CN217691079U

CN217691079U - High-precision chip bonding tool

Info

Publication number: CN217691079U
Application number: CN202221294694.0U
Authority: CN
Inventors: 杨波
Original assignee: Chengdu Zhanyi Electronic Technology Co ltd
Current assignee: Chengdu Zhanyi Electronic Technology Co ltd
Priority date: 2022-05-27
Filing date: 2022-05-27
Publication date: 2022-10-28
Anticipated expiration: 2032-05-27

Abstract

The utility model discloses a frock of high accuracy bonding chip, it is including setting firmly chip positioning mechanism (2) and metal substrate positioning mechanism (3) on the lateral wall about conducting resin storage tank (1) respectively, chip positioning mechanism (2) are including setting firmly horizontal cylinder (4) on conducting resin storage tank (1) left side wall, the effect of horizontal cylinder (4) piston rod is served and has been set firmly fly leaf (5), the top surface of fly leaf (5) has set firmly lift cylinder (6), the effect of lift cylinder (6) piston rod is served and has set firmly on lift board (7), it has set firmly two locating piece (8) on the top surface of board (7), tang (9) have all been seted up on the terminal surface in two locating piece (8), the outline of tang (9) cooperatees with stabilizer blade (20) of chip (18). The utility model has the advantages that: compact structure, can be accurate glue the chip to metal substrate assigned position, need not artifical rubber coating.

Description

High-precision chip bonding tool

Technical Field

The utility model relates to a technical field that chip and metal substrate bonded in the assembly of radio frequency part, especially a high accuracy bonding chip's frock.

Background

The radio frequency part is mainly responsible for processing baseband digital signals generated by the baseband equipment to obtain radio frequency signals, and the radio frequency signals are transmitted to the outside through an antenna or received external radio frequency signals, and the baseband digital signals are obtained after processing and transmitted to the baseband equipment. The radio frequency part comprises a metal substrate, a chip and an aluminum base, and the operation steps of assembling the radio frequency part in a workshop are as follows: a worker firstly coats a conductive adhesive on one surface of a metal substrate to form a conductive adhesive layer on the metal substrate, then the worker adheres a chip to the conductive adhesive layer, the metal substrate is installed in a cavity of an aluminum base after the chip is fixed with the metal substrate, and therefore assembly of a radio frequency part is finally achieved, and as shown in fig. 1 to 2, the chip is adhered to the metal substrate.

Among them, in the step of bonding the chip 18 to the metal substrate 19, there are the following technical drawbacks:

I. the manual work of applying a layer of conductive paste on the surface of the metal substrate 19 is required, which undoubtedly increases the working strength of the worker.

II. The worker only adheres the chip 18 to the metal substrate 19 by experience, and cannot ensure that the chip 18 can be adhered to the specified position of the metal substrate 19 every time the chip 18 is adhered, so that the consistency of the product is poor, and the technical defect of low chip adhering precision exists. Therefore, a tool which can accurately adhere the chip to the specified position of the metal substrate without manual gluing is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, can be accurate glue the chip to the metal substrate assigned position, need not the frock of artifical rubber coated high accuracy bonding chip.

The purpose of the utility model is realized through the following technical scheme: a high-precision chip bonding tool comprises a chip positioning mechanism and a metal substrate positioning mechanism which are fixedly arranged on the left side wall and the right side wall of a conductive adhesive storage tank respectively, wherein the chip positioning mechanism comprises a horizontal cylinder fixedly arranged on the left side wall of the conductive adhesive storage tank, a movable plate is fixedly arranged on the action end of a piston rod of the horizontal cylinder, a lifting cylinder is fixedly arranged on the top surface of the movable plate, a lifting plate is fixedly arranged on the action end of the piston rod of the lifting cylinder, two positioning blocks are fixedly arranged on the top surface of the lifting plate, rabbets are respectively arranged on the inner end surfaces of the two positioning blocks, and the outer profiles of the rabbets are matched with supporting legs of a chip;

