CN217476322U

CN217476322U - Liquid path circulating system and slicing machine

Info

Publication number: CN217476322U
Application number: CN202221337010.0U
Authority: CN
Inventors: 丁海军; 高涛; 范国强; 孙启童; 陈超; 李玮渊
Original assignee: Leshan Gaoce New Energy Technology Co ltd
Current assignee: Leshan Gaoce New Energy Technology Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-09-23
Anticipated expiration: 2032-05-31

Abstract

The embodiment of the application provides a liquid way circulation system and slicer, wherein, liquid way circulation system includes: a liquid supply cylinder, a collecting tank and a spraying device; the spraying device is arranged above a cutting main roller of the cutting equipment and used for providing cutting liquid for a cutting wire net wound by the cutting main roller; the collecting tank is arranged below the cutting main roller and used for collecting cutting liquid; the collecting tank is also communicated with the liquid supply cylinder through a pipeline, and the collected cutting liquid flows back to the liquid supply cylinder; the spraying device comprises: the spray pipe is used for containing cutting fluid and is provided with spray holes; the injection port of the spray pipe is communicated with the liquid supply cylinder through a pipeline; the flow discharge plate is arranged in the spray pipe and divides the inner space of the spray pipe into a first space and a second space, the first space is communicated with the injection port of the spray pipe, and the second space is communicated with the spray hole; the flow discharge plate is provided with a flow discharge hole, and the first space and the second space are communicated through the flow discharge hole. The liquid path circulation system and the slicing machine provided by the embodiment of the application can improve the cooling effect on the cutting wire net.

Description

Liquid path circulating system and slicing machine

Technical Field

The application relates to a silicon chip production technology, in particular to a liquid path circulating system and a slicing machine.

Background

A slicer is a device for slicing a bar of hard and brittle material, and is usually arranged horizontally with two parallel main rollers, on which a single diamond wire is wound to form at least 2000 wire saws. Taking a silicon rod as a hard and brittle material rod as an example, the silicon rod moves from top to bottom and passes through between two main rollers, and the main rollers rotate to drive a diamond wire to move at a high speed so as to slice the silicon rod.

And the two sides of the silicon rod are respectively provided with a spraying device for spraying cutting liquid to the wire saw in the cutting process, cooling the wire saw and washing away silicon powder on the wire saw. The cutting liquid is provided by a liquid supply system in the slicing machine, in practical application, the liquid supply pressure of the liquid supply system has large fluctuation, so that the pressure sprayed out from the spraying device by the cutting liquid is large and small, the cutting liquid sprayed to the wire saw is unevenly distributed, the cooling effect is greatly influenced, and the roughness of the surface of the silicon wafer formed by cutting can be influenced when more silicon powder exists on the wire saw, so that the yield is reduced.

Disclosure of Invention

In order to solve one of the above technical drawbacks, an embodiment of the present application provides a fluid circulation system and a slicer.

According to a first aspect of embodiments herein, there is provided a fluid circuit circulation system comprising:

the liquid supply cylinder is used for containing cutting liquid;

the spraying device is connected with the liquid supply cylinder through a pipeline, arranged above a cutting main roller of the cutting equipment and used for supplying cutting liquid to a cutting wire net wound by the cutting main roller;

the collecting tank is arranged below the cutting main roller and is used for collecting cutting liquid; the collecting tank is also communicated with the liquid supply cylinder through a pipeline, and the collected cutting liquid flows back to the liquid supply cylinder;

the spray device comprises:

the spray pipe is used for containing cutting fluid; the spraying pipe is provided with a spraying hole; the injection port of the spray pipe is communicated with the liquid supply cylinder through a pipeline;

the flow discharge plate is arranged in the spray pipe and divides the inner space of the spray pipe into a first space and a second space, the first space is communicated with the injection port of the spray pipe, and the second space is communicated with the spray hole; the flow discharge plate is provided with a flow discharge hole, and the first space and the second space of the spray pipe are communicated through the flow discharge hole.

The liquid path circulation system as described above, the shower device further includes:

and the drainage plate is arranged below the spraying holes so as to guide the cutting liquid flowing out of the spraying holes to the cutting wire net.

