CN217507928U - Heat sink matched with sectional chip and laser - Google Patents
Heat sink matched with sectional chip and laser Download PDFInfo
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- CN217507928U CN217507928U CN202221875797.6U CN202221875797U CN217507928U CN 217507928 U CN217507928 U CN 217507928U CN 202221875797 U CN202221875797 U CN 202221875797U CN 217507928 U CN217507928 U CN 217507928U
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Abstract
The utility model provides a heat sink and laser instrument for with sectional type chip matching relates to the technical field of laser instrument for heat sink with sectional type chip matching includes: the surface of the heat conducting part is provided with a first positive electrode and a second positive electrode which are electrically isolated, the first positive electrode is used for being butted with a laser area of the sectional chip, so that the first positive electrode injects a first current I into the laser area 1 The second positive electrode is used for being butted with the transparent area of the segmented chip so that the second positive electrode injects a second current I into the transparent area 2 The first current I 1 Greater than the second current I 2 。
Description
Technical Field
The utility model belongs to the technical field of the laser instrument technique and specifically relates to a heat sink and laser instrument for matcing with sectional type chip are related to.
Background
The existing segmented chip includes: the main part, the upper surface of main part is provided with the spine structure, and the orientation is close to light-emitting cavity face direction, the spine structure has in proper order and the laser region and the transparent region that the interval set up. The upper surface of the ridge structure is provided with a first positive electrode structure corresponding to the laser area and a second positive electrode structure corresponding to the transparent area. Applying a working current I to the laser region 1 A laser beam is generated in the laser area. Applying a current I to the transparent area 2 ，I 2 ＜I 1 The transparent region acts as a transparent waveguide to guide the laser beam out of the chip, reducing losses when the pump light is guided in the transparent region.
Pdown (ridge structure face down) packaging has the absolute advantage of less thermal resistance than Pup (ridge structure face up) packaging, but Pdown packaging cannot be completed by a sectional chip through a conventional heat sink, and therefore a heat sink capable of realizing the Pdown packaging is urgently needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat sink and laser instrument for matcing with the sectional type chip to alleviate the technical problem that current sectional type chip can't carry out Pdawn encapsulation through conventional heat sink.
In a first aspect, an embodiment of the present invention provides a heat sink for matching with a segmented chip, including: the surface of the heat conducting part is provided with a first positive electrode and a second positive electrode which are electrically isolated, the first positive electrode is used for being butted with a laser area of the sectional chip, so that the first positive electrode injects a first current I into the laser area 1 The second positive electrode is used for being butted with the transparent area of the segmented chip so that the second positive electrode injects a second current I into the transparent area 2 The first current I 1 Greater than the second current I 2 。
Further, a first isolation groove is arranged between the first positive electrode and the second positive electrode, and the first isolation groove is used for electrically isolating the first positive electrode from the second positive electrode.
Further, the surface of the heat conducting part is provided with a negative electrode, and the negative electrode is electrically isolated from the first positive electrode and the second positive electrode through a second isolation groove.
Further, the materials of the first positive electrode and the second positive electrode are the same.
Further, the second positive electrode includes a first portion and a second portion, the material of the first portion is the same as the material of the first positive electrode, and the resistivity of the material of the second portion is higher than the resistivity of the material of the first portion, so that the resistance of the second positive electrode is greater than the resistance of the first positive electrode.
Further, the material of the second portion is silicon carbide.
Further, the first positive electrode and the second positive electrode are made of materials having different resistivities.
Further, the material of the first positive electrode is metal copper.
Further, the heat conduction portion has a heat resistance layer inside thereof at a position between the first positive electrode and the second positive electrode, the heat resistance layer being for preventing heat of a portion of the heat conduction portion below the first positive electrode from being conducted in a lateral direction to a portion of the heat conduction portion below the second positive electrode.
In a second aspect, the present invention provides a laser, including the above-mentioned heat sink for matching with a segmented chip.
