CN217641278U - Wafer ceramic dish snatchs assembly - Google Patents
Wafer ceramic dish snatchs assembly Download PDFInfo
- Publication number
- CN217641278U CN217641278U CN202221876391.XU CN202221876391U CN217641278U CN 217641278 U CN217641278 U CN 217641278U CN 202221876391 U CN202221876391 U CN 202221876391U CN 217641278 U CN217641278 U CN 217641278U
- Authority
- CN
- China
- Prior art keywords
- vacuum
- assembly
- sucking disc
- vacuum circuit
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a ceramic wafer dish snatchs assembly, be used for installing on the arm, include the sucking disc of being connected the platform and outwards extending respectively along being connected a platform both ends of being connected with the arm, the sucking disc is including the sealing ring that the surrounding edge department outwards extends, and be located the sucking disc and locate the many rings of pad backing ring of sealing ring inner circle department, enclose each other between the adjacent pad backing ring and close and form an at least vacuum circuit, set up an at least vacuum opening that runs through the sucking disc perpendicularly in the vacuum circuit, set up an at least logical groove in directional sucking disc centre of a circle on the vacuum circuit, so that adjacent vacuum circuit intercommunication, so that the vacuum opening can create vacuum condition in the vacuum circuit arbitrary department, consequently, arrange the vacuum opening in the vacuum circuit and can be located vacuum circuit optional position, so that follow-up corresponding vacuum opening external pipeline arrange.
Description
Technical Field
The utility model relates to a semiconductor technology field, in particular to ceramic wafer dish snatchs assembly.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent.
Wafer processing belongs to the high-precision processing industry, and small errors have certain influence on the wafer processing result, and finally affect the product quality. The wafer disc is a structure for placing wafers in laser cutting and other processes, and when the wafer disc made of ceramic is grabbed, in order to ensure that the wafer disc made of ceramic materials cannot be damaged in the grabbing process, the wafer disc is usually sucked and grabbed by a sucker.
Current sucker structure adopts the mark target formula structure that the skew of ring cover ring formed usually, and forms an independent at least vacuum channel between ring and ring, for guaranteeing independent vacuum channel's adsorption effect, need set up the vacuum of correspondence and inhale the hole on every vacuum channel, and still need correspond every vacuum and inhale hole one end and connect the vacuum pipe, and then cause external vacuum pipeline more, set up comparatively complicatedly.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model aims at providing a wafer ceramic dish snatchs assembly aims at solving and is offering the vacuum of correspondence and inhale the hole on every vacuum channel among the prior art, and still need to correspond every vacuum and inhale hole one end and connect the vacuum pipe, and then causes external vacuum pipeline more, sets up comparatively complicated problem.
An embodiment of the utility model provides a wafer ceramic dish snatchs assembly for on the arm, include with the connection platform that the arm is connected and follow connect the sucking disc that the platform both ends outwards extended respectively, the sucking disc includes the sealing ring that the surrounding edge department outwards extended, and is located just locate on the sucking disc the many rings of sealing ring inner circle department are filled up and are leaned on the ring, and are adjacent fill up and lean on to enclose each other between the ring and close and form an at least vacuum circuit, it runs through perpendicularly to have seted up in the vacuum circuit at least a vacuum opening of sucking disc, it is directional to have seted up on the vacuum circuit at least one logical groove in the sucking disc centre of a circle, so that adjacent vacuum circuit intercommunication.
The vacuum sucking disc structure comprises a vacuum sucking disc, a vacuum sucking hole and a vacuum guide pipe, wherein the vacuum sucking disc is provided with a vacuum hole, the vacuum hole is formed in the vacuum sucking disc, the vacuum hole is communicated with the vacuum circuit, the adjacent vacuum circuit is formed between the adjacent cushion leaning rings, so that the vacuum hole can create a vacuum condition at any position of the vacuum circuit, the vacuum hole can be located at any position in the vacuum circuit, the subsequent arrangement of the external pipeline corresponding to the vacuum hole is convenient, the problem that the current sucking disc structure usually adopts a target type structure formed by the deviation of a ring sleeve ring is solved, at least one independent vacuum channel is formed between the ring and the ring, the corresponding vacuum sucking hole needs to be formed in each vacuum channel for ensuring the adsorption effect of the independent vacuum channel, one end of each vacuum sucking hole needs to be connected with the vacuum guide pipe, the external vacuum pipeline is more, and the problem that the arrangement is more complicated is solved.
Additionally, according to the utility model provides a wafer pottery dish snatchs assembly can also have following additional technical characterstic:
furthermore, at least one mounting hole is formed in the connecting platform and used for mounting the connecting platform.
Furthermore, a through pipe groove for accommodating a vacuum pump penetrates through the circular center of the connecting table, which is surrounded by the mounting hole.