According to the liquid path circulating system, the drainage plate is obliquely arranged, one end of the drainage plate is connected with the spray pipe and used for receiving the cutting liquid flowing out of the spray holes, and the other end of the drainage plate faces the cutting wire net so as to guide the cutting liquid to the cutting wire net.

In the liquid path circulating system, the first space in the shower pipe is located above the second space.

The fluid path circulation system as described above, the drainage plate comprising: the drainage plate comprises a first plate section and a second plate section which are arranged along the width direction of the drainage plate, and an included angle between the first plate section and the second plate section is larger than or equal to 90 degrees; the top of the first plate section extends to the side face of the spraying hole far away from the cutting wire net, and the first plate section and the second plate section are arranged below the spraying pipe in an enclosing mode to form a drainage space.

The liquid path circulation system as described above further includes:

one end of the sealing plate extends to the outer surface of the spray pipe and is positioned on the side surface of the spray hole close to the cutting wire net; the sealing plate is stopped above the drainage space, and an outlet of the cutting fluid is formed between the sealing plate and the end part of the drainage plate.

The liquid path circulation system as described above further includes:

a connecting plate; the two ends of the connecting plate in the length direction are connected to the drainage plate; the sealing plate is fixed to the connecting plate.

The liquid path circulation system as described above further includes:

an adjustment plate; the adjusting plate is provided with a long hole extending along the vertical direction and is connected to the connecting plate through a bolt capable of penetrating through the long hole; and the gap between the bottom end of the adjusting plate and the drainage plate forms an outlet of the drainage space.

The liquid path circulation system as described above further includes:

the filter barrel assembly is connected between the liquid supply cylinder and the spraying device; and a cutting fluid filter screen is arranged in the filter barrel assembly.

The liquid path circulation system as described above further includes:

the heat exchange assembly is connected between the filter barrel assembly and the spraying device; the cutting fluid flows through the heat exchange assembly to be cooled.

The liquid path circulation system as described above further includes:

and the flowmeter assembly is connected between the heat exchange assembly and the spraying device.

In the liquid path circulating system, the number of the spraying devices is two, and the spraying devices are respectively arranged above the two cutting main rollers; the two spraying devices are respectively connected with the two connectors of the three-way piece through pipelines, and the other connector of the three-way piece is connected with the liquid supply cylinder through a pipeline.

According to a second aspect of embodiments of the present application, there is provided a microtome comprising: the liquid path circulation system as described above.

According to the technical scheme, the spraying device is arranged above the cutting main roller, the liquid supply cylinder supplies cutting liquid to the spraying device, so that the spraying device sprays the cutting liquid to the cutting wire net, the cutting wire net is cooled, silicon powder attached to the cutting wire net is washed away, the surface quality of a silicon wafer obtained by cutting is guaranteed, and the yield of the silicon wafer is improved. In addition, a flow discharge plate is arranged in the spray pipe, the flow discharge plate divides the inner space of the spray pipe into a first space and a second space, and a flow discharge hole formed in the flow discharge plate is communicated with the first space and the second space, so that the cutting fluid entering the spray pipe firstly enters the first space, enters the second space through the flow discharge hole and then flows to the cutting wire net through the spray hole. The discharge hole is arranged on the discharge plate in the scheme, so that the flow of the cutting liquid in the spray pipe is slowed down. Under the condition of pressure fluctuation of the liquid supply, the cutting liquid can be uniformly distributed in the spraying pipe so as to uniformly flow out of the spraying holes, thereby ensuring that the cutting liquid uniformly flows to a cutting wire net, ensuring the cooling effect and washing silicon powder on the cutting wire.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic structural diagram of a fluid circuit circulation system according to an embodiment of the present disclosure;

fig. 2 is a perspective view of a slicing machine provided with a spraying device according to an embodiment of the present disclosure;

FIG. 3 is a side view of a slicer with a spray assembly according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a spraying device in a slicing machine according to an embodiment of the present disclosure;

FIG. 5 is a cross-sectional view of a spray assembly of a microtome according to an embodiment of the present disclosure;

FIG. 6 is an enlarged view of area A of FIG. 4;

FIG. 7 is a schematic diagram of a cleaning device in a microtome according to an embodiment of the present disclosure;

fig. 8 is an enlarged view of the region B in fig. 2.

