CN213583733U - Vacuum adsorption device - Google Patents

Abstract

The utility model discloses a vacuum adsorption device belongs to the semiconductor and equips technical field. The vacuum adsorption device comprises a sucker and a base, wherein the end surface of the sucker is provided with at least two concentric and separated adsorption areas, each adsorption area is provided with an air inlet communicated with the outside, the air inlets on different adsorption areas are not communicated, a sucker air passage is independently arranged on the sucker corresponding to each adsorption area, and the sucker air passage is communicated with the air inlet of the corresponding adsorption area; the base sets up in the one side of adsorption zone dorsad, sets up two at least base air flues that correspond respectively with each adsorption zone on the base, the one end of base air flue and the sucking disc air flue intercommunication of corresponding adsorption zone, the other end and outside vacuum system intercommunication. The utility model discloses a vacuum adsorption device through set up corresponding inlet port, sucking disc air flue and base air flue in sucking disc and base, realizes that different adsorption zones are to the vacuum adsorption of silicon chip, need not the exterior structure and ventilate, and simple structure is frivolous.

Description

Vacuum adsorption device

Technical Field

The utility model relates to a semiconductor equipment technical field especially relates to a vacuum adsorption device.

Background

In semiconductor manufacturing process equipment, a silicon wafer needs to be fixed on a supporting platform in the links of process production, detection and the like. The commonly used silicon wafer fixing method is basically an adsorption type, including a vacuum adsorption type and an electrostatic adsorption type. The vacuum adsorption type silicon wafer is characterized in that a contact area between the silicon wafer and the surface of the sucker generates vacuum, the silicon wafer is firmly fixed on the vacuum sucker by means of pressure generated by pressure difference between two sides of the silicon wafer, the silicon wafer can be uniformly stressed by the adsorption mode, the silicon wafer is not easy to damage, and the requirement of vacuum adsorption on the environment is low, so that the silicon wafer is widely applied by the vacuum adsorption mode.

The existing silicon wafers are different in size, when one sucker is correspondingly used for each size and specification of silicon wafer, the cost is increased, and the corresponding sucker needs to be replaced when the silicon wafers with different specifications are produced, so that the operation is inconvenient; in the prior art, the adopted vacuum adsorption device can be compatible with silicon wafers of different sizes, but the vacuum adsorption device has the disadvantages of complex structure, thickness, heaviness, high cost and inconvenient operation.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a vacuum adsorption device can adsorb the not silicon chip of equidimension, and is compatible good, and simple structure is frivolous.

To achieve the purpose, the utility model adopts the following technical proposal:

a vacuum adsorption apparatus comprising:

the end surface of the sucking disc is provided with at least two concentric and separated adsorption areas, each adsorption area is provided with an air inlet communicated with the outside, the air inlets on different adsorption areas are not communicated, the sucking disc is provided with a sucking disc air passage corresponding to each adsorption area independently, the sucking disc air passage is communicated with the air inlet of the corresponding adsorption area, and the different adsorption areas are used for adsorbing silicon wafers with different specifications;

the base sets up dorsad one side of adsorption zone, seted up on the base with each two at least base air flues that the adsorption zone corresponds respectively, the one end and the corresponding of base air flue the adsorption zone the sucking disc air flue intercommunication, the other end and outside vacuum system intercommunication.

Optionally, each of the adsorption zones comprises: the air inlet rows are uniformly arranged around the circumferential direction of the sucker, and each air inlet row comprises a plurality of air inlets which are arranged at intervals along the radial direction of the sucker;

the sucking disc air flue in every adsorption zone all is provided with a plurality ofly around the circumference of sucking disc, and every the sucking disc air flue with correspond the adsorption zone the inlet port row one-to-one sets up, and every inlet port row the inlet port with correspond the sucking disc air flue intercommunication.

