CN217641231U

CN217641231U - Device for double-sided chip bonding on substrate

Info

Publication number: CN217641231U
Application number: CN202221364962.1U
Authority: CN
Inventors: 杨波
Original assignee: Chengdu Zhanyi Electronic Technology Co ltd
Current assignee: Chengdu Zhanyi Electronic Technology Co ltd
Priority date: 2022-06-02
Filing date: 2022-06-02
Publication date: 2022-10-21
Anticipated expiration: 2032-06-02

Abstract

The utility model discloses a device for double-sided chip adhesion on a substrate, which comprises a portal frame (2) fixedly arranged on a workbench (1), a bin (3) which runs through the workbench (1) is fixedly arranged in the workbench (1), the outline of the inner cavity of the bin (3) is matched with the outline of a metal substrate (15), a material ejecting cylinder (5) is fixedly arranged at the bottom of a support (4), a piston rod of the material ejecting cylinder (5) upwards runs through the support (4) and is arranged, a top plate (6) is fixedly arranged on an extending end, and the top plate (6) extends into the inner cavity of the bin (3); two vertical cylinders (7) are fixedly arranged on a cross beam of the portal frame (2), piston rods of the two vertical cylinders (7) penetrate through the cross beam downwards, and a clamping mechanism (8) is arranged on the extending end. The beneficial effects of the utility model are that: compact structure, electrically conductive sticky staff of preventing, greatly alleviate workman working strength, greatly improve chip bonding efficiency.

Description

Device for double-sided chip bonding on substrate

Technical Field

The utility model relates to a bond the technical field of chip on two terminal surfaces of metal substrate, especially a device that is used for two-sided chip that glues on the base plate.

Background

The radio frequency part is mainly responsible for processing baseband digital signals generated by the baseband equipment to obtain radio frequency signals, and the radio frequency signals are transmitted to the outside through an antenna or received external radio frequency signals, and the baseband digital signals are obtained after processing and transmitted to the baseband equipment.

The assembly operation method of the radio frequency part comprises the following steps: a worker places a metal substrate on a workbench, then coats a conductive adhesive layer on the top surface of the metal substrate, then bonds chips on the conductive adhesive layer, turns over the metal substrate after bonding, coats a conductive adhesive layer on the other surface, and then bonds another chip on the conductive adhesive layer, so that the bonding of the metal substrate and the two chips is realized, and after bonding, the worker installs the metal substrate on an aluminum base, so that the assembly of a radio frequency part is finally realized. As shown in fig. 1, two chips are bonded to a metal substrate 15.

However, although the radio frequency part assembling method in use in a workshop can realize the assembly of the metal substrate and the two chips, the worker still has the following technical defects in the actual operation process:

1. in the gluing process, a metal substrate needs to be manually pressed by one hand, and then manual gluing is carried out, so that the conductive adhesive is often coated on the hands of people, and great inconvenience is brought to the cleaning operation in the later period.

2. Need artifical turn-over metal substrate, the turn-over in-process, on workman's hand still probably touched the conductive adhesive layer that has scribbled, further lead to the conductive adhesive to glue on the staff, for the clearance operation in later stage, brought very big inconvenience, artifical turn-over has increased workman's working strength undoubtedly simultaneously.

3. Before gluing, the metal substrates need to be manually taken out from the basketry one by one and then placed on a dry workbench for gluing, so that the working strength of workers is increased undoubtedly, and the efficiency of gluing chips is greatly reduced. Therefore, a device for preventing the conductive adhesive from adhering to hands, greatly reducing the working strength of workers and greatly improving the chip adhesion efficiency is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, prevent that electrically conductive glue to the staff, greatly alleviate workman working strength, greatly improve the device that is used for two-sided chip that glues on the base plate of chip bonding efficiency.