Furthermore, the pipeline of the vacuum pump is communicated with the vacuum port through the pipe through groove.
Furthermore, two ends of the through pipe groove respectively extend outwards to form a pipe discharge groove for accommodating the vacuum pump pipeline.
Furthermore, one end of the pipe discharge groove is communicated with a pipe distribution groove, and the pipe distribution groove is formed in the sucker and communicated with a vacuum port penetrating through the sucker.
Further, be provided with the vacuum transmission piece in the branch pipe groove, the vacuum transmission piece court main opening has been seted up to the pipe groove direction the inside centre of vacuum transmission piece be provided with the reposition of redundant personnel chamber of main opening intercommunication, reposition of redundant personnel chamber surrounding edge department intercommunication has at least a reposition of redundant personnel mouth.
Further, the flow dividing port is communicated with the vacuum port through the vacuum pump pipeline.
Furthermore, the sucking disc is kept away from connecting platform one side outwards extends at least one supporting part, supporting part one side is extended perpendicularly and is spacing portion.
Furthermore, a limiting part vertically extends from the position, close to the mounting hole, of the connecting table, and the limiting part on the supporting part and the limiting part on the connecting table are enclosed to form a limiting space for limiting the wafer ceramic disc.
Drawings
Fig. 1 is a schematic side view of a wafer ceramic disk grabbing assembly according to a first embodiment of the present invention;
fig. 2 is a schematic view of another side of a part of a wafer ceramic disk grabbing assembly according to a first embodiment of the present invention;
fig. 3 is a schematic structural view of a suction cup in a wafer ceramic plate gripping assembly according to a first embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a vacuum transmission member in a wafer chuck gripping assembly according to a first embodiment of the present invention.
Description of the main element symbols:
| connecting table | 1 | |
5 |
| |
2 | Through |
6 |
| |
21 | Calandria |
7 |
| |
22 | |
8 |
| |
23 | |
9 |
| |
24 | |
91 |
| Supporting |
3 | |
92 |
| Limiting |
4 | Shunting |
93 |
The following detailed description of the invention will be further described in conjunction with the above-identified drawings.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Referring to fig. 1 to 4, a wafer ceramic plate grabbing assembly according to a first embodiment of the present invention is shown, and the wafer ceramic plate grabbing assembly is used to be installed on a robot arm, and includes a connecting platform 1 connected to the robot arm and sucking discs 2 extending outward from two ends of the connecting platform 1, each sucking disc 2 includes a sealing ring 21 extending outward from a peripheral edge, and a plurality of pad backup rings 22 located on the sucking disc 2 and located at inner rings of the sealing ring 21, adjacent pad backup rings 22 enclose each other to form at least one vacuum loop 23, at least one vacuum port 24 vertically penetrating through the sucking disc 2 is provided in the vacuum loop 23, at least one through groove pointing to the center of the sucking disc 2 is provided on the vacuum loop 23, so that the adjacent vacuum loops are communicated;
furthermore, at least one mounting hole 5 is formed in the joint of the mechanical arm and the connecting platform 1, a vacuum pump is arranged on the mechanical arm, at least one mounting hole 5 is formed in the connecting platform 1, the mounting hole 5 is used for mounting the connecting platform 1, a through pipe groove 6 for accommodating the vacuum pump penetrates through the connecting platform 1 at the circular center enclosed by the mounting hole 5, and a pipeline of the vacuum pump is communicated with a vacuum port 24 through the through pipe groove 6;
the mechanical arm is used for driving the grabbing assembly to convey and transfer the wafer ceramic disc, the vacuum pump is fixedly connected to the mechanical arm and extends out of the pipeline to penetrate through the top of the tube through groove 6 to the bottom of the tube through groove and is connected with the vacuum port 24 of the sucking disc 2 penetrating through the bottom of the vacuum pump.
In the specific implementation, an operator may drive the robot arm to drive the grabbing assembly to move to a position parallel to the ceramic wafer disk and to abut against the ceramic wafer disk, and then drive the vacuum pump communicated with the vacuum port 24 to generate a vacuum suction force at the vacuum port 24 and transmit the vacuum suction force to the vacuum loop 23, wherein at least one through groove pointing to the center of the chuck 2 is formed on the vacuum loop 23 to communicate the adjacent vacuum loops 23, and the vacuum port 24 may create a vacuum condition at any position of the vacuum loop 23, so that the vacuum loop 23 generates a corresponding vacuum suction force on the ceramic wafer disk abutting against the surface of the chuck 2 to achieve the purpose of suction-type grabbing of the ceramic wafer disk, in addition, the sealing ring 21 is disposed at the outer ring of the vacuum loop 23 to isolate the vacuum loop 23 from the air outside the sealing ring 21, which can be understood, a sealed vacuum environment is formed in the sealing ring 21, and it is required to explain that, because the adjacent vacuum loops 23 are communicated with each other, the vacuum port 24 disposed in the vacuum loop 23 may be located at any position in the vacuum loop 23 to facilitate the subsequent arrangement of the external pipeline corresponding to the vacuum port 24. In addition, the vacuum port 24 specifically sets up quantity and can correspond to set up according to the wafer ceramic dish quality of snatching at present, and four and corresponding reference quality are 17 KG's wafer ceramic dish are seted up to vacuum port 24 in this application.
