CN217588114U - Fingerprint identification module and terminal equipment - Google Patents
Fingerprint identification module and terminal equipment Download PDFInfo
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- CN217588114U CN217588114U CN202221250746.4U CN202221250746U CN217588114U CN 217588114 U CN217588114 U CN 217588114U CN 202221250746 U CN202221250746 U CN 202221250746U CN 217588114 U CN217588114 U CN 217588114U
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Abstract
The application provides a fingerprint identification module and terminal equipment, this fingerprint identification module includes: a substrate; a first circuit board located at an end of the substrate; a sensor disposed on a surface of the substrate; the sensor is electrically connected with the first circuit board through a metal wire. Compare in prior art, the fingerprint identification module of this application, because the sensor sets up the surface at the base plate, the circuit board is located the tip of base plate, and both are not set up on the base plate with range upon range of mode, consequently, help reducing the thickness of fingerprint identification module.
Description
Technical Field
The application relates to the technical field of fingerprint identification, particularly, relate to a fingerprint identification module and terminal equipment.
Background
At present, in the market of mobile terminals, it is common knowledge of manufacturers to pursue longer battery life and thinner body design, and how to make the terminals lighter and smaller is a concern of manufacturers. Current fingerprint identification module, range upon range of setting usually between its each part leads to the fingerprint identification module thicker, is unfavorable for realizing the frivolousization of product.
SUMMERY OF THE UTILITY MODEL
In view of this, an object of the present application is to provide a fingerprint identification module and a terminal device, so as to solve the problem that the fingerprint identification module is thick and is not beneficial to implementing the lightness and thinness of a product in the prior art.
In a first aspect, an embodiment of the present application provides a fingerprint identification module, and the fingerprint identification module includes: a substrate; a first circuit board located at an end of the substrate; a sensor disposed on a surface of the substrate; the sensor is electrically connected with the first circuit board through a metal wire.
In this application embodiment, through setting up the sensor on the surface of base plate, first circuit board is located the tip of base plate, compares in prior art with the range upon range of scheme that sets up of sensor and circuit board, helps reducing the thickness of fingerprint identification module. In addition, compare in the scheme that makes sensor and circuit board electricity be connected through routing joint among the prior art, the sensor of this application passes through the metal wire electricity with first circuit board and is connected, when can reducing the routing degree of difficulty, ensures the electric connection quality of sensor and first circuit board, increases the connection stability of sensor and first circuit board.
In one embodiment, the fingerprint identification module further comprises a piezoelectric material layer, and the piezoelectric material layer is arranged on the surface of the sensor far away from the substrate.
In this application embodiment, through set up the piezoelectric material layer in the fingerprint identification module, this piezoelectric material layer sets up the surface of keeping away from the base plate at the sensor for when piezoelectric material layer receives pressure, produce the signal of telecommunication and send the sensor to trigger sensor discernment fingerprint, from this, can improve the sensitivity of sensor to a certain extent, simultaneously, the sensor need not to be in operating condition always, helps energy saving.
In one embodiment, the fingerprint identification module further comprises an acoustic impedance matching layer, and the acoustic impedance matching layer is arranged on the surface of the piezoelectric material layer far away from the sensor.
In this application embodiment, through set up the acoustic impedance matching layer in fingerprint identification module, this acoustic impedance matching layer sets up the surface of keeping away from the sensor at the piezo-electric material layer, on the one hand, can reduce the interference signal who transmits the sensor, and on the other hand helps promoting fingerprint identification's accuracy through impedance matching.
In one embodiment, the fingerprint identification module further comprises a bonding adhesive layer, wherein the bonding adhesive layer is located between the sensor and the substrate and used for fixing the sensor on the substrate.
In this application embodiment, through set up the laminating glue film in the fingerprint identification module, this laminating glue film is located between sensor and the base plate for the sensor can be fixed on the base plate comparatively portably.
In an embodiment, the fingerprint identification module further includes a second circuit board electrically connected to the first circuit board, and the fingerprint identification signal of the sensor is led out through the metal wire, the first circuit board and the second circuit board in sequence.
In one embodiment, the second circuit board is a flexible board.
In one embodiment, the fingerprint identification module further comprises an ACF glue layer, and the second circuit board is electrically connected to the first circuit board through the ACF glue layer.
In an embodiment, the first circuit board is a flexible board, the first circuit board is disposed on the surface of the substrate, the fingerprint identification module further includes a conductive adhesive layer, the conductive adhesive layer is disposed between the first circuit board and the substrate, and the first circuit board is bonded to the substrate through the conductive adhesive layer.