metal substrate positioning mechanism is including setting firmly the support on the conducting resin storage tank right side wall, the top of support sets firmly extends the mounting panel directly over the conducting resin storage tank, vertical cylinder has set firmly on the top surface of mounting panel, the piston rod of vertical cylinder runs through the mounting panel setting, and extend and serve the welding and have the sucking disc, the welding has the posting on the basal surface of sucking disc, the inner chamber of posting cooperatees with metal substrate's outline, set up the vacuum hole with the sucking disc intercommunication on the basal surface of sucking disc, each vacuum hole all communicates with the inner chamber of posting, sucking disc and vacuum pump connection.

The height of the positioning frame is smaller than the thickness of the metal substrate.

The left outer wall and the right outer wall of the conductive adhesive storage tank are respectively fixedly provided with a platform, the horizontal cylinder is fixedly arranged on the top surface of the left platform, and the support is welded on the top surface of the right platform.

The top surface of the sucker is provided with a joint communicated with the sucker, and the joint is connected with a working port of a vacuum pump through a hose.

The tool further comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the horizontal cylinder, the electromagnetic valve of the vertical cylinder and the electromagnetic valve of the lifting cylinder through signal wires.

The utility model has the advantages of it is following: the structure is compact, the chip can be accurately adhered to the designated position of the metal substrate, and manual gluing is not needed.

Drawings

FIG. 1 is a schematic view of a chip bonded to a metal substrate;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a schematic view of the present invention;

FIG. 4 is a schematic view of FIG. 3 taken along line A;

FIG. 5 is a schematic view of FIG. 3 taken along line B;

FIG. 6 is a schematic view of positioning a chip and a metal substrate;

FIG. 7 is a schematic view of FIG. 6 taken along line C;

FIG. 8 is a schematic view of a conductive paste being applied on the bottom surface of a metal substrate;

FIG. 9 is a schematic view of the chip being fed to the bonding station;

FIG. 10 is a schematic view of a chip bonded to a metal substrate;

in the figure, 1-conductive adhesive storage tank, 2-chip positioning mechanism, 3-metal substrate positioning mechanism, 4-horizontal cylinder, 5-movable plate, 6-lifting cylinder, 7-lifting plate, 8-positioning block, 9-spigot, 10-bracket, 11-mounting plate, 12-vertical cylinder, 13-sucker, 14-positioning frame, 15-vacuum hole, 16-platform, 17-joint, 18-chip, 19-metal substrate, 20-support leg.

Detailed Description

The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:

as shown in fig. 3 to 5, a high-precision chip bonding tool includes a chip positioning mechanism 2 and a metal substrate positioning mechanism 3 respectively fixed on left and right outer side walls of a conductive adhesive storage tank 1, the chip positioning mechanism 2 includes a horizontal cylinder 4 fixed on a left side wall of the conductive adhesive storage tank 1, a movable plate 5 is fixed on an action end of a piston rod of the horizontal cylinder 4, a lifting cylinder 6 is fixed on a top surface of the movable plate 5, a lifting plate 7 is fixed on an action end of a piston rod of the lifting cylinder 6, two positioning blocks 8 are fixed on a top surface of the lifting plate 7, inner end surfaces of the two positioning blocks 8 are both provided with a spigot 9, and an outer contour of the spigot 9 is matched with a support leg 20 of a chip 18.

Metal substrate positioning mechanism 3 is including setting firmly support 10 on 1 right side wall of conductive adhesive storage tank, and the top of support 10 has set firmly and extends in mounting panel 11 directly over conductive adhesive storage tank 1, and mounting panel 11 has set firmly vertical cylinder 12 on the top surface, and the piston rod of vertical cylinder 12 runs through mounting panel 11 and sets up, and extends to serve the welding and have sucking disc 13, be provided with rather than the joint 17 of intercommunication on the top surface of sucking disc 13, the work port of joint 17 and vacuum pump is through the hose connection, and the welding has a locating frame 14 on the basal surface of sucking disc 13, and the highly thickness that is less than metal substrate 19 of locating frame 14, and the inner chamber of locating frame 14 cooperatees with metal substrate 19's outline, offers the vacuum hole 15 with sucking disc 13 intercommunication on the basal surface of sucking disc 13, and each vacuum hole 15 all communicates with the inner chamber of locating frame 14, and sucking disc 13 and vacuum pump connection.