The purpose of the utility model is realized through the following technical scheme: a device for double-sided chip adhesion on a substrate comprises a portal frame fixedly arranged on a workbench, wherein a bin penetrating through the workbench is fixedly arranged in the workbench, the outer contour of the inner cavity of the bin is matched with the outer contour of a metal substrate, a support is fixedly arranged on the bottom surface of the workbench and below the bin, a material ejecting cylinder is fixedly arranged at the bottom of the support, a piston rod of the material ejecting cylinder penetrates through the support upwards, a top plate is fixedly arranged on an extending end of the piston rod, and the top plate extends into the inner cavity of the bin;

two vertical cylinders are fixedly arranged on the portal frame beam, piston rods of the two vertical cylinders all penetrate through the beam downwards to be arranged, the extension end is provided with a clamping mechanism, the clamping mechanism comprises a lifting plate fixedly arranged on the action end of a vertical cylinder piston rod, a stepping motor fixedly arranged on the top surface of the lifting plate, the level of the stepping motor is arranged, a cantilever is welded on an output shaft of the stepping motor, a clamping cylinder fixedly arranged on the cantilever and provided with a level, an L plate is arranged on the action end of the clamping cylinder piston rod, a vertical plate of the L plate is fixedly arranged on the action end of the clamping cylinder piston rod, and the horizontal plate of the L plate is arranged towards the storage bin.

And a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench.

Set up in the workstation and lead to the groove with feed bin outline matched with, the feed bin welds in leading to the inslot.

The bottom surface of the horizontal plate of the L-plate is flush with the top surface of the silo.

The two clamping mechanisms are arranged in bilateral symmetry relative to the storage bin.

The clamping cylinder is arranged right above the stepping motor.

And a strip-shaped groove is formed in the rear wall of the storage bin along the length direction of the storage bin.

The device also comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the vertical cylinder, the electromagnetic valve of the clamping cylinder, the electromagnetic valve of the material ejecting cylinder and the stepping motor through signal wires.

The utility model has the advantages of it is following: the anti-conductive adhesive is adhered to hands of workers, the working strength of workers is greatly reduced, and the chip adhesion efficiency is greatly improved.

Drawings

FIG. 1 is a schematic view of two chips bonded to a metal substrate;

FIG. 2 is a schematic structural view of the present invention;

FIG. 3 is a cross-sectional view B-B of FIG. 2;

fig. 4 is a schematic structural view of the clamping mechanism of the present invention;

FIG. 5 is a schematic view of the present invention lifting the topmost metal substrate I;

FIG. 6 is a schematic view of the present invention clamping a metal substrate I;

FIG. 7 is a schematic view of a metal substrate entering a die attach station;

in the figure, 1-a workbench, 2-a portal frame, 3-a storage bin, 4-a support, 5-a material ejecting cylinder, 6-a top plate, 7-a vertical cylinder, 8-a clamping mechanism, 9-a lifting plate, 10-a stepping motor, 11-a cantilever, 12-a clamping cylinder, 13-an L plate, 14-a strip groove, 15-a metal substrate and 16-a metal substrate I.

Detailed Description

The present invention will be further described with reference to the accompanying drawings, and the protection scope of the present invention is not limited to the following:

as shown in fig. 2 to 4, a device for double-sided chip bonding on a substrate comprises a portal frame 2 fixedly arranged on a workbench 1, a bin 3 arranged through the workbench 1 is fixedly arranged in the workbench 1, the outer contour of the inner cavity of the bin 3 is matched with the outer contour of a metal substrate 15, a support 4 is fixedly arranged on the bottom surface of the workbench 1 and below the bin 3, a material ejecting cylinder 5 is fixedly arranged at the bottom of the support 4, a piston rod of the material ejecting cylinder 5 upwards penetrates through the support 4, a top plate 6 is fixedly arranged on an extending end, and the top plate 6 extends into the inner cavity of the bin 3;

