CN217546407U

CN217546407U - High current-carrying circuit board

Info

Publication number: CN217546407U
Application number: CN202221021223.2U
Authority: CN
Inventors: 周晓斌; 袁绪彬; 陈爱兵
Original assignee: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd
Current assignee: RAYBEN TECHNOLOGIES (ZHUHAI) Ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-10-04
Anticipated expiration: 2032-04-29

Abstract

The utility model discloses a high current-carrying circuit board. The high current-carrying circuit board of an embodiment includes: an insulating substrate, at least one surface of which is provided with an outer layer conductive pattern and solder resist ink; the thickness of the outer layer conductive pattern is more than 100 mu m, and a first insulating material is filled in a circuit gap of the outer layer conductive pattern; the thickness of the solder resist ink is 10-30 μm. The utility model discloses fill first insulating material in outer conducting pattern's line clearance, can show to reduce and hinder and weld printing ink thickness to avoid or reduce because of hindering printing ink bubbling, the circuit corner that welds the printing ink excess thickness and produce easily and leak copper and components and parts and paste bad scheduling problem.

Description

High current-carrying circuit board

Technical Field

The utility model relates to a circuit board field; and more particularly to a circuit board having high current carrying capability.

Background

Solder resist ink is usually arranged on the surface of the circuit board, covers the non-conductive pattern surface of the circuit board and most of the outer conductive patterns of the circuit board, and only exposes connection and test point positions for component connection and electrical performance test in the outer conductive patterns.

For circuit boards requiring higher current carrying capacity, the prior art typically employs conductive traces with greater thickness and correspondingly increases the thickness of the solder resist ink (since solder resist ink is required to fill the trace gaps). However, after the thickness of the solder resist ink is increased, the problems of ink bubbling, copper leakage at line corners and the like are easily caused, and the mounting of components on a circuit board is also affected, so that poor mounting is easily caused.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a high current-carrying circuit board capable of reducing solder resist thickness.

In order to achieve the above main objective, an embodiment of the present invention provides a high current-carrying circuit board, which includes:

an insulating substrate, at least one surface of which is provided with an outer layer conductive pattern and solder resist ink;

the thickness of the outer layer conductive pattern is more than 100 mu m, and a first insulating material is filled in a line gap of the outer layer conductive pattern; the thickness of the solder resist ink is 10-30 μm.

Among the above-mentioned technical scheme, the line clearance of outer conductive pattern is instead hinders the filling of welding ink through first insulating material, is favorable to reducing the thickness of hindering the welding ink, from can avoiding or reducing because of hindering the printing ink bubbling, the line corner that welding ink too thick leads to and leak copper and components and parts and paste bad scheduling problem.

Preferably, the thickness of the solder resist ink is 10 μm to 20 μm.

Preferably, the surface roughness of the first insulating material is 5 μm to 15 μm to enhance the bonding force of the solder resist ink and the first insulating material.

Preferably, the first insulating material is a resin material.

According to the utility model discloses a concrete implementation mode, insulating substrate is including the multilayer insulated core board of range upon range of setting, through first bonding material bonding connection between the multilayer insulated core board, and first bonding material is the prepreg.

Further, the insulating substrate is internally provided with an inner layer conductive pattern arranged on the insulating core board, the thickness of the inner layer conductive pattern is more than 100 μm, and a line gap of the inner layer conductive pattern is filled with a second insulating material. Wherein the second insulating material may be a resin material.

In the prior art, the multilayer core boards are usually connected by laminating prepregs, but under the condition that the thickness of the inner conductive pattern is large, the condition that a cavity exists because an inner line gap cannot be fully filled by the prepregs easily occurs, so that the board surface is not flat and the voltage resistance is poor. In the technical scheme, the second insulating material is used for filling the line gap of the inner-layer conductive pattern, so that the problems of poor voltage resistance and uneven board surface caused by the cavity existing in the line gap of the inner-layer conductive pattern can be well solved.

Preferably, the surface roughness of the second insulating material is 5 μm to 15 μm to enhance the bonding force of the prepreg to the first insulating material.

According to the utility model discloses a concrete implementation mode, the embedded heat-conducting piece that has buried of insulating substrate, the heat-conducting piece runs through insulating substrate in the thickness direction to strengthen the heat dispersion of circuit board.

Preferably, the heat conducting member is bonded to the insulating substrate through a second bonding material, and the second bonding material and the first bonding material have an integrally formed structure, so that the heat conducting member and the insulating substrate are more reliably connected.

To more clearly illustrate the objects, aspects and advantages of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and the detailed description.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of embodiment 2 of the present invention.

It should be noted that, in order to clearly illustrate the structures that are being represented, the various parts of the drawings may not be drawn to the same scale. Therefore, unless explicitly stated otherwise, the drawings are not intended to be limited to the dimensions and proportional relationships of the various parts of the circuit board.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.

It should be noted that, in the case of conflict, the embodiments and features of the embodiments of the present invention may be combined with each other, and some descriptions of different embodiments may be omitted because they may be referred to each other.

Example 1

As shown in fig. 1, the high current carrying circuit board of embodiment 1 includes an insulating substrate, and an outer layer conductive pattern 21 is provided on a surface of the insulating substrate and an inner layer conductive pattern 22 is provided inside the insulating substrate. Specifically, the insulating substrate includes a first insulating core plate 11a, a second insulating core plate 11b, and a third insulating core plate 11c, which are stacked, the first insulating core plate 11a and the third insulating core plate 11c are outer core plates, and the second insulating core plate 11b is an inner core plate; the adjacent insulated core boards are bonded and connected through the first bonding material 12, and the first bonding material 12 can be a thermally cured prepreg.

Outer layer conductive patterns 21 are provided on the outer side surfaces of the first insulating core board 11a and the third insulating core board 11c, and inner layer conductive patterns 22 are provided on the inner side surfaces thereof; both surfaces of the second insulating core board 11b are also provided with the inner layer conductive patterns 22. In the utility model, the number of the inner core plates can be set according to the thickness of the circuit board and/or the layer number requirement of the circuit pattern; in addition, the two outer layer conductive patterns 21 may have the same or different structures, and the inner layer conductive patterns 22 may also have the same or different structures, and may be arranged according to the requirements, which is not limited thereto.

In the embodiment of the present invention, the thickness of the outer conductive pattern 21 is more than 100 μm, and the specific thickness can be set as required. Further, the line gap of the outer layer conductive pattern 21 is filled with a first insulating material 41, and the first insulating material 41 is preferably a resin material; the filling of the first insulating material 41 may be performed by a screen printing process. The embodiment of the utility model provides an in, because the line clearance of outer conductive pattern 20 is filled by first insulating material 41, consequently can reduce and hinder the thickness that welds printing ink 30, from can avoiding or reducing because of hindering printing ink 41 printing ink bubbling, the circuit corner copper leakage and the bad scheduling problem of components and parts subsides dress that leads to thickly.

The solder resist ink 30 covers most of the outer conductive pattern 21 and the first insulating material 41. The thickness of the solder resist ink 30 may be 10 μm to 30 μm, preferably 10 μm to 20 μm. In order to enhance the bonding force of the solder resist ink 30 and the first insulating material 41, the board grinding may be performed after the filling of the first insulating material 41 is completed to increase the surface roughness of the first insulating material 41. Wherein the surface roughness of the first insulating material 41 may be 5 μm to 15 μm, for example, about 10 μm.

The thickness of the inner layer conductive pattern 22 is also 100 μm or more, and the thickness of the inner layer conductive pattern 22 may be equal to that of the outer layer conductive pattern 21. Preferably, the line gap of the inner layer conductive pattern 22 is filled with the second insulating material 42, and the second insulating material 42 may also be a resin material. The embodiment of the utility model provides an in, because the line clearance of inlayer conductive pattern 22 is filled by second insulating material 42, consequently can avoid or reduce the line clearance of inlayer conductive pattern 22 and appear cavitedly, and then improve the plane flatness and the withstand voltage performance of circuit board.

In order to enhance the bonding force between the first bonding material 12 (prepreg) and the second insulating material 42, a grinding process may be performed after the filling of the second insulating material 42 is completed to increase the surface roughness of the second insulating material 42. Wherein the surface roughness of the second insulating material 42 may be 5 μm to 15 μm, for example, about 10 μm.

Example 2

As shown in fig. 2, in embodiment 2, a heat conductive member 50 is embedded in an insulating substrate, and the heat conductive member 50 penetrates the insulating substrate in a thickness direction. The material and shape of the heat conducting member 50 may not be limited, and for example, the material may be metal, ceramic or a combination thereof, and the shape may be a regular or irregular shape such as a circle, a polygon, or the like. In use, a component (not shown) can be mounted on the heat conducting member 50, and the heat conducting member 50 can be utilized to rapidly dissipate heat of the component.

The heat conducting member 50 is bonded to the insulating substrate through the second adhesive material 13, and the second adhesive material 13 and the first adhesive material 12 (prepreg) have an integrally formed structure. Specifically, windows may be formed in the insulating core board and the prepreg, then the heat conducting member 50 is placed in the window hole, and the insulating core board and the prepreg are pressed together, a part of the first bonding material 12 flows into a gap between the heat conducting member 50 and the insulating substrate during the pressing process, and the part is cured to form the second bonding material 13 having an integrated structure with the first bonding material 12.

Other structures of embodiment 2 can refer to the description of embodiment 1, and are not described again.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the scope of the invention. Any person skilled in the art can make some modifications without departing from the scope of the invention, i.e. all equivalent modifications made according to the invention are intended to be covered by the scope of the invention.

Claims

1. A high current carrying circuit board comprising:

an insulating substrate, at least one surface of the insulating substrate is provided with an outer layer conductive pattern and solder resist ink,

the method is characterized in that: the thickness of the outer layer conductive pattern is more than 100 mu m, and a first insulating material is filled in a line gap of the outer layer conductive pattern; the thickness of the solder resist ink is 10-30 μm.

2. High current carrying circuit board according to claim 1, characterized in that: the thickness of the solder resist ink is 10-20 μm.

3. High current carrying circuit board according to claim 1, characterized in that: the surface roughness of the first insulating material is 5-15 μm.

4. High current carrying circuit board according to claim 1, characterized in that: the first insulating material is a resin material.

5. High current carrying circuit board according to claim 1, characterized in that: the insulating substrate comprises a plurality of layers of insulating core plates which are stacked, the insulating core plates are connected in a bonding mode through a first bonding material, and the first bonding material is a prepreg.

6. High current carrying circuit board according to claim 5, characterized in that: the insulating substrate is internally provided with an inner layer conductive pattern arranged on the insulating core board, the thickness of the inner layer conductive pattern is more than 100 mu m, and a second insulating material is filled in a line gap of the inner layer conductive pattern.

7. High current carrying circuit board according to claim 6, characterized in that: the second insulating material is a resin material.

8. High current carrying circuit board according to claim 6, characterized in that: the surface roughness of the second insulating material is 5-15 μm.

9. High current carrying circuit board according to claim 5, characterized in that: the insulating substrate is embedded with a heat conducting piece, and the heat conducting piece penetrates through the insulating substrate in the thickness direction.

10. High current carrying circuit board according to claim 9, characterized in that: the heat conducting piece is bonded and connected with the insulating substrate through a second bonding material, and the second bonding material and the first bonding material are of an integrally formed structure.