The left outer side wall and the right outer side wall of the conductive adhesive storage tank 1 are respectively fixedly provided with a platform 16, the horizontal cylinder 4 is fixedly arranged on the top surface of the left platform 16, and the support 10 is welded on the top surface of the right platform 16. The tool further comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the horizontal cylinder 4, the electromagnetic valve of the vertical cylinder 12 and the electromagnetic valve of the lifting cylinder 6 through signal wires.

The working process of the utility model is as follows:

s1, filling a certain amount of liquid conductive adhesive in a conductive adhesive storage tank 1 by a worker in advance;

s2, positioning the chip, namely taking one chip 18 by a worker, respectively and correspondingly embedding the support legs 20 on one side of the chip 18 into the stop openings 9 of the left positioning block 8, and simultaneously, respectively and correspondingly embedding the support legs 20 on the other side of the chip 18 into the stop openings 9 of the right positioning block 8, so that the chip 18 is positioned as shown in FIGS. 6 to 7;

s3, positioning and fixing the metal substrate, wherein a worker takes a metal substrate 19 of a chip to be bonded, the metal substrate 19 is embedded into an inner cavity of a positioning frame 14 from bottom to top, the inner cavity of the positioning frame 14 is matched with the outer contour of the metal substrate 19, so that the metal substrate 19 is positioned as shown in FIGS. 6 to 7, after positioning, the worker turns on a vacuum pump, the vacuum pump vacuumizes a hose, a connector 17, an inner cavity of a sucking disc 13 and a vacuum hole 15, the sucking disc 13 adsorbs the metal substrate 19 on the bottom surface under negative pressure, and therefore the metal substrate is fixed, and after the metal substrate 19 is fixed, the worker releases a hand supporting the metal substrate 19;

s4, coating conductive adhesive on the metal substrate, controlling a piston rod of the vertical cylinder 12 to extend downwards by a worker, driving the sucker 13 to move downwards by the piston rod, driving the adsorbed metal substrate 19 to move downwards by the sucker 13, enabling the metal substrate 19 to enter the conductive adhesive storage tank 1, and after the piston rod of the vertical cylinder 12 extends completely, enabling the bottom surface of the metal substrate 19 to just contact the liquid level of the conductive adhesive as shown in figure 8, so that a layer of conductive adhesive is coated on the bottom surface of the metal substrate 19; in the steps S3-S4, the metal is adsorbed and fixed through the sucking disc 13, and then the adsorbed metal substrate 19 is placed into the gluing station through the vertical air cylinder 12, so that a layer of conductive adhesive layer is coated on the bottom surface of the metal substrate 19, the conductive adhesive layer is not required to be coated on the bottom surface of the metal substrate manually, the working strength of workers is greatly reduced, and the labor cost is saved.

S5, after the glue is coated, a worker controls a piston rod of the vertical air cylinder 12 to retract upwards, the piston rod drives the sucker 13 to move upwards and simultaneously drives the metal substrate 19 coated with the conductive glue to move upwards, and when the piston rod retracts completely, the sucker 13 is in an initial state;

s6, a worker controls a piston rod of the horizontal cylinder 4 to extend rightwards, the piston rod drives the movable plate 5 to move rightwards, the movable plate 5 drives the lifting cylinder 6, the lifting plate 7 and a chip 18 on the lifting cylinder to synchronously extend rightwards, after the piston rod of the horizontal cylinder 4 completely extends out, the chip 18 is just positioned right below the metal substrate 19, and at the moment, the chip 18 is positioned at a bonding station as shown in FIG. 9;

s7, a worker controls a piston rod of the lifting cylinder 6 to extend upwards, the piston rod drives the lifting plate 7 to move upwards, the lifting plate 7 drives the positioning block 8 and the chip 18 to move upwards synchronously, and after the piston rod of the lifting cylinder 6 extends completely, the top surface of the chip 18 is just bonded on the conductive adhesive layer on the bottom surface of the metal substrate 19, so that the chip 18 is finally bonded on the metal substrate 19 as shown in FIG. 10;

s8, after staying for a period of time, the worker controls the piston rod of the lifting cylinder 6 to reset, after resetting, the worker controls the piston rod of the horizontal cylinder 4 to reset, the positioning block 8 is in an initial state, then the worker uses one hand to support the product, and then the vacuum pump is controlled to be closed, so that the product is taken away from the positioning frame 14;

and S9, repeating the operations of the steps S2 to S8 to produce a second product, and repeating the operations to continuously produce a plurality of products. The chip 18 in each product has all accomplished the location in step S2, and all accomplished the location and fixed in step S3 in the metal substrate 19 of every product, the locating position of chip 18 and metal substrate 19' S locating position are respectively at same initial position, thereby guaranteed in each product, the position that chip 18 bonds on metal substrate 19 is unanimous all the time, thereby very big improvement the uniformity of product, compare traditional mode of bonding the chip, very big improvement the precision of bonding chip 18, have the technical characterstic that the precision is high.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a frock of high accuracy bonding chip which characterized in that: the conductive adhesive storage tank comprises a chip positioning mechanism (2) and a metal substrate positioning mechanism (3) which are fixedly arranged on the left side wall and the right side wall of a conductive adhesive storage tank (1) respectively, wherein the chip positioning mechanism (2) comprises a horizontal cylinder (4) fixedly arranged on the left side wall of the conductive adhesive storage tank (1), a movable plate (5) is fixedly arranged on the action end of a piston rod of the horizontal cylinder (4), a lifting cylinder (6) is fixedly arranged on the top surface of the movable plate (5), a lifting plate (7) is fixedly arranged on the action end of the piston rod of the lifting cylinder (6), two positioning blocks (8) are fixedly arranged on the top surface of the lifting plate (7), the inner end faces of the two positioning blocks (8) are respectively provided with a spigot (9), and the outline of the spigot (9) is matched with support legs (20) of a chip (18);

metal substrate positioning mechanism (3) is including setting firmly support (10) on conductive adhesive storage tank (1) right side wall, the top of support (10) has set firmly mounting panel (11) extending directly over conductive adhesive storage tank (1), vertical cylinder (12) have set firmly on the top surface of mounting panel (11), the piston rod of vertical cylinder (12) runs through mounting panel (11) and sets up, and the welding has sucking disc (13) on the extension end, the welding has locating frame (14) on the basal surface of sucking disc (13), the inner chamber of locating frame (14) cooperatees with the outline of metal substrate (19), vacuum hole (15) with sucking disc (13) intercommunication are seted up on the basal surface of sucking disc (13), each vacuum hole (15) all communicate with the inner chamber of locating frame (14), sucking disc (13) and vacuum pump connection.

2. The tool for bonding the chip with high precision as claimed in claim 1, wherein: the height of the positioning frame (14) is smaller than the thickness of the metal substrate (19).

3. The tool for bonding the chip with high precision according to claim 1, characterized in that: all set firmly platform (16) on the lateral wall about conducting resin storage tank (1), horizontal cylinder (4) set firmly on the top surface of left side platform (16), support (10) weld on the top surface of right side platform (16).

4. The tool for bonding the chip with high precision as claimed in claim 1, wherein: the top surface of the sucker (13) is provided with a joint (17) communicated with the sucker, and the joint (17) is connected with a working port of a vacuum pump through a hose.

5. The tool for bonding the chip with high precision as claimed in claim 1, wherein: the tool further comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the horizontal cylinder (4), the electromagnetic valve of the vertical cylinder (12) and the electromagnetic valve of the lifting cylinder (6) through signal wires.