two vertical cylinders 7 are fixedly arranged on the cross beam of the portal frame 2, piston rods of the two vertical cylinders 7 all penetrate through the cross beam downwards, the extension end is provided with a clamping mechanism 8, the two clamping mechanisms 8 are arranged in a manner of bilateral symmetry relative to the storage bin 3, the clamping mechanism 8 comprises a lifting plate 9 fixedly arranged on the action end of the piston rod of the vertical cylinder 7, a stepping motor 10 fixedly arranged on the top surface of the lifting plate 9, the stepping motor 10 is horizontally arranged, a cantilever 11 is welded on an output shaft of the stepping motor 10, a clamping cylinder 12 horizontally arranged is fixedly arranged on the cantilever 11, the clamping cylinder 12 is arranged right above the stepping motor 10, an L plate 13 is arranged on the action end of the piston rod of the clamping cylinder 12, a vertical plate of the L plate 13 is fixedly arranged on the action end of the piston rod of the clamping cylinder 12, a horizontal plate of the L plate 13 is arranged towards the storage bin 3, and the bottom surface of the horizontal plate of the L plate 13 is flush with the top surface of the storage bin 3.

And a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench 1. A through groove matched with the outline of the stock bin 3 is formed in the workbench 1, and the stock bin 3 is welded in the through groove. A strip-shaped groove 14 is formed in the rear wall of the stock bin 3 along the length direction of the rear wall, so that a worker can conveniently place a metal substrate into the stock bin 3.

The device still includes the controller, the solenoid valve of controller and vertical cylinder 7, the solenoid valve of die clamping cylinder 12, the solenoid valve and the step motor 10 of liftout cylinder 5 are connected through the signal line electricity, and the workman accessible controller control vertical cylinder 7, die clamping cylinder 12, the stretching out or the withdrawal of liftout cylinder 5 piston rod, still can control step motor 10's start-up or close simultaneously to very big make things convenient for workman's operation, have the characteristics that degree of automation is high.

The working process of the utility model is as follows:

s1, a worker puts a plurality of metal substrates 15 to be adhered with chips into an inner cavity of a storage bin 3 from top to bottom, and stacks the metal substrates 15 on the top surface of a top plate 6, so that the metal substrates are fed, and the top surface of the topmost metal substrate I16 is flush with the top surface of the storage bin 3;

s2, a worker controls a piston rod of the material ejecting cylinder 5 to extend upwards, the piston rod drives the top plate 6 to move upwards, the top plate 6 ejects all the stacked metal substrates 15 upwards, and when the movement stroke of the piston rod is equal to the thickness of one metal substrate, the metal substrate I16 at the topmost layer is just exposed outside the storage bin 3 and is positioned between the horizontal plates of the two L plates 13 as shown in FIG. 5;

s3, a worker controls the piston rods of the two clamping cylinders 12 to extend out, the piston rods drive the L-shaped plates 13 to move towards the direction of the metal substrate I16, and after the piston rods of the clamping cylinders 12 extend out completely, the metal substrate I16 is clamped between the horizontal plates of the two L-shaped plates 13, so that the metal substrate I16 is clamped as shown in FIG. 6;

s4, a worker controls piston rods of two vertical cylinders 7 to retract upwards at the same time, the piston rods drive a lifting plate 9 to move upwards, the lifting plate 9 drives a stepping motor 10 and a clamping cylinder 12 to move upwards synchronously, and further drives a clamped metal substrate I16 to move upwards, when the piston rods of the vertical cylinders 7 retract completely, the metal substrate I16 enters a chip bonding station as shown in FIG. 7, at the moment, the worker coats a conductive adhesive layer on the top surface of the metal substrate I16, then bonds a chip on the conductive adhesive layer, after bonding, the worker controls two stepping motors 10 to start synchronously, the stepping motor 10 drives a cantilever 11 to rotate, the cantilever 11 drives an L plate 13 to rotate, and further drives the metal substrate I16 to rotate, when the metal substrate I16 turns over for 180 degrees, a controller controls the stepping motor 10 to be turned off, at the moment, the worker coats the conductive adhesive on the other surface of the metal substrate I16, and bonds a second chip on the conductive adhesive layer after coating, so that the chips are bonded on two surfaces of the metal substrate I16 finally; in this step S4, the metal substrate I16 is sandwiched between the horizontal plates of the two L-plates 13, so that there is no need to manually press the metal substrate with a hand, thereby avoiding conductive adhesion to a human hand. In addition, this device passes through two step motor 10 with metal substrate upset 180 to realize metal substrate's automatic turn-over, consequently need not artifical turn-over, not only avoided the electrically conductive glue to the workman on hand, simultaneously very big work strength who has alleviateed the workman.

