CN217639659U

CN217639659U - Optical module capable of eliminating stress

Info

Publication number: CN217639659U
Application number: CN202221463579.1U
Authority: CN
Inventors: 彭蒙; 彭开盛
Original assignee: Tri Light Wuhan Electronics Technology Co ltd
Current assignee: Tri Light Wuhan Electronics Technology Co ltd
Priority date: 2022-06-13
Filing date: 2022-06-13
Publication date: 2022-10-21
Anticipated expiration: 2032-06-13

Abstract

The utility model relates to an optical communication technical field provides an optical module that can eliminate stress, include the casing of constituteing by upper cover and base, be equipped with the circuit board on the base, just the circuit board is located in the casing, move towards on the circuit board one side of upper cover is equipped with a plurality of cushions, the upper cover court the base direction is extended and is pressed projection on the cushion, projection and each the cushion one-to-one, each the projection is pressed and is lain in its correspondence on the soft cushion. The utility model reduces the deformation of the circuit board by arranging the soft cushion on the circuit board; the thickness tolerance of the circuit board can be absorbed, the problem of adaptation of the circuit board to a connector is avoided, the requirement on the machining precision of the shell can be lowered, and the material cost is reduced.

Description

Optical module capable of eliminating stress

Technical Field

The utility model relates to an optical communication technical field specifically is an optical module that can eliminate stress.

Background

With the development of the internet, new requirements are provided for long-distance large-bandwidth signal transmission, in the past, cables are used as transmission media, the influence of skin effect on the cables can cause the increase of signal loss, the long-distance transmission requirements cannot be met, and the transmission of optical signals through optical fibers is not influenced by the skin effect, so that the long-distance transmission requirements can be met. Meanwhile, signal transmission inside the switch is an electric signal, and the current technology cannot support all-optical transmission. Therefore, an optical-to-electrical signal conversion device is needed, one end of which is connected with the switch and the other end of which is connected with the optical fiber, and the device is the optical module.

In the photoelectric conversion process of the optical module, an electromagnetic signal can be generated and radiated outwards, which interferes with the normal use of peripheral equipment and affects the accuracy of signal transmission and processing. In an actual use scene, the optical module can be inserted into a shielding cage, electromagnetic radiation mainly radiates outwards through the light port side, and the design of electromagnetic shielding on the light port side is very critical. Meanwhile, the optical fiber needs to be led out from the optical port side, so that the shell cannot avoid the need of slotting, and the slotting of the shell can cause the leakage of electromagnetic waves from the optical port side. In addition, the upper and lower shells are matched, so that the hard touch cannot be completely contacted, a slit formed in the middle can cause an interference effect on light, and leaked electromagnetic waves can be amplified.

In addition, the requirement on the air tightness of the optical module in the current data center is not high, and along with the continuous increase of the social requirement on the bandwidth, the optical module in the data center has the updating and updating requirement in 3-5 years, and the requirement on the service life is not high. The COB (Chip on Board) optical module with low cost becomes the main choice of each manufacturer. The conventional COB scheme optical module mainly comprises a structure that circuit components such as a resistance-capacitance sensor are pasted on a PCB through an SMT (surface mount technology), a photoelectric chip is adhered on the PCB through silver adhesive, a lens is coupled with the photoelectric chip and then fixed through adhesive dispensing, other components and a shell are assembled, and the assembling process of the optical module is completed. The photoelectric chip is one of the main heat sources and is a heat sensitive device, and a corresponding thermal design is required to ensure the reliability of the optical module. The conventional heat conduction paths for the current optoelectronic chip sites are as follows: chip-top copper sheet of PCB-via copper of PCB-back copper sheet of PCB-thermal pad-shell. However, the PCB is fixed to the housing by pressing the bosses of the upper and lower covers of the housing, and is hard-connected. And the thermal pad must have a compression between the PCB and the housing that causes an upward compression of the PCB. Conventional PCB material is FR4, and the atress is yielding, and PCB deformation can lead to the optical chip to shift, and the optical chip precision is the micron order, and the optical chip shifts and can lead to the light path skew, and serious can lead to the optical module to become invalid. And PCBs are typically designed as multi-layer boards, with the thickness tolerance being controlled to +/-10% for the lamination process. The conventional PCB thickness of the optical module is defined as 1mm, namely the common thickness tolerance is +/-0.1mm, the board can be loosened and skewed when the thickness of the PCB is lower than the tolerance, the plugging reliability of the module is influenced, the plugging risk is reduced by tightening the dimensional tolerance of the shell at present, but the cost is increased by tightening the tolerance.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a but optical module of stress relief can solve the partial defect among the prior art at least.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions: the utility model provides an optical module that can eliminate stress, includes the casing of compriseing upper cover and base, be equipped with the circuit board on the base, just the circuit board is located in the casing, on the circuit board towards one side of upper cover is equipped with a plurality of cushions, the upper cover court the base direction extends and to press convex column on the cushion, convex column and each the cushion one-to-one, each the convex column is pressed and is located its correspondence on the soft cushion.