Optionally, the sucking disc air flue includes along the first radial air flue portion of the radial setting of sucking disc and perpendicular to the first axial air flue portion that the terminal surface set up, first radial air flue portion with one that corresponds each on the inlet port row the inlet port all communicates, just first axial air flue portion sets up and keeps away from on another terminal surface of inlet port, the one end of first axial air flue portion with first radial air flue portion intercommunication, the other end of first axial air flue portion with the base air flue intercommunication.

Optionally, the base is provided with at least two communicating grooves on the end surface close to the suction cup, the communicating grooves are arranged in one-to-one correspondence with the adsorption area, and the base air passage is communicated with all the suction cup air passages corresponding to the adsorption area through the communicating grooves.

Optionally, each of the base air passages comprises:

the second radial air channel part is arranged along the radial direction of the base, and one end of the second radial air channel part is communicated with the vacuum system;

the second axial air channel part is vertical to the sucker, and two ends of the second axial air channel part are respectively communicated with the second radial air channel part and the sucker air channel;

the sucker air passages of different adsorption areas are respectively communicated with corresponding second radial air passages through corresponding second axial air passage parts, and the communication grooves are communicated with the second axial air passage parts of the corresponding base air passages.

Optionally, a sealing element is arranged between the base and the suction cup and between two adjacent communication grooves.

Optionally, each adsorption area comprises a plurality of concentric and spaced dense rings, each dense ring is convexly arranged on the end surface of the corresponding sucker and used for supporting the silicon wafer, a groove is formed between every two adjacent dense rings, and the air inlet hole is formed in the bottom of each groove.

Optionally, each adsorption area is formed by surrounding a support wall convexly arranged on the end face of the sucker, a plurality of bulges are convexly arranged on the end face of each adsorption area, and the support wall and the bulges are used for supporting the silicon wafer.

Optionally, the vacuum adsorption device still includes the RZ module, the base orientation extend upwards to be equipped with the boss in the middle of one side of sucking disc, the intercommunication groove sets up on the boss, the RZ module encircles the boss cover is established on the base and clamp establish the sucking disc with between the base, the base with the sucking disc can be followed relative rotary motion is to the RZ module.

Optionally, the RZ module comprises a stator and a rotor, the rotor is sleeved on the stator, two adjacent adsorption zones are provided with a first fixing hole therebetween, a second fixing hole corresponding to the first fixing hole is provided on the end face of the rotor, the rotor and the sucker are detachably connected through a fastener penetrating through the first fixing hole and the second fixing hole, the stator is connected with the base, and the stator and the rotor are in running fit so that the sucker can rotate relative to the base.

The utility model has the advantages that:

the utility model provides a vacuum adsorption device, during the adsorption operation, the corresponding external vacuum system is opened, and the vacuum channel is formed through the base channel and the sucker channel in sequence for vacuumizing, so that the end surface of the sucker generates negative pressure, thereby realizing the adsorption of silicon wafers with corresponding sizes; the plurality of adsorption areas are arranged on the sucker, and different adsorption areas can adsorb silicon wafers with different sizes, so that the compatibility of the vacuum adsorption device is improved; corresponding air inlet holes, sucker air passages and base air passages are formed in the suckers and the bases, so that vacuum adsorption of different adsorption areas on the silicon wafer is realized, ventilation is performed without an external structure, and the structure is simple, light and thin.

Drawings

Fig. 1 is a cross-sectional view of a vacuum adsorption apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view at A of FIG. 1;

FIG. 3 is a schematic structural view of a first suction cup according to an embodiment of the present invention;

FIG. 4 is a partial cross-sectional view of FIG. 3;

FIG. 5 is an enlarged view at B of FIG. 4;

FIG. 6 is an enlarged view at C of FIG. 4;

FIG. 7 is a schematic structural view of the bottom of FIG. 3;

fig. 8 is a cross-sectional view of a base and an RZ module as provided in an embodiment of the present invention;

FIG. 9 is an enlarged view at D of FIG. 1;

FIG. 10 is a partial cross-sectional view of a second suction cup according to an embodiment of the present invention;

FIG. 11 is an enlarged view at E of FIG. 10;

fig. 12 is an enlarged view of fig. 10 at F.