S6, after the chips are bonded for a period of time, the conductive adhesive is solidified, the metal substrate I16 bonded with the chips is dragged by hands, and then the piston rods of the two clamping cylinders 12 are controlled to retract simultaneously, so that the metal substrate I16 is taken away;

s7, after the L-shaped plate 13 is taken away, a worker controls the two stepping motors 10 to rotate reversely, when the L-shaped plate 13 is turned over for 180 degrees reversely, the worker controls the piston rods of the two vertical cylinders 7 to extend out simultaneously, and when the piston rods extend out completely, the two clamping mechanisms 8 enter an initial state;

and S8, repeating the operation of the steps S2 to S7, namely bonding the chips on the two surfaces of the second metal substrate, and repeating the operation to bond the chips on all the metal substrates in the bin 3. Consequently, need not the manual work and glue the chip again behind the metal substrate of taking from the charging basket, but through clamping mechanism 8 and vertical cylinder 7's cooperation, the metal substrate of automatic taking to very big work strength who has alleviateed the workman, and then very big improvement the bonding efficiency of chip.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a device that is used for two-sided chip that glues on base plate, it is including setting firmly portal frame (2) on workstation (1), its characterized in that: a bin (3) penetrating through the workbench (1) is fixedly arranged in the workbench (1), the outer contour of the inner cavity of the bin (3) is matched with the outer contour of the metal substrate (15), a support (4) is fixedly arranged on the bottom surface of the workbench (1) and below the bin (3), a material ejecting cylinder (5) is fixedly arranged at the bottom of the support (4), a piston rod of the material ejecting cylinder (5) penetrates through the support (4) upwards, a top plate (6) is fixedly arranged on the extending end of the piston rod, and the top plate (6) extends into the inner cavity of the bin (3);

portal frame (2) crossbeam is last to set firmly two vertical cylinders (7), the piston rod of two vertical cylinders (7) all runs through the crossbeam setting downwards, and extend and serve and be provided with clamping mechanism (8), clamping mechanism (8) are including setting firmly lifter plate (9) on vertical cylinder (7) piston rod effect end, set firmly step motor (10) on lifter plate (9) top surface, step motor (10) level sets up, and the welding has cantilever (11) on the output shaft of step motor (10), set firmly centre gripping cylinder (12) that the level set up on cantilever (11), be provided with L board (13) on the effect end of centre gripping cylinder (12) piston rod, the vertical plate of L board (13) sets firmly on the effect end of centre gripping cylinder (12) piston rod, the horizontal plate of L board (13) sets up towards feed bin (3).

2. The apparatus of claim 1, wherein the apparatus further comprises: the bottom surface of the workbench (1) is fixedly provided with a plurality of supporting legs supported on the ground.

3. The apparatus of claim 1, wherein the apparatus comprises: set up in workstation (1) and feed bin (3) outline matched with logical groove, feed bin (3) weld in leading to the inslot.

4. The apparatus of claim 1, wherein the apparatus further comprises: the bottom surface of the horizontal plate of the L-plate (13) is flush with the top surface of the silo (3).

5. The apparatus of claim 1, wherein the apparatus comprises: the two clamping mechanisms (8) are arranged in bilateral symmetry relative to the storage bin (3).

6. The apparatus of claim 1, wherein the apparatus comprises: and the clamping cylinder (12) is arranged right above the stepping motor (10).

7. The apparatus of claim 1, wherein the apparatus comprises: and a strip-shaped groove (14) is formed in the rear wall of the stock bin (3) along the length direction of the stock bin.

8. The apparatus of claim 1, wherein the apparatus comprises: the device also comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the vertical cylinder (7), the electromagnetic valve of the clamping cylinder (12), the electromagnetic valve of the ejection cylinder (5) and the stepping motor (10) through signal wires.