Furthermore, the convex columns are arranged on two sides of the upper cover, and two convex columns are arranged on each side; an avoiding position is arranged between the two convex columns on each side, and the upper cover passes through the avoiding position and has an interval with the circuit board.

Furthermore, the cushion is a cube structure with thickness, the surface of the cube structure contacting the circuit board is a plane, and four corners of the upper part of the cube structure are fillets.

Further, the soft pad is attached to the circuit board.

Furthermore, the number of the soft pads is four, and the four soft pads are respectively arranged at four corners of the circuit board.

Furthermore, a photoelectric chip is arranged on the circuit board.

Furthermore, the photoelectric chip transfers heat to the base through a heat conducting pad, and the heat conducting pad is arranged on one side, deviating from the upper cover, of the circuit board.

Furthermore, the circuit board is provided with a hole, a copper column is filled in the hole, and the photoelectric chip is connected with the heat conducting pad through the copper column.

Furthermore, the photoelectric chip is attached to the circuit board.

Further, conductive adhesive is arranged at the gap between the shell and the optical fiber.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the conductive soft rubber can clamp the optical fiber and contact with the shell to form effective conductive seal, and effectively solve the problem of electromagnetic radiation on the side of the optical port.

2. The conductive soft rubber is designed into a hollow structure, so that the stress generated by interference fit of the upper cover and the base cover can be absorbed, and the optical fiber is prevented from being damaged due to overlarge stress.

3. The gap between the shell and the optical fiber is filled by the conductive soft rubber, so that the electric continuity effect is good.

4. The soft glue continuous position can be blocked through the designed arrangement position, and the problem of interference and reinforcement caused by the fact that electromagnetic waves penetrate through a long and thin slit can be avoided through the matching of the clamping groove and the convex rib.

5. The soft pad is arranged on the circuit board, so that the deformation of the circuit board is reduced; the thickness tolerance of the circuit board can be absorbed, the problem of adaptation of the circuit board to a connector is avoided, the requirement on the machining precision of the shell can be lowered, and the material cost is reduced.

Drawings

Fig. 1 is a schematic diagram of an optical module according to an embodiment of the present invention;

fig. 2 is a schematic view of a first viewing angle of the optical module provided by the embodiment of the present invention after the upper cover and the sheet metal part are removed;

FIG. 3 is an enlarged partial schematic view of FIG. 2;

fig. 4 is a schematic view illustrating an assembly of an optical port adapter, an optical fiber, a conductive soft rubber, a photoelectric chip, and a circuit board of an optical module according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a circuit board and a cushion of an optical module provided in an embodiment of the present invention;

fig. 6 is a schematic view of a local enlargement of an optical module provided by an embodiment of the present invention after a base and a sheet metal part are removed;

fig. 7 is a schematic view of a second viewing angle of the optical module provided by the embodiment of the present invention after the upper cover and the sheet metal part are removed;

FIG. 8 is an enlarged partial schematic view of FIG. 7;

FIG. 9 is an enlarged partial view of FIG. 7 (with the conductive soft gel removed);

fig. 10 is a schematic diagram of an upper cover of an optical module according to an embodiment of the present invention;