In the figure:

100-a silicon wafer; 200-vacuum system;

1-a sucker; 11-a first adsorption zone; 111-a first intake aperture; 112-a first suction cup channel; 1121-first radial air passage portion; 1122-a first axial airway portion; 12-a second adsorption zone; 121-a second air intake; 122-a second suction cup channel; 13-a first fixation hole; 14-dense ring; 15-a groove; 16-convex;

2-a base; 21-a first seat channel; 211-a second radial gas duct portion; 212-a second axial air passage portion; 22-a second seat channel; 23-a boss; 24-a first seal groove; 25-a first connecting groove; 26-a second communicating groove; 27-a second seal groove;

3-a first sealing ring;

4-a second sealing ring;

5-RZ module;

6-blocking.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Example one

The present embodiment provides a vacuum adsorption apparatus, which includes a suction cup 1 and a base 2. Specifically, as shown in fig. 1 to 4, at least two concentric and separated adsorption regions are arranged on the end surface of the suction cup 1, each adsorption region is provided with an air inlet communicated with the outside, the air inlets on different adsorption regions are not communicated, a suction cup air passage is independently arranged on the suction cup 1 corresponding to each adsorption region, the suction cup air passage is communicated with the air inlet of the corresponding adsorption region, and the different adsorption regions are used for adsorbing silicon wafers 100 of different specifications; base 2 sets up in the one side of adsorption zone dorsad, sets up two at least base air flues that correspond respectively with each adsorption zone on base 2, the one end of base air flue and the sucking disc air flue intercommunication of corresponding adsorption zone, the other end and outside vacuum system 200 intercommunication.

During the adsorption operation, the corresponding external vacuum system 200 is started, and a vacuum channel is formed through the base channel and the sucker channel in sequence for vacuumizing, so that the end surface of the sucker 1 generates negative pressure, and a vacuum space is formed between the end surface of the sucker 1 and the silicon wafer 100, thereby realizing the adsorption of the silicon wafer 100 with corresponding size; the plurality of adsorption areas are arranged on the sucker 1, and different adsorption areas can adsorb silicon wafers 100 with different sizes, so that the compatibility of the vacuum adsorption device is improved; through set up corresponding inlet port, sucking disc air flue and base air flue in sucking disc 1 and base 2 to realize different adsorption zone to the vacuum adsorption of silicon chip 100, need not external structure and ventilate, simple structure is frivolous.

Generally, the silicon wafer 100 has a circular structure, and optionally, as shown in fig. 3 and 4, each adsorption region is concentrically arranged, wherein the first adsorption region 11 is disc-shaped, the second adsorption region 12 is ring-shaped and is sleeved on the periphery of the first adsorption region 11, when the silicon wafer 100 is adsorbed, the adsorption region within the ring shape of the corresponding silicon wafer 100 is vacuumized to improve the adsorption capacity, and the ring-shaped region with the size other than the silicon wafer 100 is not required to be vacuumized, so that the waste of resources is avoided; different silicon wafers 100 are provided with adsorption areas with corresponding sizes, so that the applicability to silicon wafers 100 with more sizes is improved; the air inlets on different adsorption areas are not communicated, so that air leakage is avoided, and the adsorption reliability is improved.

In this embodiment, as shown in fig. 3 to 5, each adsorption region includes a plurality of concentric and spaced dense rings 14, the dense rings 14 are protruded on the end surface of the chuck 1 and used for supporting the silicon wafer 100, a groove 15 is formed between two adjacent dense rings 14, and an air inlet is formed at the bottom of each groove. Because the dense rings 14 are concentrically arranged, a plurality of concentric grooves are formed, and the air inlet holes are formed in the bottoms of the concentric grooves 15, so that the gaps between the bottoms of the concentric grooves 15 and the silicon wafer 100 are both vacuum, the adsorption area of the silicon wafer 100 is increased, and the adsorption reliability is high.

Optionally, the height of the close ring 14 is 0.1mm-1mm, and the width of the close ring 14 is 0.1mm-1mm, so that on one hand, the formed vacuum gap is prevented from being too large, and the adsorption reliability is low due to insufficient vacuum pumping capacity, and on the other hand, the formed vacuum gap is properly improved, and the adsorption force is increased. Preferably, the height of the dense ring 14 is 0.5mm, and the width of the dense ring 14 is 0.5 mm.

As shown in fig. 1 to 6, optionally, each adsorption area includes a plurality of air inlet rows arranged around the circumferential direction, each air inlet row includes a plurality of air inlets arranged along the radial direction, each air inlet row is communicated with the corresponding suction cup air passage of the adsorption area, and the adsorption area is provided with a plurality of air inlet rows, so that the adsorption capacity of the silicon wafer 100 is improved, and the stress on the silicon wafer 100 is uniform.

Further optionally, each adsorption area comprises a plurality of air inlet rows uniformly arranged around the circumference of the sucker 1, and each air inlet row comprises a plurality of air inlets arranged at intervals along the radial direction of the sucker 1; the sucking disc air flue in every adsorption zone all is provided with a plurality ofly along sucking disc 1's circumference, and every sucking disc air flue arranges the one-to-one with the inlet port that corresponds the adsorption zone and sets up, and the inlet port that every inlet port was arranged communicates with the sucking disc air flue that corresponds to realize the air-permeable structure that multirow inlet port was arranged on every adsorption zone, make the adsorption affinity that the silicon chip that adsorbs receives balanced.

Specifically, as shown in fig. 5 and 9, the suction cup air passage includes a first radial air passage portion 1121 and a first axial air passage portion 1122, the first radial air passage portion 1121 and each air inlet hole on a corresponding air inlet hole row are all communicated, and the first axial air passage portion 1122 is disposed at one end away from the air inlet hole, in this embodiment, the suction cup 1 includes two upper and lower end surfaces, the air inlet hole row is disposed on the upper end surface, the first axial air passage portion 1122 is disposed on the lower end surface, the air inlet hole row is communicated with the first axial air passage portion 1122 through the first radial air passage portion 1121, that is, one end of the first axial air passage portion 1122 is communicated with the first radial air passage portion 1121, the other end of the first axial air passage portion 1122 is communicated with the base air passage, and the first radial air passage portion 1121 is communicated with the base air passage through the first axial air passage portion 1122.

Optionally, only one first axial air channel portion 1122 is arranged on each adsorption region, and the first axial air channel portions 1122 are communicated with the plurality of first radial air channel portions 1121, so that the number of the first axial air channel portions 1122 is reduced, the air channel structure of the suction cup is simplified, and the structure is simple; in addition, reduce sucking disc air flue quantity, reduce the gas leakage risk, be convenient for maintain. Optionally, one or more first axial air channel portions 1122 may be provided, as the case may be. Optionally, the air inlet hole is arranged perpendicular to the end face, so that the processing is convenient, the gas flow is convenient, and the vacuumizing efficiency is improved.

Specifically, the first radial air passage portion 1121 may be perforated in the radial direction on the side circumferential surface of the suction cup 1 for easy processing, and then the plug 6 is installed on the side circumferential surface of the first radial air passage portion 1121 at the perforated position in the radial direction to prevent air leakage.

Optionally, the base 2 is provided with at least two communicating grooves on the end surface close to the sucker 1, the communicating grooves and the adsorption area are arranged in a one-to-one correspondence manner, and the base air passage is communicated with the sucker air passage through the communicating grooves. When base 2 and 1 relative rotary motion of sucking disc, through setting up the intercommunication groove, enable base air flue and sucking disc air flue intercommunication all the time, compact structure. In addition, the corresponding suction cup channel is communicated with each corresponding row of air inlet holes through the corresponding communicating groove, so that the same adsorption force is generated, and the damage to the silicon wafer 100 caused by different adsorption forces on the silicon wafer 100 at different air inlet hole rows in the same adsorption area is avoided.

As shown in fig. 1 and 8, optionally, each base air passage includes at least one first base passage 21 and at least one second base passage 22. Detailed structure of the base air passage referring to the first base passage 21 and the second base passage 22 of fig. 1, the first base passage 21 includes a second radial air passage portion 211 and a second axial air passage portion 212, the second radial air passage portion 211 is arranged along the radial direction of the base 2, and one end thereof is communicated with the vacuum system 200; second axial air flue portion 212 is perpendicular with the terminal surface of sucking disc, the both ends of second axial air flue portion 212 respectively with radial air flue portion 211 of second and sucking disc air flue intercommunication, and the sucking disc air flue of different adsorption zones all is linked together with the radial air flue portion 211 of second that corresponds through the second axial air flue portion 212 that corresponds separately, the second axial air flue portion 212 intercommunication of intercommunication groove and corresponding base air flue, when including more than two first base passageway 21, the intercommunication groove all communicates with each second axial air flue portion 212, moreover, the steam generator is simple in structure, and the processing is convenient. In a similar way, the suction cup air passages of different adsorption areas are respectively communicated with the corresponding second base passages 22 through the corresponding communication grooves. The sucking disc air flue, the base air flue and the communicating groove one-to-one that each adsorption zone corresponds promptly, and the sucking disc air flue, the base air flue and the communicating groove of different adsorption zones are all not linked together. Through setting up two at least base air flues and outside vacuum system 200 intercommunication simultaneously, improved the vacuum strength and then improved the adsorption affinity to silicon chip 100.

Specifically, the second radial air duct portion 211 may be perforated radially on the side circumferential surface of the base 2 for easy processing, and then the vacuum system 200 is installed in a connected manner on the side circumferential surface of the second radial air duct portion 211 along the radial perforation to achieve vacuum pumping and reduce the thickness of the vacuum adsorption device.

In this embodiment, as shown in fig. 3 and 4, the chuck 1 is provided with a first adsorption region 11 and a second adsorption region 12 for adsorbing silicon wafers 100 of two sizes. Specifically, as shown in fig. 1 to 9, four rows of first air inlet holes 111 are formed in the first adsorption area 11, four rows of second air inlet holes 121 are formed in the second adsorption area 12, preferably, the four rows of first air inlet holes 111 are uniformly arranged along the circumferential direction, that is, the air hole rows of adjacent first air inlet holes 111 form an included angle of 90 degrees, the four rows of second air inlet holes 121 are uniformly arranged along the circumferential direction, that is, the adjacent air hole rows also form an included angle of 90 degrees, and further, the air hole rows where the adjacent first air inlet holes 111 are located and the air hole rows where the second air inlet holes 121 are located are spaced from each other by 45 degrees; the suction cup 1 is provided with a first suction cup channel 112 and a second suction cup channel 122; the base 2 is provided with a first base channel 21 and a second base channel 22, the end surface of the base 2 is respectively provided with a first communicating groove 25 and a second communicating groove 26, the first base channel 21 is communicated with the first communicating groove 25, the second base channel 22 is communicated with the second communicating groove 26, and the number of the first base channel 21 and the second base channel 22 is reduced to simplify the structure; the first air inlet hole 111, the first suction cup channel 112 and the first communicating groove 25 are communicated with the first base channel 21, and the second air inlet hole 121, the second suction cup channel 122 and the second communicating groove 26 are communicated with the second base channel 22; the first and second pedestal passages 21 and 22 are respectively communicated with the external vacuum system 200, so that the first and second adsorption regions 11 and 12 are formed on the end surface of the chuck 1, and each adsorption region forms an independent vacuum adsorption system, and different adsorption regions are used according to the size of a silicon wafer.

When the vacuum adsorption device is used for adsorbing the small-sized silicon wafer 100, the external vacuum system 200 is communicated with the first pedestal channel 21, and passes through the first pedestal channel 21, the first connecting groove 25, the first chuck channel 112 and the first air inlet 111 in sequence, and finally forms a vacuum state on the first adsorption area 11, so that the small-sized silicon wafer 100 can be adsorbed; when the vacuum adsorption device is used for adsorbing large-size silicon wafers 100, the external vacuum system 200 is respectively communicated with the first pedestal channel 21 and the second pedestal channel 22, and respectively sequentially passes through the first pedestal channel 21 and the second pedestal channel 22, the first connecting groove 25 and the second connecting groove 26, the first sucker channel 112 and the second sucker channel 122, the first air inlet hole 111 and the second air inlet hole 121, and finally, the first adsorption area 11 and the second adsorption area 12 are in a vacuum state, so that the large-size silicon wafers 100 can be adsorbed, and the operation is simple and convenient.

Optionally, a sealing element is arranged between the base 2 and the sucker 1 to improve the sealing property between the base 2 and the sucker 1 and improve the adsorption reliability; optionally, a sealing element is arranged between two adjacent communication grooves, so that the sealing property between different communication grooves is improved; in the present embodiment, as shown in fig. 8 and 9, a first sealing ring 3 is disposed between the first communicating groove 25 and the second communicating groove 26, and a second sealing ring 4 is disposed between the base 2 and the suction cup 1; specifically, the base 2 is provided with a first sealing groove 24 and a second sealing groove 27, and the first sealing ring 3 and the second sealing ring 4 are respectively installed in the first sealing groove 24 and the second sealing groove 27, so that the installation and the positioning are convenient.

Optionally, as shown in fig. 1, 8 and 9, the vacuum adsorption device further includes an RZ module 5, a boss 23 is upwardly provided in the middle of one side of the base 2 facing the suction cup 1, the communicating groove is provided on the boss 23, the RZ module 5 is sleeved on the base 2 around the boss 23 and is clamped between the suction cup 1 and the base 2, the RZ module has driving and guiding functions, and the base 2 and the suction cup 1 can move relatively along with the RZ module 5.

Specifically, as shown in fig. 1, the RZ module 5 comprises a stator and a rotor, the rotor is sleeved on the stator, a first fixing hole 13 is formed between two adjacent adsorption areas, a second fixing hole corresponding to the first fixing hole 13 is formed in the end face of the rotor, the rotor and the sucker 1 are detachably connected through a fastener penetrating through the first fixing hole 13 and the second fixing hole, the stator is connected with the base 2, and the stator and the rotor are in running fit so that the sucker 1 can rotate relative to the base 2. Specifically, the first fixing hole 13 is a through hole, the second fixing hole is a threaded hole, and the fastener penetrates through the through hole and is screwed on the threaded hole, so that the connection between the sucker 1 and the rotor is realized, and the disassembly and the assembly are convenient.

Example two

As shown in fig. 10 to 12, the present embodiment provides a vacuum suction device, and the overall structure of the vacuum suction device provided in the present embodiment is substantially the same as that of the vacuum suction device in the first embodiment, and only the partial arrangement of the suction cup 1 is different, and the structure that is the same as that of the first embodiment is not repeated in the present embodiment.

The difference between the embodiment and the first embodiment is that each adsorption region is surrounded by a supporting wall protruding from the end surface of the chuck, a plurality of protrusions 16 are protruding from the end surface of each adsorption region, and the supporting wall and the protrusions 16 are used for supporting the silicon wafer 100; alternatively, the protrusions 16 are uniformly arranged on the end surface of the chuck 1, so that the silicon wafer 100 is uniformly stressed.

The vacuum adsorption device provided by the embodiment can be used for structures such as a photoetching system and the like, and the compatibility of the photoetching system to different silicon wafers is improved.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A vacuum adsorption apparatus, comprising:

the end face of the sucking disc (1) is provided with at least two concentric and separated adsorption areas, each adsorption area is provided with an air inlet communicated with the outside, the air inlets on different adsorption areas are not communicated, the sucking disc (1) is provided with a sucking disc air passage corresponding to each adsorption area independently, the sucking disc air passage is communicated with the air inlet of the corresponding adsorption area, and the different adsorption areas are used for adsorbing silicon wafers (100) with different specifications;

base (2), set up dorsad one side of adsorption zone, seted up on base (2) with each two at least base air flues that the adsorption zone corresponds respectively, the one end of base air flue and corresponding the adsorption zone the sucking disc air flue intercommunication, the other end and outside vacuum system (200) intercommunication.