Reference numerals are as follows:

11-a cutting frame; 12-cutting the main roller; 13-a holding tank; 14-first-stage filter screen; 15-secondary filter screen; 16-a chip box;

2-a spraying device; 21-a spray pipe; 211-spray holes; 212-cutting fluid injection tube; 213-cutting fluid line connection; 22-a leakage flow plate; 221-a drain hole; 23-a drainage plate; 24-a connecting plate; 25-an adjusting plate; 251-a long hole; 26-a sealing plate; 27-spraying bracket; 28-a tee;

31-a silicon rod;

4-a cleaning device; 41-cleaning tube; 42-cleaning liquid injection pipe; 43-cleaning liquid spraying hole; 44-cleaning liquid line connection; 45-buckling;

5-a liquid supply cylinder;

6-a filter vat component;

7-a heat exchange assembly;

8-flow meter assembly.

Detailed Description

In order to make the technical solutions and advantages in the embodiments of the present application more clearly understood, the following description of the exemplary embodiments of the present application with reference to the accompanying drawings is made in further detail, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all the embodiments. It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict.

The embodiment provides a liquid path circulation system, can be applied to the cutting equipment that cuts hard and brittle material stick, is particularly useful for carrying out sliced slicer to the silicon rod that the cross section is the rectangle. In the present embodiment, a slicer is taken as an example to describe the liquid path circulation system in detail, but the technical solution provided in the present embodiment is also applicable to cutting apparatuses other than slicers.

Fig. 1 is a schematic structural diagram of a liquid path circulation system according to an embodiment of the present disclosure. As shown in fig. 1, the liquid path circulating system provided in this embodiment includes: liquid supply cylinder 5, spraying device 2 and collecting tank 13. The liquid supply cylinder 5 is used for containing cutting liquid, the spraying device 2 is connected with the liquid supply cylinder 5 through a pipeline, arranged above a cutting main roller 12 of the cutting equipment and used for providing the cutting liquid for the cutting main roller 12 around a cutting wire net, cooling the cutting liquid and washing away silicon powder attached to the cutting wire, so that the surface roughness of a silicon wafer formed by cutting meets the requirement, and the yield is improved. The collecting tank 13 is disposed below the cutting main roller 12, and is used for collecting cutting fluid. The collecting tank 13 is also communicated with the liquid supply cylinder 5 through a pipeline, and collected cutting liquid flows back to the liquid supply cylinder for cyclic utilization.

Fig. 2 is a perspective view of a slicer provided with a spraying device according to an embodiment of the present disclosure, and fig. 3 is a side view of the slicer provided with the spraying device according to the embodiment of the present disclosure. As shown in fig. 2 and 3, the slicer provided in the present embodiment includes: a cutting frame 11 and at least two cutting main rollers 12, the cutting main rollers 12 being arranged side by side. A gap for the silicon rod 31 to pass through is left between the two main cutting rollers 12. The cutting wire wound on the cutting main rollers 12 forms a cutting wire net, the cutting wire section between the two cutting main rollers 12 serves as a cutting wire saw, the silicon rod 31 moves from one side of the cutting wire net to the other side of the cutting wire net to the position between the two cutting main rollers 12, and the silicon rod 31 is sliced by the plurality of wire saws to form a silicon wafer.

The number of the cutting main rollers 12 may be two, three, four, or four or more, and the cutting lines are wound around the respective cutting main rollers 12. The two cutting main rollers 12 are arranged horizontally side by side. The three cutting main rollers 12 are arranged in a triangle, wherein two cutting main rollers 12 are at the same height and the other cutting main roller 12 is above or below. The four cutting main rollers 12 are arranged in a rectangular or trapezoidal shape. Both ends of the cutting main roller 12 are arranged on the cutting frame 11 through bearings, and the cutting main roller 12 is driven to rotate through a motor.