in the reference symbols: 1-covering the upper cover; 2-a base; 3-a circuit board; 4-a soft cushion; 5-convex column; 6-avoidance position; 7-a photoelectric chip; 8-optical port adapter; 9-a heat conducting pad; 10-well; 11-an optical fiber; 12-conductive soft rubber; 13-a platform; 14-retaining wall; 15-a notch; 16-a card slot; 17-a rib; 18-a sheet metal part; 19-handle.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 6, an embodiment of the present invention provides an optical module, including a housing composed of an upper cover 1 and a base 2, the base 2 is provided with a circuit board 3, the circuit board 3 is located in the housing, one side of the circuit board 3 facing the upper cover 1 is provided with a plurality of soft pads 4, the upper cover 1 extends toward the base 2 to form convex columns 5 which can be pressed on the soft pads 4, the convex columns 5 correspond to the soft pads 4 one to one, and each convex column 5 is pressed on the corresponding soft pad 4. In the embodiment, the deformation of the circuit board 3 can be reduced by arranging the soft pad 4 on the circuit board 3 and pressing the soft pad 4 through the convex column 5; the tolerance of the thickness of the circuit board 3 can be absorbed, the problem of adaptation of the circuit board to a connector is avoided, the requirement on the machining precision of the shell can be lowered, and the material cost is reduced. Specifically, cushion 4 has certain deformability, and after upper cover 1 closed on base 2, boss 5 of upper cover 1 pressed on cushion 4, cushion 4 atress warp and absorbs the stress that should originally be born by circuit board 3, so can reduce the deformation of circuit board 3. The circuit board 3 can be stressed evenly by arranging a plurality of soft pads 4, preferably, the number of the soft pads 4 is four, and four soft pads 4 are respectively arranged at four corners of the circuit board 3. Preferably, the optical module further comprises an unlocking structure, the unlocking structure further comprises a handle 19 and a sheet metal part 18, and the unlocking is completed by pulling the handle 19 to drive the sheet metal part 18 to move.

As an optimized scheme of the embodiment of the present invention, please refer to fig. 1 to 6, wherein the protruding columns 5 are disposed on two sides of the upper cover 1, and each side has two protruding columns 5; an avoiding position 6 is arranged between the two convex columns 5 on each side, and the upper cover 1 passes through the avoiding position 6 and the circuit board 3 to form an interval. In the embodiment, the designed avoiding position 6 prevents the position of the upper cover 1 from contacting the circuit board 3, so that the pressing on the circuit board 3 is reduced.

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 to 6, the cushion 4 is a cube structure with thickness, a contact surface of the cube structure and the circuit board 3 is a plane, and four corners of the upper portion of the cube structure are rounded corners. In this embodiment, cushion 4 has certain thickness, can play better stress relief effect, cushion 4 pastes on circuit board 3, bottom planar design makes things convenient for its circuit board 3 of laminating better, and the fillet of design is convenient and the cooperation of projection 5.

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 to 6, a photoelectric chip 7 is disposed on the circuit board 3. In the present embodiment, the optoelectronic chip 7 includes a light emitting chip, a light receiving chip, a driving chip, and a transimpedance amplifier, which are all heat generating devices. They need to be heat dissipated. The heat dissipation mode is as follows: the photoelectric chip 7 transfers heat to the base 2 through the heat conducting pad 9, and the heat conducting pad 9 is arranged on one side of the circuit board 3 departing from the upper cover 1. The circuit board 3 is provided with a hole 10, a copper column is filled in the hole 10, and the photoelectric chip 7 is connected with the heat conducting pad 9 through the copper column. In the above embodiment, the soft pad 4 is adopted to solve the stress on the circuit board 3 caused by the heat dissipation manner.

The above embodiments relate to a way of eliminating stress of an optical module, and a way of improving electromagnetic protection performance of the optical module is described below.

Referring to fig. 1 and 7 to 10, an embodiment of the present invention provides an optical module, which includes a housing composed of an upper cover 1 and a base 2 and an optical fiber 11 disposed in the housing, wherein the head and the tail of the optical fiber 11 are respectively connected to an optical port adapter 8 and a circuit board 3, the middle of the optical fiber 11 is clamped by conductive soft glue 12 disposed up and down, and one side of the conductive soft glue 12 deviating from the optical fiber 11 is respectively abutted to the upper cover 1 and the base 2. In this embodiment, the conductive soft rubber 12 can clamp the optical fiber 11 and contact the housing to form an effective conductive seal, thereby effectively solving the problem of electromagnetic radiation at the optical port side. Specifically, two ends of the optical fiber 11 are respectively connected with the optical port adapter 8 and the optoelectronic chip 7 on the circuit board 3. The optical fiber 11 has a certain length, the length of the optical fiber 11 is skillfully utilized in the embodiment, the conductive software is arranged at the middle part of the optical fiber 11, and the optical fiber 11 is clamped by the two conductive soft rubber 12, so that the effective conductive seal between the optical fiber and the shell can be ensured only by designing the size of the conductive soft rubber 12, such as the width and the thickness of the conductive soft rubber, and the problem of electromagnetic radiation is further effectively solved. Preferably, a gap is formed between the optical port adapter 8 and the circuit board 3, the middle of the optical fiber 11 is suspended, and the two conductive soft rubber 12 clamp the optical fiber 11 located at the suspended position. The conductive soft rubber 12 is arranged at a suspended position, so that the conductive soft rubber can be conveniently arranged in the shell without changing the standard space in the shell.

