CN217484770U - Flow sensor and mass flow controller - Google Patents

Flow sensor and mass flow controller Download PDF

Info

Publication number
CN217484770U
CN217484770U CN202221342982.9U CN202221342982U CN217484770U CN 217484770 U CN217484770 U CN 217484770U CN 202221342982 U CN202221342982 U CN 202221342982U CN 217484770 U CN217484770 U CN 217484770U
Authority
CN
China
Prior art keywords
sensor
chip
flow
groove
accommodating cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202221342982.9U
Other languages
Chinese (zh)
Inventor
王贲
何漫丽
王蒙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Sevenstar Flow Co Ltd
Original Assignee
Beijing Sevenstar Flow Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Sevenstar Flow Co Ltd filed Critical Beijing Sevenstar Flow Co Ltd
Priority to CN202221342982.9U priority Critical patent/CN217484770U/en
Application granted granted Critical
Publication of CN217484770U publication Critical patent/CN217484770U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model provides a flow sensor, which comprises a sensor bottom plate, a sensor chip module, a sensor pressing plate and a signal processing module, wherein a chip accommodating cavity is formed in the sensor bottom plate, a runner groove is formed at the bottom of the chip accommodating cavity, and two ends of the runner groove are communicated with a pipeline of fluid to be measured through two communicating holes penetrating to the bottom surface of the sensor bottom plate; the sensor chip module is arranged opposite to the runner groove, the detection point of the sensor chip module is opposite to the runner groove, and the sensor chip module is used for detecting a temperature signal of the fluid to be detected and sending the temperature signal to the signal processing module; the sensor pressing plate is pressed at the bottom of the chip accommodating cavity and used for sealing the runner groove; the signal processing module is arranged above the sensor pressing plate and used for determining the flow of the fluid to be measured flowing through the flow channel groove based on the temperature signal sent by the sensor chip module. The utility model provides a flow sensor detects precision height, stability good. The utility model also provides a mass flow controller.

Description

Flow sensor and mass flow controller
Technical Field
The utility model relates to a semiconductor process equipment field specifically relates to a flow sensor and a mass flow controller including this flow sensor.
Background
With the continuous and high-speed development of self-integrated circuits, Micro-Electro-Mechanical System (MEMS) technology has emerged quietly, and the principle of the technology is to integrate an inductive component on a Micro-diaphragm by Micro-nano technology to realize rapid detection and response to the surrounding environment. The detection technology of the micro electro mechanical system is divided into the following steps according to the principle: thermal, differential pressure, lift, fluid vibration, coriolis, and bionic micro-flow.
Compared with the traditional thermal sensor, the micro sensing module of the micro-electromechanical system flow sensor can reduce the interference of the micro-electromechanical system flow sensor on a flow field, and the micro-electromechanical system flow sensor has the advantages of small mass inertia and thermal inertia, high response speed, low power consumption, low cost and the like. However, the existing thermal flow sensor of the micro-electromechanical system has poor sealing performance, and the measurement accuracy and the measurement consistency of the thermal flow sensor are affected.
Therefore, how to provide a sensor structure with better sealing performance for a mass flow controller becomes a technical problem to be solved in the field.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a flow sensor and a mass flow controller including this flow sensor, this flow sensor's detection precision and stability are higher.
In order to achieve the above objects, as an aspect of the present invention, there is provided a flow sensor for detecting a flow rate of a fluid, the flow sensor including a sensor base plate, a sensor chip module, a sensor pressing plate and a signal processing module, the sensor base plate having a chip accommodating chamber formed therein, the chip accommodating chamber having a channel groove formed at a bottom thereof, and two ends of the channel groove being communicated with a pipeline of the fluid to be detected through two communication holes penetrating to a bottom surface of the sensor base plate; the sensor chip module is arranged opposite to the runner groove, a detection point of the sensor chip module is opposite to the runner groove and is used for contacting with the fluid to be detected flowing through the runner groove, and the sensor chip module is used for detecting a temperature signal of the fluid to be detected and sending the temperature signal to the signal processing module; the sensor pressing plate is pressed at the bottom of the chip accommodating cavity and used for sealing the runner groove; the signal processing module is arranged above the sensor pressing plate and used for determining the flow of the fluid to be detected flowing through the runner groove based on the temperature signal sent by the sensor chip module.
Optionally, the runner groove includes a first communicating section, a detecting section and a second communicating section which are communicated in sequence, one end of the first communicating section and one end of the second communicating section, which are far away from the detecting section, are provided with the communicating hole, and the sensor chip module is arranged opposite to the detecting section.
Optionally, a plurality of sealing grooves are further formed in the bottom of the chip accommodating cavity, the sealing grooves are arranged in parallel with the detection section and filled with a sealing insulating material, and the sensor chip module is pressed on the sealing grooves to seal the detection section.
Optionally, a bonding layer is arranged between the bottom surface of the sensor pressing plate and the bottom of the chip accommodating cavity, the bonding layer has a avoiding hole corresponding to the runner groove in shape and position, and the bonding layer is used for bonding and connecting the sensor pressing plate and the sensor bottom plate to seal the runner groove.
Optionally, the flow sensor further includes a plurality of first mounting screws, a plurality of first threaded holes are formed in the bottom of the chip accommodating cavity, a plurality of first through holes penetrating through the sensor pressing plate in the thickness direction are formed in the sensor pressing plate, the first through holes are in one-to-one correspondence with the first threaded holes, and the first mounting screws penetrate through the first through holes in a one-to-one correspondence manner and are screwed into the corresponding first threaded holes, so that the sensor pressing plate is fixedly connected with the sensor bottom plate.
Optionally, a chip fixing groove is formed in the bottom of the chip accommodating cavity, the bottom of the chip fixing groove is provided with the detection section and the plurality of sealing grooves, the sensor chip module is pressed in the plurality of sealing grooves in the chip fixing groove, and the upper surface of the sensor chip module is flush with the bottom of the chip accommodating cavity.
Optionally, the sensor chip module includes detection chip, circuit board and many conductive pins, it holds to have on the circuit board the holding tank of detection chip, the check point is located on the detection chip, the detection chip is arranged in the holding tank and with flow through the runner groove the fluid contact that awaits measuring for it flows through to detect the runner groove the fluidic temperature signal that awaits measuring, the one end of conductive pin is fixed in on the circuit board, the other end with the signal processing module electricity is connected, many pins of detection chip pass through the circuit board with many the conductive pin one-to-one electricity is connected.
Optionally, the circuit board has a routing area and a pad area, the accommodating groove is disposed in the routing area, the circuit board has a plurality of traces on one side of the routing area facing the bottom of the chip accommodating cavity, the circuit board has a plurality of electrodes on one side of the pad area facing the bottom of the chip accommodating cavity, one ends of the traces are connected to the plurality of pins of the detection chip in a one-to-one correspondence manner, and the other ends of the traces extend to the pad area and are connected to the plurality of electrodes in a one-to-one correspondence manner;
the conductive pin comprises a horizontally extending bending part and a vertically extending connecting part, one end of each of the bending parts is fixed and electrically connected with the electrodes in a one-to-one correspondence manner, the other end of each of the bending parts is connected with the bottom end of the corresponding connecting part, and the top end of each connecting part penetrates through the upper part of the accommodating cavity of the detection chip and is electrically connected with the signal processing module;
the bottom that the chip holds the chamber still is formed with dodges the groove, dodge the groove with chip fixed slot intercommunication, the kink is arranged in dodge the inslot, the circuit board is pressed to be fixed in the chip fixed slot.
Optionally, the embedment has the casting glue in the chip holds the chamber, the lateral wall that the chip held the chamber is formed with dodges the breach, dodge the breach with dodge the groove intercommunication, dodge the breach be used for to the chip holds embedment in the chamber the casting glue.
Optionally, the flow sensor further includes a plurality of second mounting screws, a plurality of second threaded holes are formed in the sensor base plate, the signal processing module has a plurality of second through holes penetrating through the signal processing module in the thickness direction, the plurality of second through holes correspond to the plurality of second threaded holes in position one to one, and the plurality of second mounting screws penetrate through the plurality of second through holes in one to one correspondence and are screwed into the corresponding second threaded holes, so that the signal processing module is fixedly connected to the sensor base plate.
As a second aspect of the present invention, there is provided a mass flow controller, wherein the mass flow controller includes a fluid passage, the fluid passage is used for communicating with a pipeline of a fluid to be measured, the mass flow controller further includes a flow sensor, the flow sensor is disposed on the fluid passage, two ends of the flow channel are passed through the communication hole and the fluid passage are communicated with each other.
The utility model provides an among flow sensor and mass flow controller, the bottom that the chip of flow sensor's sensor bottom plate held the chamber is formed with the runner groove, the sensor clamp plate is in sealed runner groove, press the sensor chip module and fix in the chip fixed slot, thereby when guaranteeing the seal of the in-process flow path of the fluid of awaiting measuring through intercommunicating pore business turn over runner groove, the stability of sensor chip module position has been guaranteed, and then flow sensor's detection precision and stability have been guaranteed, the response speed of using this flow sensor's mass flow controller has been improved, the measuring accuracy, interference killing feature and job stabilization nature.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is an exploded schematic view of a flow sensor provided in an embodiment of the present invention;
fig. 2 is a schematic top view of a flow sensor provided by an embodiment of the present invention;
fig. 3 is a cross-sectional view of a flow sensor provided by an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a sensor base plate in a flow sensor provided by an embodiment of the present invention;
fig. 5 is a schematic bottom structure diagram of a sensor bottom plate in a flow sensor according to an embodiment of the present invention;
fig. 6 is a schematic diagram of one installation step of a flow sensor provided by an embodiment of the present invention;
fig. 7 is a schematic diagram of another installation step of a flow sensor provided by an embodiment of the present invention;
fig. 8 is a schematic diagram illustrating a connection relationship between a sensor chip module and a conductive pin in a flow sensor according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a mass flow controller according to an embodiment of the present invention.
Description of reference numerals:
100: the sensor base plate 110: runner groove
111: communication hole 112: first communicating section
113: detection section 114: second communicating section
120: chip fixing groove 121: sealing groove
130: avoidance groove 140: first screw hole
150: second screw hole 160: fixing through hole
200: the sensor chip module 201: detection chip
202: the circuit board 210: conductive needle
300: the sensor platen 310: first mounting screw
320: first through hole 400: adhesive layer
500: the signal processing module 510: second mounting screw
520: second through hole
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It should be understood that the description herein is provided for illustration and explanation of the invention and is not intended to limit the invention.
In order to solve the above technical problem, as an aspect of the present invention, there is provided a flow sensor, as shown in fig. 1 to 3, the flow sensor includes a sensor base plate 100, a sensor chip module 200 (which may be a Micro Electro Mechanical System (MEMS) chip, for example), a sensor pressing plate 300 and a signal processing module 500, a chip accommodating cavity is formed in the sensor base plate 100, a runner groove 110 is formed at the bottom of the chip accommodating cavity, and both ends of the runner groove 110 are communicated with a pipeline of a fluid to be measured through two communication holes 111 penetrating to a bottom surface of the sensor base plate 100. The sensor chip module 200 is disposed opposite to the flow channel groove 110, a detection point of the sensor chip module 200 is opposite to the flow channel groove 110, and is configured to contact with a fluid (e.g., gas, liquid) to be detected flowing through the flow channel groove 110, and the sensor chip module 200 is configured to detect a temperature signal of the fluid to be detected and send the temperature signal to the signal processing module 500. A sensor pressure plate 300 is provided at the bottom of the chip receiving chamber for sealing the runner groove 110. The signal processing module 500 is disposed above the sensor pressing plate 300, and is configured to determine a flow rate of the fluid to be measured flowing through the flow channel groove 110 based on the temperature signal sent by the sensor chip module 200.
It should be noted that the utility model provides a flow sensor is arranged in two intercommunicating pores 111 through runner groove 110 and both ends to be measured by the fluidic pipeline of branch, detects the fluid flow in this branch based on temperature variation again, and then realizes detecting the fluid flow in the former pipeline. For example, when the flow sensor provided by the present invention is applied to a mass flow controller, the two communication holes 111 are respectively used for introducing the fluid in the fluid passage of the mass flow controller into the flow channel groove 110 and remitting the fluid flowing through the flow channel groove 110 into the fluid passage of the mass flow controller, when the fluid flow in the fluid passage of the mass flow controller changes, the flow rate of the fluid to be measured flowing through the flow channel groove 110 changes accordingly, so that the temperature signal detected by the sensor chip module 200 changes accordingly, so that the signal processing module 500 can determine the flow rate of the fluid to be measured flowing through the flow channel groove 110 based on the temperature signal sent by the sensor chip module 200, and further can detect the fluid flow rate in the fluid passage of the mass flow controller.
The utility model provides an among the flow sensor, the bottom that the chip of sensor bottom plate 100 held the chamber is formed with runner groove 110, sensor clamp plate 300 is in sealed runner groove 110, press sensor chip module 200 and fix in chip fixed slot 120, thereby when guaranteeing the in-process flow path's of the fluid of awaiting measuring through intercommunicating pore 111 business turn over runner groove 110 seal, the stability of sensor chip module 200 position has been guaranteed, and then flow sensor's detection precision and stability have been guaranteed, the response speed of using this flow sensor's quality flow controller has been improved, the measuring accuracy, interference killing feature and job stabilization nature.
In order to ensure the temperature detection accuracy of the sensor chip module 200, as a preferred embodiment of the present invention, as shown in fig. 1 and fig. 4, the runner groove 110 includes a first communicating section 112, a detecting section 113 and a second communicating section 114 which are sequentially communicated, one end of the first communicating section 112 and one end of the second communicating section 114, which is far away from the detecting section 113, are connected by a communicating hole 111, and the sensor chip module 200 is arranged opposite to the detecting section 113.
That is, the flow channel groove 110 is bent and extended along a horizontal plane to form a "C" shape, the sensor chip module 200 is disposed opposite to the middle detection section 113 and detects the temperature of the fluid to be detected flowing through the detection section 113, so that the length of the flow channel groove 110 is extended under the condition that the size of the sensor base plate 100 is limited, the stability of the flow velocity of the fluid flowing through the corresponding portion of the sensor chip module 200 is ensured, the temperature monitoring precision of the sensor chip module 200 is ensured, and the flow detection precision is further ensured.
In order to further improve the sealing performance of the flow path of the fluid flowing into and out of the flow channel groove 110 through the communication hole 111, as a preferred embodiment of the present invention, as shown in fig. 1 and 4, a bonding layer 400 is provided between the bottom surface of the sensor pressing plate 300 and the bottom of the chip accommodating chamber, the bonding layer 400 has a relief hole corresponding to the flow channel groove 110 in shape and position, and the bonding layer 400 is used to adhesively connect the sensor pressing plate 300 and the sensor base plate 100.
In the embodiment of the present invention, the bonding layer 400 is further disposed between the bottom of the sensor holding plate 300 and the bottom of the chip holding cavity, so that the gap between the sensor holding plate 300 and the sensor base plate 100 is sealed by the adhesion of the bonding layer 400, and the sealing effect on the flow channel 110 is further improved. In addition, the adhesive layer 400 has an avoiding hole corresponding to the flow channel groove 110 in shape and position, so that it is possible to prevent the adhesive surface of the adhesive layer 400 from contacting the fluid to cause dirt adhering to the adhesive surface and affecting the temperature detection accuracy. In addition, the adhesive layer 400 may further adhere and fix the sensor chip module 200, thereby ensuring the stability of the relative position between the sensor chip module 200 and the flow channel groove 110 and improving the flow rate detection accuracy.
Preferably, as shown in fig. 1 and 7, the avoiding hole is cut at a corresponding position of the sensor chip module 200 to ensure an adhesive fixing effect on the sensor chip module 200.
As an optional embodiment of the present invention, the adhesive layer 400 is a PET double-sided adhesive tape, that is, a double-sided adhesive tape made of polyethylene glycol terephthalate (PET) double-coated acrylic adhesive tape.
It should be noted that the embodiment of the present invention provides a flow sensor for mounting on a fluid passage of a mass flow controller, wherein the relative positions of two communication holes 111 correspond to the positions of corresponding air inlet and outlet holes on the mass flow controller, and the effect of mounting on the mass flow controller is shown in fig. 9.
In order to facilitate the installation of the flow sensor on the mass flow controller, as an alternative embodiment of the present invention, as shown in fig. 5, a plurality of fixing through holes 160 penetrating the sensor base plate 100 in the height direction are formed on the sensor base plate 100.
In order to further improve the sealing effect on the flow channel 110, as a preferred embodiment of the present invention, as shown in fig. 1 and fig. 4, the bottom of the chip accommodating cavity is further formed with a plurality of sealing grooves 121, the plurality of sealing grooves 121 are parallel to the detecting section 113, and the sealing insulating material is filled in the plurality of sealing grooves 121, and the sensor chip module 200 is pressed on the plurality of sealing grooves 121 to seal the detecting section 113.
As an optional embodiment of the present invention, the sealing insulating material filled in the sealing groove 121 may be silicon rubber.
For further improvement to the sealed effect of flow channel groove 110, as the utility model discloses a preferred embodiment, as shown in fig. 1, fig. 4, the chip holds the bottom in chamber and still is formed with chip fixed slot 120, the bottom of chip fixed slot 120 has been seted up detect section 113 and a plurality of seal groove 121, sensor chip module 200 is pressed and is established a plurality of in the chip fixed slot 120 on the seal groove 121, sensor chip module 200 the upper surface with the chip holds the bottom in chamber and flushes to make sensor clamp plate 300's bottom can keep being the plane shape, press the below through the plane of sensor clamp plate 300 bottom, guarantee bond line 400's planarization, and then improve the sealed effect to flow channel groove 110.
As an optional embodiment of the present invention, the sensor pressing plate 300 is fixedly connected to the sensor base plate 100 through a threaded fastener. Specifically, as shown in fig. 1, the flow sensor further includes a plurality of first mounting screws 310, a plurality of first threaded holes 140 are formed at the bottom of the chip accommodating cavity, a plurality of first through holes 320 penetrating through the sensor pressing plate 300 in the thickness direction are formed on the sensor pressing plate 300, the plurality of first through holes 320 correspond to the plurality of first threaded holes 140 in a one-to-one manner, and the plurality of first mounting screws 310 penetrate through the plurality of first through holes 320 in a one-to-one manner and are screwed into the corresponding first threaded holes 140, so as to fixedly connect the sensor pressing plate 300 to the sensor base plate 100.
As an alternative embodiment of the present invention, the first mounting screw 310 is a countersunk screw, and the first through hole 320 is correspondingly formed as a countersunk hole.
As a preferred embodiment of the present invention, as shown in fig. 1, fig. 3, fig. 6 and fig. 8, the sensor chip module 200 includes a detecting chip 201, a circuit board 202 and a plurality of conductive pins 210, the circuit board 202 has a holding space for the detecting chip 201, the detecting point is located on the detecting chip 201, the detecting chip 201 is disposed in the holding space and flows through the runner groove 110 for the fluid contact to be detected, for detecting the flow through the runner groove 110 for the temperature signal of the fluid to be detected, one end of the conductive pins 210 is fixed on the circuit board 202, the other end is electrically connected to the signal processing module 500, a plurality of pins of the detecting chip 201 pass through the circuit board 202 and a plurality of the conductive pins 210 are electrically connected in a one-to-one correspondence.
Specifically, the circuit board 202 has a routing area and a pad area, the receiving groove is disposed in the routing area, the circuit board 202 has a plurality of traces on one side of the routing area facing the bottom of the chip accommodating cavity, the circuit board 202 has a plurality of electrodes on one side of the pad area facing the bottom of the chip accommodating cavity, one ends of the plurality of traces are connected to the plurality of pins of the detection chip 201 in a one-to-one correspondence manner, and the other ends of the plurality of traces extend to the pad area and are connected to the plurality of electrodes in a one-to-one correspondence manner.
As shown in fig. 1, 3, 6, and 8, the conductive pin 210 includes a horizontally extending bending portion and a vertically extending connecting portion, one end of the bending portion is fixed and electrically connected to the electrodes in a one-to-one correspondence, the other end of the bending portion is connected to the bottom end of the corresponding connecting portion, and the top end of the connecting portion penetrates through the top of the detection chip accommodating cavity and is electrically connected to the signal processing module;
an avoiding groove 130 is further formed at the bottom of the chip accommodating cavity, the avoiding groove 130 is communicated with the chip fixing groove 120, a pad area of the circuit board 202 is opposite to the avoiding groove 130, the bent portion is arranged in the avoiding groove 130, and the circuit board 202 is pressed and fixed in the chip fixing groove 120.
The embodiment of the utility model provides an in, flow sensor still includes the conducting pin 210 of many buckles, and sensor chip module 200's pad district is connected with the signal processing module 500 of top through conducting pin 210 to strengthen the signal transmission intensity between signal processing module 500 and the sensor chip module 200, compared with the scheme that carries out data transmission through flat cable among the prior art, reduced signal loss, guaranteed the accuracy nature that fluid temperature detected.
As an optional implementation manner of the present invention, the conductive pin 210 is a gold-plated copper pin.
As an optional implementation manner of the present invention, as shown in fig. 8, the sensor chip module 200 further includes a glue 203, and the glue 203 is coated at the connection between the pin of the detection chip 201 and the circuit board 202, so as to maintain the integrity of the pin of the detection chip 201 and the stability of the position, and further ensure the accuracy of the flow detection.
For further improvement flow sensor's gas tightness to improve flow sensor intermediate member's relative position stability, as the utility model discloses a preferred embodiment, as shown in fig. 3, the embedment has the casting glue in the chip holds the chamber, and the lateral wall that the chip held the chamber is formed with dodges the breach, dodge the breach with dodge groove 130 intercommunication, dodge the breach be used for to the chip holds the embedment in the chamber the casting glue. Namely, the structure is integrally encapsulated by the encapsulating adhesive, so that the compression strength and the air tightness of the flow sensor are improved, the internal parts of the flow sensor are prevented from loosening in collision or vibration, and the accuracy of detecting the fluid flow by the flow sensor is ensured.
As an optional embodiment of the present invention, the potting adhesive may be an epoxy resin potting adhesive.
As an optional implementation manner of the present invention, as shown in fig. 1, the projection shape of the sensor pressing plate 300 on the horizontal plane is an approximate rectangle, the horizontal cross section of the chip accommodating cavity has a contour corresponding to the approximate rectangle, and an avoiding notch is further provided at the position corresponding to the avoiding groove 130, that is, the sensor pressing plate 300 is only compressed at the flow channel 110 and the region rectangle where the chip fixing groove 120 is located, and the top of the avoiding groove 130 is reserved as the glue injection hole filling hole in the form of avoiding the notch.
Alternatively, as shown in fig. 1, four corners of the sensor pressing plate 300 are each formed with one first through hole 320, and the sensor pressing plate 300 is fastened by four first mounting screws 310, respectively.
As an optional embodiment of the present invention, the signal processing module 500 is fixedly connected to the sensor base plate 100 through a threaded fastener. Specifically, as shown in fig. 1, the flow sensor further includes a plurality of second mounting screws 510, a plurality of second threaded holes 150 are formed in the sensor base plate 100, the signal processing module 500 has a plurality of second through holes 520 penetrating through the signal processing module 500 in the thickness direction, the plurality of second through holes 520 correspond to the plurality of second threaded holes 150 in a one-to-one manner, and the plurality of second mounting screws 510 penetrate through the plurality of second through holes 520 in a one-to-one manner and are screwed into the corresponding second threaded holes 150, so as to fixedly connect the signal processing module 500 to the sensor base plate 100.
As an optional embodiment of the present invention, the second mounting screw 510 is a pan head screw, and the second through hole 520 is correspondingly formed as a countersunk hole.
Alternatively, as shown in fig. 1, two sides of the sensor pressing plate 300 are respectively formed with a boss structure, two second through holes 520 are respectively formed in the two boss structures, two mounting grooves are correspondingly formed on the top surface of the sensor base plate 100, two second threaded holes 150 are respectively formed in the corresponding mounting grooves, and two second mounting screws 510 are respectively passed through the two second through holes 520 and screwed into the corresponding second threaded holes 150 to fixedly connect the signal processing module 500 with the sensor base plate 100.
To facilitate understanding by the skilled person, the following provides an assembly process of a flow sensor according to embodiments of the present invention:
first, as shown in fig. 6, silicone rubber is smeared in the chip fixing groove 120 of the sensor substrate 100, the sensor chip module 200 is pressed into the chip fixing groove 120 (as shown in fig. 8, the conductive pins 210 are soldered to the pad regions of the circuit board 202 in advance), the adhesive layer 400 is adhered at the corresponding position (as shown in fig. 7), and then the sensor pressure plate 300 is fixed on the sensor substrate 100 by using the first mounting screws 310, at which time the sensor chip module 200 has formed a tight adhesive seal;
next, the signal processing module 500 is fixed on the sensor base plate 100 using the second mounting screw 510, and the tip of the conductive pin 210 on the sensor chip module 200 is soldered to the signal processing module 500 (as shown in fig. 2). The detection chip 201 of the sensor chip module 200 can read the temperature of the gas flow in real time and transmit the temperature signal to the signal processing module 500 through the conductive pin 210, and the signal processing module 500 determines the gas flow in the runner duct 110 based on the temperature signal.
After the whole module test is passed, uniformly mixing the pouring sealant (for example, epoxy glue can be poured into the loctite 9460 AB) according to the proportion of 10:1, and then filling and sealing the chip accommodating cavity.
As a second aspect of the present invention, there is provided a mass flow controller, as shown in fig. 9, the mass flow controller includes a fluid passage 10, the fluid passage is used for communicating with a pipeline of the fluid to be measured, the mass flow controller further includes a flow sensor 30 provided in an embodiment of the present invention, the flow sensor 30 is disposed on the fluid passage 10, two ends of the flow channel groove 110 are connected to the communication hole 111 and the fluid passage 10.
The utility model provides an among the mass flow controller, the bottom that flow sensor's sensor bottom plate 100's chip held the chamber is formed with runner groove 110, sensor clamp plate 300 is in sealed runner groove 110, press sensor chip module 200 and fix in chip fixed slot 120, thereby when guaranteeing the in-process flow path's of the fluid of awaiting measuring through intercommunicating pore 111 business turn over runner groove 110 seal, the stability of sensor chip module 200 position has been guaranteed, and then flow sensor's detection precision and stability have been guaranteed, mass flow controller's response speed has been improved, the measuring accuracy, interference killing feature and job stabilization nature.
As an alternative embodiment of the present invention, as shown in fig. 9, the mass flow controller further includes a controller (not shown in the figure) and a regulating valve 20 disposed on the fluid passage 10, wherein the controller is configured to control the opening degree of the regulating valve 20 based on the flow detection result of the flow sensor 30 to maintain the fluid flow in the regulating fluid passage 10 at a set point.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and scope of the invention, and such modifications and improvements are also considered to be within the scope of the invention.

Claims (11)

1. A flow sensor is used for detecting the flow of fluid and is characterized by comprising a sensor bottom plate, a sensor chip module, a sensor pressing plate and a signal processing module, wherein a chip accommodating cavity is formed in the sensor bottom plate, a runner groove is formed at the bottom of the chip accommodating cavity, and two ends of the runner groove are communicated with a pipeline of the fluid to be detected through two communicating holes penetrating to the bottom surface of the sensor bottom plate; the sensor chip module is arranged opposite to the runner groove, a detection point of the sensor chip module is opposite to the runner groove and is used for contacting with the fluid to be detected flowing through the runner groove, and the sensor chip module is used for detecting a temperature signal of the fluid to be detected and sending the temperature signal to the signal processing module; the sensor pressing plate is pressed at the bottom of the chip accommodating cavity and used for sealing the runner groove; the signal processing module is arranged above the sensor pressing plate and used for determining the flow of the fluid to be detected flowing through the runner groove based on the temperature signal sent by the sensor chip module.
2. The flow sensor according to claim 1, wherein the flow channel groove includes a first communicating section, a detecting section, and a second communicating section which communicate in this order, and ends of the first communicating section and the second communicating section which are away from the detecting section have the communicating hole, and the sensor chip module is disposed opposite to the detecting section.
3. The flow sensor according to claim 2, wherein a plurality of sealing grooves are formed at the bottom of the chip accommodating cavity, the sealing grooves are parallel to the detection section and filled with a sealing insulating material, and the sensor chip module is pressed on the sealing grooves to seal the detection section.
4. The flow sensor according to claim 1, wherein an adhesive layer is provided between the bottom surface of the sensor pressure plate and the bottom of the chip accommodating chamber, the adhesive layer has an avoiding hole corresponding to the flow channel groove in shape and position, and the adhesive layer is used for adhesively connecting the sensor pressure plate and the sensor base plate to seal the flow channel groove.
5. The flow sensor according to claim 1, wherein the flow sensor further comprises a plurality of first mounting screws, a plurality of first threaded holes are formed in the bottom of the chip accommodating cavity, a plurality of first through holes penetrating through the sensor pressure plate in a thickness direction are formed in the sensor pressure plate, the plurality of first through holes correspond to the plurality of first threaded holes in a one-to-one manner, and the plurality of first mounting screws penetrate through the plurality of first through holes in a one-to-one manner and are screwed into the corresponding first threaded holes to fixedly connect the sensor pressure plate and the sensor bottom plate.
6. The flow sensor according to claim 3, wherein a chip fixing groove is further formed at the bottom of the chip accommodating cavity, the detecting section and the plurality of sealing grooves are formed at the bottom of the chip fixing groove, the sensor chip module is pressed on the plurality of sealing grooves in the chip fixing groove, and an upper surface of the sensor chip module is flush with the bottom of the chip accommodating cavity.
7. The flow sensor according to claim 6, wherein the sensor chip module includes a detection chip, a circuit board, and a plurality of conductive pins, the circuit board has a receiving slot for receiving the detection chip, the detection point is located on the detection chip, the detection chip is disposed in the receiving slot and contacts with the fluid to be detected flowing through the flow channel slot, for detecting a temperature signal of the fluid to be detected flowing through the flow channel slot, one end of the conductive pin is fixed on the circuit board, the other end of the conductive pin is electrically connected to the signal processing module, and the plurality of pins of the detection chip are electrically connected to the plurality of conductive pins through the circuit board in a one-to-one correspondence manner.
8. The flow sensor according to claim 7, wherein the circuit board has a routing area and a pad area, the accommodating groove is disposed in the routing area, the circuit board has a plurality of traces on a side of the routing area facing a bottom of the chip accommodating cavity, the circuit board has a plurality of electrodes on a side of the pad area facing the bottom of the chip accommodating cavity, one ends of the traces are connected to the plurality of pins of the detection chip in a one-to-one correspondence, and the other ends of the traces extend to the pad area and are connected to the plurality of electrodes in a one-to-one correspondence;
the conductive pin comprises a horizontally extending bending part and a vertically extending connecting part, one end of each bending part is fixed and electrically connected with the electrodes in a one-to-one correspondence manner, the other end of each bending part is connected with the bottom end of the corresponding connecting part, and the top end of each connecting part penetrates out of the accommodating cavity of the detection chip and is electrically connected with the signal processing module;
the bottom that the chip held the chamber still is formed with dodges the groove, dodge the groove with chip fixed slot intercommunication, the kink is arranged in dodge the inslot, the circuit board is pressed and is fixed in the chip fixed slot.
9. The flow sensor according to claim 8, wherein the chip accommodating cavity is filled with a potting adhesive, and a sidewall of the chip accommodating cavity is formed with an avoiding notch, the avoiding notch is communicated with the avoiding groove, and the avoiding notch is used for filling the potting adhesive into the chip accommodating cavity.
10. The flow sensor according to claim 1, wherein the flow sensor further comprises a plurality of second mounting screws, a plurality of second threaded holes are formed in the sensor base plate, the signal processing module has a plurality of second through holes penetrating through the signal processing module in a thickness direction, the plurality of second through holes correspond to the plurality of second threaded holes in a one-to-one manner, and the plurality of second mounting screws penetrate through the plurality of second through holes in a one-to-one manner and are screwed into the corresponding second threaded holes to fixedly connect the signal processing module and the sensor base plate.
11. A mass flow controller comprising a fluid passage for communicating with a pipe of a fluid to be measured, characterized by further comprising a flow sensor according to any one of claims 1 to 10 provided on the fluid passage, both ends of the flow channel groove communicating with the fluid passage through two of the communication holes.
CN202221342982.9U 2022-05-31 2022-05-31 Flow sensor and mass flow controller Active CN217484770U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221342982.9U CN217484770U (en) 2022-05-31 2022-05-31 Flow sensor and mass flow controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221342982.9U CN217484770U (en) 2022-05-31 2022-05-31 Flow sensor and mass flow controller