In this embodiment, taking two cutting main rollers 12 as an example, the two cutting main rollers 12 are parallel and at the same height, and the silicon rod 31 may move from top to bottom for cutting or from bottom to top for cutting. In this embodiment, the silicon rod 31 moves from the top to the bottom for cutting.

The spraying device 2 is arranged above the cutting main roller 12 and is positioned on one side of the cutting wire net and used for spraying cutting fluid to the cutting wire net in the slicing process so as to reduce dust generated in the cutting process and cool the cutting fluid. The shower device 2 may be mounted on the cutting frame 11.

Fig. 4 is a schematic structural diagram of a spraying device in a slicer according to an embodiment of the present disclosure, and fig. 5 is a cross-sectional view of the spraying device in the slicer according to an embodiment of the present disclosure. As shown in fig. 4 and 5, the shower apparatus includes: a shower 21 and a effusion plate 22.

Wherein, shower 21 is used for holding cutting fluid, and shower 21 and cutting main roll 12 parallel arrangement. The spray pipe 21 is provided with an injection port, the injection port is connected with a liquid supply system in the slicing machine through a pipeline, and the liquid supply system injects cutting liquid into the spray pipe 21. The spray pipe 21 is provided with spray holes 211, and the cutting fluid can flow out from the spray holes 211. The number of the spray holes 211 is plural, and the spray holes 211 are arranged at intervals or uniformly.

The effusion plate 22 is disposed in the shower pipe 21, and divides the internal space of the shower pipe 21 into a first space and a second space. The first space is communicated with the injection port, and the second space is communicated with the spraying hole 211. Drain plate 22 is provided with drain hole 221, and the first space and the second space communicate through drain hole 221.

According to the technical scheme, the spraying device is arranged above the cutting main roller, the liquid supply cylinder supplies cutting liquid to the spraying device, so that the spraying device sprays the cutting liquid to the cutting wire net, the cutting wire net is cooled, silicon powder attached to the cutting wire net is washed away, the surface quality of the silicon wafer obtained by cutting is guaranteed, and the yield of the silicon wafer is further improved. In addition, a flow discharge plate is arranged in the spray pipe, the flow discharge plate divides the inner space of the spray pipe into a first space and a second space, and a flow discharge hole formed in the flow discharge plate is communicated with the first space and the second space, so that the cutting fluid entering the spray pipe firstly enters the first space, enters the second space through the flow discharge hole and then flows to the cutting wire net through the spray hole. The discharge hole is arranged on the discharge plate in the scheme, so that the flow of the cutting liquid in the spray pipe is slowed down. Under the condition of pressure fluctuation of the supplied liquid, the cutting liquid can be uniformly distributed in the spray pipe, so that the cutting liquid uniformly flows out from the spray holes, the cutting liquid is ensured to uniformly flow to the cutting wire net, the cooling effect is ensured, and the silicon powder on the cutting wire is washed away.

On the basis of the technical scheme, one implementation mode is as follows: the effusion plate 22 is provided inside the shower pipe 21, and divides the internal space of the shower pipe 21 into an upper space (i.e., a first space) and a lower space (a second space). The drain plate 22 is provided with a drain hole 221 penetrating the drain plate 22 in the thickness direction, and the upper space and the lower space of the shower pipe 21 are communicated with each other through the drain hole 221. The upper part of the spray pipe 21 is provided with an injection port for connecting with a liquid supply system through a pipeline. The cutting fluid in the upper space enters the lower space through the drain hole 221, and the cutting fluid in the lower space flows out through the spray holes 211.

Drain holes 221 are provided in plurality and drain holes 221 may be spaced apart or uniformly spaced. The drain holes 221 and the shower holes 211 may be aligned vertically or staggered vertically.

Further, the flow guide plate 23 is disposed below the spray holes 211 to guide the cutting fluid flowing out of the spray holes 211 to the cutting wire net.

One embodiment is: the drainage plate 23 is arranged below the spray pipe 21 and is obliquely arranged. One end of the flow guide plate 23 is connected with the spray pipe 21 for receiving the cutting fluid flowing out of the spray holes 211, and the other end faces the cutting wire net to guide the cutting fluid to the cutting wire net.

One specific way is as follows: the end of the flow guide plate 23 close to the shower pipe 21 is higher, and the height close to the cutting wire net is lower. The drainage plate 23 receives the cutting fluid flowing out from the spraying holes 211, and the cutting fluid flows to the cutting wire net along the drainage plate 23. One implementation is as follows: the length of the flow guide plate 23 is matched with that of the shower pipe 21 so that all cutting fluid flowing out of the shower holes 211 is received by the flow guide plate 23.

An injection port is arranged at the end part or the middle part of the spray pipe 21, one end of the cutting fluid injection pipe 212 is connected to the injection port, the other end of the cutting fluid injection pipe is provided with a cutting fluid pipeline connector 213, and the cutting fluid pipeline connector 213 is connected with a cleaning fluid supply pipeline in the fluid supply system through a pipeline.

The above-mentioned liquid supply cylinder 5 has an internal cavity in which the cutting liquid is contained. The liquid supply cylinder 5 has a liquid outlet in communication with the internal cavity, the liquid outlet being in communication with the spray device 2 via a conduit. The liquid supply cylinder 5 is provided with a liquid supply pump which pumps the cutting liquid from the liquid outlet to the pipeline.

On the basis of the above scheme, the liquid path circulating system further comprises: and the filter barrel assembly 6 is connected between the liquid supply cylinder 5 and the spraying device 2. Be equipped with the cutting fluid filter screen in the filter vat subassembly for filter the cutting fluid, large granule, the tiny particle object of filtering to reduce the follow-up solid particle in the cutting fluid that sends out through spray set 2, and then guarantee cutting quality, carry high yield.

Further, the liquid path circulation system further comprises: and the heat exchange assembly 7 is connected between the filter barrel assembly 6 and the spraying device 2, and the cutting fluid flows through the heat exchange assembly 7 to be cooled. The temperature of cutting fluid is reduced, can improve the cooling effect to cutting wire net.

Further, the liquid path circulation system further includes: and the flowmeter assembly 8 is connected between the heat exchange assembly 7 and the spraying device 2. Flowmeter subassembly 8 is used for detecting the cutting fluid flow who provides spray set 2, and the flow that flowmeter subassembly 8 detected also can feed back to the controller, sends the aperture instruction through the controller to the ooff valve in the pipeline, adjusts the aperture of ooff valve, and then the cutting fluid flow in the adjustment pipeline to reach the effect that satisfies cutting wire net cooling requirement.

Based on the above scheme, the number of the spraying devices 2 is two, and the spraying devices are respectively arranged above the two cutting main rollers 12. The two spraying devices 2 are respectively connected with two interfaces of a three-way piece 28 through pipelines, and the other interface of the three-way piece 28 is connected with the liquid supply cylinder 5 through a pipeline. Cutting fluid is supplied to the two spraying devices 2 through the fluid supply cylinder 5, the flow rates of the cutting fluid in the two spraying devices 2 are basically the same, the cutting fluid on a cutting wire net can be kept uniform, and the cutting quality of the silicon wafer can be guaranteed.

The solid arrows in fig. 1 show the flow direction of the cutting fluid, which flows out of the fluid supply cylinder, sequentially flows to the cutting wire net through the filter barrel assembly, the heat exchange assembly, the flow meter assembly and the spraying device.

On the basis of the above technical scheme, this embodiment provides a concrete implementation of drainage plate:

fig. 5 is a cross-sectional view of a spray device in a microtome according to an embodiment of the present disclosure. As shown in fig. 4 and 5, the length direction of the flow guide plate 23 is defined as the same direction as the axial direction of the cutting main roller 12, and the width direction of the flow guide plate 23 is defined as the direction from the shower pipe 21 toward the wire net. The drainage plate 23 specifically includes: the included angle between the first plate section and the second plate section is larger than or equal to 90 degrees, and the first plate section and the second plate section are in smooth transition. The first plate section can extend along the vertical direction or extend obliquely, the top end of the first plate section extends to abut against the spray pipe 21 and is positioned in the spray hole 211 to be far away from the side face of the cutting wire net, for example, the first plate section abuts against the left side and the side face of the spray pipe 21 upwards in fig. 5, and the first plate section and the second plate section are arranged below the spray pipe 21 in a surrounding manner to form a drainage space.

One specific way is as follows: the first plate section and the second plate section are L-shaped, wherein the top end of the first plate section extends to the left side which is welded with the outer wall of the spray pipe 21 and is positioned in the spray hole 211, and the second plate section extends towards the right lower direction. A drainage space is defined by the drainage plate 23 and the spray pipe 21, and cutting fluid flows out from the spray holes 211, flows downwards along the second plate section in the drainage space and flows out from the right end of the second plate section.

The included angle between the second plate section and the horizontal direction is (0 degree, 20 degrees), namely, the included angle is larger than 0 degree and smaller than or equal to 20 degrees, for example, the included angle between the second plate section and the horizontal direction can be about 5 degrees, so that the cutting fluid flows out smoothly, and the included angle has a certain initial speed and is shot to the cutting wire net by a parabolic track, so that the middle part and two ends of the cutting wire net are contacted with the cutting fluid, and the cooling and flushing effects are guaranteed.

The above-mentioned shower 21 can be fixed to the cutting frame 11, for example: both ends of the shower pipe 21 are fixed to the cutting frame 11 through shower brackets 27, respectively.

Further, a sealing plate 26 is used, one end of which extends to the outer surface of the shower pipe 21, for example, may be welded to the outer surface of the shower pipe 21, and is located at the side of the shower holes 211 adjacent to the wire mesh, as shown at the right side of the shower holes 211 in fig. 5. The sealing plate 26 may extend horizontally or obliquely downward, stopping above the drainage space, and forming an outflow opening for the cutting fluid between the sealing plate 26 and the end of the drainage plate 21. The sealing plate 26, the drainage plate 23 and the spray pipe 21 enclose a closed drainage space, and an opening is formed only at the end parts of the sealing plate 26 and the drainage plate 23 for the cutting fluid to flow out. Above-mentioned scheme makes cutting fluid all flow from the opening, all can flow to the cutting wire net, and the guarantee is to the cooling and the washing effect of cutting wire net.

The sealing plate 26 may also be fixed at both ends to the shower brackets 27. Alternatively, the sealing plate 26 may be fixed as follows:

the connecting plate 24 is used to extend in the axial direction of the cutting main roller 12. Both ends of the connecting plate 24 in the length direction thereof may be fixed to the flow guide plate 23 by welding. The seal plate 26 is fixed to the connecting plate 24 by welding or bolting. Connecting plate 24 plays the effect of fixed closing plate 26 on the one hand, and the clearance between the bottom of on the other hand connecting plate 24 and the drainage plate 23 forms the export in drainage space, and encloses with closing plate 26, drainage plate 23 and establish together and form drainage space, makes the cutting fluid all flow from the opening, and the guarantee can flow to the cutting line on the net, the guarantee to the cooling of cutting line net and wash the effect.

Further, the sealing plate 26 includes a sealing plate section and a fixing plate section. Wherein the included angle between the sealing plate section and the fixing plate section is less than or equal to 90 degrees. One end of the sealing plate section extends to the outer surface of the spray pipe 21, and is welded to the outer surface of the spray pipe 21 and is located on the right side of the spray hole 211. The sealing plate section is arranged to incline downwards to the right, and the distance between one end of the sealing plate section close to the spray pipe 21 and the drainage plate 23 is larger than the distance between the end part of the seal plate section far away from the spray pipe 21 and the drainage plate 23. The fixing plate section is parallel to the connecting plate 24 and fixed to the connecting plate 24.

Fig. 6 is an enlarged view of the area a in fig. 4. As shown in fig. 6, further, an adjusting plate 25 is further included. The adjusting plate 25 is parallel to the connecting plate 24, and is located on both sides of the connecting plate 24 with the sealing plate 26. The adjusting plate 25 is provided with a vertically extending long hole 251, and is connected to the connecting plate 24 by a bolt capable of passing through the long hole 251, specifically, the bolt is adapted to pass through the long hole 251 of the adjusting plate 25, the through hole of the connecting plate 24 and the through hole of the sealing plate 26 in sequence and then is matched and connected with a nut, so as to fix the sealing plate 26, the connecting plate 24 and the adjusting plate 25 together. The gap between the bottom end of the adjusting plate 25 and the drainage plate 23 forms the outlet of the drainage space, and the height of the adjusting plate 25 is further changed by adjusting the position of the bolt in the long hole 251 so as to adjust the size of the outlet of the drainage space and change the flow and pressure of the cutting fluid outlet.

With respect to the slicer provided by the present embodiment, as shown in fig. 2 and 3, a collecting tank 13 for collecting the cutting fluid is provided below the cutting main rollers 12, and the cutting fluid flows into the collecting tank 13 from the area between the two cutting main rollers 12, passes through the collecting pipeline, and is filtered for recycling. The cutting liquid can be clean water or other corrosion-resistant liquid which is not easy to react with the surface of the silicon rod.

Further, a filter screen is arranged at the top of the collecting tank 13 for filtering out the cut fragments. Two stages of filter screens are adopted, namely: the upper part is provided with a first-level filter screen 14 for filtering large particles, and the lower part is provided with a second-level filter screen 15 for filtering small particles.

A chip box 16 is further provided between the two cutting main rollers 12 for collecting silicon chips generated during the cutting process, reducing silicon chips falling on the first filter 14 and avoiding clogging.

On the basis of the technical scheme, the slicing machine provided by the embodiment is further provided with a cleaning device 4, so that the silicon wafer can be pre-cleaned in the process of slicing and retreating the rod, and the silicon powder on the surface of the silicon wafer and in the kerf can be washed off. The rod withdrawing process is utilized for pre-cleaning, so that the subsequent step of pre-cleaning in a degumming machine is omitted, and the production time of the silicon wafer is shortened. And need not set up belt cleaning device in advance in the degumming machine, can simplify the structure of degumming machine.

The cleaning device 4 and the spraying device 2 are arranged on the same side of the cutting wire net. The distance between the cleaning liquid outlet of the cleaning device 4 and the cutting main roller 12 is larger than the distance between the cutting liquid outlet of the spraying device 2 and the cutting main roller 12.

In the present embodiment, the silicon rod is lowered and the cutting wire net formed on the upper surface of the cutting main roller 12 slices the silicon rod, taking the example of moving from top to bottom for cutting. After the cutting is completed, the silicon rod rises to retreat. The cleaning device 4 and the spraying device 2 are arranged above the cutting wire net, a cleaning liquid outlet in the cleaning device 4 is higher than a cutting liquid outlet in the spraying device 2, and the cutting liquid outlet is lower in height and directly sprayed onto the cutting wire net; and the cleaning liquid outlet is higher in height so as to spray the cleaning liquid in the rod withdrawing process.

In the process of moving back the bar upwards, the cutting line is clamped between the silicon wafers and is slowly threaded, a certain gap is reserved between the adjacent silicon wafers, the silicon wafers are not completely attached together, the silicon wafers are cleaned at the moment, liquid can enter the silicon wafers more easily, the cleaning effect can be improved, the silicon powder concentration between the silicon wafers is greatly reduced, the bar can be moved back upwards more conveniently, and the scratch of the silicon wafers can be reduced.

Fig. 7 is a schematic structural diagram of a cleaning device in a microtome according to an embodiment of the present disclosure. As shown in fig. 7, the cleaning device 4 includes: a cleaning pipe 41 and a cleaning liquid injection pipe 42. The cleaning pipe 41 extends in a horizontal direction from one end of the cutting main roller 12 to the other end. The cleaning pipe 41 has a cleaning liquid injection hole 43 formed on a side thereof facing the silicon wafer as a cleaning liquid outlet, and the cleaning liquid is injected from the cleaning liquid injection hole 43 to be directed to the silicon wafer. The cleaning liquid injection pipe 42 is connected to one end of the cleaning pipe 41, and the other end of the cleaning pipe 41 is closed. The cleaning pipe 41 is provided with a plurality of cleaning liquid spray holes 43.

Specifically, one end of the cleaning liquid injection pipe 42 is connected to a cleaning liquid supply pipe on the slicer through a cleaning liquid pipe joint 44, and the cleaning liquid is continuously supplied to the cleaning pipe 141 through the cleaning liquid supply pipe, and the cleaning liquid is collected and recovered from the lower side of the cutting main roller 12 for recycling. The cleaning liquid can be clean water or other corrosion-resistant liquid which is not easy to generate chemical reaction on the surface of the silicon wafer.

The length of the cleaning pipe 41 may be smaller than the length of the cutting main roller 12 and larger than the length of the silicon rod, and may be specifically set according to the length of the silicon rod. For example: the length of the cleaning pipe 41 is 600mm-900mm, the pipe diameter is 20mm-40mm, and the liquid injection pressure of the cleaning liquid injection pipe 42 is 0.2Mpa-1 Mpa. The diameter of the cleaning liquid spray holes 43 is 0.3mm-1.5mm, and the cleaning liquid spray holes are uniformly distributed on the cleaning pipe 41.

Fig. 8 is an enlarged view of the region B in fig. 2. As shown in fig. 8, the cleaning pipe 41 may be arranged above the sealing plate 26 based on the solution of the spraying device 2. The cleaning pipe 41 is fixed on the cutting fluid injection pipe 212 by using the buckle 45, and the buckle 45 is positioned in the middle of the cleaning pipe 41, so that the installation distance is short, and the size of the installation part is reduced. The buckle 45 specifically includes an upper mounting plate and a lower retaining ring, and the lower retaining ring is located below the cutting fluid injection pipe 212 and fixed to the upper mounting plate through a bolt, so as to be convenient for disassembly and assembly.

The present embodiment provides a microtome, which includes the liquid path circulation system provided in any of the above embodiments, and has the same technical effects as the liquid path circulation system.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A fluid circuit circulation system, comprising:

the liquid supply cylinder is used for containing cutting liquid;

the collecting tank is arranged below the cutting main roller and used for collecting cutting liquid; the collecting tank is also communicated with the liquid supply cylinder through a pipeline, and the collected cutting liquid flows back to the liquid supply cylinder;

the spray device comprises:

a spray pipe for containing cutting fluid; the spraying pipe is provided with a spraying hole; the injection port of the spray pipe is communicated with the liquid supply cylinder through a pipeline;

the flow discharge plate is arranged in the spray pipe and divides the inner space of the spray pipe into a first space and a second space, the first space is communicated with the injection port of the spray pipe, and the second space is communicated with the spray hole; the drain plate is provided with a drain hole, and the first space and the second space of the spray pipe are communicated through the drain hole.

2. The fluid circuit circulation system of claim 1, wherein the spray device further comprises:

3. The fluid path circulation system of claim 2, wherein the flow guide plate is disposed obliquely, one end of the flow guide plate is connected to the spray pipe for receiving the cutting fluid flowing out from the spray holes, and the other end faces the cutting wire net to guide the cutting fluid to the cutting wire net.

4. The fluid path circulation system of claim 1, wherein the first space within the shower pipe is located above the second space.

5. The fluid path circulation system of claim 3, wherein the flow guide plate comprises: the drainage plate comprises a first plate section and a second plate section which are arranged along the width direction of the drainage plate, and an included angle between the first plate section and the second plate section is larger than or equal to 90 degrees; the top of the first plate section extends to the side face of the spraying hole far away from the cutting wire net, and the first plate section and the second plate section are arranged below the spraying pipe in an enclosing mode to form a drainage space.

6. The fluid circuit circulation system of claim 5, further comprising:

7. The fluid circuit circulation system of claim 6, further comprising:

8. The fluid circuit circulation system of claim 7, further comprising:

9. The fluid circuit circulation system of claim 1, further comprising:

10. The fluid circuit circulation system of claim 9, further comprising:

11. The fluid circuit circulation system of claim 10, further comprising:

12. The liquid path circulation system according to claim 1, wherein the number of the spraying devices is two, and the spraying devices are respectively arranged above the two cutting main rollers; the two spraying devices are respectively connected with the two connectors of the three-way piece through pipelines, and the other connector of the three-way piece is connected with the liquid supply cylinder through a pipeline.

13. A microtome, comprising: a fluid path circulation system as claimed in any one of claims 1 to 12.