In summary, the adjacent vacuum loops 23 formed between the adjacent pad backup rings 22 are communicated, so that the vacuum ports 24 can create a vacuum condition at any position of the vacuum loops 23, and therefore the vacuum ports 24 arranged in the vacuum loops 23 can be located at any position in the vacuum loops 23, and there is no need to additionally arrange channels communicated with each other in the suction cups 2 between the vacuum ports 24, which is convenient for the subsequent arrangement and arrangement of the vacuum ports 24 in the suction cups 2, and simultaneously reduces the process difficulty of the suction cups 2 in the manufacturing process, thereby solving the problem that the conventional suction cup structure usually adopts a target-type structure formed by the offset of a ring sleeve and a ring, and at least one independent vacuum channel is formed between the ring and the ring, and in order to ensure the adsorption effect of the independent vacuum channel, a corresponding vacuum suction hole needs to be arranged on each vacuum channel, and the problem that the vacuum suction holes need to be communicated with each other in the suction cup without avoiding the vacuum suction holes independently connected with each other, thereby causing the process difficulty of the suction cups in the manufacturing process.
Furthermore, two ends of the through pipe groove 6 respectively extend outwards to form a pipe discharging groove 7 for accommodating a vacuum pump pipeline, one end of the pipe discharging groove 7 is communicated with a pipe distributing groove 8, the pipe distributing groove 8 is formed in the sucker 2 and is communicated with a vacuum port 24 penetrating through the sucker 2, a vacuum transfer piece 9 is arranged in the pipe distributing groove 8, the vacuum transfer piece 9 is provided with a main through hole 91 towards the direction of the pipe discharging groove 7, a flow distributing cavity 92 communicated with the main through hole 91 is formed in the middle inside of the vacuum transfer piece 9, the peripheral edge of the flow distributing cavity 92 is communicated with at least one flow distributing port 93, and the flow distributing port 93 is communicated with the vacuum port 24 through the vacuum pump pipeline;
in specific implementation, the vacuum pump pipelines can be arranged through the pipe arrangement grooves 7 and the pipe distribution grooves 8, so that the service life of the pipelines can be stably prolonged, meanwhile, the vacuum transfer piece 9 can achieve the purpose of pipe distribution, the situation that the process difficulty of design and treatment of the pipes at the distribution positions is high is avoided, and in the specific channel process of the vacuum transfer piece 9, the vacuum suction force is conducted into the distribution cavity 92 along the main port 91, the vacuum suction force is conducted to the distribution port 93 communicated with the distribution cavity 92 through the distribution cavity 92, and the suction force can be transmitted into the vacuum loop 23 through the vacuum port 24 through the connection of the distribution port 93 and the vacuum port 24 through the pipeline, wherein the specific number of the distribution ports 93 formed in the vacuum transfer piece 9 can be determined according to the number of the vacuum ports 24, the arrangement mode is simple, only through holes communicated with the distribution cavity 92 in the vacuum transfer piece 9 are formed in the edge of the vacuum transfer piece 9, the distribution ports 93 can be determined, and in some optional embodiments, the appearance of the vacuum transfer piece 9 can be quadrilateral, hexagonal, octagonal and the hole forming of the subsequent surface can be facilitated by the design of the edge plane.
In addition, in some optional embodiments, sucking disc 2 is provided with two altogether and is located the 1 both ends of connection platform respectively, can be used for simultaneously carrying out the absorption formula to two wafer ceramic dishes and snatch, in order to improve and snatch efficiency, keep away from at sucking disc 2 and connect 1 one side of platform and outwards extend at least a supporting part 3, spacing portion 4 is extended perpendicularly to supporting part 3 one side, connect and locate to extend perpendicularly spacing portion 4 near mounting hole 5 on the platform 1, spacing portion 4 on the supporting part 3 and the spacing portion 4 of connecting on the platform 1 enclose to close the spacing space that forms and be used for restricting wafer ceramic dish, in order to ensure to snatch or the stable in structure of transportation in the wafer ceramic dish.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a pottery dish snatchs assembly for install on the arm, its characterized in that, include with the connection platform that the arm is connected and follow connect the sucking disc that the platform both ends outwards extended respectively, the sucking disc includes the sealing ring that the surrounding edge department outwards extended, and is located just locate on the sucking disc the many rings of packing ring inner circle department lean on the ring, and is adjacent it leans on to enclose each other between the ring and close to form an at least vacuum circuit to fill up, it runs through perpendicularly to have seted up in the vacuum circuit at least one vacuum opening of sucking disc, seted up the sensing on the vacuum circuit at least one logical groove in the sucking disc centre of a circle, so that adjacent the vacuum circuit intercommunication.