Publications (1)

Publication Number Publication Date
CN217484770U true CN217484770U (en) 2022-09-23

Family

ID=83313359

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221342982.9U Active CN217484770U (en) 2022-05-31 2022-05-31 Flow sensor and mass flow controller

Country Status (1)

Country Link
CN (1) CN217484770U (en)

Similar Documents

Publication Publication Date Title
US6729181B2 (en) Flow sensor in a housing
US6369435B1 (en) Semiconductor component
KR101740014B1 (en) Pressure sensor device and method of fabricating the same
JP4425784B2 (en) Integrated fluid flow and characteristics microsensor assembly
US20130008263A1 (en) Flowrate sensor and flowrate detection device
US5648615A (en) Pressure sensor providing improved connection to a circuit board
CN100368780C (en) Flow meter
US8256285B2 (en) Flow sensor including a base member with a resilient region forming a flow channel and a cover member covering the flow channel
US7484419B2 (en) Mounting structure of pressure sensor element
US6153070A (en) Sensor packaging using heat staking technique
WO2022188524A1 (en) Packaging module, packaging process, and electronic device
CN217484770U (en) Flow sensor and mass flow controller
US8408072B2 (en) Coupling element for an ultrasonic flow measuring device
CN107532935B (en) Sensor for determining at least one parameter of a fluid medium flowing through a measurement channel
KR101715244B1 (en) Pressure sensor device and method of fabricating the same
US10035703B2 (en) Die bond design for medium pressure sensor
CN113108829A (en) Sensor assembly
CN114945806A (en) Sensor assembly
JPH1068645A (en) Sensor mounting plate sensor unit, and flow velocity sensor module
CN219843830U (en) Microwave photon device packaging structure
KR101762429B1 (en) Pressure sensor device and method of fabricating the same
CN212963461U (en) Sensor assembly and valve device
CN216816404U (en) Blood analysis subassembly
CN216925684U (en) Mass flowmeter based on MEMS mass flow sensing chip
CN210833675U (en) Multi-chip integrated packaging structure

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant