KR101762429B1 - Pressure sensor device and method of fabricating the same - Google Patents

Abstract

The present invention relates to an air conditioner comprising: a housing having an atmospheric air inlet and a fluid inlet formed in different directions; A substrate disposed in an inner space of the housing, the substrate having a through hole through which air can pass; And a pressure sensor for detecting a relative pressure of the fluid with respect to the atmospheric pressure, the pressure being applied to the upper surface of the substrate to cover the through hole, Wherein the inner space is divided into an upper region and a lower region with respect to the substrate, the upper region includes a first inner region in which the pressure sensor chip is disposed, And a second inner region that can be formed by the first and second inner regions.

Description

Technical Field The present invention relates to a pressure sensor device and a manufacturing method thereof,

The present invention relates to a pressure sensor device and a method of manufacturing the same, and more particularly, to a pressure sensor for detecting a water level and a method of manufacturing the same.

In general, a washing machine is an apparatus for washing laundry through washing, rinsing and dewatering processes using the action of water and detergent supplied into the washing tub, and the washing machine is installed in the washing machine according to a predetermined water level A pressure sensor capable of appropriately adjusting the supply amount of water is provided.

The pressure sensor has a structure in which a metal coil and a magnetic bar move through a change in air pressure according to a change in the water level of a water level sensing object, and the frequency is oscillated through a change in inductance thereof.

Meanwhile, in recent years, a drum washing machine for spraying steam by spraying steam has also been commercialized, and a lot of researches on pressure sensors have been conducted to detect a more accurate water level. However, the pressure sensor has a sensitivity of changing the output frequency of several kHz, and the output value changes in the form of a nonlinear quadratic curve, which causes a problem that the level can not be precisely detected. Also, there is a problem that excessive pressure is generated due to excessive steam generation or water pressure continuously supplied, resulting in breakage or failure of the pressure sensor in severe cases.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a pressure sensor device capable of sensing a precise level and preventing breakage by washing water and a method of manufacturing the same, . However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, a pressure sensor device is provided. The pressure sensor device comprising: a substrate including a first through hole and a second through hole; a pressure sensor chip mounted on the substrate to cover one side of the first through hole; And a housing including an air inlet formed in the housing and a fluid guide. The housing includes: a partition wall coupled to the substrate and defining an inner space to separate the first through hole and the second through hole; An upper housing joined on the partition wall; And a lower housing joined to the lower portion of the substrate or the partition wall, wherein the second through hole is in communication with the atmospheric pressure inlet, and the pressure sensor chip is connected to the atmospheric pressure inlet To measure the relative pressure of the fluid.

According to another aspect of the present invention, there is provided a pressure sensor device comprising: a housing having an atmospheric gas inlet and a fluid inlet formed in different directions; A substrate disposed in an inner space of the housing, the substrate having a through hole through which air can pass; And a pressure sensor for detecting a relative pressure of the fluid with respect to the atmospheric pressure, the pressure being applied to the upper surface of the substrate to cover the through hole, Wherein the inner space is divided into an upper region and a lower region with respect to the substrate, the upper region includes a first inner region in which the pressure sensor chip is disposed, And a second inner area that can be used as the second inner area.

In the pressure sensor device, the housing is divided into an upper housing and a lower housing with respect to the substrate, and the upper housing includes a partition wall which is in contact with the substrate and can distinguish the first region from the second region .

The pressure sensor device may further include a pressure transmission medium disposed in the first region to protect the pressure sensor chip and to transmit pressure of the fluid so as to measure pressure in the pressure sensor chip .

In the pressure sensor device, a space through which the air flowing from the airflow inlet can move and a space through which the pressure transmission medium can be formed can be divided by the partition wall.

In the pressure sensor device, the partition wall is bonded to the upper surface of the substrate, the upper housing is bonded to the partition wall, and the lower housing is bonded to the lower surface of the substrate.

In the pressure sensor device, the lower housing may be in contact with the substrate and communicated with the air inlet.

In the pressure sensor device, the air inlet and the fluid inlet may extend in directions perpendicular to each other.

In the pressure sensor device, the pressure transmission medium may have a waterproof function so that the fluid does not directly touch the pressure sensor chip.