2. The assembly as claimed in claim 1, wherein the connection platform has at least one mounting hole for mounting the connection platform.
3. The assembly as claimed in claim 2, wherein a through pipe slot for receiving a vacuum pump penetrates through the circular center of the connecting platform surrounded by the mounting holes.
4. The assembly as claimed in claim 3, wherein the vacuum pump conduit communicates with the vacuum port through the through-channel.
5. The assembly as claimed in claim 4, wherein the through-channel extends outwardly from both ends thereof to form a channel for accommodating the vacuum pump.
6. The assembly as claimed in claim 5, wherein one end of the tube-arranging groove is connected to a tube-dividing groove opened on the chuck and connected to a vacuum port penetrating the chuck.
7. The assembly as claimed in claim 6, wherein a vacuum transfer member is disposed in the tube-dividing groove, the vacuum transfer member has a main opening facing the tube-dividing groove, a flow-dividing chamber communicating with the main opening is disposed in the middle of the vacuum transfer member, and at least one flow-dividing opening is communicated with the periphery of the flow-dividing chamber.
8. The assembly as claimed in claim 7, wherein the bypass port is in communication with the vacuum port via the vacuum pump line.
9. The assembly as claimed in claim 1, wherein at least one support portion extends outwardly from a side of the chuck away from the connecting table, and a limit portion extends perpendicularly from a side of the support portion.
10. The assembly of claim 9, wherein a position-limiting portion extends from the connecting platform near the mounting hole, and the position-limiting portion on the supporting portion and the position-limiting portion on the connecting platform enclose a position-limiting space for limiting the ceramic wafer disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221876391.XU CN217641278U (en) | 2022-07-19 | 2022-07-19 | Wafer ceramic dish snatchs assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221876391.XU CN217641278U (en) | 2022-07-19 | 2022-07-19 | Wafer ceramic dish snatchs assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217641278U true CN217641278U (en) | 2022-10-21 |
Family
ID=83634041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221876391.XU Active CN217641278U (en) | 2022-07-19 | 2022-07-19 | Wafer ceramic dish snatchs assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217641278U (en) |
-
2022
- 2022-07-19 CN CN202221876391.XU patent/CN217641278U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109585353B (en) | Suction cup and working method thereof | |
| JP2016533636A (en) | Pneumatic end effector device, substrate transfer system, and substrate transfer method | |
| CN213583733U (en) | Vacuum adsorption device | |
| CN217641278U (en) | Wafer ceramic dish snatchs assembly | |
| CN217544570U (en) | Mechanical arm for adsorbing wafer and semiconductor equipment | |
| EP3605597A1 (en) | Silicon chip holding device, silicon chip conveying device, silicon chip delivery system and conveying method | |
| US20190259647A1 (en) | Deposition ring for processing reduced size substrates | |
| CN211103541U (en) | Vacuum chuck and vacuum adsorption device | |
| CN110875167B (en) | Cooling chamber and semiconductor processing equipment | |
| CN212331075U (en) | Vacuum adsorption type fork-shaped tail end clamp holder | |
| TW201807248A (en) | Bernoulli susceptor and epitaxial growth equipment | |
| TWI678759B (en) | Non-contact substrate handling equipment | |
| CN108933099B (en) | Apparatus for handling substrates | |
| JP2003225880A (en) | Suction cup for sucking and carrying article | |
| CN113035681B (en) | Wafer airlock device | |
| CN209487484U (en) | Transmitting device in wafer processing technology | |
| CN108470704B (en) | Pass piece cavity and semiconductor processing equipment | |
| US20190259635A1 (en) | Process kit for processing reduced sized substrates | |
| CN212161782U (en) | Vacuum adsorption type circular tail end clamp holder | |
| JP2022051595A (en) | Vacuum suction chuck | |
| JP7144547B2 (en) | Non-contact substrate handling equipment and epitaxial reactor | |
| CN106801222A (en) | A kind of chip tray and MOCVD systems | |
| CN214643745U (en) | Vacuum adsorption type annular tail end clamp holder | |
| CN220233142U (en) | End effector | |
| CN100349253C (en) | Tool for handling wafers and epitaxial growth station |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |