform 613 is provided with a belt and a motor arranged to pull the substrate for introduction into the platform 613. The driving force for driving the transverse motion adopts double-power driving, and an iron-core-free motor is selected without the influence of tooth socket force, so that the platform 613 has more uniform output, better stress condition and quicker and more stable motion.

In one embodiment, referring to fig. 8, the chip search platform 62 includes a base 621, a second sliding plate 622, a wafer ring platform 623, a clamp 624, a third linear driving element 625, a fourth linear driving element 626, and a first rotary driving element 627, wherein the second sliding plate 622 is slidably disposed on the base 621 along a first direction, and the third linear driving element 625 is disposed on the base 621 and is used for driving the second sliding plate 622; the wafer ring stage 623 is slidably disposed on the second sliding plate 622 along the second direction, and the fourth linear driver 626 is disposed on the second sliding plate 622 and configured to drive the wafer ring stage 623; the chuck 624 is rotatably connected to the ring platform 623, and a first rotary driving member 627 is used to drive the chuck 624. The base 621 is provided with a transverse slide rail, a third linear driving element 625 and a second sliding plate 622 for driving transverse movement; a longitudinal slide rail, a second linear driving piece 615 for driving the longitudinal movement and a longitudinal slide plate are arranged on the second slide plate 622, a wafer ring platform 623 is arranged on the longitudinal slide plate, and the wafer ring platform 623 is driven by a first rotary driving piece 627 to rotate angularly; the crystal ring is provided with a chip for taking and fixing the crystal.

In an embodiment, please refer to fig. 9 in combination, the core ejecting mechanism 63 includes a mounting plate 631, a first sliding table 632, a second sliding table 633, a first driving element 634, a second driving element 635, and a third driving element 636, wherein the first sliding table 632 is slidably disposed on the mounting plate 631 along a first direction, the second sliding table 633 is disposed on the first sliding table 632 along a second direction, the first driving element 634 and the second driving element 635 are disposed on two sides of the mounting plate 631, the first driving element 634 drives the first sliding table 632 through a cam mechanism, the second driving element 635 drives the second sliding table 633 through the cam mechanism, the third driving element 636 is disposed on the second sliding table 633, and the third driving element 636 is used for ejecting a chip. The mounting plate 631 is provided with a transverse slide rail and a first driving element 634 for driving the transverse movement, the core ejecting mechanism 63 can transversely move through an eccentric structure, the transverse slide rail is provided with a first sliding table 632 capable of transversely moving, the first sliding table 632 is provided with a slide rail capable of longitudinally moving, a second driving element 635 for driving the longitudinal movement and a second sliding table 633 capable of longitudinally moving, and the second sliding table 633 is provided with a third driving element 636 for driving the vertical movement, so as to provide a driving force for ejecting the chip.

In an embodiment, referring to fig. 10 in combination, the die bonding mechanism 64 includes a mounting frame 641, and a swing arm 642, a rotary driving element 643 and a vertical driving element 644 which are disposed on the mounting frame 641, wherein the swing arm 642 is provided with a suction nozzle 645 for sucking the chip, the rotary driving element 643 is configured to drive the swing arm 642 to rotate, and the vertical driving element 644 is configured to drive the rotary driving element 643 and the swing arm 642 to move in a vertical direction. The number of the swing arms 642 is two, and the rotary driving element 643 can drive the swing arms 642 to reciprocate 180 degrees, and the suction nozzles 645 arranged on the swing arms 642 can continuously perform the crystal taking and crystal fixing actions. The die bonding mechanism 64 further comprises a die-taking visual system for positioning the die position on the die search platform 62 and feeding back the die position to the microcomputer system, the die bonding mechanism 64 further comprises a die-bonding visual system for positioning the die-bonding position on the substrate and feeding back the die-bonding position to the microcomputer system, and the rack 1 is provided with two groups of visual systems for respectively feeding back two groups of die angles of the suction nozzles 645 arranged on the swing arm 642 to the microcomputer system.

In an embodiment, referring to fig. 3, the feeding assembly 3 includes a base 31, a feeding box 32, and a first screw driving assembly 33 and a first sliding plate 34 disposed on the base 31, the feeding box 32 is slidably connected to the first sliding plate 34, and the first screw driving assembly 33 is used for driving the feeding box 32 to move. The first screw driving assembly 33 is used for driving the material box to move up and down, and a belt conveying system driven by a stepping motor is further arranged on the supporting plate 42 and used for connecting upstream equipment of a product.

In an embodiment, referring to fig. 2 in combination, the pushing assembly 2 includes a pneumatic system and an adjusting plate, the pushing assembly 2 is used for pushing the substrate in the cassette 32 to the moving platform 61, and the adjusting plate is used for adjusting the pushing depth of the pneumatic system.

In an embodiment, referring to fig. 4, the material receiving assembly 4 includes a support 41, a supporting plate 42, a material box, and a second screw rod driving assembly 44 and a second sliding plate 45 disposed on the support 41, the material box is slidably connected to the second sliding plate 45, the second screw rod driving assembly 44 is used for driving the material box to move, the material box is disposed on the supporting plate 42, and a belt conveying system is further disposed on the supporting plate 42. The support 41 is provided with a slide rail and a second lead screw driving assembly 44 which move in the vertical direction, the slide rail is provided with a second sliding plate 45, the second sliding plate 45 is provided with a support plate 42 for placing a material box 43, the second lead screw driving assembly 44 is used for driving the material box 43 to move up and down, and the support plate 42 is further provided with a belt conveying system driven by a stepping motor and used for connecting upstream equipment of a product.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the patent scope of the utility model, all be in the utility model discloses a under the design, utilize the equivalent structure transform of what the content of the description and the attached drawing was done, or direct/indirect application all includes in other relevant technical field the utility model discloses a patent protection is within range.

Claims (10)

1. The online equipment for Mini RGB die bonding is characterized by comprising a rack, and a material pushing assembly, a material feeding assembly, a material receiving assembly, a transferring assembly and a plurality of die bonding units which are connected with the rack, wherein the material pushing assembly and the material receiving assembly are respectively arranged at two ends of the rack, the material pushing assembly and the material feeding assembly are adjacently arranged, the plurality of die bonding units are arranged between the material feeding assembly and the material receiving assembly, the plurality of die bonding units are sequentially arranged along the direction of the material feeding assembly pointing to the material receiving assembly, and the transferring assembly is arranged between any two adjacent die bonding units;

move and carry subassembly including mount pad, first transfer rail and second transfer rail, the bottom of mount pad with the frame is connected, first transfer rail is fixed in the top of mount pad, second transfer rail with first transfer rail sets up relatively, second transfer rail with mount pad sliding connection, second transfer rail can be close to or keep away from first transfer rail, second transfer rail with first transfer rail cooperation is in order to remove the work piece of treating processing.

2. The on-line apparatus for Mini RGB die attach as claimed in claim 1, wherein the top of the mounting base is provided with a chute, the bottom of the second conveying track is provided with a sliding part, and the sliding part is slidably disposed in the chute; and the first conveying rail and the second conveying rail are both provided with belt conveying mechanisms, and the two belt conveying mechanisms are matched to support and move the workpiece to be processed.

3. The on-line apparatus for Mini RGB die attach according to claim 1, wherein the die attach unit comprises a moving platform, a chip search platform, a core attaching mechanism and a die attach mechanism, the moving platform is used for docking with the transfer component to receive the workpiece to be processed, the chip search platform is used for pulling a chip to a working position, the core attaching mechanism is disposed at a lower side of the chip search platform, the core attaching mechanism is used for jacking up the chip to separate the chip from a blue film, the die attach mechanism is disposed at an upper side of the moving platform and the chip search platform, and the die attach mechanism is used for transporting the chip jacked up by the core attaching mechanism to the workpiece to be processed on the moving platform.

4. The on-line apparatus for Mini RGB die attach as claimed in claim 3, wherein said movable platform comprises a base plate, a first slide plate, a platform, a first linear driving element and a second linear driving element, said first slide plate is slidably disposed on said base plate along a first direction, said first linear driving element is disposed on said base plate and is used for driving said first slide plate; the platform along the second direction slide set up in on the first slide, second linear driving piece set up in just be used for the drive on the first slide the platform, set up on the platform and pull the subassembly, pull the subassembly be used for with move the butt joint of carrying the subassembly.

5. The on-line apparatus for Mini RGB die attach as claimed in claim 3, wherein the chip search platform comprises a base, a second slide plate, a die ring platform, a fixture, a third linear driving member, a fourth linear driving member and a first rotary driving member, the second slide plate is slidably disposed on the base along a first direction, the third linear driving member is disposed on the base and is used for driving the second slide plate; the wafer ring platform is arranged on the second sliding plate in a sliding manner along a second direction, and the fourth linear driving piece is arranged on the second sliding plate and is used for driving the wafer ring platform; the fixture is rotationally connected with the crystal ring platform, and the first rotary driving part is used for driving the fixture.

6. The on-line apparatus for Mini RGB die attach of claim 3, wherein said core-ejecting mechanism comprises a mounting plate, a first sliding table, a second sliding table, a first driving member, a second driving member and a third driving member, said first sliding table is slidably disposed on said mounting plate along a first direction, said second sliding table is slidably disposed on said first sliding table along a second direction, said first driving member and said second driving member are disposed on two sides of said mounting plate, said first driving member is driven by said cam mechanism, said second driving member is driven by said cam mechanism, said third driving member is disposed on said second sliding table, said third driving member is used for ejecting chips.

7. The on-line apparatus for Mini RGB die attach as claimed in claim 3, wherein said die attach mechanism comprises a mounting frame, and a swing arm, a rotary driving member and a vertical driving member disposed on said mounting frame, said swing arm having a suction nozzle for sucking chips, said rotary driving member being used to drive said swing arm to rotate, said vertical driving member being used to drive said rotary driving member and said swing arm to move along a vertical direction.

8. The in-line apparatus for Mini RGB die bonding as claimed in any one of claims 1 to 7, wherein the feeding assembly comprises a base, a discharging box, and a first screw driving assembly and a first sliding plate disposed on the base, the discharging box is slidably connected to the first sliding plate, and the first screw driving assembly is used for driving the discharging box to move.

9. The on-line apparatus for Mini RGB die attach as claimed in claim 8, wherein the pusher assembly comprises a pneumatic system and an adjusting plate, the pusher assembly is used for pushing the workpiece to be processed in the magazine to the moving platform, and the adjusting plate is used for adjusting the pushing depth of the pneumatic system.

10. The on-line apparatus for Mini RGB die bonding as claimed in any one of claims 1 to 7, wherein the material receiving assembly comprises a support, a support plate, a magazine, and a second screw driving assembly and a second sliding plate disposed on the support, the magazine is slidably connected to the second sliding plate, the second screw driving assembly is used for driving the magazine to move, the magazine is disposed on the support plate, and a belt conveying system is further disposed on the support plate.

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