In this application embodiment, when first circuit board is the soft board, first circuit board setting is on the surface of base plate, and through setting up conductive adhesive layer in the fingerprint identification module, this conductive adhesive layer sets up between first circuit board and base plate for first circuit board can be fixed on the base plate comparatively portably, and conductive adhesive layer helps satisfying the ground connection demand of first circuit board.
In one embodiment, the first circuit board is a hard board, and the first circuit board and the end portion of the substrate are of an integrated structure.
In the embodiment of the present application, when the first circuit board is a hard board, the end portions of the first circuit board and the substrate are an integrated structure, which is helpful for improving the firmness of the connection between the first circuit board and the substrate.
In one embodiment, the substrate has a thickness smaller than that of the first circuit board.
In one embodiment, the first circuit board is a hard board, and the first circuit board and the end portion of the substrate are of an integrated structure.
In an embodiment, the first circuit board is a hard board, and the first circuit board and the second circuit board form a rigid-flex board structure.
In the embodiment of the present application, when the first circuit board is a hard board, the first circuit board and the second circuit board form a rigid-flex board structure, which is helpful for the firmness of the connection between the first circuit board and the second circuit board.
In one embodiment, the substrate has a thickness smaller than that of the first circuit board.
In a second aspect, an embodiment of the present application provides a terminal device, including: a display panel having a back side facing away from the display side; in an embodiment of the first aspect and/or in combination with any possible implementation manner of the embodiment of the first aspect, the fingerprint identification module is disposed on the back side and is fixedly connected to the display panel.
In one embodiment, the terminal device further includes: the frame structural part is arranged on the back side and is provided with an accommodating space; the fingerprint identification module is located in the accommodating space.
In an embodiment, the terminal device further includes a heat dissipation layer and/or a protection layer, the heat dissipation layer is disposed between the frame structure and the display panel, and the heat dissipation layer is provided with a first opening corresponding to the accommodating space; the protective layer is arranged between the frame structural member and the display panel, and a second opening is formed in the protective layer corresponding to the accommodating space.
In an embodiment, the terminal device further includes a buffer layer, the buffer layer is disposed between the frame structure and the display panel, and the buffer layer is provided with a third opening corresponding to the receiving space.
The details of one or more embodiments of the application are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the application will be apparent from the description and drawings, and from the claims.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a fingerprint identification module according to a first embodiment of the present application;
fig. 2 is a schematic structural diagram of a fingerprint identification module according to a second embodiment of the present application;
fig. 3 is a schematic structural diagram of a fingerprint identification module according to a third embodiment of the present application;
fig. 4 is a schematic partial structure diagram of a fingerprint identification module according to an embodiment of the present application;
fig. 5 is a schematic partial structure diagram of a fingerprint identification module according to another embodiment of the present application;
fig. 6 is a schematic structural diagram of a fingerprint identification module according to a fourth embodiment of the present application;
fig. 7 is a schematic structural diagram of a fingerprint identification module according to a fifth embodiment of the present application;
fig. 8 is a schematic structural diagram of a terminal device according to an embodiment of the present application.
Icon: fingerprint identification modules 10, 10a, 10b, 10c, 10d; substrates 11, 11a, 11b, 11d; a fingerprint sensor 12; first circuit boards 13, 13a, 13b, 13c, 13d; a layer of piezoelectric material 14; an acoustic impedance matching layer 15; a bonding glue layer 16; second circuit boards 17, 17c; an ACF glue layer 18; a conductive adhesive layer 19; a display panel 21; a frame structure 22; a heat dissipation layer 23; a protective layer 24; a buffer layer 25.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a fingerprint identification module 10 according to a first embodiment of the present application. The fingerprint identification module 10 may include a substrate 11, a first circuit board 13 and a sensor 12.
The first circuit board 13 is located at an end of the substrate 11. The sensor 12 is disposed on the surface of the substrate 11. The fingerprint sensor 12 is electrically connected to the first circuit board 13 through a metal wire.
In an embodiment, other components may be disposed between the sensor 12 and the substrate according to a specific application scenario, so as to indirectly dispose the sensor 12 on the substrate 11.
Further, the sensor 12 may be connected to the first circuit board 13 by a Wire Bonding (Wire Bonding) method using a metal Wire.
It can be understood that the type and model of the selected metal wire can be selected according to the actual use scene, which is not limited in the present application.
In one embodiment, the sensor 12 may be an ultrasonic fingerprint sensor.
In one embodiment, the substrate 11 may be metal, resin, plastic, or the like. It is understood that whether the substrate 11 has insulation or not may be selected according to an actual usage scenario, and the present application is not limited thereto.
In the embodiment of the present application, the sensor 12 is disposed on the surface of the substrate 11, and the first circuit board 13 is located at the end of the substrate 11, which is beneficial to reducing the thickness of the fingerprint identification module 10 compared to the prior art in which the sensor 12 and the circuit board are stacked. In addition, compare in the scheme that makes sensor 12 and circuit board electricity be connected through routing bonding among the prior art, sensor 12 and first circuit board 13 of this application pass through the metal wire electricity and are connected, when can reducing the routing degree of difficulty, ensure the electric connection quality of sensor 12 and first circuit board 13, increase the connection stability of sensor 12 and first circuit board 13.
In one embodiment, the fingerprint identification module 10 may further include a piezoelectric material layer 14. The layer 14 of piezoelectric material is provided on the surface of the sensor 12 remote from the substrate 11.
It can be understood that, by arranging the piezoelectric material layer 14 in the fingerprint identification module 10, the piezoelectric material layer 14 is arranged on the surface of the sensor 12 far away from the substrate 11, so that when the piezoelectric material layer 14 receives pressure, an electric signal is generated and sent to the sensor 12 to trigger the sensor 12 to identify the fingerprint, thereby improving the sensitivity of the sensor 12 to a certain extent, and meanwhile, the sensor 12 does not need to be in a working state all the time, which is beneficial to saving energy consumption.
In another embodiment, the chip pixel sensing elements of the fingerprint sensor 12 may form a composite structure with the piezoelectric material layer 14.
In one embodiment, the fingerprint recognition module 10 may further include an acoustic impedance matching layer 15. An acoustic impedance matching layer 15 is disposed on the surface of the layer 14 of piezoelectric material remote from the sensor 12
In the embodiment of the present application, a bonding paste may be provided between the acoustic impedance matching layer 15 and the piezoelectric material layer 14 to bond the acoustic impedance matching layer 15 and the piezoelectric material layer 14.
Further, the acoustic impedance matching layer 15 may be a single-layer structure or a multilayer composite structure.
It can be understood that by disposing the acoustic impedance matching layer 15 in the fingerprint identification module 10, the acoustic impedance matching layer 15 is disposed on the surface of the piezoelectric material layer 14 away from the sensor 12, on one hand, the interference signal transmitted to the sensor 12 can be reduced, and on the other hand, the accuracy of fingerprint identification can be improved by impedance matching.
In one embodiment, the fingerprint identification module 10 may further include a bonding adhesive layer 16. The adhesive layer 16 is located between the sensor 12 and the substrate 11, and is used for fixing the sensor 12 on the substrate 11.
Specifically, the adhesive layer 16 may be a glue, a fixing glue film, or the like. It can be understood that the type of the adhesive can be selected according to the actual application scenario, which is not limited in the present application.
It can be understood that, by providing the adhesive layer 16 in the fingerprint identification module 10, the adhesive layer 16 is located between the sensor 12 and the substrate 11, so that the sensor 12 can be fixed on the substrate 11 more easily.
Further, the fingerprint identification module 10 further includes a second circuit board 17. The second circuit board 17 is electrically connected with the first circuit board 13, and the fingerprint identification signal of the sensor 12 is led out through the metal wire, the first circuit board 13 and the second circuit board 17 in sequence.
Further, the second circuit board 17 may be a flexible board (FPC board).
Specifically, the fingerprint identification module 10 may further include an ACF glue layer 18, and the second circuit board 17 is electrically connected to the first circuit board 13 through the ACF glue layer 18.
It is understood that the first circuit board 13 and the second circuit board 17 may be connected by HOTBAR (hot melt tin soldering), SMT soldering (surface mount technology), or the like. It can be understood that the specific connection scheme may be selected according to the actual application scenario, and the application is not limited thereto.
The first circuit board 13 may be a flexible board disposed on the surface of the substrate 11, and the fingerprint identification module 10 may further include a conductive adhesive layer 19. The conductive adhesive layer 19 is disposed between the first circuit board 13 and the substrate 11, and the first circuit board 13 is bonded to the substrate 11 through the conductive adhesive layer 19.
It can be understood that when the first circuit board 13 is a flexible board, the first circuit board 13 is disposed on the surface of the substrate 11, and the conductive adhesive layer 19 is disposed between the first circuit board 13 and the substrate 11 by disposing the conductive adhesive layer 19 in the fingerprint identification module 10, so that the first circuit board 13 can be easily fixed on the substrate 11, and the conductive adhesive layer 19 helps to meet the grounding requirement of the first circuit board 13.
In an embodiment, the connection between the first circuit board 13 and the substrate 11 may be SMT soldering.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a fingerprint identification module 10a according to a second embodiment of the present application. The difference between the fingerprint recognition module 10a and the fingerprint recognition module 10 shown in fig. 1 is that: the first circuit board 13a is a hard board (PCB).
In some embodiments of the present application, the first circuit board 13a may be integrated with the end portion of the substrate 11a, i.e., the first circuit board 13a is directly formed on the substrate 11a during the manufacturing process of the first circuit board 13 a. It can be understood that the first circuit board 13a and the end of the substrate 11a are of an integral structure, which helps to improve the firmness of the connection between the first circuit board 13a and the substrate 11 a.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a fingerprint identification module 10b according to a third embodiment of the present application. The difference between the fingerprint recognition module 10b and the fingerprint recognition module 10a shown in fig. 2 is that: the thickness of the substrate 11b is smaller than that of the first circuit board 13 b.
The boundary between the first circuit board 13b and the substrate 11b can be formed integrally in two ways as shown in fig. 4 and 5.
Specifically, please refer to fig. 4, wherein fig. 4 is a schematic partial structural diagram of a fingerprint identification module 10b according to an embodiment of the present disclosure.
An integrally molded boundary of the first circuit board 13b and the substrate 11b is provided on the surface of the substrate 11b, and the thickness of the substrate 11b is smaller than that of the first circuit board 13 b.
Referring to fig. 5, fig. 5 is a schematic partial structure diagram of a fingerprint identification module 10b according to another embodiment of the present application.
An integrally molded boundary of the first circuit board 13b and the base plate 11b is provided at an end edge of the base plate 11b, and the thickness of the base plate 11b is smaller than that of the first circuit board 13 b.
It can be understood that the specific thicknesses of the substrate 11b and the first circuit board 13b may be set according to practical application scenarios, and are not described herein again.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a fingerprint identification module 10c according to a fourth embodiment of the present application. The fingerprint identification module 10c is different from the fingerprint identification modules shown in fig. 1, 2 and 3 in that: the fingerprint identification module 10c does not include the ACF glue layer 18, and the first circuit board 13c and the second circuit board 17c form a rigid-flex board structure.
It can be understood that when the first circuit board 13c is a hard board, the first circuit board 13c and the second circuit board 17c form a rigid-flex board structure, which is helpful for the firmness of the connection between the first circuit board 13c and the second circuit board 17 c.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a fingerprint identification module 10d according to a fifth embodiment of the present application. The difference between the fingerprint recognition module 10d and the fingerprint recognition module 10c shown in fig. 6 is that: the thickness of the substrate 11d is smaller than that of the first circuit board 13 d.
It should be understood that the thickness of the substrate 11d and the thickness of the first circuit board 13d of the fingerprint identification module 10d of the fifth embodiment are similar to those of fig. 4 and 5, and are not repeated herein.
Referring to fig. 8, fig. 8 is a structural diagram of a terminal device according to an embodiment of the present application. The terminal device may include the display panel 21 and the fingerprint recognition module 10 provided in any of the foregoing embodiments.
The display panel 21 has a back side departing from the display side, and the fingerprint identification module 10 is disposed on the back side and fixedly connected to the display panel 21.
Further, the fingerprint identification module 10 may be fixed on the back side of the display panel 21 by glue, glue film, foam, silica gel, or the like.
It can be understood that the terminal device may be a tablet computer, a mobile phone, or the like.
In some embodiments of the present application, the terminal device may further include a frame structure 22. The frame structure 22 is disposed on the back side of the display panel 21 and has an accommodating space, and the fingerprint identification module 10 is located in the accommodating space.
In an embodiment, the terminal device further includes a heat dissipation layer 23 and/or a protection layer 24, the heat dissipation layer 23 is disposed between the frame structure 22 and the display panel 21, the heat dissipation layer 23 is provided with a first opening corresponding to the receiving space, the protection layer is disposed between the frame structure and the display panel, and the protection layer is provided with a second opening corresponding to the receiving space.
It is understood that the heat dissipation layer 23 can be a metal material, such as copper, aluminum, or the like, or a non-metal material with high heat conduction efficiency, or the like. The protective layer 24 may be a foam tape, and the protective layer 24 prevents the display panel 21 from entering dust and other impurities, so as to prevent the display effect of the display panel 21 from being affected.
In an embodiment, the terminal device further includes a buffer layer 25, the buffer layer 25 is disposed between the frame structure 22 and the display panel 21, and the buffer layer 25 is provided with a third opening corresponding to the receiving space.
It can be understood that buffer layer 25 can be used for buffering the power that display panel 21 and fingerprint identification module 10 received, avoids the atress too big, leads to devices such as display panel 21, fingerprint identification module 10 to damage.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
In addition, units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
Furthermore, the functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (17)
1. The utility model provides a fingerprint identification module which characterized in that includes:
a substrate;
a first circuit board located at an end of the substrate;
a sensor disposed on a surface of the substrate; the sensor is electrically connected with the first circuit board through a metal wire.
2. The fingerprint identification module of claim 1, further comprising a piezoelectric material layer disposed on a surface of the sensor remote from the substrate.
3. The fingerprint identification module of claim 2, further comprising an acoustic impedance matching layer disposed on a surface of the layer of piezoelectric material remote from the sensor.
4. The fingerprint identification module of claim 1, further comprising a glue layer between the sensor and the substrate for securing the sensor to the substrate.
5. The fingerprint identification module of claim 1, further comprising a second circuit board electrically connected to the first circuit board, wherein the fingerprint identification signal of the sensor is sequentially led out through the metal wire, the first circuit board and the second circuit board.
6. The fingerprint identification module of claim 5, wherein the second circuit board is a flexible board.
7. The fingerprint identification module of claim 6, further comprising an ACF glue layer, wherein the second circuit board is electrically connected to the first circuit board through the ACF glue layer.
8. The fingerprint identification module of any one of claims 1 to 7, wherein the first circuit board is a flexible board, the first circuit board is disposed on a surface of the substrate, the fingerprint identification module further comprises a conductive adhesive layer, the conductive adhesive layer is disposed between the first circuit board and the substrate, and the first circuit board is bonded to the substrate through the conductive adhesive layer.
9. The fingerprint identification module of claim 7, wherein the first circuit board is a rigid board, and the first circuit board is integrally formed with an end of the base plate.
10. The fingerprint identification module of claim 9, wherein the substrate has a thickness less than a thickness of the first circuit board.
11. The fingerprint identification module of any one of claims 1-6, wherein the first circuit board is a rigid board, and the first circuit board is integrated with an end portion of the substrate.
12. The fingerprint identification module of claim 11, wherein the first circuit board is a rigid board, and the first circuit board and the second circuit board form a rigid-flex board structure.
13. The fingerprint identification module of claim 12, wherein the substrate has a thickness less than a thickness of the first circuit board.
14. A terminal device, comprising:
a display panel having a back side facing away from the display side;
the fingerprint identification module of any one of claims 1-13, said fingerprint identification module being disposed on said back side and fixedly attached to said display panel.
15. The terminal device of claim 14, wherein the terminal device further comprises:
the frame structural part is arranged on the back side and is provided with an accommodating space;
the fingerprint identification module is located in the accommodating space.
16. The terminal device according to claim 15, wherein the terminal device further comprises a heat dissipation layer and/or a protective layer, the heat dissipation layer is disposed between the frame structure and the display panel, and the heat dissipation layer is provided with a first opening corresponding to the receiving space;
the protective layer is arranged between the frame structural member and the display panel, and a second opening is formed in the protective layer corresponding to the accommodating space.
17. The terminal device according to claim 15, further comprising a buffer layer disposed between the frame structure and the display panel, wherein the buffer layer is provided with a third opening corresponding to the receiving space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221250746.4U CN217588114U (en) | 2022-05-18 | 2022-05-18 | Fingerprint identification module and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221250746.4U CN217588114U (en) | 2022-05-18 | 2022-05-18 | Fingerprint identification module and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217588114U true CN217588114U (en) | 2022-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221250746.4U Active CN217588114U (en) | 2022-05-18 | 2022-05-18 | Fingerprint identification module and terminal equipment |
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| Country | Link |
|---|---|
| CN (1) | CN217588114U (en) |
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- 2022-05-18 CN CN202221250746.4U patent/CN217588114U/en active Active
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Address after: 201-1, 2nd Floor, Building 4, No. 188 Rixin Road, Binhai Science and Technology Park, Binhai New Area, Tianjin, 300450 Patentee after: Tianjin Jihao Technology Co.,Ltd. Address before: 100082 Z, 17th floor, No. 1, Zhongguancun Street, Haidian District, Beijing Patentee before: Beijing Jihao Technology Co.,Ltd. |