As an optimized scheme of the embodiment of the present invention, please refer to fig. 4, wherein the conductive soft rubber 12 is a cubic structure. In particular, the hollow cubic structure can be adopted. The hollow structure can absorb the stress generated by the interference fit of the upper cover 1 and the base 2, and avoid the damage of the optical fiber 11 caused by overlarge stress. This is because the hollow soft rubber can deform to absorb pressure when being pressed, thereby protecting the optical fiber 11.

As an optimized scheme of the embodiment of the present invention, please refer to fig. 7, 8 and 9, the upper cover 1 and the base 2 are both provided with a mounting position for the conductive soft rubber 12 to be mounted. The installation position is step-shaped, and the step-shaped installation position comprises a platform 13 for placing the conductive soft rubber 12 and a retaining wall 14 for blocking the conductive soft rubber 12. In this embodiment, the base 2 and the upper cover 1 are respectively provided with a mounting position for mounting the respective conductive soft rubber 12, the position of the conductive soft rubber 12 can be limited, the platform 13 can contact the conductive soft rubber 12, and the retaining wall 14 can block the conductive soft rubber 12 to prevent the conductive soft rubber from moving.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 8 and 9, the placement position on the base 2 is provided with a notch 15 for the optical fiber 11 to pass through. In this embodiment, the positioning position, specifically, the side of the retaining wall 14, is provided with a notch 15, so that the optical fiber 11 can pass through the notch conveniently without interfering with the optical fiber 11. Preferably, the notch 15 is provided with two slots 16 on both sides thereof, and the upper cover 1 has two ribs 17 capable of being respectively inserted into the two slots 16. The designed arrangement position can block the soft glue connection position, and the clamping groove 16 is matched with the convex rib 17, so that the problem of interference and reinforcement caused by the fact that electromagnetic waves penetrate through a long and thin slit can be avoided.

As the embodiment of the utility model provides an optimization scheme establish the conducting resin in casing and optic fibre 11's gap department. The designed conductive adhesive can fill the gap between the shell and the optical fiber 11, and the electric continuity effect is good.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an optical module that can eliminate stress, includes the casing of compriseing upper cover and base, be equipped with the circuit board on the base, just the circuit board is located in the casing, its characterized in that: the circuit board is provided with a plurality of soft pads on one side facing the upper cover, the upper cover extends towards the base to form convex columns capable of being pressed on the soft pads, the convex columns correspond to the soft pads one by one, and each convex column presses on the corresponding soft pad.

2. A stress-relieved optical module as defined in claim 1, wherein: the convex columns are arranged on two sides of the upper cover, and each side is provided with two convex columns; an avoiding position is arranged between the two convex columns on each side, and the upper cover passes through the avoiding position and has an interval with the circuit board.

3. A stress-relieving optical module as claimed in claim 1, wherein: the soft pad is a cube structure with thickness, the surface of the cube structure contacted with the circuit board is a plane, and four corners of the upper part of the cube structure are fillets.

4. A stress-relieved optical module as defined in claim 1, wherein: the soft pad is attached to the circuit board.

5. A stress-relieving optical module as claimed in claim 1, wherein: the number of the soft pads is four, and the four soft pads are respectively arranged at four corners of the circuit board.

6. A stress-relieving optical module as claimed in claim 1, wherein: and the circuit board is provided with a photoelectric chip.

7. A stress-relieved optical module as defined in claim 6, wherein: the photoelectric chip transfers heat to the base through the heat conducting pad, and the heat conducting pad is arranged on one side, away from the upper cover, of the circuit board.

8. A stress-relieved optical module as defined in claim 7, wherein: the circuit board is provided with a hole, a copper column is filled in the hole, and the photoelectric chip is connected with the heat conducting pad through the copper column.

9. A stress-relieved optical module as defined in claim 6, wherein: the photoelectric chip is attached to the circuit board.

10. A stress-relieving optical module as claimed in claim 1, wherein: and conductive adhesive is arranged at the gap between the shell and the optical fiber.