2. The vacuum adsorption device of claim 1, wherein each of the adsorption zones comprises: the air inlet rows are uniformly arranged around the circumferential direction of the sucker (1), and each air inlet row comprises a plurality of air inlets which are arranged at intervals along the radial direction of the sucker (1);

the sucker air passages in each adsorption area are arranged in a plurality of surrounding directions of the suckers (1), the sucker air passages are arranged in one-to-one correspondence with the air inlet rows corresponding to the adsorption area, and the air inlet holes in the air inlet row are communicated with the corresponding sucker air passages.

3. The vacuum absorbing apparatus according to claim 2, wherein the suction cup air passage includes a first radial air passage portion (1121) disposed along a radial direction of the suction cup (1) and a first axial air passage portion (1122) disposed perpendicular to the end surface, the first radial air passage portion (1121) communicates with each of the air inlet holes in a corresponding one of the air inlet hole rows, and the first axial air passage portion (1122) is disposed on the other end surface away from the air inlet holes, one end of the first axial air passage portion (1122) communicates with the first radial air passage portion (1121), and the other end of the first axial air passage portion (1122) communicates with the base air passage.

4. The vacuum adsorption device according to claim 2, wherein at least two communication grooves are formed in the end surface of the base (2) close to the suction cup (1), the communication grooves are arranged in one-to-one correspondence with the adsorption areas, and the base air passages are communicated with all the suction cup air passages corresponding to the corresponding adsorption areas through the communication grooves.

5. The vacuum chucking device of claim 4, wherein each of the base air passages includes:

a second radial air duct portion (211) provided along a radial direction of the base (2) and having one end communicating with the vacuum system (200);

the second axial air channel part (212) is perpendicular to the sucker, and two ends of the second axial air channel part (212) are respectively communicated with the second radial air channel part (211) and the sucker air channel;

the sucker air passages of different adsorption areas are communicated with corresponding second radial air passage parts (211) through corresponding second axial air passage parts (212), and the communication grooves are communicated with the second axial air passage parts (212) of the corresponding base air passages.

6. Vacuum suction device according to claim 4, characterized in that a sealing is arranged between the base (2) and the suction cup (1) and between two adjacent communication grooves.

7. The vacuum adsorption device according to any one of claims 1 to 6, wherein each adsorption region comprises a plurality of concentric and spaced-apart dense rings (14), the dense rings (14) are protruded on the end surface of the chuck (1) and are used for supporting the silicon wafer (100), a groove (15) is formed between two adjacent dense rings (14), and the bottom of each groove is provided with the air inlet hole.

8. The vacuum adsorption device according to any one of claims 1 to 6, wherein each adsorption region is surrounded by a support wall protruding from the end surface of the chuck, a plurality of protrusions (16) are protruding from the end surface of each adsorption region, and the support wall and the protrusions (16) are used for supporting the silicon wafer (100).

9. The vacuum adsorption device according to claim 4, characterized in that the vacuum adsorption device further comprises an RZ module (5), a boss (23) is upwardly arranged on the base (2) in a manner of extending towards the middle of one side of the sucker (1), the communication groove is formed in the boss (23), the RZ module (5) is sleeved on the base (2) around the boss (23) and clamped between the sucker (1) and the base (2), and the base (2) and the sucker (1) can rotate relatively along with the RZ module (5).

10. The vacuum adsorption device of claim 9, wherein the RZ module (5) comprises a stator and a rotor, the rotor is sleeved on the stator, a first fixing hole (13) is formed between two adjacent adsorption zones, a second fixing hole corresponding to the first fixing hole (13) is formed on an end surface of the rotor, the rotor and the sucker (1) are detachably connected through a fastener penetrating through the first fixing hole (13) and the second fixing hole, the stator is connected with the base (2), and the stator and the rotor are in rotational fit to enable the sucker (1) to rotate relative to the base (2).

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