The embodiment of the utility model provides a be used for with heat sink of sectional type chip matching includes: the surface of the heat conducting part is provided with a first positive electrode and a second positive electrode which are electrically isolated, the first positive electrode is used for being butted with a laser area of the sectional chip, so that the first positive electrode injects a first current I into the laser area 1 The second positive electrode is used for being butted with the transparent area of the segmented chip so that the second positive electrode injects a second current I into the transparent area 2 The first current I 1 Greater than the second current I 2 . The first positive electrode and the second positive electrode which are electrically isolated from each other are arranged on the heat conducting part of the heat sink, when the heat sink is packaged with the chip, the first positive electrode is connected with the laser area of the chip, and the second positive electrode is connected with the laser area of the chipThe transparent areas of the chips are connected, the heat sink is utilized to realize the multi-section positive electrode current injection of the chips, and the current injection with different sizes can be respectively realized, so that the Pdawn packaging of the sectional type chips can be realized, large current can be applied to the laser areas of the chips to carry out laser lasing, and small current can be applied to the transparent areas of the chips to form transparent windows.
The embodiment of the utility model provides a laser instrument includes foretell be used for with sectional type chip matching's heat sink. Because the embodiment of the utility model provides a laser instrument has quoted foretell heat sink, so, the embodiment of the utility model provides a laser instrument also possesses heat sink's advantage.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a top view of a heat sink for matching with a segmented chip according to an embodiment of the present invention;
fig. 2 is a sectional view taken along a-a in fig. 1.
Icon: 100-a first positive electrode; 200-a second positive electrode; 210-a first portion; 220-a second portion; 300-negative electrode; 410-a first isolation trench; 420-a second isolation trench; 500-a heat conducting portion; 600-thermal barrier.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 and fig. 2, a heat sink for matching with a segmented chip according to an embodiment of the present invention includes: and a heat conduction part 500, wherein the heat conduction part 500 is used for conducting heat of the first positive electrode 100, the second positive electrode 200 and the negative electrode 300 outwards so as to reduce heat on a chip packaged with the heat sink. The material of the heat conduction part 500 may be ceramic.
The upper surface of the heat conducting part 500 is provided with a first positive electrode 100 and a second positive electrode 200 which are electrically isolated, the first positive electrode 100 and the second positive electrode 200 can be arranged in a split mode, when the heat conducting part is manufactured, a first isolation groove 410 is formed by utilizing an etching process, and the first isolation groove 410 completely separates the first positive electrode 100 and the second positive electrode 200 to avoid electric interference between the first positive electrode 100 and the second positive electrode 200.
When Pdown packaging is performed, the first anode 100 is in butt joint with a laser region of the segmented chip, so that the first anode 100 injects a first current I into the laser region 1 The second positive electrode 200 is butted with the transparent region of the segmented chip, so that the second positive electrode 200 injects a second current I into the transparent region 2 The first current I 1 Greater than the second current I 2 。
The advantages of this embodiment are as follows: through setting up first positive pole 100 and second positive pole 200 that electrically separate each other on heat conduction portion 500 of heat sink, when heat sink and chip package, with the laser region connection of first positive pole 100 with the chip, with the transparent region connection of second positive pole 200 with the chip, utilize foretell heat sink to realize the positive current injection of multistage to the chip, can realize the current injection of equidimension not respectively to can realize the Pdawn encapsulation of sectional type chip, can exert heavy current at the laser region department of chip and carry out laser lasing, can exert undercurrent at the transparent region department of chip and form transparent window.
In addition to the manner in which the first isolation groove 410 is provided between the first positive electrode 100 and the second positive electrode 200, an insulating material may be provided between the first positive electrode 100 and the second positive electrode 200, thereby achieving electrical isolation therebetween.
The upper surface of the heat conduction part 500 further has a negative electrode 300, and the negative electrode 300 is electrically isolated from the first positive electrode 100 and the second positive electrode 200 by a second isolation groove 420.
The first isolation groove 410 and the second isolation groove 420 are communicated with each other and are T-shaped, and the first positive electrode 100, the second positive electrode 200 and the negative electrode 300 are completely separated from each other and independent from each other on the heat conduction portion 500.
In one possible embodiment, the materials of the first positive electrode 100 and the second positive electrode 200 are the same.
The two materials may be conventional electrode materials, such as copper, and a first external power source may be connected to the first positive electrode 100 and a second external power source may be connected to the second positive electrode 200, so that the first positive electrode 100 may input a relatively large first current I to the laser region of the chip 1 While a relatively small second current I is input to the transparent region of the chip 2 . Applying a working current I to the laser region 1 A laser beam is generated in the laser area. Applying a current I to the transparent area 2 ，I 2 ＜I 1 The transparent region acts as a transparent waveguide to guide the laser beam out of the chip, reducing losses when the pump light is guided in the transparent region.
In another embodiment, the second positive electrode 200 may include a first portion 210 and a second portion 220, the material of the first portion 210 is the same as the material of the first positive electrode 100, and the resistivity of the material of the second portion 220 is higher than the resistivity of the material of the first portion 210, so that the resistance of the second positive electrode 200 is greater than the resistance of the first positive electrode 100.
The first portion 210 and the second portion 220 may be formed by stacking layers, and different materials may be sequentially plated during the manufacturing process. A copper plated layer, i.e., the first portion 210, may be formed on the upper surface of the heat conduction part 500, and then a silicon carbide layer, i.e., the second portion 220, may be formed on the copper plated layer, the silicon carbide having a high resistivity, and the resistance of the second positive electrode 200 as a whole may be increased. When the resistance of the second positive electrode 200 is greater than that of the first positive electrode 100, a larger current can be generated in the first positive electrode 100 and a relatively smaller current can be generated in the second positive electrode 200 by applying the same voltage to the first positive electrode 100 and the second positive electrode 200, so that the laser area and the transparent area on the segmented chip are adapted, and the requirement for an external power supply is smaller.
In yet another possible embodiment, the resistivity of the materials of the first and second positive electrodes 100 and 200 are different.
The materials of the first positive electrode 100 and the second positive electrode 200 may be the same or different. And the first positive electrode 100 and the second positive electrode 200 are prepared by selecting materials with different resistivity, so that the resistance of the second positive electrode 200 is far larger than that of the first positive electrode 100, and therefore, the first positive electrode 100 and the second positive electrode 200 can generate larger current and the second positive electrode 200 can generate smaller current by applying the same voltage to the first positive electrode 100 and the second positive electrode 200, so that the laser area and the transparent area on a sectional chip are adapted, and the requirement on an external power supply is smaller.
The material of the first positive electrode 100 may be metallic copper, and the material of the second positive electrode 200 may be a pure substance having a higher resistivity than the metallic copper, or a mixture doped with multiple materials.
The heat conduction portion 500 has a heat resistance layer 600 therein at a position between the first positive electrode 100 and the second positive electrode 200, the heat resistance layer 600 serving to prevent heat of the portion of the heat conduction portion 500 below the first positive electrode 100 from being conducted in the lateral direction to the portion of the heat conduction portion 500 below the second positive electrode 200.
In order to avoid the light-emitting cavity surface from being affected by the thermal crosstalk of the first positive electrode 100, a thermal resistance layer 600 may be further disposed inside the thermal conduction portion 500, the thermal resistance layer 600 is located between the first positive electrode 100 and the second positive electrode 200, and the thermal resistance layer 600 is configured to reduce the heat inside the thermal conduction portion 500 from being conducted in the lateral direction along the direction from the first positive electrode 100 to the second positive electrode 200. An accommodating groove extending in the left-right direction may be formed in the upper surface of the heat conducting portion 500, a distance between the left and right ends of the accommodating groove may be slightly greater than the lengths of the first positive electrode 100 and the second positive electrode 200 in the left-right direction, and a heat blocking material may be filled in the accommodating groove to form the heat blocking layer 600, and the heat blocking layer 600 having a length in the left-right direction greater than the lengths of the first positive electrode 100 and the second positive electrode 200 may be formed in the accommodating groove, so that the heat blocking layer 600 having a sufficient width may be formed in the heat conducting portion 500, thereby performing a sufficient heat blocking and reducing a lateral conduction of heat, and the accommodating groove does not cross the second isolation groove 420.
The embodiment of the utility model provides a laser instrument includes foretell be used for with sectional type chip matching's heat sink. Because the embodiment of the utility model provides a laser instrument has quoted foretell heat sink, so, the embodiment of the utility model provides a laser instrument also possesses heat sink's advantage.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A heat sink for mating with a segmented chip, comprising: a heat conducting part (500), wherein the surface of the heat conducting part (500) is provided with a first positive electrode (100) and a second positive electrode (200) which are electrically isolated, the first positive electrode (100) is used for being butted with a laser region of the segmented chip, so that the first positive electrode (100) injects a first current I into the laser region 1 The second positive electrode (200) is used for being butted with the transparent area of the segmented chip, so that the second positive electrode (200) injects a second current I into the transparent area 2 The first current I 1 Greater than the second current I 2 。
2. The heat sink for mating with a segmented chip according to claim 1, wherein the first positive electrode (100) and the second positive electrode (200) have a first isolation groove (410) therebetween, the first isolation groove (410) for electrically isolating the first positive electrode (100) and the second positive electrode (200).
3. The heat sink for mating with a segmented chip according to claim 2, wherein the heat conducting portion (500) surface has a negative pole (300), the negative pole (300) being electrically isolated from the first positive pole (100) and the second positive pole (200) by a second isolation groove (420), respectively.
4. The heat sink for mating with a segmented chip according to claim 1, wherein the first positive electrode (100) and the second positive electrode (200) are of the same material.
5. The heat sink for matching with a segmented chip according to claim 1, wherein the second positive electrode (200) comprises a first portion (210) and a second portion (220), the material of the first portion (210) being the same as the material of the first positive electrode (100), the resistivity of the material of the second portion (220) being higher than the resistivity of the material of the first portion (210) such that the resistance of the second positive electrode (200) is greater than the resistance of the first positive electrode (100).
6. The heat sink for mating with a segmented chip according to claim 5, wherein the material of the second portion (220) is silicon carbide.
7. The heat sink for matching with a segmented chip according to claim 1, wherein the first positive electrode (100) and the second positive electrode (200) are of different materials resistivity.
8. The heat sink for mating with a segmented chip according to claim 1, wherein the material of the first positive electrode (100) is metallic copper.
9. The heat sink for matching with a segmented chip according to any of claims 1-8, wherein the heat conducting portion (500) has a heat resistant layer (600) inside at a position between the first positive electrode (100) and the second positive electrode (200), the heat resistant layer (600) is used for preventing heat of the part of the heat conducting portion (500) below the first positive electrode (100) from being conducted to the part of the heat conducting portion (500) below the second positive electrode (200) along the transverse direction.
10. A laser comprising a heat sink according to any of claims 1 to 9 for matching with a segmented chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221875797.6U CN217507928U (en) | 2022-07-20 | 2022-07-20 | Heat sink matched with sectional chip and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221875797.6U CN217507928U (en) | 2022-07-20 | 2022-07-20 | Heat sink matched with sectional chip and laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217507928U true CN217507928U (en) | 2022-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221875797.6U Active CN217507928U (en) | 2022-07-20 | 2022-07-20 | Heat sink matched with sectional chip and laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217507928U (en) |
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2022
- 2022-07-20 CN CN202221875797.6U patent/CN217507928U/en active Active
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