In the pressure sensor device, the pressure transmission medium may include a gel that can be deformed according to a pressure of the fluid.

In the pressure sensor device, the pressure transmission medium may include silicone or epoxy, which may be deformed depending on the pressure of the fluid.

In the pressure sensor device, the substrate and the pressure sensor chip may be electrically connected to each other by using a conductive lead, and the pressure sensor chip and the conductive lead may be sealed using the pressure transmission medium.

The pressure sensor device may include an integrated circuit (IC) chip mounted on the substrate and converting an analog signal output generated from the pressure sensor chip into a digital signal output.

In the pressure sensor device, as the atmosphere introduced through the airflow inlet is moved to the lower region through the second region, the pressure sensor device is communicated with the pressure sensor chip so that the atmosphere can reach the pressure sensor chip exposed by the through hole Structure.

According to another aspect of the present invention, a pressure sensor device is provided. The pressure sensor device comprising: a substrate having a first through hole and a second through hole; Wherein the pressure sensor chip is mounted on the substrate so as to cover the first through hole and the lower portion is exposed to the atmosphere through the first through hole to measure a relative pressure of the fluid with respect to the atmospheric pressure. A partition wall defining an inner space by being joined to an upper surface of the substrate so as to protect the pressure sensor chip; An upper housing coupled to the partition wall to protect at least a portion of the pressure sensor chip, the upper housing having an atmospheric air inlet and a fluid inlet formed in different directions; And a lower portion which is joined to a lower surface of the substrate to protect the pressure sensor chip, thereby forming a passage so that air introduced through the air inlet may sequentially pass through the second through hole and the first through hole, And a housing.

In the pressure sensor device, the internal space may be divided into a first area in which the pressure sensor chip is disposed and a second area in which the atmosphere can pass, with respect to the partition wall.

According to another aspect of the present invention, a pressure sensor device is provided. The pressure sensor device comprising: a substrate including a first through hole and a second through hole; A first surface on which the fluid inlet is formed and a second surface different from the first surface on which the air inlet is formed, the second surface being surrounded by at least a part of the substrate such that the first through hole and the second through hole are disposed therein ; And a pressure sensor chip mounted on the substrate for measuring a relative pressure of a fluid applied to the fluid inlet with respect to an atmospheric pressure applied to the atmospheric introduction port, the housing communicating with the fluid inlet, A first inner region to which pressure is applied, a second inner portion that is separated from the first inner region by the inner wall between the first through holes and the second through holes on the substrate, And the pressure sensor chip is disposed on the first through hole so that one surface of the pressure sensor chip is disposed in the first inner region and the other surface of the pressure sensor chip is allowed to receive the atmospheric pressure of the second inner region through the first through hole .

In the pressure sensor device, the first surface may be the upper surface of the housing, the second surface may be one side of the housing, and the fluid conduit inlet and the atmosphere conduit inlet may be disposed on the front surface of the substrate .

In the pressure sensor jig, the first surface and the second surface may be directions perpendicular to each other.

The pressure sensor device may include a pressure transmission medium which seals the pressure sensor chip and can transmit the pressure of the fluid so as to measure pressure in the pressure sensor chip.

According to another aspect of the present invention, a method of manufacturing a pressure sensor device is provided. The method of manufacturing the pressure sensor device includes: preparing a substrate having at least two through holes so that air can pass therethrough; Forming a pressure sensor chip on the substrate so as to cover the through hole and measuring the relative pressure of the fluid with respect to the atmospheric pressure so that the lower part is exposed to the atmosphere through the through hole; Forming an integrated circuit (IC) chip on the substrate; Forming a partition wall defining an internal space in contact with the substrate to protect the pressure sensor chip and the integrated circuit chip; Forming a pressure transmission medium capable of sealing at least a part of the pressure sensor chip and the integrated circuit chip in the internal space; Forming a lower housing to protect the pressure sensor chip exposed by the through hole at a lower portion of the substrate; And forming an upper housing on the partition wall, the upper housing having an atmospheric inlet and a fluid inlet formed in different directions.

According to the embodiment of the present invention described above, it is possible to provide a pressure sensor device capable of realizing miniaturization, saving water and reducing power consumption through precise level control, and preventing breakage by washing water, The manufacturing method can be implemented. Of course, the scope of the present invention is not limited by these effects.

1 is a schematic diagram illustrating the configuration of a pressure sensor device according to an embodiment of the present invention.
2A to 2H are perspective views schematically illustrating a manufacturing method of the pressure sensor device shown in Fig.
3 is a schematic view illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.
4A to 4I are perspective views schematically illustrating a manufacturing method of the pressure sensor device shown in FIG.
5 is a schematic diagram illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.
6 is a perspective view schematically illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.
7 is a perspective view schematically illustrating a configuration of a pressure sensor device according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a schematic diagram illustrating the configuration of a pressure sensor device according to an embodiment of the present invention.

Referring to FIG. 1, a pressure sensor device 1000 according to an embodiment of the present invention may use a lead frame as the substrate 100. Although not shown in the drawing, when the lead frame is used as the substrate 100, it is possible to further include a separate molding part (not shown) to which the respective lead frames can be connected.

The substrate 100 may include at least two through holes 102, 104. The first through hole 102 and the second through hole 104 are communicated with the atmospheric air inlet 210 of the upper housing 700c to be described later.

The pressure sensor chip 200 can be mounted on the substrate 100 to measure the relative pressure of the fluid applied to the fluid inlet 220 with respect to the atmospheric pressure applied to the atmospheric pressure inlet 210. The pressure of the fluid flowing from the fluid inlet 220 can be applied by covering the first through hole 102 with the pressure sensor chip 200. The lower portion of the pressure sensor chip 200 may be exposed to the atmosphere through the first through hole 102. The silicon patterning 202 may be formed in an area where the pressure sensor chip 200 is to be disposed before the pressure sensor chip 200 is mounted on the substrate 100. [ The silicon patterning 202 may perform an adhesive function so that the pressure sensor chip 200 can be fixed on the substrate 100. Here, the fluid includes both a liquid and a gas, and the pressure sensor chip 200 is a well-known technique, and a detailed description thereof will be omitted.

An integrated circuit (IC) chip 300 capable of converting an analog signal output generated in the pressure sensor chip 200 into a digital signal output in the same manner as the pressure sensor chip 200 can be mounted on the substrate 100 have. Here, the integrated circuit (IC) chip 300 may be understood as an analog front end, for example.

At least any two selected from the substrate 100, the pressure sensor chip 200, and the integrated circuit (IC) chip 300 may be electrically connected to each other by using the conductive lead 800. [ For example, the pressure sensor chip 200 and the integrated circuit (IC) chip 300 can be electrically connected to the substrate 100 through the wire bonding process by using the conductive leads 800, respectively, 200 and the IC chip 300 may be electrically connected to each other by using the conductive lead 800. [

Meanwhile, the housing 700 may include a partition 700a, a lower housing 700b, and an upper housing 700c. For example, the partition 700a may be bonded to at least a part of the substrate 100. [ The lower housing 700b is located below the substrate 100 and can be bonded to the partition 700a. In addition, the upper housing 700c may be bonded onto the partition 700a. The upper housing 700c may include an air inlet 210 and a fluid inlet 220 formed in different directions.

Here, the fluid direction inlet 220 is formed on the first surface, for example, in the upper housing 700c including a first surface and a second surface different from the first surface And an air inlet 210 may be formed on the second surface. The first surface and the second surface may be perpendicular to each other and the first surface is an upper surface of the upper housing 700c and the second surface is a side surface of the upper housing 700c And both the fluid inlet 220 and the air inlet 210 may be disposed on the front surface of the substrate with respect to the substrate 100. [

Although the atmosphere inlet 210 and the fluid inlet 220 of the upper housing 700c are formed to be perpendicular to each other in the illustrated example, the air inlet 210 and the fluid inlet 220 may be formed in different directions depending on the position, size and structure of the partition 700a. . Further, the barrier 700a, the lower housing 700b, and the upper housing 700c may all be the same material or may be made of different materials.

An air inlet 210 is formed on one side of the upper housing 700c. Although the air inlet 210 is shown as passing through one side of the upper housing 700c, when the air inlet 210 is assembled with an external device, the upper housing 700c As shown in Fig.

Also, the diameters of the air inlet 210 and the fluid inlet 220 may be the same, but either one of them may be made larger. The outer diameter of the air inlet 210 and the outer diameter of the fluid inlet 220 may be different from each other depending on the shape of the coupling portion, The shape can be determined. On the other hand, the size and formation direction of the air inlet 210 and the fluid inlet 220 are determined by the position of the pressure sensor chip 200 disposed in the device, the position of the through hole provided in the substrate 100, Height, or the position of each sensor chip, or the like.

In addition, the pressure sensor device 1000 includes an inner space surrounded by the outer wall of the housing 700. The inner space is divided into an upper region of the substrate 100 and a lower region of the substrate 100 with respect to the substrate 100. The upper region may be divided into a first inner region where the pressure sensor chip 200 is disposed by the inner wall of the upper housing 700c and a second inner region through which the atmosphere can pass. The first inner region may have a fluid inlet 220 through which a fluid can flow, and an air inlet 210 may be formed in the second inner region.

The lower region is a region defined by the lower housing 700b and serves as a passage through which the atmosphere can move by covering the first through hole 102 and the second through hole 104 through which the atmosphere can pass . On the other hand, the upper portion of the partition 700a may be in contact with the upper housing 700c so as to be divided into the first inner region and the second inner region. The inner wall of the upper housing 700c, which is divided into the first inner region and the second inner region, may be in contact with at least a part of the partition 700a. The inner wall of the upper housing 700c, 2 internal areas.

The partition 700a may surround at least a part of the substrate 100 such that the first through hole 102 and the second through hole 104 provided in the substrate 100 are disposed inside. The partition wall 700a can precisely form the pressure transmission medium 500 in the inner space by contacting the substrate 100 and defining the inner space. The inner space is filled with a pressure transmission medium 500 to cover at least a part of the substrate 100 with the pressure sensor chip 200, the integrated circuit (IC) chip 300 and the conductive leads 800 Can be sealed. Here, the pressure transmission medium 500 may be made of, for example, a silicone-based material (Young's modulus value is 0.001 GPa to 0.05 GPa) or an epoxy-based material (Young's modulus value is 2.0 GPa to 2.0 GPa) 20.0 GPa) can be used. Both of these materials are excellent in waterproofing function, and the silicon-based material is superior to the epoxy-based material in the pressure transfer function. This can be determined by the difference in young's modulus of the materials. The Young's modulus value means the longitudinal modulus of elasticity, and the smaller the Young's modulus value, the better the shrinkage, which means that the pressure transfer is good.

The pressure transmitting medium 500 may be formed of a flexible material such that fluid pressure may be applied to a diaphragm (not shown) provided on the pressure sensor chip 200 to generate an electrical signal . The materials may use a gel-like material capable of transferring the pressure of the fluid to the diaphragm and performing a waterproof function. The gel is a state in which the colloid solution is solidified at a predetermined concentration or more like a jelly, and the force transmitted by the pressure applied to the pressure transmission medium 500 formed on the diaphragm can be directly transmitted to the diaphragm .

In addition, the pressure transmission medium 500 may be formed by covering the surfaces of the chips 200 and 300 with a very thin thickness so that pressure can be applied to the diaphragm. Accordingly, the pressure transmission medium 500 can prevent the pressure sensor chip 200 from being damaged due to electrical defects or excessive water pressure caused by moisture outside the apparatus.

On the other hand, when the lead frame is used as the substrate 100, the partition 700a and the lower housing 700b may be integrally formed. At this time, the lower housing 700b may be omitted. The partition 700a functions to protect the pressure sensor chip 200 by performing the function of the lower housing 700b and forms a communicated fluid movement path so that the atmosphere can move. It is possible to realize a pressure sensor device 1000 that can be miniaturized by assembling the upper housing 700c on the partition 700a and can save water and reduce power consumption through precise level control.

In addition, the barrier rib 700a may be formed integrally with the lead frame substrate 100 by molding. In this case, the partition 700a may be integrally formed with the substrate 100 by injecting an insert instead of a separate molding part. At this time, the height of the partition 700a formed on the upper surface of the substrate 100 may be lower than the height of the partition 700a of the pressure sensor devices to be described later.

Accordingly, the passages communicating with the fluid inlet 220 and the air inlet 210 provided in the upper housing 700c can be relatively longer. On the other hand, when the upper housing 700c having the same size as that of the pressure sensor devices using other substrates is used, the height of the partition 700a is low so that the fluid is communicated with the inlet 220 and the air inlet 210 May be formed to be relatively shorter.

2A to 2H are perspective views schematically illustrating a manufacturing method of the pressure sensor device shown in Fig.

2A to 2H are sectional views of the substrate 100, the pressure sensor chip 200, the integrated circuit chip 300, the pressure transmission medium 500, and the housing 700 Will be omitted since they are the same as those described above with reference to FIG.

First, referring to FIG. 2A, a lead frame substrate 100 including a first through hole 102 and a second through hole 104 may be prepared. When the lead frame is used as the substrate 100, it may include a step of molding the lead frame into a separate molding part to which each lead frame can be connected. Here, the barrier rib 700a may be formed by inserting the barrier ribs 700a together with the plurality of lead frames without separately forming the barrier ribs 700a on the substrate 100, . The first through hole 102 and the second through hole 104 are passages through which air can be introduced and are connected to the air inlet 210 of the upper housing 700c to be described later with reference to FIG. .

2B to 2F, in order to measure the relative pressure of the fluid with respect to the atmospheric pressure, the substrate 100 is mounted on the substrate 100 so as to cover the first through-hole 102, The pressure sensor chip 200 may be formed to be exposed to the atmosphere. The silicon patterning 202 capable of performing the adhesive function of the pressure sensor chip 200 may be formed on the rim of the pressure sensor chip 200. [

An integrated circuit (IC) chip 300, which is mounted on the same surface of the substrate 100 in the same manner as the pressure sensor chip 200 and converts an analog signal output generated from the pressure sensor chip 200 into a digital signal output, May be formed. The substrate 100, the pressure sensor chip 200, and the integrated circuit chip 300 may be electrically connected to each other by using the conductive leads 800. [

In addition, the pressure sensor device 1000 according to an embodiment of the present invention may further include a regulator (not shown) mounted on the substrate 100 and capable of maintaining a constant voltage. The regulator can be understood as, for example, an LDO regulator (Low Dropout Regulator). Here, the regulator may be used or unused depending on the combination of the sensor and the integrated circuit. The regulator is a well known technique and its detailed description is omitted.

The pressure transmission medium 500 can be precisely formed in the inner space defined by the partition 700a formed in at least a part of the substrate 100 in FIG. A pressure transmitting medium 500 is filled in the internal space to electrically connect at least a part of the substrate 100 to the pressure sensor chip 200, the integrated circuit chip 300, the regulator (not shown) The leads 800 can be sealed.

Referring to FIGS. 2G and 2H, a lower housing 700b may be formed below the substrate 100. FIG.

Referring to FIG. 2G, a part of the partition 700a formed on the lower surface of the substrate 100 may be joined to the lower housing 700b. The lower housing 700b may form a passage through which the air entering the pressure sensor device 1000 can reach the lower portion of the pressure sensor chip 200 to measure the standard pressure.

Referring to FIG. 2H, an upper housing 700c, which is finally formed in different directions, has an air inlet 210 through which air can be introduced and a fluid inlet 220 through which the fluid can flow, The pressure sensor device 1000 can be manufactured by joining on the partition wall 700a.

3 is a schematic view illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.

3 is a cross-sectional view of a pressure sensor device 1100 according to another embodiment of the present invention. First, the pressure sensor device 1100 may include a housing 700 formed on the substrate 100. The substrate 100 may be, for example, a printed circuit board (PCB). It can be understood that the resist film of the printed circuit board is generally formed thin on the upper surface 100a and the lower surface 100b of the substrate 100. [

The housing 700 may include a partition 700a, a lower housing 700b, and an upper housing 700c. For example, the partition 700a may be bonded onto at least a part of the substrate 100. [ The lower housing 700b may be bonded to at least a part of the lower surface of the substrate 100. [ In addition, the upper housing 700c may be bonded onto the partition 700a. The upper housing 700c is not parallel but may have an atmospheric inlet 210 and a fluid inlet 220 formed in different directions.

Here, the fluid direction inlet 220 is formed on the first surface, for example, in the upper housing 700c including a first surface and a second surface different from the first surface And an air inlet 210 may be formed on the second surface. The first surface and the second surface may be perpendicular to each other and the first surface may be an upper surface of the upper housing 700c and the second surface may be understood as one surface of the upper housing 700c Both the fluid inlet 220 and the air inlet 210 may be disposed on the upper surface of the substrate 100 with respect to the substrate 100.

Here, the detailed description of the pressure sensor chip 200, the integrated circuit chip 300, and the pressure transmission medium 500 is the same as that described above with reference to FIG.

The housing 700 includes a partition wall 700a, a lower housing 700b and an upper housing 700c and includes an inner space surrounded by the outer wall of the housing 700. [ The upper surface 100a of the substrate 100 is divided into an upper region and the lower region 100b of the substrate 100 is divided into lower regions with respect to the substrate 100. The upper region may be divided into a first inner region where the pressure sensor chip 200 is disposed by the inner structure of the upper housing 700c, i.e., the inner wall, and a second inner region through which the atmosphere can pass. The first inner region may have a fluid inlet 220 through which a fluid can flow, and an air inlet 210 may be formed in the second inner region.

The lower region is a region defined by the lower housing 700b and serves as a passage through which the atmosphere can move by covering the through holes 102 and 104 through which the atmosphere can pass. On the other hand, the upper portion of the partition 700a may be in contact with the upper housing 700c so as to be divided into the first inner region and the second inner region. The inner structure of the upper housing 700c, which is divided into the first inner region and the second inner region, may be in contact with at least a part of the barrier rib 700a, and the first inner region, And a second internal area. Accordingly, the partition wall 700a separates the pressure transmitting medium 500 from the first inner region and the second inner region in which the pressure sensor chip 200 is disposed, by separating at least a part of the substrate 100 into the first inner region and the second inner region. . ≪ / RTI >

In addition, a passageway through which the atmosphere can move can be formed by embedding the pressure transmission medium 500 in the internal space defined by the partition 700a and forming the lower housing 700b below the substrate 100. [

After the partition 700a and the lower housing 700b are bonded to each other, the upper housing 700c may be assembled on the partition 700a to form the pressure sensor unit 1100. [ Although the atmosphere inlet 210 and the fluid inlet 220 of the upper housing 700c are formed to be perpendicular to each other, they may be formed in different directions depending on the position and size of the partition.

As described above, the pressure sensor device 1100 can be formed in such a manner that the partition 700a, the lower housing 700b, and the upper housing 700c are bonded onto the substrate. When a printed circuit board is used as the substrate 100, the pressure sensor device 1000 can be easily formed without a separate molding process.

The housing 700 is connected to the fluid inlet 220 and communicates with the first interior region to which the pressure of the fluid is applied and the air inlet 210 to apply atmospheric pressure to the first through hole 102 and a second inner region separated from the first inner region by an inner wall between the second through holes 104. [ The pressure sensor chip 200 is provided on the first through hole 102 so that one surface is disposed in the first inner area and the other surface is applied with the atmospheric pressure of the second inner area through the first through hole 102 A pressure sensor device 1100 can be provided.

4A to 4I are perspective views schematically illustrating a manufacturing method of the pressure sensor device shown in Fig.

4A to 4I are sectional views of the substrate 100, the pressure sensor chip 200, the integrated circuit chip 300, the pressure transmission medium 500, and the housing 700 Will be omitted since they are the same as those described above with reference to Figs.

Referring to FIG. 4A, a printed circuit board 100 having at least two through holes can be prepared. The through hole may include a first through hole (102) and a second through hole (104).

4B and 4C, in order to measure the relative pressure of the fluid with respect to the atmospheric pressure, the substrate 100 is mounted on the substrate 100 so as to cover the first through-hole 102, The pressure of the fluid may be applied, and the pressure sensor chip 200 may be formed to expose the lower portion through the first through hole 102 to the atmosphere. A silicon patterning 202 capable of performing an adhesive function can be formed so that the pressure sensor chip 200 can be previously fixed to the rim of the pressure sensor chip 200. [

4D and 4E, the pressure sensor chip 200 is mounted on the same surface of the substrate 100 in the same manner as the pressure sensor chip 200, and the integrated signal output from the pressure sensor chip 200 is converted into a digital signal output A circuit (IC) chip 300 may be formed. At least two selected from the substrate 100, the pressure sensor chip 200 and the integrated circuit chip 300 may be electrically connected to each other by using the conductive leads 800. [

Referring to FIGS. 4F and 4G, the barrier rib 700a may be bonded to at least a part of the upper surface of the substrate 100. FIG. The barrier rib 700a may surround at least a part of the substrate 100 such that the first through hole 102 and the second through hole 104 provided in the substrate 100 are disposed inside. The partition wall 700a can precisely form the pressure transmission medium 500 in the inner space by contacting the substrate 100 and defining the inner space. The inner space is filled with the pressure transmission medium 500 to electrically connect at least a part of the substrate 100 with the pressure sensor chip 200, the integrated circuit chip 300, and the conductive leads 800 electrically connecting the chips to each other. It can be sealed.

Referring to FIGS. 4H and 4I, a lower housing 700b may be formed on a lower portion of the substrate 100. FIG.

Referring to FIG. 4H, the lower housing 700b may be bonded to at least a part of the lower surface of the substrate 100. FIG. The lower housing 700b may form a passage through which the atmosphere entering the pressure sensor device can reach the lower portion of the pressure sensor chip 200 to measure the standard pressure.

4I, finally, an upper housing 700c having an air inlet 210 through which air can be introduced and a fluid inlet 220 through which fluid can flow can be joined on the partition 700a The pressure sensor device 1000 can be manufactured.

On the other hand, the air inlet 210 and the fluid inlet 220 are not arranged side by side and may be formed in different directions. For example, the atmosphere inlet 210 and the fluid inlet 220 may extend in directions perpendicular to each other. That is, according to FIG. 4I, the fluid inlet 220 is extended in the direction of the upper surface of the upper housing 700c. An air inlet 210 is formed on one side of the upper housing 700c. Although the air inlet 210 is shown as passing through one side of the upper housing 700c, when the air inlet 210 is assembled with an external device, the upper housing 700c As shown in Fig.

5 is a schematic diagram illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.

The pressure sensor device 1200 shown in Fig. 5 is substantially similar in structure to the pressure sensor device 1100 described above with reference to Fig. 3, but the height of the partition 700a or the internal structure of the upper housing 700c varies . ≪ / RTI > When the height of the partition wall 700a formed between the first inner area where the pressure sensor chip 200 is disposed and the second inner area where the air passage is formed is high, It can have a bent structure. At this time, the first inner region and the second inner region are not separated by the upper housing 700c but are separated by the partition 700a. In this case, the outer wall of the upper housing 700c may be formed with a stepped portion to be engaged with the partition 700a.

Meanwhile, although not shown, the upper housing 700c may include only the fluid inlet 220, and in this case, the air inlet 210 may be formed on one side of the partition 700a. In addition, if there is no second through-hole 104 through which air can pass through the substrate 100, the air inlet 210 may be formed on either side of the lower housing 700b.

6 is a perspective view schematically illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.

Referring to FIG. 6, the pressure sensor device 1300 has the same internal structure as the pressure sensor device 1000 described with reference to FIG. 1, except that the shape of the fluid inlet 220 provided in the upper housing 700c is This is a differently configured embodiment. The fluid inlet 220 may be formed at an oblique angle with respect to the upper surface of the upper housing 700c at a predetermined angle to a direction perpendicular to the upper surface. Although the drawing shows an example in which the direction of the fluid inlet 220 is shifted toward the direction in which the air inlet 210 is formed, it can be easily combined with an engaging portion in which water can move in an external device such as a washing machine So that the direction and length of the fluid inlet 220 can be changed.

7 is a perspective view schematically illustrating a configuration of a pressure sensor device according to another embodiment of the present invention.

Referring to FIG. 7, the pressure sensor device 1400 has substantially the same internal structure as the pressure sensor device 1000 described with reference to FIG. 1, and the shape of the fluidity inlet 220 provided in the upper housing 700c Is an alternatively configured embodiment. The fluid conduit inlet 220 may be formed on one side of the upper housing 700c. At this time, the fluid inlet 220 and the air inlet 210 may be formed in directions perpendicular to each other.

However, depending on the internal structure of the pressure sensor device 1400, the fluid inlet 220 may be formed on the opposite side of the surface on which the air inlet 210 is formed or on the same side where the air inlet 210 is formed. The upper housing 700c may be inclined obliquely to the upper surface of the upper housing 700c or in a direction parallel to the upper surface of the upper housing 700c to engage with the engaging portion of the external device as shown in FIG.

Meanwhile, the pressure sensor devices 1000, 1100, 1200, 1300, and 1400 described above with reference to FIGS. 1 to 7 are according to embodiments of the present invention, and have a structure that can easily be combined with an external device . The direction and structure of the air inlet 210 and the fluid inlet 220 may be designed to have various directions and shapes according to the internal structure of the apparatus, the height of the partition, and the like.

INDUSTRIAL APPLICABILITY As described above, the present invention can prevent a device defect due to fluid or moisture from occurring in a pressure sensor chip, an integrated circuit chip and the like by introducing a pressure transmission medium. In addition, since the mounting form of the pressure sensor device is a shape in which the fluid inlet is downward, the lower waterproofing of the pressure sensor device may be relatively weak. Therefore, it is possible to prevent defects due to moisture by covering the housing with a waterproof function and protecting the outside.

In addition, when the characteristics of the pressure transmission medium are hardened, the characteristic of the sensor changes, and the operation of the pressure sensor can be smoothly performed by introducing the partition wall structure for fixing the pressure transmitting medium in the form of a waterproof gel having a low viscosity. In addition, each housing has a separate structure, and the fluid inlet and the air inlet are not parallel to each other and are formed in different directions, so that productivity is improved by automatic assembly and the like, and the structure is simple, And a pressure sensor device in which an integrated circuit can be easily mounted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: substrate
102: first through hole
104: second through hole
200: Pressure sensor chip
202: Silicon patterning
210: Air intake
220: Fluid inlet
300: integrated circuit chip
500: protective member
700: Housing
700a: partition wall
700b: Lower housing
700c: upper housing
800: conductive lead
1000: Pressure sensor device

Claims (10)

A substrate including a first through hole and a second through hole;
A first surface on which the fluid inlet is formed, and a second surface different from the first surface on which the air inlet is formed, the second surface being surrounded by at least a portion of the substrate such that the first through hole and the second through hole are disposed therein ; And
And a pressure sensor chip provided at one side of the first through hole of the substrate for measuring a relative pressure of fluid applied to the fluid inlet with respect to an atmospheric pressure applied to the atmospheric introduction port,
The housing includes:
A partition wall coupled to the substrate and defining an inner space to separate the first through hole and the second through hole;
An upper housing joined on the partition wall; And
And a lower housing joined to the substrate or the lower portion of the partition,
Wherein the air inlet is communicated with the second through hole so that the air introduced through the air inlet is introduced into the lower housing through the second through hole,
Pressure sensor device. The method according to claim 1,
The air inlet and the fluid inlet are formed on different surfaces of the upper housing,
Wherein the first surface is an upper surface of the upper housing and the second surface is a side surface of the upper housing,
Pressure sensor device. The method according to claim 1,
Wherein the fluid guide opening is formed to protrude out of the upper housing,
Wherein the air inlet is formed in a shape penetrating through one side of the upper housing,
Pressure sensor device. 3. The method of claim 2,
Wherein the first surface and the second surface are perpendicular to each other,
Pressure sensor device. The method according to claim 1,
And a pressure delivery medium that seals the pressure sensor chip and is capable of transferring the pressure of the fluid so as to measure pressure in the pressure sensor chip.
Pressure sensor device. 6. The method of claim 5,
Wherein the pressure transmitting medium has a waterproof function so that the fluid does not directly touch the pressure sensor chip,
Pressure sensor device. The method according to claim 1,
And an integrated circuit (IC) chip mounted on the substrate for converting the analog signal output generated by the pressure sensor chip into a digital signal output.
Pressure sensor device. The method according to claim 1,
Wherein the inner space is divided into a first inner area in which the fluid pressure is applied to the fluid inlet and a second inner area in which the atmospheric pressure is applied,
Pressure sensor device. The method according to claim 1,
Wherein the substrate comprises a lead frame,
Pressure sensor device. The method according to claim 1,
Wherein the substrate comprises a printed circuit board,
Pressure sensor device.

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